TW200609340A - Thermally conductive composition - Google Patents

Thermally conductive composition

Info

Publication number
TW200609340A
TW200609340A TW094125272A TW94125272A TW200609340A TW 200609340 A TW200609340 A TW 200609340A TW 094125272 A TW094125272 A TW 094125272A TW 94125272 A TW94125272 A TW 94125272A TW 200609340 A TW200609340 A TW 200609340A
Authority
TW
Taiwan
Prior art keywords
thermally conductive
conductive composition
central portion
conductive filler
giving
Prior art date
Application number
TW094125272A
Other languages
English (en)
Inventor
Yuji Hiroshige
Toshihiro Kasai
Yoshinao Yamazaki
Kiyoshi Tadokoro
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of TW200609340A publication Critical patent/TW200609340A/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
TW094125272A 2004-07-27 2005-07-26 Thermally conductive composition TW200609340A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004219054A JP2006036931A (ja) 2004-07-27 2004-07-27 熱伝導性組成物

Publications (1)

Publication Number Publication Date
TW200609340A true TW200609340A (en) 2006-03-16

Family

ID=35197872

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094125272A TW200609340A (en) 2004-07-27 2005-07-26 Thermally conductive composition

Country Status (7)

Country Link
US (1) US20070249755A1 (zh)
EP (1) EP1773925A1 (zh)
JP (1) JP2006036931A (zh)
KR (1) KR20070046147A (zh)
CN (1) CN1989190A (zh)
TW (1) TW200609340A (zh)
WO (1) WO2006019751A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008222776A (ja) * 2007-03-09 2008-09-25 Shin Etsu Chem Co Ltd 熱伝導性シリコーングリース組成物
US8586650B2 (en) 2007-09-14 2013-11-19 Henkel US IP LLC Thermally conductive composition
EP2201079B1 (en) * 2007-09-14 2017-08-23 Henkel AG & Co. KGaA Thermally conductive composition
DE102008025484A1 (de) * 2008-05-28 2009-12-03 Siemens Aktiengesellschaft Wärmeleitfähiger Verbundwerkstoff mit Aluminium-Pulver, Verfahren zum Herstellen des Verbundwerkstoffs und Verwendung des Verbundwerkstoffs
US8618211B2 (en) 2009-03-16 2013-12-31 Dow Corning Corporation Thermally conductive grease and methods and devices in which said grease is used
US8709538B1 (en) 2009-09-29 2014-04-29 The Boeing Company Substantially aligned boron nitride nano-element arrays and methods for their use and preparation
US9469790B2 (en) * 2009-09-29 2016-10-18 The Boeing Company Adhesive compositions comprising electrically insulating-coated carbon-based particles and methods for their use and preparation
DE102009055765A1 (de) * 2009-09-30 2011-03-31 Osram Opto Semiconductors Gmbh Optisches oder optoelektronisches Bauelement und Verfahren zu dessen Herstellung
CN103842421B (zh) * 2011-10-14 2017-10-13 默克专利股份有限公司 导热性自支撑片材
US9353245B2 (en) 2014-08-18 2016-05-31 3M Innovative Properties Company Thermally conductive clay
US20170114455A1 (en) * 2015-10-26 2017-04-27 Jones Tech (USA), Inc. Thermally conductive composition with ceramic-coated electrically conductive filler
US10782078B2 (en) 2016-09-13 2020-09-22 Bgt Materials Limited Heat dissipation coating layer and manufacturing method thereof
CN106433035B (zh) * 2016-10-18 2018-11-20 中国科学院深圳先进技术研究院 一种铝基填充热界面复合材料及其制备方法与应用
KR102322289B1 (ko) * 2017-01-03 2021-11-05 현대자동차주식회사 방열성 복합소재 및 이를 포함하는 수냉식 배터리 시스템
JP7123525B2 (ja) * 2017-03-23 2022-08-23 東洋アルミニウム株式会社 放熱性フィラーおよびそれを含む放熱性樹脂組成物、放熱性フィラーの製造方法
DE102017210200A1 (de) * 2017-06-19 2018-12-20 Osram Gmbh Substrat zum aufnehmen eines optoelektronischen bauelements, optoelektronische baugruppe, verfahren zum herstellen eines substrats und verfahren zum herstellen einer optoelektronischen baugruppe
JP2020147631A (ja) * 2019-03-11 2020-09-17 デクセリアルズ株式会社 熱伝導性材料
CN109909494B (zh) * 2019-03-14 2021-05-04 昆山市中迪新材料技术有限公司 一种高导热粉体及其制备方法和应用

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US3701758A (en) * 1967-08-02 1972-10-31 Nat Starch Chem Corp Pressure-sensitive adhesives of cyanoacrylate polymers
GB1603205A (en) * 1977-04-12 1981-11-18 Raychem Ltd Polymer compositions
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JPH06907B2 (ja) * 1984-07-16 1994-01-05 日本石油化学株式会社 接着剤
US4886689A (en) * 1986-08-29 1989-12-12 Ausimont, U.S.A., Inc. Matrix-matrix polyblend adhesives and method of bonding incompatible polymers
ATE142557T1 (de) * 1989-05-11 1996-09-15 Landec Corp Von der temperatur aktivierte bindemitteleinheiten
US5399432A (en) * 1990-06-08 1995-03-21 Potters Industries, Inc. Galvanically compatible conductive filler and methods of making same
US5470622A (en) * 1990-11-06 1995-11-28 Raychem Corporation Enclosing a substrate with a heat-recoverable article
AU1441692A (en) * 1991-02-12 1992-09-07 Landec Corporation Temperature zone specific pressure-sensitive adhesive compositions, and adhesive assemblies and methods of use associated therewith
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US5589714A (en) * 1992-06-08 1996-12-31 The Dow Chemical Company Epoxy polymer filled with aluminum nitride-containing polymer and semiconductor devices encapsulated with a thermosetting resin containing aluminum nitride particles
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US6776835B2 (en) * 1998-08-14 2004-08-17 Merck Patent Gesellschaft Mit Beschrankter Haftung Multilayer pigments based on coated metal platelets
US6710103B2 (en) * 2001-09-27 2004-03-23 Basf Corporation Curable, powder-based coating composition including a color effect-providing pigment
EP1342763B1 (en) * 2002-02-27 2008-09-24 Nitto Denko Corporation Acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive tape

Also Published As

Publication number Publication date
US20070249755A1 (en) 2007-10-25
JP2006036931A (ja) 2006-02-09
EP1773925A1 (en) 2007-04-18
KR20070046147A (ko) 2007-05-02
WO2006019751A1 (en) 2006-02-23
CN1989190A (zh) 2007-06-27

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