TW200610592A - Methods for wet cleaning quartz surfaces of components for plasma processing chambers - Google Patents
Methods for wet cleaning quartz surfaces of components for plasma processing chambersInfo
- Publication number
- TW200610592A TW200610592A TW094119085A TW94119085A TW200610592A TW 200610592 A TW200610592 A TW 200610592A TW 094119085 A TW094119085 A TW 094119085A TW 94119085 A TW94119085 A TW 94119085A TW 200610592 A TW200610592 A TW 200610592A
- Authority
- TW
- Taiwan
- Prior art keywords
- methods
- components
- plasma processing
- wet cleaning
- processing chambers
- Prior art date
Links
- 239000010453 quartz Substances 0.000 title abstract 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title abstract 5
- 238000004140 cleaning Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title abstract 2
- 239000002253 acid Substances 0.000 abstract 2
- 239000000243 solution Substances 0.000 abstract 2
- 239000003637 basic solution Substances 0.000 abstract 1
- 239000000356 contaminant Substances 0.000 abstract 1
- 239000003960 organic solvent Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32798—Further details of plasma apparatus not provided for in groups H01J37/3244 - H01J37/32788; special provisions for cleaning or maintenance of the apparatus
- H01J37/32853—Hygiene
- H01J37/32862—In situ cleaning of vessels and/or internal parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Metallurgy (AREA)
- Public Health (AREA)
- Plasma & Fusion (AREA)
- Epidemiology (AREA)
- Analytical Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Organic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
- Cleaning In General (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/863,360 US20050274396A1 (en) | 2004-06-09 | 2004-06-09 | Methods for wet cleaning quartz surfaces of components for plasma processing chambers |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200610592A true TW200610592A (en) | 2006-04-01 |
TWI364327B TWI364327B (en) | 2012-05-21 |
Family
ID=35459232
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094119085A TWI364327B (en) | 2004-06-09 | 2005-06-09 | Methods for wet cleaning quartz surfaces of components for plasma processing chambers |
Country Status (8)
Country | Link |
---|---|
US (2) | US20050274396A1 (zh) |
EP (1) | EP1753549A4 (zh) |
JP (1) | JP4648392B2 (zh) |
KR (1) | KR20070033419A (zh) |
CN (1) | CN101194046B (zh) |
IL (1) | IL179875A0 (zh) |
TW (1) | TWI364327B (zh) |
WO (1) | WO2005123282A2 (zh) |
Cited By (2)
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US9079228B2 (en) | 2009-12-18 | 2015-07-14 | Lam Research Corporation | Methodology for cleaning of surface metal contamination from an upper electrode used in a plasma chamber |
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- 2005-06-03 EP EP05756207A patent/EP1753549A4/en not_active Withdrawn
- 2005-06-03 JP JP2007527594A patent/JP4648392B2/ja active Active
- 2005-06-03 CN CN2005800240998A patent/CN101194046B/zh active Active
- 2005-06-09 TW TW094119085A patent/TWI364327B/zh active
-
2006
- 2006-12-06 IL IL179875A patent/IL179875A0/en unknown
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2011
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TWI400133B (zh) * | 2008-11-14 | 2013-07-01 | Lg Display Co Ltd | 清洗裝置 |
US9362146B2 (en) | 2008-11-14 | 2016-06-07 | Lg Display Co., Ltd. | Washing device |
US10217651B2 (en) | 2008-11-14 | 2019-02-26 | Lg Display Co., Ltd. | Washing device |
US9079228B2 (en) | 2009-12-18 | 2015-07-14 | Lam Research Corporation | Methodology for cleaning of surface metal contamination from an upper electrode used in a plasma chamber |
Also Published As
Publication number | Publication date |
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KR20070033419A (ko) | 2007-03-26 |
TWI364327B (en) | 2012-05-21 |
US20110146909A1 (en) | 2011-06-23 |
EP1753549A2 (en) | 2007-02-21 |
CN101194046B (zh) | 2011-04-13 |
US20050274396A1 (en) | 2005-12-15 |
WO2005123282A3 (en) | 2008-02-21 |
IL179875A0 (en) | 2007-05-15 |
EP1753549A4 (en) | 2009-09-16 |
WO2005123282A2 (en) | 2005-12-29 |
JP4648392B2 (ja) | 2011-03-09 |
CN101194046A (zh) | 2008-06-04 |
JP2008506530A (ja) | 2008-03-06 |
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