TWI309225B - Substrate movling apparatus and vacuum processing apparatus with thereof - Google Patents

Description

[Technical Field] The present invention relates to a vacuum processing apparatus which is provided with a substrate conveying apparatus and which can perform, for example, film formation, etching treatment, heat treatment, and the like in a vacuum gas atmosphere. [Prior Art] When a plurality of vacuum processes different from each other are sequentially performed by one device, as a device capable of transferring a workpiece from a processing chamber to a next processing chamber in a vacuum state, for example, It is well known that a vacuum chamber is provided for the vacuum chamber to the processing chamber and a plurality of substrate transfer assemblies are provided at the vacuum preheating chamber. Such a device can perform a lifting operation performed by a conveying device provided at two portions of a vacuum preheating chamber to switch the conveying line to carry out conveyance and reception of the substrate between the processing chambers (for example, see Patent Literature 丨). [Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-239144 (page 2, Fig. 1 and Fig. 2). The load-fixing type vacuum device disclosed in Patent Document 1 is a transfer device that switches the transfer line by a lifting device. Since the substrate is transported into the processing chamber and the operation is carried out by the processing chamber, there is a problem that the transport operation of the transport line is complicated. SUMMARY OF THE INVENTION (1) A substrate transfer apparatus according to a first aspect of the present invention, characterized in that it may have a substrate holder for transporting a substrate to be processed or holding a substrate to be processed 1309^25 T/T78pifiCi〇c a transport mechanism assembly that maintains and carries out the transport; and a tilt switch mechanism for switching the transport surface between the horizontal state and the tilt state at a predetermined tilt angle with respect to the horizontal state; and the transport mechanism component can be horizontal on the transport surface The substrate to be processed or the substrate holder is transported in an inclined state. (2) A vacuum processing apparatus according to a second aspect of the present invention may have two or more interconnected processing chambers for performing continuous vacuum processing on a substrate to be processed; and respectively disposed in at least two processing chambers The substrate transfer apparatus according to the first aspect of the present invention, characterized in that each of the substrate transporting devices provided at the at least two processing chambers can be tilted substantially in one direction according to the transport surface thereof. Form a form of dumping surface. (3) A vacuum processing apparatus according to a third aspect of the present invention, characterized in that, in addition to the vacuum processing apparatus of the second aspect of the present invention, there is provided a substrate transportable at at least two processing chambers Each of the conveying faces of the apparatus is inclined substantially in one direction to form a tilting control unit for tilting the conveying surface. (4) A vacuum processing apparatus according to a fourth aspect of the present invention, characterized in that it is the second aspect of the present invention. Further, in addition to the vacuum processing apparatus of the third aspect, there is further provided a loading capable of loading the substrate to be processed or the substrate holder into the processing chamber for performing the initial vacuum processing, and capable of switching between opening to the atmosphere and vacuum sealing. a chamber; and the substrate to be processed or the substrate holder can be recovered as a processed substrate from the processing chamber for performing the final vacuum processing, and can be I3〇9% Uc := toward the atmosphere opening and vacuum sealing:= ί chamber. And the 'processing chamber can also be used as a loading chamber

The mountain (5) is a vacuum processing apparatus according to a sixth aspect of the present invention, and the base of the vacuum processing apparatus according to the second and third aspects of the present invention has a touchable substrate or a substrate carrier. Putting it into the processing chamber for vacuum processing, and can reversely move the treated substrate and the counter-electrode from the processing chamber where the final vacuum is performed to the processing chamber for the initial vacuum processing of the shell target. The recovery process is carried out as a substrate after the treatment, and the transition chamber can be switched between opening to the atmosphere and vacuum sealing. ^, the processing chamber (4) can also serve as a transition chamber. According to the substrate transfer device of the present invention, the substrate to be processed or the substrate can be transported by switching between the horizontal and the oblique (four) transport surfaces, so that the transport operation can be simplified and the time can be known. Enter the transfer state with a slight movement. Further, when such a substrate transfer device is installed at the line device, the transfer speed of the substrate to be processed or the like can be increased, and the throughput can be improved. The above and other objects, features, and advantages of the present invention will become more apparent <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; [Embodiment] A vacuum processing apparatus according to an embodiment of the present invention will be described below with reference to Figs. 1 to 6 . (First Embodiment) Fig. 1 is a view showing a vacuum configuration of a vacuum processing apparatus according to a first embodiment of the present invention. Schematic diagram of the action. Fig. 3 is a substrate transfer device at the table base J = true device = two: not intended. FIG. 3(a) is a schematic plan view, and FIG. 3(1) is a front view. Fig. 4 is a view showing the use of the UlL for the substrate transfer time = the vacuum of the ::_ formula in the apparatus. Further, in Fig. 4t, the same constituent members are denoted by the same reference numerals. The a-air treatment device (10) is composed of a direct-air preparatory heating chamber f1G and a money room_room 2 () which are also used as a loading/unloading chamber, and the external device 7G and the shirt processing device are separately connected to each other. In the upper and lower parts of the 10, the substrate is placed on the outside of the chamber, and the heating element power supply is connected to the unit. 'Direct = mouth also through the pipeline and exhaust system ... and the emission system = t; rr in the direction of the open air and vacuum sealed state ^ = η 'two feet can be applied to the substrate w 11, 13 appropriate and tilt switching mechanical components 12, 14 phase:::::: Relatively horizontal state of the angle of inclination

The substrate transfer device 21 and the RF electrode p are provided in the electrode P. RF electric plum p and "π connection. The plasma processing chamber 20 is connected to the RF power source at the outside of the chamber and connected to the system 20b, and is also delivered through the official line and the drainage system 20a and the gas. The process of I309^pi, oc deposition^^^ (Vap〇r, etc.) can be performed under a predetermined gas pressure. The substrate transfer device is connected, so that the state switching tilt angle can be implemented between the tilt states of the horizontal state and the phase f energy. The tilting garments 11, 13 and 21 for state switching are connected to the drive control circuit 80: the knife, the mechanical member 12, 14, 22 'also 11, 13 for detailed recitation. Below the _ the substrate transport device is in vacuum The pre-filled cavity 1^ is provided with a door type member G1,, and, at the side of the device to the real device 70, the chamber 20_boundary (four) is added to the chamber 10 and the electric treatment is performed.

When Sit Hi is placed, the vacuum is pre-filled and sealed. The door type portion; G2f can be disposed in the time other than the time when the person is moved out and out. (4) When the substrate w is processed, the === can be stored and supplied to the vacuum processing apparatus 100, and the substrate Wf is processed. The chamber to be recovered is usually at a large = xl to x4 indicating the transfer operation of the substrate. Arrow illusion = t The substrate W is operated by the gate member G1_, that is, the operation when the substrate w is carried by the S/Γ&quot; device 71 to the substrate transfer device 11. Arrow: The operation when the substrate w passes through the gate member G2, that is, the movement when the substrate is transported by the substrate transfer device n to the substrate transfer device 21 is performed. The movement of the county printed substrate W indicated by the arrow x3 is carried by the substrate through the action of the gate type Japanese temple. When the arrow x4* is transported to the substrate transfer device 13, the substrate W is operated at 72 points when the substrate W passes through the gate member G1. The earth reverse conveyance device 13 is transported to the substrate transfer device. The operations of the arrows xl and X4 ± - AA a can be carried out when the rain is not carried out and the substrate is transported in the horizontal direction. Change (4) Bamboo θ drop mechanical group ship material red horizontal state implementation The earth plate w is inclined and the transport line λ is set along the oblique direction. The operation at the time of delivery' is the greatest feature of the substrate transfer apparatus provided by the present invention. When the inclined conveyance is performed along the arrows χ2 and χ3, it is necessary to cause the base, the conveying devices η, 13, and 21 to be inclined, and the states corresponding to the arrows indicated by the arrows yl to y3 are switched. By the transfer operations χ1 to x4 as described above, the substrate W supplied from the external device 70 to the vacuum processing device 1 can be subjected to predetermined continuous processing by the vacuum processing device 1 and then recovered to the external device 70. . Next, the transfer operation of the above substrate will be described in detail with reference to Fig. 2 . Fig. 2 shows the substrate transfer apparatuses 11, 13, and 21 by a line segment (transport surface) connecting the five transfer rolls R and the transfer rolls R, respectively, in a simplified form. The conveyance rolling light R does not rotate when the vacuum processing is performed, and the carrier substrate W is not produced. When the substrate transfer is carried out, the transfer report R is around

I3〇9%W Paper vertical_Touch, (4) Substrate w The feeding device u is in the horizontal position (the tilting angle of the substrate can be made θ) _ The row state is switched to the oblique position (the conveying roller at the left end of the tilting substrate conveying device u) and :: The state is switched by the state of the substrate: 11: τ =:::, and the state is switched from the direction indicated by Shuoyi. The class, the 'transport device 13 is in the horizontal position and the tilt position, and the = substrate

The state switching axis T3 coincides with the rotation axis of the roller for the transport of the bite transport, and the transport roller Tm at the right side of fβ causes the base collision device 13 to switch state in the direction indicated by the arrow y3 in the state switching state 4. The roller for performing state switching between the tilt position device 21 at a horizontal position (the tilt angle is a girth), the tilt angle is + 0 or - θ, and the transfer roll at the right end of the base transport device 21 Actuating, so that the substrate transporting device 21 can be replaced with the rotating core, in the direction indicated by the arrow y2, and the tilting conveyance in the direction indicated by the arrow x2 is said to be kept at the level. In the state in which the substrate is transported, it is known that the tilt is generated so that the angle 1 is rotated to the right by the state switching shaft 1 and the transport line L2 is aligned. On the other hand, the transport surface of the substrate transporting unit 21 held in the f-flat state can be inclined in such a manner that the angle θ is rotated to the right by the twisted switching axis T2 and the transport line L2 is aligned. In this state, the substrate w can be transferred from the 12 I309225pi, d〇〇 substrate transfer device η to the substrate transfer device 21 by rotating the transfer rolls R of the substrate transfer devices η and 21 toward the right side. This substrate w is treated. The position in the plasma processing chamber 2 is performed in a state where the 'in!: substrate' is horizontal, or may be performed in a state where the substrate W / σ transport line L2 is inclined. In the tilting conveyance to be performed, the conveyance surface of the substrate conveyance device 21 in a similar state may be tilted so as to be held at the conveyance line L3 at only the rotation angle θ. The substrate conveyance surface held in the horizontal state may be only The state switching axis T3 is rotated to the left = degree two = the mode is inclined. In the track type: the passing conveying roller is rotated toward the left side so that the substrate is transferred from the substrate conveying device 21 to the device 13. The tilt switching mechanism units 12 and 14 are controlled under the control of the board transfer circuit 80, and the rotation angle of the T3 of the shape and the control is controlled in accordance with the predetermined method of driving the substrate transfer device to drive the control. Il, T2, and: Referring to Fig. 3, the mechanism for the substrate transfer device will be described. The two-use component 12 for the substrate transfer device n has a state switching steam red... Along the direction 、, can == state wheel 3 (Pm10n). State switching cylinder! The lower rotating small tooth is set in the vacuum preheating chamber 1〇/. σ pinion 3 can also be 'tilt switch Gu Shi 12 also configures the money In the vacuum pre-injury 13 I3〇92j2^pif-d〇c the lever 4 (lever) inside the heating chamber ^ 10. The lever 4 is connected to the rotating disc coaxially connected to the moving shaft C of the gear 3 (not shown/exited) The side surface portion 4 is provided. When the pinion gear 3 rotates at a timing; i will be the second diagram, and the front end portion of the lever 4 is transported to the substrate: the 11 is abutted to form a substrate transporting device, and the configuration is set. ^^f/千位(bits by means of pre-(four) compartments, at the side of the rotating disc 3== different levers, will be available according to the lever

The angle of inclination of the device 11. When the rotation of the round fox/Γΐ mast is in contact with the substrate transporting device 11, the substrate can be transported and supported at the tilt position (position £2), and the #rotation trajectory is the arc D3 (4) the lever and the substrate are transported. When the ii is abutted, an example of the configuration in which the substrate transfer apparatus 11 is at the inclined position (position E3) can be shown in Fig. 3(b). Next, the turning operation of the conveying roller R will be described. As shown in Fig. 3 (a), the rotational driving force of the rolling drive motor 5 can be transmitted to the rotating shaft 6, and the rotating shaft 6 can be rotated in the direction indicated by the arrow b in the figure, thereby passing through the bevel gear (bevel gea). The respective conveying rolls R are rotated in the same direction by the rotational force. Although not shown in the drawings, the driving mechanism components of the substrate conveying device n, the tilt switching mechanism assembly 12, and the conveying roller R may be along the arrow x2. There are two rows in the direction shown. The board on which the ship is removed or the substrate holder (substrate tray) for holding the substrate can be tilted at a predetermined inclination angle, and the rotation of the roll can be carried out. Along the 14

I30m, 〇c is transmitted in the direction indicated by the arrow in the transport direction. &amp;,, the substrate transfer device 13 and the tilt switching mechanism assembly, 5; its &amp; delivery device 2 and tilting device assembly 22, the base 2 = and the base "feed device n and tilt switching mechanic The 12 mouths have omitted the detailed description of them in the court. The following description will be made with reference to the transfer time flow chart shown in Fig. 4 . In the table of Fig. 4(4) to Fig. 4(4), the state of the device is 5传, Μ π^ + , and the state of the device is changed from the processing error to the ==. In order to avoid the illustration of Fig. 4, the actions of the substrate W and the substrate w are mainly shown, and the respective reference numerals are only shown in Fig. 4(a). Moreover, the process of the substrate w 、 and the processing are also indicated by reference numerals W1, W2, and W3, respectively. It is indicated that the state of the transfer is carried out according to the time series described later. (4) The job is to indicate that the first substrate W1 is sent from the vacuum preparation chamber to the electric cavity f20 by the action Χ2 as described above, and the vacuum is opened toward the atmosphere after the transfer is performed. The heating chamber 10 is prepared and passed through the external device 7 through the movable substrate W2 as described above. Transfer to the vacuum to warm up the hot chamber and the state at the end. Vacuum evacuation of the vacuum preheating chamber 10 may be performed, and vacuum heat treatment may be performed by the vacuum preheating chamber 10, and plasma treatment may be performed by the plasma processing chamber 20.

After Ik, as shown in Fig. 4(b), the gate member G2 is opened, and the substrate W1 subjected to the plasma treatment only is transferred from the electropolymerization processing chamber 20 to the vacuum preheating chamber 10 by the action. This transfer step can be carried out in a manner of 15 130%, doc which inclines the substrate transfer apparatuses 11, 21 along a predetermined transport line as described above. The substrate W2 subjected to heat treatment may then be transferred from the vacuum preheating chamber 1 to the electropolymerization processing chamber 20 by action χ2 as shown in Fig. 4(c). This transfer step can be carried out in such a manner that the substrate transfer apparatuses 11 and 21 are inclined along a predetermined transport line as described above. After the conveyance is performed by the action x2, the door member G2 is closed. The substrate transfer device 13 on which the substrate W1 is mounted is returned to the horizontal position from the inclined position. Then, as shown in FIG. 4(d), the gate member G1 is opened after the pressure of the vacuum preheating chamber 1〇 is adjusted to atmospheric pressure, and the substrate W1 subjected to the treatment is subjected to the vacuum preheating chamber by the action x4. The substrate W is transported to the external device 70, and the substrate W3 that has not been processed is put into the vacuum preheating chamber 1 by the external device 70 by the operation. At this time, the substrate transfer device 11 can be returned from the tilted position to the horizontal position. Subsequently, the door type member G1 is closed to perform vacuum evacuation of the vacuum preheating chamber 10. The vacuum heat treatment is performed by the vacuum preheating chamber 10, and the plasma treatment is performed by the plasma processing chamber 20. φ The above steps can be repeated, and a plurality of substrates W are subjected to continuous treatment and recovery. Further, Fig. 4 shows an embodiment in which the substrate w is mounted on the tray τ and transported together. However, the substrate W may be transported separately. The substrate transfer devices 11, 13, and 21 of the present embodiment are respectively arranged at the horizontal position (inclination angle) or the tilt position (inclination angle θ) of the mechanical button members 12, 14, 22 respectively. Since the substrate holder for the substrate w or the substrate holding substrate W is transported, the tilting operation of the substrate 13 can be simplified, and the short-term (four) can be completed. * and need to use the tilt switch mechanical components 12, 14, 22 pairs,

State switching, which improves reliability and reduces equipment costs and power consumption compared to those who use large lifting machinery components. The vacuum processing apparatus 100 of the present embodiment is provided with the substrate transporting packages 11, 13, and 21 which can be transported in a short-term manner to perform the tilting conveyance, so that the substrate w or the substrate w can be in a short time. The substrate holder for holding the base w is conveyed, and the overall throughput of the continuous vacuum processing can be improved. Moreover, the substrate transfer device! Since only the tilt drive is required, the space required for the operation can be partially reduced, so that the components in the vacuum processing chamber, such as the heating member, the electric city line, and various piping can be enlarged by such spatial distribution. Set the space used. (Second embodiment) Fig. 5 is a view showing the overall configuration of a vacuum processing apparatus according to a second embodiment of the present invention. The turret processing apparatus 2GG as a second embodiment and the vacuum processing as a first embodiment The device 1 〇〇 differs from the cavity (4) in the form of a cavity. The same points are mainly described below. The same components are denoted by the same reference numerals, and a detailed description of these components is omitted. The vacuum processing unit f 2 〇〇 is a vacuum pre-heating chamber 1G which is also used as a loading/unloading chamber in the vacuum processing apparatus, and is divided into a chamber according to its function. In other words, the vacuum preheating chamber 1 () is divided into two chambers, a loading/unloading chamber to 30 and a vacuum preheating chamber. True I309^, doc surveying the substrate transporting devices n, 13 at the vacuum pre-filling place = to 40, the substrate transporting device 21 is disposed in the plasma processing chamber plus the substrate w is transported according to the arrow χ 5, χ; ι, χ 2, χ 3 . Yes: the loading/unloading chamber 3G will not be re-entered into the vacuum preheating chamber 40, and the processed substrate will be recycled from the vacuum=hot space 40 to be opened to the atmosphere with IT. The heat chamber is installed between the vacuum chamber and the vacuum chamber. The heat chamber is used to carry out the loading and unloading process. The vacuum pre-borrowing can be performed under the direct-empty energy and the loading and unloading process is performed. The action and effect of the substrate transfer u and (4) of gamma; Ϊ = 均 are the same as those described in the first embodiment. (Second embodiment) The structure of the vacuum processing device of the embodiment is The vacuum processing load transfer path of the third embodiment is the vacuum processing load transfer path of the embodiment, the lower main 3 = the configuration form of the chamber and the reference mark of the substrate = _, and the two "pairs"; Processing the stacking 3〇0 will load/unload the 18 if.doc chamber 30 in the vacuum processing teach 200, dividing it into two chambers according to its function. In other words, the loading/unloading chamber 30 is divided into a loading chamber 50 for carrying out the processing of the substrate, and a loading chamber 50 for carrying out the processing, and carrying out the processed substrate to the unloading chamber 60 for the device=part. These two chambers. Both the loading chamber 5Q and the unloading chamber 60 can be switched between opening to the atmosphere and vacuum (4). The vacuum processing apparatus 300 sets the substrate transfer apparatuses n and 13 in the true-preparation heating chamber 40 &amp; and places the substrate transfer apparatus 21 in the electric-electrode chamber 20.

The transfer of the bandit w is two systems, that is, according to the arrow χ5, χ卜 =, x7, X, the path f plane is transmitted, and the transmission is performed according to the arrow χ5, χΐ, , : inverse two = right. The substrate device 51 at the loading chamber 50 can perform the vacuum heating chamber (4) in the direction of the performance of the head of the vacuum, and the transition between the wires and the feeding device u, ^, and the configuration can be used. For two systems. The tilting conveyance operation performed by the substrate transfer device u toward the board transport unit 21 is the first and the soil 7',

:; as for the head X3, the transport operation shown: m _the direction of the transfer is different, but the phase and effect of the substrate transport are both described and saved by the first and second embodiments. The substrate to be processed is sent to the mechanical cylinder (: mind: 5 乇 贯 保持 保持 保持 保持 上 和 和 和 和 和 和 和 和 和 和 和 , , , , , , , , , , , , , , , , , , , , , , Tilting 19 1309%_doc 70 : External devices 71, 72 : Substrate transfer device 80 : Drive control circuit 100 , 200 , 300 : Vacuum processing device A , B : Direction C : Rotation axis D D D2 , D3 : Arc E E E2 , E3 : Position G Bu G2 : Strict, type member Η: Heating parts U, L2, L3 : Transport line P : RF electrode R : Transfer roll ΊΠ, Τ 2, Τ 3 : State switching axis W, W1 W W3 : Substrate Processing) xl~χ8 : Transfer action (action) yl, y2, y3 : state switching action z: lifting action Θ : tilt angle 22

Claims (1)

13 09221 _u 17138pifl.doc No. 9 Chinese Patent Range No slash correction This revision period: January 17 98 B, X. Patent application scope: L type substrate transfer device, characterized in that the substrate transfer device includes: And transporting the transporting machine assembly facing the substrate to be processed or holding the substrate to be processed and holding the soil carrier; and the horizontal state and the tilting state between the horizontal state and the horizontal direction toward the transport direction The inclined cutting machine assembly for switching the conveying surface; and the conveying mechanism unit is horizontally beared or inclined 29 on the conveying surface (4): the processing button or the substrate holder is conveyed: 2. Vacuum treatment The apparatus, characterized in that the vacuum processing apparatus comprises: two or more interconnected processing chambers for performing continuous vacuum processing on the substrate to be processed; and other disposed at the at least two processing chambers, For example, please refer to the substrate transfer device described in item 1 of the patent stipulation; and transfer the substrates placed on the front line of the small oil 4 line, according to Substantially toward the conveyance surface - Choi inclined slope form to form a conveyance surface inclined configuration. / 3. The vacuum processing apparatus according to the second aspect of the patent application, comprising: a drive control circuit for causing the substrate transfer device disposed in the at least two processing chambers j to have a transfer surface, substantially facing each other The direction slope is inclined to form an inclined conveying surface. A vacuum processing apparatus, comprising: 23: a processing chamber for performing continuous vacuum processing on the substrate to be processed; and a plurality of processing chambers respectively disposed at the at least two processing chambers, such as an application The substrate transfer apparatus of the first aspect of the present invention, wherein each of the substrate transfer apparatuses provided in the processing chambers is configured such that the transfer surface is inclined substantially in one direction to form an inclined transport surface; Processing the substrate or the substrate holder into a loading chamber for performing a vacuum processing (4) processing chamber, and capable of switching between a large displacement and a straight space sealing; and implementing the substrate to be processed or the substrate holder Finally, the processing chamber for vacuum processing is recovered as a processed substrate, and can be = an unloading chamber that is switched between opening to the atmosphere and vacuum sealing. 5. A vacuum processing apparatus, characterized in that said vacuum processing comprises: two or more interconnected processing chambers for performing continuous vacuum processing on a substrate to be processed; respectively disposed in said at least two processing chambers The substrate transfer device according to the first aspect of the invention, wherein each of the substrate transfer devices provided at the at least two processing chambers is inclined in a direction substantially toward one direction to form a tilt transfer. Forming a surface; driving the control circuit such that each of the conveying surfaces of the substrate conveying device disposed at the at least two processing chambers is inclined at a slope in a general direction to form an inclined conveying surface; and the substrate to be processed or The substrate holder is placed in a processing chamber that performs the first processing process for vacuum processing, and is capable of switching between opening to the atmosphere and vacuum sealing; and the substrate to be processed or the aforementioned The substrate holder is implemented as a processed substrate at the processing chamber for performing the final vacuum processing. , And the unload chamber capable of being switched between closed and vacuum opened to the atmosphere. 6. The vacuum processing apparatus of claim 4, wherein the processing chamber also serves as the loading chamber or the unloading chamber. 7. A vacuum processing apparatus, comprising: two or more interconnected processing chambers for performing continuous vacuum processing on a substrate to be processed; and - respectively disposed at said at least two processing chambers The substrate transfer apparatus according to claim 1, wherein each of the substrate transfer apparatuses provided at the at least two processing chambers is inclined in such a manner that the transport surface is substantially inclined in one direction to form an inclined transport surface. And arranging the substrate to be processed or the substrate holder to be processed into a processing chamber for performing the first true processing, and the processing substrate or the substrate holder is subjected to a processing chamber for performing a final vacuum processing The reverse transfer is carried out to the processing chamber for performing the initial vacuum processing, and is recovered as a processed substrate, and is capable of being transferred to the transition chamber between the atmosphere opening and the vacuum sealing. &amp; A vacuum processing apparatus characterized by comprising: two or more interconnected processing chambers for performing continuous vacuum processing on a substrate to be processed; 25 130922§_.doc are respectively disposed in at least two of the foregoing The substrate transfer apparatus according to the first aspect of the invention, wherein each of the substrate transfer apparatuses provided at the at least two processing chambers is inclined in a direction substantially toward one direction to form a a configuration of the inclined transfer surface; the drive control circuit 'slanting the respective transfer faces of the substrate transfer device provided at the at least two processing chambers to a slope in a general direction to form an inclined transfer surface; and processing the aforementioned The substrate or the substrate holder is placed in a processing chamber for performing the initial vacuum processing, and the substrate to be processed or the substrate holder is reversely transported from the processing chamber for the final vacuum processing to the first vacuum processing. At the processing chamber, the recovery is carried out as a treated substrate, and _ is open to the atmosphere and true A transition chamber that switches between airtight closures. 9. The vacuum processing apparatus of claim 7 or 8, wherein the processing chamber also serves as the transition chamber. 26