TW200611991A - Solution vaporizing CVD apparatus - Google Patents
Solution vaporizing CVD apparatusInfo
- Publication number
- TW200611991A TW200611991A TW094106953A TW94106953A TW200611991A TW 200611991 A TW200611991 A TW 200611991A TW 094106953 A TW094106953 A TW 094106953A TW 94106953 A TW94106953 A TW 94106953A TW 200611991 A TW200611991 A TW 200611991A
- Authority
- TW
- Taiwan
- Prior art keywords
- tube
- kinds
- vaporizing
- orifice tube
- material solutions
- Prior art date
Links
- 230000008016 vaporization Effects 0.000 title abstract 6
- 239000000463 material Substances 0.000 abstract 6
- 239000012159 carrier gas Substances 0.000 abstract 2
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4412—Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4486—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by producing an aerosol and subsequent evaporation of the droplets or particles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004290087A JP3896594B2 (ja) | 2004-10-01 | 2004-10-01 | Cvd用気化器、溶液気化式cvd装置及びcvd用気化方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200611991A true TW200611991A (en) | 2006-04-16 |
TWI265978B TWI265978B (en) | 2006-11-11 |
Family
ID=35521158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094106953A TWI265978B (en) | 2004-10-01 | 2005-03-08 | Solution-vaporization type CVD apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US20060070575A1 (zh) |
EP (1) | EP1643003A1 (zh) |
JP (1) | JP3896594B2 (zh) |
KR (1) | KR100654400B1 (zh) |
CN (1) | CN1754982A (zh) |
TW (1) | TWI265978B (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2900070B1 (fr) * | 2006-04-19 | 2008-07-11 | Kemstream Soc Par Actions Simp | Dispositif d'introduction ou d'injection ou de pulverisation d'un melange de gaz vecteur et de composes liquides et procede de mise en oeuvre dudit dispositif. |
JP2007308774A (ja) * | 2006-05-19 | 2007-11-29 | Utec:Kk | 薄膜形成装置、及び薄膜形成方法 |
FR2900071B1 (fr) * | 2006-08-24 | 2009-02-13 | Kemstream Soc Par Actions Simp | Dispositif d'introduction ou d'injection ou de pulverisation d'un melange de gaz vecteur et de composes liquides et procede de mise en oeuvre dudit dispositif |
JP5427344B2 (ja) | 2007-05-23 | 2014-02-26 | 株式会社渡辺商行 | 気化装置、及び、気化装置を備えた成膜装置 |
JP2008294190A (ja) * | 2007-05-24 | 2008-12-04 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2009239082A (ja) * | 2008-03-27 | 2009-10-15 | Tokyo Electron Ltd | ガス供給装置、処理装置及び処理方法 |
JP5422177B2 (ja) * | 2008-11-11 | 2014-02-19 | ルネサスエレクトロニクス株式会社 | 成膜装置の再稼働方法 |
US9353625B2 (en) * | 2009-01-13 | 2016-05-31 | General Electric Technology Gmbh | Device for cleaning oxidized or corroded components in the presence of a halogenous gas mixture |
FI20115236A0 (fi) * | 2011-03-09 | 2011-03-09 | Beneq Oy | Pinnoitusmenetelmä, laite ja käyttö |
JP5720406B2 (ja) * | 2011-05-10 | 2015-05-20 | 東京エレクトロン株式会社 | ガス供給装置、熱処理装置、ガス供給方法及び熱処理方法 |
KR101678100B1 (ko) * | 2015-02-12 | 2016-11-22 | (주)티티에스 | 원료 공급기 및 기판 처리 장치 |
JP6578125B2 (ja) * | 2015-04-30 | 2019-09-18 | 株式会社フジキン | 気化供給装置 |
CN113692641A (zh) | 2019-04-17 | 2021-11-23 | 株式会社威尔康 | 气化器和其制造方法 |
CN113058342B (zh) * | 2021-04-13 | 2022-10-28 | 西安航空制动科技有限公司 | 一种便于在线实时清理的cvd炉过滤装置 |
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JPS60100501A (ja) | 1983-11-08 | 1985-06-04 | Sankyo Co Ltd | 水中崩壊拡展性の良好な農薬粒剤 |
JP2767284B2 (ja) | 1989-06-06 | 1998-06-18 | 日立電子エンジニアリング株式会社 | 液状半導体形成材料気化供給装置 |
US5362328A (en) * | 1990-07-06 | 1994-11-08 | Advanced Technology Materials, Inc. | Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem |
DE69218152T2 (de) * | 1991-12-26 | 1997-08-28 | Canon Kk | Herstellungsverfahren einer niedergeschlagenen Schicht mittels CVD, unter Verwendung von flüssigem Rohstoff und dazu geeignete Vorrichtung |
KR940011791B1 (ko) * | 1992-04-15 | 1994-12-26 | 금성일렉트론주식회사 | 온도안정화 매스 플로우 컨트롤러 센서 |
JPH05297955A (ja) * | 1992-04-20 | 1993-11-12 | Nec Corp | マスフローコントローラー |
US6047713A (en) * | 1994-02-03 | 2000-04-11 | Applied Materials, Inc. | Method for cleaning a throttle valve |
US5620524A (en) * | 1995-02-27 | 1997-04-15 | Fan; Chiko | Apparatus for fluid delivery in chemical vapor deposition systems |
US5876503A (en) | 1996-11-27 | 1999-03-02 | Advanced Technology Materials, Inc. | Multiple vaporizer reagent supply system for chemical vapor deposition utilizing dissimilar precursor compositions |
US6409839B1 (en) * | 1997-06-02 | 2002-06-25 | Msp Corporation | Method and apparatus for vapor generation and film deposition |
US20030101938A1 (en) * | 1998-10-27 | 2003-06-05 | Applied Materials, Inc. | Apparatus for the deposition of high dielectric constant films |
JP3470055B2 (ja) | 1999-01-22 | 2003-11-25 | 株式会社渡邊商行 | Mocvd用気化器及び原料溶液の気化方法 |
JP2000252271A (ja) * | 1999-03-03 | 2000-09-14 | Ebara Corp | 成膜装置 |
JP3335603B2 (ja) * | 1999-12-22 | 2002-10-21 | 積水化学工業株式会社 | 放電プラズマ薄膜製造装置 |
US6596085B1 (en) * | 2000-02-01 | 2003-07-22 | Applied Materials, Inc. | Methods and apparatus for improved vaporization of deposition material in a substrate processing system |
US6572706B1 (en) * | 2000-06-19 | 2003-06-03 | Simplus Systems Corporation | Integrated precursor delivery system |
JP4002060B2 (ja) | 2000-09-26 | 2007-10-31 | 株式会社島津製作所 | 液体材料供給装置 |
JP3850651B2 (ja) * | 2000-09-26 | 2006-11-29 | 株式会社島津製作所 | 気化器 |
JP2002134497A (ja) * | 2000-10-23 | 2002-05-10 | Sony Corp | 半導体装置の製造方法 |
JP4614252B2 (ja) * | 2001-02-15 | 2011-01-19 | キヤノンアネルバ株式会社 | 基板処理装置及びこれに用いられるコンピュータプログラム |
JP2003066633A (ja) * | 2001-08-28 | 2003-03-05 | Konica Corp | 有機感光体の塗布装置、塗布方法及び有機感光体 |
AU2002346665A1 (en) * | 2001-12-04 | 2003-06-17 | Primaxx, Inc. | Chemical vapor deposition vaporizer |
JP2003273030A (ja) * | 2002-03-18 | 2003-09-26 | Watanabe Shoko:Kk | Cvd薄膜堆積の方法 |
JP2003297828A (ja) * | 2002-04-01 | 2003-10-17 | Seiko Epson Corp | 強誘電体膜の成膜方法及び成膜装置 |
JP3822135B2 (ja) | 2002-05-13 | 2006-09-13 | 日本パイオニクス株式会社 | 気化供給装置 |
US7192486B2 (en) * | 2002-08-15 | 2007-03-20 | Applied Materials, Inc. | Clog-resistant gas delivery system |
JP4759916B2 (ja) * | 2002-12-13 | 2011-08-31 | 東京エレクトロン株式会社 | 処理装置 |
JP4192008B2 (ja) * | 2003-02-18 | 2008-12-03 | 株式会社渡辺商行 | 気化器及び気化器の洗浄方法並びに気化器を用いた装置 |
JP2004256510A (ja) * | 2003-02-26 | 2004-09-16 | Toyoshima Seisakusho:Kk | Cvd用ビスマス原料溶液及びこれを用いたビスマス含有薄膜の製造方法 |
JP2004273766A (ja) * | 2003-03-07 | 2004-09-30 | Watanabe Shoko:Kk | 気化装置及びそれを用いた成膜装置並びに気化方法及び成膜方法 |
-
2004
- 2004-10-01 JP JP2004290087A patent/JP3896594B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-08 TW TW094106953A patent/TWI265978B/zh not_active IP Right Cessation
- 2005-03-10 KR KR1020050020175A patent/KR100654400B1/ko not_active IP Right Cessation
- 2005-03-11 CN CNA2005100547283A patent/CN1754982A/zh active Pending
- 2005-03-14 US US11/079,723 patent/US20060070575A1/en not_active Abandoned
- 2005-09-30 EP EP05292037A patent/EP1643003A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
US20060070575A1 (en) | 2006-04-06 |
TWI265978B (en) | 2006-11-11 |
JP3896594B2 (ja) | 2007-03-22 |
CN1754982A (zh) | 2006-04-05 |
JP2006108230A (ja) | 2006-04-20 |
KR20060043838A (ko) | 2006-05-15 |
EP1643003A1 (en) | 2006-04-05 |
KR100654400B1 (ko) | 2006-12-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |