TW200612533A - Flip chip quad flat non-leaded package structure and manufacturing method thereof - Google Patents

Flip chip quad flat non-leaded package structure and manufacturing method thereof

Info

Publication number
TW200612533A
TW200612533A TW093130514A TW93130514A TW200612533A TW 200612533 A TW200612533 A TW 200612533A TW 093130514 A TW093130514 A TW 093130514A TW 93130514 A TW93130514 A TW 93130514A TW 200612533 A TW200612533 A TW 200612533A
Authority
TW
Taiwan
Prior art keywords
chip
manufacturing
gold stud
stud bumps
bumps
Prior art date
Application number
TW093130514A
Other languages
English (en)
Other versions
TWI242279B (en
Inventor
Chia-Chieh Hu
Original Assignee
Advanced Semiconductor Eng
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Semiconductor Eng filed Critical Advanced Semiconductor Eng
Priority to TW93130514A priority Critical patent/TWI242279B/zh
Application granted granted Critical
Publication of TWI242279B publication Critical patent/TWI242279B/zh
Publication of TW200612533A publication Critical patent/TW200612533A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16245—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic

Landscapes

  • Wire Bonding (AREA)
TW93130514A 2004-10-08 2004-10-08 Flip chip quad flat non-leaded package structure and manufacturing method thereof TWI242279B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW93130514A TWI242279B (en) 2004-10-08 2004-10-08 Flip chip quad flat non-leaded package structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW93130514A TWI242279B (en) 2004-10-08 2004-10-08 Flip chip quad flat non-leaded package structure and manufacturing method thereof

Publications (2)

Publication Number Publication Date
TWI242279B TWI242279B (en) 2005-10-21
TW200612533A true TW200612533A (en) 2006-04-16

Family

ID=37021522

Family Applications (1)

Application Number Title Priority Date Filing Date
TW93130514A TWI242279B (en) 2004-10-08 2004-10-08 Flip chip quad flat non-leaded package structure and manufacturing method thereof

Country Status (1)

Country Link
TW (1) TWI242279B (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393223B (zh) * 2009-03-03 2013-04-11 Advanced Semiconductor Eng 半導體封裝結構及其製造方法
CN110164833A (zh) * 2019-06-04 2019-08-23 广东气派科技有限公司 一种芯片散热片的封装方法及芯片封装产品
TWI828054B (zh) * 2022-01-28 2024-01-01 群創光電股份有限公司 電子裝置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI393223B (zh) * 2009-03-03 2013-04-11 Advanced Semiconductor Eng 半導體封裝結構及其製造方法
CN110164833A (zh) * 2019-06-04 2019-08-23 广东气派科技有限公司 一种芯片散热片的封装方法及芯片封装产品
TWI828054B (zh) * 2022-01-28 2024-01-01 群創光電股份有限公司 電子裝置

Also Published As

Publication number Publication date
TWI242279B (en) 2005-10-21

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