TW200616176A - Packaged microchip with premolded-type package - Google Patents

Packaged microchip with premolded-type package

Info

Publication number
TW200616176A
TW200616176A TW094124427A TW94124427A TW200616176A TW 200616176 A TW200616176 A TW 200616176A TW 094124427 A TW094124427 A TW 094124427A TW 94124427 A TW94124427 A TW 94124427A TW 200616176 A TW200616176 A TW 200616176A
Authority
TW
Taiwan
Prior art keywords
isolator
substrate
package
cavity
inertial sensor
Prior art date
Application number
TW094124427A
Other languages
English (en)
Other versions
TWI336511B (en
Inventor
Maurice S Karpman
Nicole Hablutzel
Peter W Farrell
Michael W Judy
Lawrence E Felton
Lewis Long
Original Assignee
Analog Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Analog Devices Inc filed Critical Analog Devices Inc
Publication of TW200616176A publication Critical patent/TW200616176A/zh
Application granted granted Critical
Publication of TWI336511B publication Critical patent/TWI336511B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/3201—Structure
    • H01L2224/32012—Structure relative to the bonding area, e.g. bond pad
    • H01L2224/32014—Structure relative to the bonding area, e.g. bond pad the layer connector being smaller than the bonding area, e.g. bond pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/146—Mixed devices
    • H01L2924/1461—MEMS
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Gyroscopes (AREA)
  • Micromachines (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Pressure Sensors (AREA)
TW094124427A 2004-09-28 2005-07-20 Packaged microchip with premolded-type package TWI336511B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/952,424 US7166911B2 (en) 2002-09-04 2004-09-28 Packaged microchip with premolded-type package

Publications (2)

Publication Number Publication Date
TW200616176A true TW200616176A (en) 2006-05-16
TWI336511B TWI336511B (en) 2011-01-21

Family

ID=34978889

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124427A TWI336511B (en) 2004-09-28 2005-07-20 Packaged microchip with premolded-type package

Country Status (5)

Country Link
US (1) US7166911B2 (zh)
EP (1) EP1794081B1 (zh)
JP (2) JP4695652B2 (zh)
TW (1) TWI336511B (zh)
WO (1) WO2006036250A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110745772A (zh) * 2019-10-21 2020-02-04 重庆大学 一种mems应力隔离封装结构及其制造方法

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CN105277733B (zh) * 2014-06-27 2018-06-08 广芯电子技术（上海）股份有限公司 Mems加速度传感器的硅盖帽结构
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US20160229689A1 (en) * 2015-02-11 2016-08-11 Analog Devices, Inc. Packaged Microchip with Patterned Interposer
US10287161B2 (en) * 2015-07-23 2019-05-14 Analog Devices, Inc. Stress isolation features for stacked dies
US9625284B2 (en) 2015-09-04 2017-04-18 Honeywell International Inc Shock mount in environment sensor protector for non-isolated systems
US10131538B2 (en) 2015-09-14 2018-11-20 Analog Devices, Inc. Mechanically isolated MEMS device
ITUB20154017A1 (it) * 2015-09-30 2017-03-30 St Microelectronics Srl Dispositivo incapsulato di materiale semiconduttore a ridotta sensibilita' nei confronti di stress termo-meccanici
DE102015117736A1 (de) * 2015-10-19 2017-04-20 Endress+Hauser Gmbh+Co. Kg Druckmesseinrichtung
CN106744644A (zh) * 2016-10-11 2017-05-31 中国科学院地质与地球物理研究所 一种mems传感器低应力封装管壳及封装系统
JP7014012B2 (ja) * 2018-03-30 2022-02-01 三菱電機株式会社 半導体装置、半導体装置の製造方法および電力変換装置
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110745772A (zh) * 2019-10-21 2020-02-04 重庆大学 一种mems应力隔离封装结构及其制造方法
CN110745772B (zh) * 2019-10-21 2023-10-20 重庆大学 一种mems应力隔离封装结构及其制造方法

Also Published As

Publication number Publication date
TWI336511B (en) 2011-01-21
EP1794081B1 (en) 2017-01-25
JP2010101900A (ja) 2010-05-06
JP2008516196A (ja) 2008-05-15
US20050035446A1 (en) 2005-02-17
US7166911B2 (en) 2007-01-23
EP1794081A1 (en) 2007-06-13
JP4695652B2 (ja) 2011-06-08
WO2006036250A1 (en) 2006-04-06

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