TW200608036A - Pretreatment method, pretreatment device, method and device for electric inspection of conductor pattern, inspected printed circuit board and semiconductor device - Google Patents

Pretreatment method, pretreatment device, method and device for electric inspection of conductor pattern, inspected printed circuit board and semiconductor device

Info

Publication number
TW200608036A
TW200608036A TW094116823A TW94116823A TW200608036A TW 200608036 A TW200608036 A TW 200608036A TW 094116823 A TW094116823 A TW 094116823A TW 94116823 A TW94116823 A TW 94116823A TW 200608036 A TW200608036 A TW 200608036A
Authority
TW
Taiwan
Prior art keywords
pretreatment
conductor pattern
circuit board
printed circuit
inspection
Prior art date
Application number
TW094116823A
Other languages
English (en)
Chinese (zh)
Inventor
Kazuo Ikuta
Original Assignee
Mitsui Mining & Smelting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co filed Critical Mitsui Mining & Smelting Co
Publication of TW200608036A publication Critical patent/TW200608036A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
TW094116823A 2004-08-26 2005-05-24 Pretreatment method, pretreatment device, method and device for electric inspection of conductor pattern, inspected printed circuit board and semiconductor device TW200608036A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004247174A JP4481111B2 (ja) 2004-08-26 2004-08-26 導体パターンの電気検査用前処理方法、導体パターンの電気検査方法、導体パターンの電気検査用前処理装置、導体パターンの電気検査装置、検査済みプリント配線板、及び検査済み半導体装置

Publications (1)

Publication Number Publication Date
TW200608036A true TW200608036A (en) 2006-03-01

Family

ID=36112825

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094116823A TW200608036A (en) 2004-08-26 2005-05-24 Pretreatment method, pretreatment device, method and device for electric inspection of conductor pattern, inspected printed circuit board and semiconductor device

Country Status (3)

Country Link
JP (1) JP4481111B2 (ko)
KR (1) KR20060046257A (ko)
TW (1) TW200608036A (ko)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684921B (zh) * 2017-07-19 2020-02-11 日商紐富來科技股份有限公司 圖案檢查裝置及圖案檢查方法
CN116223515A (zh) * 2023-05-05 2023-06-06 成都中航华测科技有限公司 一种用于电路板测试过程的导电图形缺陷检测方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100834113B1 (ko) * 2006-11-10 2008-06-02 아주하이텍(주) 자동 광학 검사 시스템
JP5127681B2 (ja) * 2008-11-26 2013-01-23 日東電工株式会社 配線回路基板の製造方法
KR20110133157A (ko) * 2010-06-04 2011-12-12 삼성전기주식회사 회로 기판 및 회로 기판의 불량 처리 장치
JP5721553B2 (ja) * 2011-06-16 2015-05-20 富士機械製造株式会社 多数枚取り基板の生産管理方法
JP5797240B2 (ja) * 2013-08-12 2015-10-21 太洋工業株式会社 プリント基板検査装置
JP6413494B2 (ja) * 2014-08-28 2018-10-31 住友電気工業株式会社 導電性インクの焼成方法及びプリント配線板用基板の製造方法
JP7042179B2 (ja) * 2018-07-19 2022-03-25 セイコータイムクリエーション株式会社 リードフレームの検査装置
JP7438907B2 (ja) 2020-09-23 2024-02-27 東芝テック株式会社 電装品
CN115988737B (zh) * 2023-03-21 2023-08-25 广州添利电子科技有限公司 一种检验自动光学检测机检测能力的验证板及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI684921B (zh) * 2017-07-19 2020-02-11 日商紐富來科技股份有限公司 圖案檢查裝置及圖案檢查方法
CN116223515A (zh) * 2023-05-05 2023-06-06 成都中航华测科技有限公司 一种用于电路板测试过程的导电图形缺陷检测方法

Also Published As

Publication number Publication date
KR20060046257A (ko) 2006-05-17
JP4481111B2 (ja) 2010-06-16
JP2006066624A (ja) 2006-03-09

Similar Documents

Publication Publication Date Title
TW200608036A (en) Pretreatment method, pretreatment device, method and device for electric inspection of conductor pattern, inspected printed circuit board and semiconductor device
TW200641377A (en) Apparatus and method for testing component built in circuit board
WO2015035016A3 (en) High current interconnect system and method for use in a battery module
ATE549902T1 (de) Buchse, leiterplattenbaugruppe und vorrichtung damit
TW200627562A (en) Chip electrical connection structure and fabrication method thereof
WO2010048653A3 (de) Verfahren zur integration eines elektronischen bauteils in eine leiterplatte
ATE557576T1 (de) Leiterplatine mit elektronischem bauelement
TW200634915A (en) Manufacturing method of semiconductor device, semiconductor device, circuit board, electro-optic device, and electronic apparatus
TW200629998A (en) Printed circuit board and forming method thereof
TWI256128B (en) Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus
TW200640315A (en) Electrically connecting structure of circuit board and method for fabricating same
IN2014CN04038A (ko)
EP2086297A3 (en) Printed circuit board and method of manufacturing the same
TW200607414A (en) Method for producing conductive patterns on printed circuit boards
WO2009037145A3 (de) Verfahren zur herstellung einer elektronischen baugruppe sowie elektronische baugruppe
MX2016006636A (es) Tarjeta de circuito impreso, circuito y metodo para producir un circuito.
WO2012092092A3 (en) A method and apparatus for mounting electronic components on an antenna structure
WO2010040161A3 (de) Schaltvorrichtung zur elektrischen kontaktprüfung
MY151656A (en) Printed substrate through which very strong currents can pass and corresponding production method
TW200723972A (en) Circuit board module and forming method thereof
FR2969899B1 (fr) Circuit imprime a substrat metallique isole
WO2012064095A3 (ko) 발광모듈
DE502008001773D1 (de) Verfahren zur herstellung einer leiterplatte mit einer kavität für die integration von bauteilen
WO2007131648A3 (de) Elektrischer sensor und dessen herstellung und verwendung
HK1158382A1 (en) Plug connector for circuit boards