TW200607653A - Liquid ejection element and manufacturing method therefor - Google Patents

Liquid ejection element and manufacturing method therefor

Info

Publication number
TW200607653A
TW200607653A TW094124154A TW94124154A TW200607653A TW 200607653 A TW200607653 A TW 200607653A TW 094124154 A TW094124154 A TW 094124154A TW 94124154 A TW94124154 A TW 94124154A TW 200607653 A TW200607653 A TW 200607653A
Authority
TW
Taiwan
Prior art keywords
substrate
manufacturing
liquid ejection
method therefor
ejection element
Prior art date
Application number
TW094124154A
Other languages
English (en)
Other versions
TWI273983B (en
Inventor
Hirokazu Komuro
Original Assignee
Canon Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Kk filed Critical Canon Kk
Publication of TW200607653A publication Critical patent/TW200607653A/zh
Application granted granted Critical
Publication of TWI273983B publication Critical patent/TWI273983B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14088—Structure of heating means
    • B41J2/14112—Resistive element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B41J2/1603—Production of bubble jet print heads of the front shooter type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1628—Manufacturing processes etching dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1632—Manufacturing processes machining
    • B41J2/1634—Manufacturing processes machining laser machining
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet
TW094124154A 2004-07-16 2005-07-15 Liquid ejection element and manufacturing method therefor TWI273983B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004210086A JP4274554B2 (ja) 2004-07-16 2004-07-16 素子基板および液体吐出素子の形成方法

Publications (2)

Publication Number Publication Date
TW200607653A true TW200607653A (en) 2006-03-01
TWI273983B TWI273983B (en) 2007-02-21

Family

ID=35598986

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124154A TWI273983B (en) 2004-07-16 2005-07-15 Liquid ejection element and manufacturing method therefor

Country Status (5)

Country Link
US (1) US7757397B2 (zh)
JP (1) JP4274554B2 (zh)
KR (1) KR100790605B1 (zh)
CN (1) CN100418773C (zh)
TW (1) TWI273983B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4274554B2 (ja) 2004-07-16 2009-06-10 キヤノン株式会社 素子基板および液体吐出素子の形成方法
JP4274555B2 (ja) * 2004-07-16 2009-06-10 キヤノン株式会社 液体吐出素子基板の製造方法および液体吐出素子の製造方法
JP4274556B2 (ja) * 2004-07-16 2009-06-10 キヤノン株式会社 液体吐出素子の製造方法
JP2008012911A (ja) * 2006-06-07 2008-01-24 Canon Inc 液体吐出ヘッド、及び液体吐出ヘッドの製造方法
JP5371475B2 (ja) * 2009-02-17 2013-12-18 キヤノン株式会社 インクジェット記録ヘッド及びそのクリーニング方法
US11161351B2 (en) 2018-09-28 2021-11-02 Canon Kabushiki Kaisha Liquid ejection head

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0729431B2 (ja) * 1986-03-04 1995-04-05 キヤノン株式会社 液体噴射記録ヘツドの作成方法
JPH0729433B2 (ja) * 1986-03-05 1995-04-05 キヤノン株式会社 液体噴射記録ヘツドの作成方法
US4791440A (en) * 1987-05-01 1988-12-13 International Business Machine Corporation Thermal drop-on-demand ink jet print head
JP2846636B2 (ja) * 1987-12-02 1999-01-13 キヤノン株式会社 インクジェット記録ヘッド用基板の作製方法
AU657930B2 (en) * 1991-01-30 1995-03-30 Canon Kabushiki Kaisha Nozzle structures for bubblejet print devices
JP2960608B2 (ja) 1992-06-04 1999-10-12 キヤノン株式会社 液体噴射記録ヘッドの製造方法
JP3143307B2 (ja) 1993-02-03 2001-03-07 キヤノン株式会社 インクジェット記録ヘッドの製造方法
US6190005B1 (en) * 1993-11-19 2001-02-20 Canon Kabushiki Kaisha Method for manufacturing an ink jet head
JP3343875B2 (ja) 1995-06-30 2002-11-11 キヤノン株式会社 インクジェットヘッドの製造方法
JPH0924612A (ja) 1995-07-11 1997-01-28 Canon Inc インクジェットヘッド
US5994205A (en) * 1997-02-03 1999-11-30 Kabushiki Kaisha Toshiba Method of separating semiconductor devices
JPH11320873A (ja) * 1997-06-05 1999-11-24 Ricoh Co Ltd インクジェットヘッド
US6013534A (en) * 1997-07-25 2000-01-11 The United States Of America As Represented By The National Security Agency Method of thinning integrated circuits received in die form
JP3726469B2 (ja) 1998-02-13 2005-12-14 セイコーエプソン株式会社 インクジェット式記録ヘッドの製造方法
JP2000052549A (ja) * 1998-08-06 2000-02-22 Ricoh Co Ltd インクジェットヘッド用アクチュエータ及び該アクチュエータを用いたインクジェットヘッド
JP2000177122A (ja) 1998-12-14 2000-06-27 Ricoh Co Ltd インクジェットヘッド及びその製造方法
JP2000222711A (ja) * 1999-01-28 2000-08-11 Alps Electric Co Ltd 薄膜磁気ヘッドの製造方法および製造装置
EP1065059B1 (en) * 1999-07-02 2007-01-31 Canon Kabushiki Kaisha Method for producing liquid discharge head, liquid discharge head, head cartridge, liquid discharging recording apparatus, method for producing silicon plate and silicon plate
JP2001171111A (ja) 1999-12-15 2001-06-26 Seiko Epson Corp インクジェットヘッドの製造方法
JP2001315337A (ja) * 2000-05-01 2001-11-13 Fuji Xerox Co Ltd インクジェット記録ヘッド、インクジェット記録装置及びヘッド作製方法
JP2001315370A (ja) * 2000-05-02 2001-11-13 Fujita Masashi サーマルプリントヘッド及びその製造方法
JP2001322276A (ja) * 2000-05-15 2001-11-20 Fuji Xerox Co Ltd インクジェット記録ヘッド、インクジェット記録装置及びヘッド作製方法
KR20020009828A (ko) * 2000-07-27 2002-02-02 윤종용 잉크 젯 프린트 헤드의 비아홀 형성방법
JP2002052709A (ja) * 2000-08-11 2002-02-19 Hitachi Koki Co Ltd インクジェットヘッドのハウジング構造
JP2002067328A (ja) 2000-08-28 2002-03-05 Casio Comput Co Ltd 記録ヘッド
JP2002301824A (ja) 2001-04-05 2002-10-15 Fuji Xerox Co Ltd インクジェット記録ヘッドおよびその作製方法、ならびにインクジェット記録装置
JP4136523B2 (ja) * 2001-08-10 2008-08-20 キヤノン株式会社 液体吐出ヘッドの製造方法、液体吐出ヘッド用基板および基板加工方法
CN1408550A (zh) * 2001-09-28 2003-04-09 飞赫科技股份有限公司 压电式喷墨打印头及其制造方法
JP3783781B2 (ja) 2002-07-04 2006-06-07 セイコーエプソン株式会社 液体噴射ヘッドの製造方法
US7381341B2 (en) * 2002-07-04 2008-06-03 Seiko Epson Corporation Method of manufacturing liquid jet head
JP2004181651A (ja) 2002-11-29 2004-07-02 Seiko Epson Corp 液体吐出ヘッドの製造方法並びに液体吐出ヘッド及びこれを備えたデバイスの製造装置、インクジェット式記録装置
JP4274556B2 (ja) * 2004-07-16 2009-06-10 キヤノン株式会社 液体吐出素子の製造方法
JP4274555B2 (ja) * 2004-07-16 2009-06-10 キヤノン株式会社 液体吐出素子基板の製造方法および液体吐出素子の製造方法
JP4274554B2 (ja) 2004-07-16 2009-06-10 キヤノン株式会社 素子基板および液体吐出素子の形成方法

Also Published As

Publication number Publication date
KR20060050197A (ko) 2006-05-19
US20060012641A1 (en) 2006-01-19
JP2006027108A (ja) 2006-02-02
JP4274554B2 (ja) 2009-06-10
TWI273983B (en) 2007-02-21
KR100790605B1 (ko) 2008-01-02
US7757397B2 (en) 2010-07-20
CN100418773C (zh) 2008-09-17
CN1721189A (zh) 2006-01-18

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees