TW200619120A - Substrate movling apparatus and vacuum processing apparatus with thereof - Google Patents

Substrate movling apparatus and vacuum processing apparatus with thereof

Info

Publication number
TW200619120A
TW200619120A TW094127119A TW94127119A TW200619120A TW 200619120 A TW200619120 A TW 200619120A TW 094127119 A TW094127119 A TW 094127119A TW 94127119 A TW94127119 A TW 94127119A TW 200619120 A TW200619120 A TW 200619120A
Authority
TW
Taiwan
Prior art keywords
substrate
moving apparatus
substrate moving
moving
movling
Prior art date
Application number
TW094127119A
Other languages
Chinese (zh)
Other versions
TWI309225B (en
Inventor
Tatsuhiro Taguchi
Original Assignee
Shimadzu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shimadzu Corp filed Critical Shimadzu Corp
Publication of TW200619120A publication Critical patent/TW200619120A/en
Application granted granted Critical
Publication of TWI309225B publication Critical patent/TWI309225B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32743—Means for moving the material to be treated for introducing the material into processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32807—Construction (includes replacing parts of the apparatus)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
    • H01J37/32816—Pressure
    • H01J37/32834—Exhausting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
  • Intermediate Stations On Conveyors (AREA)
  • Attitude Control For Articles On Conveyors (AREA)
  • Chemical Vapour Deposition (AREA)
  • ing And Chemical Polishing (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

A substrate moving apparatus, using simple movement to the transporting situation in a short time, is provided. A vacuum processing apparatus 100 includes a vacuum pre-heating chamber 10 and a plasma processing chamber 20. The substrate moving apparatuses 11, 13 are disposed at the upper and lower sites of the vacuum pre-heating chamber 10, and the substrate moving apparatus 21 is disposed in the plasma processing chamber 20. The substrate moving apparatus 11, 13, 21 corresponding turn with the situation switching axis T1, T2, T3 to be in horizontal position or in tilting position. When the handed substrate is transported to the position of the substrate moving apparatus 21 by the substrate moving apparatus 11, the moving face of the substrate moving apparatus 11, 21 can corresponding be consistent with the moving line L2. When the handed substrate is transported to the position of the substrate moving apparatus 13 by the substrate moving apparatus 21, the moving face of the substrate moving apparatus 13, 21 can corresponding be consistent with the moving line L3.
TW094127119A 2004-09-29 2005-08-10 Substrate movling apparatus and vacuum processing apparatus with thereof TWI309225B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004283427A JP4581602B2 (en) 2004-09-29 2004-09-29 Vacuum processing equipment

Publications (2)

Publication Number Publication Date
TW200619120A true TW200619120A (en) 2006-06-16
TWI309225B TWI309225B (en) 2009-05-01

Family

ID=36236668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094127119A TWI309225B (en) 2004-09-29 2005-08-10 Substrate movling apparatus and vacuum processing apparatus with thereof

Country Status (4)

Country Link
JP (1) JP4581602B2 (en)
KR (1) KR100712732B1 (en)
CN (1) CN1754795B (en)
TW (1) TWI309225B (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4593536B2 (en) * 2006-08-23 2010-12-08 大日本スクリーン製造株式会社 Attitude change device and substrate transfer device
JP4755233B2 (en) * 2008-09-11 2011-08-24 東京エレクトロン株式会社 Substrate processing equipment
CN101924002B (en) * 2009-06-11 2013-02-27 北京北方微电子基地设备工艺研究中心有限责任公司 Heating device and plasma treatment equipment using same
JP2011044537A (en) * 2009-08-20 2011-03-03 Shimadzu Corp Heating device and in-line type film deposition device
KR101651164B1 (en) * 2009-12-22 2016-08-25 주식회사 원익아이피에스 Substrate process system, and process module therefor
JP5469507B2 (en) * 2010-03-31 2014-04-16 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
KR101329303B1 (en) * 2010-06-17 2013-11-20 세메스 주식회사 Substrates processing apparatus for loading/unloading of substrates
TWI451521B (en) * 2010-06-21 2014-09-01 Semes Co Ltd Substrate treating apparatus and substrate treating method
US20120064461A1 (en) * 2010-09-13 2012-03-15 Nikon Corporation Movable body apparatus, exposure apparatus, device manufacturing method, flat-panel display manufacturing method, and object exchange method
CN110295356B (en) * 2019-07-03 2021-03-02 京东方科技集团股份有限公司 Substrate cushion block, substrate conveying equipment and film forming system
CN111056302B (en) * 2019-12-31 2022-04-12 苏州精濑光电有限公司 Carrying unit
CN111219978A (en) * 2020-03-18 2020-06-02 无锡先导智能装备股份有限公司 Transfer device and drying equipment
CN115449770B (en) * 2022-09-01 2024-05-07 江苏宝浦莱半导体有限公司 Production equipment of silicon-based film material

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61113725U (en) * 1984-12-26 1986-07-18
JPS62168024U (en) * 1986-04-15 1987-10-24
JPH0497729U (en) * 1991-01-23 1992-08-24
KR100189981B1 (en) * 1995-11-21 1999-06-01 윤종용 Apparatus for fabricating semiconductor device with vacuum system
JP3384666B2 (en) * 1995-12-04 2003-03-10 大日本スクリーン製造株式会社 Substrate processing equipment
JP3608949B2 (en) * 1998-07-10 2005-01-12 大日本スクリーン製造株式会社 Substrate transfer device
JP2000195925A (en) * 1998-12-28 2000-07-14 Anelva Corp Substrate-treating device
KR100951337B1 (en) * 2002-05-23 2010-04-08 캐논 아네르바 가부시키가이샤 Substrate processing device and substrate processing method
KR100596050B1 (en) * 2002-10-31 2006-07-03 삼성코닝정밀유리 주식회사 Glass substrate transferring system

Also Published As

Publication number Publication date
TWI309225B (en) 2009-05-01
KR100712732B1 (en) 2007-05-04
JP4581602B2 (en) 2010-11-17
CN1754795B (en) 2010-05-05
KR20060050383A (en) 2006-05-19
JP2006096498A (en) 2006-04-13
CN1754795A (en) 2006-04-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees