TW200605767A - Lightweight heat sink - Google Patents
Lightweight heat sinkInfo
- Publication number
- TW200605767A TW200605767A TW094112135A TW94112135A TW200605767A TW 200605767 A TW200605767 A TW 200605767A TW 094112135 A TW094112135 A TW 094112135A TW 94112135 A TW94112135 A TW 94112135A TW 200605767 A TW200605767 A TW 200605767A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat sink
- base portion
- lightweight heat
- heat
- disposable
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56774504P | 2004-05-03 | 2004-05-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200605767A true TW200605767A (en) | 2006-02-01 |
Family
ID=34960360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094112135A TW200605767A (en) | 2004-05-03 | 2005-04-15 | Lightweight heat sink |
Country Status (3)
Country | Link |
---|---|
US (1) | US7147041B2 (zh) |
TW (1) | TW200605767A (zh) |
WO (1) | WO2005112533A2 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI514119B (zh) * | 2010-06-09 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | 電子元件冷卻裝置 |
TWI643298B (zh) * | 2016-08-02 | 2018-12-01 | 美商高通公司 | 多層散熱裝置及設備 |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7748439B2 (en) * | 2004-04-13 | 2010-07-06 | Headway Technologies, Inc. | Heat extractor for magnetic reader-writer |
AT501252B1 (de) * | 2004-12-23 | 2008-02-15 | Chemiefaser Lenzing Ag | Cellulosischer formkörper und verfahren zu seiner herstellung |
US20070133177A1 (en) * | 2005-12-14 | 2007-06-14 | International Business Machines Corporation | Flexing chip heatsink |
TWI300802B (en) * | 2005-12-23 | 2008-09-11 | Foxconn Tech Co Ltd | Thermal interface material and semiconductor device |
US7176707B1 (en) | 2006-02-23 | 2007-02-13 | Lockheed Martin Corporation | Back side component placement and bonding |
US20070215323A1 (en) * | 2006-03-17 | 2007-09-20 | Inventec Corporation | Heat-dissipating structure |
US20070247851A1 (en) * | 2006-04-21 | 2007-10-25 | Villard Russel G | Light Emitting Diode Lighting Package With Improved Heat Sink |
US7705238B2 (en) * | 2006-05-22 | 2010-04-27 | Andrew Llc | Coaxial RF device thermally conductive polymer insulator and method of manufacture |
TW200814264A (en) * | 2006-09-07 | 2008-03-16 | Univ Nat Central | Heat sink structure for sub package substrate |
WO2008122942A1 (en) * | 2007-04-05 | 2008-10-16 | Koninklijke Philips Electronics N.V. | Radiator and luminary |
KR100910227B1 (ko) * | 2007-09-10 | 2009-07-31 | 주식회사 하이닉스반도체 | 반도체 모듈용 냉각 유닛 |
US20090175006A1 (en) * | 2008-01-09 | 2009-07-09 | Rong-Yuan Jou | Honeycomb heat dissipating apparatus |
US20090321045A1 (en) * | 2008-06-30 | 2009-12-31 | Alcatel-Lucent Technologies Inc. | Monolithic structurally complex heat sink designs |
CN101762200B (zh) * | 2008-12-23 | 2013-03-06 | 富瑞精密组件(昆山)有限公司 | 电子装置及其散热装置与散热片 |
ITMI20090251A1 (it) * | 2009-02-24 | 2010-08-25 | Dmt System S P A Ovvero Dmts S P A | Dissipatore di calore a ventilazione forzata, particolarmente per dispositivi elettronici di alta potenza. |
FR2949181B1 (fr) * | 2009-08-14 | 2017-02-24 | Splitted Desktop Systems | Dissipateur thermique pour composants electroniques et methode d'assemblage associee |
US8289712B2 (en) * | 2010-06-21 | 2012-10-16 | International Business Machines Corporation | Flux-free detachable thermal interface between an integrated circuit device and a heat sink |
US8459831B2 (en) * | 2010-08-30 | 2013-06-11 | Lightel Technologies, Inc. | Linear solid-state lighting free of shock hazard |
CN102095322B (zh) * | 2010-11-25 | 2014-05-14 | 中国矿业大学 | 一种蜂窝结构蒸发及冷凝装置 |
US20130058042A1 (en) * | 2011-09-03 | 2013-03-07 | Todd Richard Salamon | Laminated heat sinks |
JP6004222B2 (ja) * | 2012-03-30 | 2016-10-05 | パナソニックIpマネジメント株式会社 | ヒートシンク、及び、空気調和装置 |
US9059129B2 (en) * | 2012-09-27 | 2015-06-16 | Hamilton Sundstrand Corporation | Micro-die natural convection cooling system |
JP6262422B2 (ja) * | 2012-10-02 | 2018-01-17 | 昭和電工株式会社 | 冷却装置および半導体装置 |
CN105027278A (zh) * | 2013-03-07 | 2015-11-04 | 住友电木株式会社 | 装置、粘合剂用组合物、粘合片 |
TW201503494A (zh) * | 2013-04-24 | 2015-01-16 | Molex Inc | 具有熱表面的連接器系統 |
US9826623B2 (en) * | 2013-05-22 | 2017-11-21 | Kaneka Corporation | Heat dissipating structure |
US9029949B2 (en) * | 2013-09-25 | 2015-05-12 | International Business Machines Corporation | Semiconductor-on-insulator (SOI) structures with local heat dissipater(s) and methods |
DE202013104990U1 (de) * | 2013-11-06 | 2015-02-09 | Akg Thermotechnik International Gmbh & Co. Kg | Kühlkörper |
JP2014090209A (ja) * | 2014-01-17 | 2014-05-15 | Panasonic Corp | ヒートシンク、及び、空気調和装置 |
US9660573B2 (en) | 2015-01-05 | 2017-05-23 | Globalfoundries Inc. | Passive solar panel cooling |
FR3033518B1 (fr) * | 2015-03-13 | 2019-09-06 | C.T.I.F. Centre Technique Des Industries De La Fonderie | Milieux architectures en metal ou en alliage |
US10371462B2 (en) | 2015-09-21 | 2019-08-06 | Lockheed Martin Corporation | Integrated multi-chamber heat exchanger |
US10527362B2 (en) * | 2015-09-21 | 2020-01-07 | Lockheed Martin Corporation | Integrated multi-chamber heat exchanger |
EP3163611B1 (en) * | 2015-11-02 | 2021-06-30 | ABB Schweiz AG | Power electronic assembly |
US9596788B1 (en) * | 2015-11-26 | 2017-03-14 | Chung-Ping Lai | Hexagonal boron nitride heat dissipation structure |
FR3045226B1 (fr) * | 2015-12-15 | 2017-12-22 | Schneider Electric Ind Sas | Dispositif de refroidissement de gaz chauds dans un appareillage haute tension |
US11014303B1 (en) | 2017-06-21 | 2021-05-25 | Space Systems/Loral, Llc | Additive manufacturing on-orbit |
JP2019096702A (ja) * | 2017-11-21 | 2019-06-20 | トヨタ自動車株式会社 | 冷却器 |
US20190289745A1 (en) * | 2018-03-13 | 2019-09-19 | Rosemount Aerospace Inc. | Flexible heat sink for aircraft electronic units |
US11858665B1 (en) | 2019-03-12 | 2024-01-02 | Maxar Space Llc | Deployment mechanism with integral actuation device |
US11351738B2 (en) | 2019-08-06 | 2022-06-07 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11364688B2 (en) | 2019-08-06 | 2022-06-21 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11230066B2 (en) | 2019-08-06 | 2022-01-25 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11292204B2 (en) | 2019-08-06 | 2022-04-05 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11358344B2 (en) | 2019-08-06 | 2022-06-14 | The Boeiog Company | Induction welding using a heat sink and/or cooling |
US11458691B2 (en) * | 2019-08-06 | 2022-10-04 | The Boeing Company | Induction welding using a heat sink and/or cooling |
US11524467B2 (en) | 2019-08-06 | 2022-12-13 | The Boeing Company | Induction welding using a heat sink and/or cooling |
CN111935964B (zh) * | 2020-10-12 | 2021-01-26 | 上海大陆天瑞激光表面工程有限公司 | 一种定向导热带 |
US11539175B2 (en) | 2020-12-23 | 2022-12-27 | Megaphase, Llc | High power coaxial adapters and connectors |
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CN2594989Y (zh) * | 2001-11-29 | 2003-12-24 | 王清风 | 可提高热交换效率的热交换鳍片板 |
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DE60229072D1 (de) | 2002-02-06 | 2008-11-06 | Parker Hannifin Corp | Wärmesteuerungsmaterialien mit phasenumwandlungsdispersion |
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-
2005
- 2005-01-28 US US11/046,143 patent/US7147041B2/en not_active Expired - Fee Related
- 2005-01-31 WO PCT/US2005/002758 patent/WO2005112533A2/en active Application Filing
- 2005-04-15 TW TW094112135A patent/TW200605767A/zh unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI514119B (zh) * | 2010-06-09 | 2015-12-21 | Hon Hai Prec Ind Co Ltd | 電子元件冷卻裝置 |
TWI643298B (zh) * | 2016-08-02 | 2018-12-01 | 美商高通公司 | 多層散熱裝置及設備 |
Also Published As
Publication number | Publication date |
---|---|
WO2005112533A2 (en) | 2005-11-24 |
US7147041B2 (en) | 2006-12-12 |
US20050241801A1 (en) | 2005-11-03 |
WO2005112533A3 (en) | 2009-03-12 |
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