TW200611783A - Polishing pad - Google Patents

Polishing pad

Info

Publication number
TW200611783A
TW200611783A TW094125626A TW94125626A TW200611783A TW 200611783 A TW200611783 A TW 200611783A TW 094125626 A TW094125626 A TW 094125626A TW 94125626 A TW94125626 A TW 94125626A TW 200611783 A TW200611783 A TW 200611783A
Authority
TW
Taiwan
Prior art keywords
range
polishing pad
pad body
pad
rate
Prior art date
Application number
TW094125626A
Other languages
English (en)
Inventor
Toshihiro Izumi
Jun Tamura
Takuya Nagamine
Takashi Arahata
Original Assignee
Nippon Micro Coating Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Micro Coating Kk filed Critical Nippon Micro Coating Kk
Publication of TW200611783A publication Critical patent/TW200611783A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628—Nonplanar uniform thickness material
    • Y10T428/24669—Aligned or parallel nonplanarities

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW094125626A 2004-10-14 2005-07-28 Polishing pad TW200611783A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004299838A JP2006110665A (ja) 2004-10-14 2004-10-14 研磨パッド

Publications (1)

Publication Number Publication Date
TW200611783A true TW200611783A (en) 2006-04-16

Family

ID=36148166

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125626A TW200611783A (en) 2004-10-14 2005-07-28 Polishing pad

Country Status (7)

Country Link
US (1) US20060229000A1 (zh)
EP (1) EP1800800A4 (zh)
JP (1) JP2006110665A (zh)
KR (1) KR100804344B1 (zh)
CN (1) CN1905991A (zh)
TW (1) TW200611783A (zh)
WO (1) WO2006040864A1 (zh)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005007520A (ja) * 2003-06-19 2005-01-13 Nihon Micro Coating Co Ltd 研磨パッド及びその製造方法並びに研磨方法
JP5288715B2 (ja) * 2007-03-14 2013-09-11 東洋ゴム工業株式会社 研磨パッド
JP2008290197A (ja) * 2007-05-25 2008-12-04 Nihon Micro Coating Co Ltd 研磨パッド及び方法
JP5078527B2 (ja) * 2007-09-28 2012-11-21 富士紡ホールディングス株式会社 研磨布
CN107199502A (zh) * 2008-04-23 2017-09-26 日立化成株式会社 研磨剂、研磨剂组件及使用该研磨剂的基板研磨方法
JP2010118424A (ja) * 2008-11-12 2010-05-27 Disco Abrasive Syst Ltd 薄板状ワークの搬送装置
JP5404107B2 (ja) * 2009-03-10 2014-01-29 キヤノン株式会社 研磨工具
JP5276502B2 (ja) * 2009-04-03 2013-08-28 東洋ゴム工業株式会社 研磨パッド及びその製造方法
TWI410299B (zh) 2009-08-24 2013-10-01 Bestac Advanced Material Co Ltd 研磨墊與其應用及其製造方法
CN102029571B (zh) * 2009-09-24 2015-07-29 贝达先进材料股份有限公司 研磨垫与其应用和其制造方法
JP5528169B2 (ja) 2010-03-26 2014-06-25 東洋ゴム工業株式会社 研磨パッドおよびその製造方法、ならびに半導体デバイスの製造方法
WO2012056512A1 (ja) 2010-10-26 2012-05-03 東洋ゴム工業株式会社 研磨パッド及びその製造方法
KR101491530B1 (ko) 2010-10-26 2015-02-09 도요 고무 고교 가부시키가이샤 연마 패드 및 그 제조 방법
KR101532990B1 (ko) * 2011-09-22 2015-07-01 도요 고무 고교 가부시키가이샤 연마 패드
KR101267982B1 (ko) * 2011-12-13 2013-05-27 삼성코닝정밀소재 주식회사 반도체 기판의 연마방법 및 반도체 기판의 연마장치
WO2013129426A1 (ja) * 2012-02-27 2013-09-06 東レ株式会社 研磨パッド
US9156125B2 (en) * 2012-04-11 2015-10-13 Cabot Microelectronics Corporation Polishing pad with light-stable light-transmitting region
WO2016123505A1 (en) * 2015-01-30 2016-08-04 Applied Materials, Inc. Multi-layered nano-fibrous cmp pads
KR102463863B1 (ko) * 2015-07-20 2022-11-04 삼성전자주식회사 연마용 조성물 및 이를 이용한 반도체 장치의 제조 방법
JP2018524193A (ja) * 2015-07-30 2018-08-30 ジェイエイチ ローデス カンパニー， インコーポレイテッド ポリマーラップ加工材料、ポリマーラップ加工材料を含む媒体およびシステム、およびそれらを形成し使用する方法
JP2018029142A (ja) * 2016-08-18 2018-02-22 株式会社クラレ 研磨パッド及びそれを用いた研磨方法
CN111818835A (zh) * 2018-03-13 2020-10-23 3M创新有限公司 地板刷毛刷组件
JP7264775B2 (ja) * 2019-09-03 2023-04-25 エヌ・ティ・ティ・アドバンステクノロジ株式会社 光コネクタ研磨用パッド
KR102309564B1 (ko) * 2020-02-25 2021-10-07 주식회사 세한텍 유리 시트 연마 휠 및 그 제조 방법
CN112338820B (zh) * 2020-10-27 2021-10-29 湖北鼎汇微电子材料有限公司 一种抛光垫及其制备方法、应用
CN112720282B (zh) * 2020-12-31 2022-04-08 湖北鼎汇微电子材料有限公司 一种抛光垫
CN112809550B (zh) * 2020-12-31 2022-04-22 湖北鼎汇微电子材料有限公司 一种抛光垫

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5514245A (en) * 1992-01-27 1996-05-07 Micron Technology, Inc. Method for chemical planarization (CMP) of a semiconductor wafer to provide a planar surface free of microscratches
JP2000263423A (ja) * 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP2001198795A (ja) * 2000-01-12 2001-07-24 Mitsubishi Materials Corp 研磨装置
JP4591980B2 (ja) * 2000-02-22 2010-12-01 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
CN100379522C (zh) * 2000-12-01 2008-04-09 东洋橡膠工业株式会社 研磨垫及其制造方法和研磨垫用缓冲层
JP2002343749A (ja) * 2001-05-11 2002-11-29 Ntn Corp ポリッシング定盤および研磨品製造方法
JP2004025407A (ja) * 2002-06-27 2004-01-29 Jsr Corp 化学機械研磨用研磨パッド
US7579071B2 (en) * 2002-09-17 2009-08-25 Korea Polyol Co., Ltd. Polishing pad containing embedded liquid microelements and method of manufacturing the same
US6848977B1 (en) * 2003-08-29 2005-02-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad for electrochemical mechanical polishing

Also Published As

Publication number Publication date
JP2006110665A (ja) 2006-04-27
EP1800800A1 (en) 2007-06-27
KR20060080201A (ko) 2006-07-07
US20060229000A1 (en) 2006-10-12
WO2006040864A1 (ja) 2006-04-20
EP1800800A4 (en) 2010-10-20
KR100804344B1 (ko) 2008-02-15
CN1905991A (zh) 2007-01-31

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