TW200605302A - Semiconductor memory device - Google Patents

Semiconductor memory device

Info

Publication number
TW200605302A
TW200605302A TW094118861A TW94118861A TW200605302A TW 200605302 A TW200605302 A TW 200605302A TW 094118861 A TW094118861 A TW 094118861A TW 94118861 A TW94118861 A TW 94118861A TW 200605302 A TW200605302 A TW 200605302A
Authority
TW
Taiwan
Prior art keywords
impurity diffusion
diffusion area
gate
gate electrode
charge storing
Prior art date
Application number
TW094118861A
Other languages
English (en)
Chinese (zh)
Other versions
TWI366898B (enExample
Inventor
Fukashi Morishita
Kazutami Arimoto
Original Assignee
Renesas Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Tech Corp filed Critical Renesas Tech Corp
Publication of TW200605302A publication Critical patent/TW200605302A/zh
Application granted granted Critical
Publication of TWI366898B publication Critical patent/TWI366898B/zh

Links

Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/405—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with three charge-transfer gates, e.g. MOS transistors, per cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B12/00—Dynamic random access memory [DRAM] devices
    • H10B12/20—DRAM devices comprising floating-body transistors, e.g. floating-body cells
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C2211/00—Indexing scheme relating to digital stores characterized by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C2211/401—Indexing scheme relating to cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C2211/4016—Memory devices with silicon-on-insulator cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
TW094118861A 2004-06-09 2005-06-08 Semiconductor memory device TW200605302A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004170920 2004-06-09

Publications (2)

Publication Number Publication Date
TW200605302A true TW200605302A (en) 2006-02-01
TWI366898B TWI366898B (enExample) 2012-06-21

Family

ID=35503374

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094118861A TW200605302A (en) 2004-06-09 2005-06-08 Semiconductor memory device

Country Status (6)

Country Link
US (2) US7910975B2 (enExample)
JP (1) JP5027503B2 (enExample)
KR (1) KR20110113215A (enExample)
CN (1) CN1965404B (enExample)
TW (1) TW200605302A (enExample)
WO (1) WO2005122244A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10460770B2 (en) 2018-03-22 2019-10-29 Toshiba Memory Corporation Semiconductor memory device

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4964225B2 (ja) * 2006-03-01 2012-06-27 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP5068035B2 (ja) * 2006-05-11 2012-11-07 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP5078338B2 (ja) * 2006-12-12 2012-11-21 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP5217042B2 (ja) * 2007-07-06 2013-06-19 ルネサスエレクトロニクス株式会社 半導体記憶装置
JP5420345B2 (ja) * 2009-08-14 2014-02-19 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP2011071173A (ja) 2009-09-24 2011-04-07 Elpida Memory Inc 半導体装置、半導体装置の製造方法および半導体装置の制御方法
SG11201404871TA (en) * 2012-02-16 2014-09-26 Zeno Semiconductor Inc Memory cell comprising first and second transistors and methods of operating
JP6429011B2 (ja) * 2014-11-13 2018-11-28 パナソニックＩｐマネジメント株式会社 インモールド成型用転写フィルム及びその製造方法
US10347320B1 (en) * 2017-12-28 2019-07-09 Micron Technology, Inc. Controlling discharge of a control gate voltage
JP2021044519A (ja) * 2019-09-13 2021-03-18 キオクシア株式会社 半導体装置
JP2022136400A (ja) * 2021-03-08 2022-09-21 キオクシア株式会社 半導体装置
WO2022269740A1 (ja) * 2021-06-22 2022-12-29 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置
WO2023170755A1 (ja) * 2022-03-07 2023-09-14 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置
KR20230134385A (ko) * 2022-03-14 2023-09-21 에스케이하이닉스 주식회사 기록 트랜지스터 및 판독 트랜지스터를 포함하는 반도체 장치
WO2025062621A1 (ja) * 2023-09-22 2025-03-27 ユニサンティス エレクトロニクス シンガポール プライベート リミテッド 半導体素子を用いたメモリ装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5912842A (en) * 1995-11-14 1999-06-15 Programmable Microelectronics Corp. Nonvolatile PMOS two transistor memory cell and array
US5767549A (en) * 1996-07-03 1998-06-16 International Business Machines Corporation SOI CMOS structure
JP3353875B2 (ja) * 1997-01-20 2002-12-03 シャープ株式会社 Ｓｏｉ・ｍｏｓ電界効果トランジスタ
JP2002246600A (ja) * 2001-02-13 2002-08-30 Mitsubishi Electric Corp 半導体装置及びその製造方法
JP3884266B2 (ja) * 2001-02-19 2007-02-21 株式会社東芝 半導体メモリ装置及びその製造方法
JP2002260381A (ja) 2001-02-28 2002-09-13 Toshiba Corp 半導体メモリ装置
JP3808763B2 (ja) * 2001-12-14 2006-08-16 株式会社東芝 半導体メモリ装置およびその製造方法
US6687154B2 (en) * 2002-02-25 2004-02-03 Aplus Flash Technology, Inc. Highly-integrated flash memory and mask ROM array architecture
JP4044401B2 (ja) * 2002-09-11 2008-02-06 株式会社東芝 半導体記憶装置
US7098499B2 (en) * 2004-08-16 2006-08-29 Chih-Hsin Wang Electrically alterable non-volatile memory cell
US7700993B2 (en) * 2007-11-05 2010-04-20 International Business Machines Corporation CMOS EPROM and EEPROM devices and programmable CMOS inverters

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10460770B2 (en) 2018-03-22 2019-10-29 Toshiba Memory Corporation Semiconductor memory device
TWI694572B (zh) * 2018-03-22 2020-05-21 日商東芝記憶體股份有限公司 半導體記憶裝置
US10854244B2 (en) 2018-03-22 2020-12-01 Toshiba Memory Corporation Semiconductor memory device
CN115968205A (zh) * 2018-03-22 2023-04-14 铠侠股份有限公司 半导体存储装置

Also Published As

Publication number Publication date
US20080251860A1 (en) 2008-10-16
JP5027503B2 (ja) 2012-09-19
US20110127609A1 (en) 2011-06-02
CN1965404B (zh) 2010-05-26
US7910975B2 (en) 2011-03-22
CN1965404A (zh) 2007-05-16
JPWO2005122244A1 (ja) 2008-04-10
TWI366898B (enExample) 2012-06-21
WO2005122244A1 (ja) 2005-12-22
KR20110113215A (ko) 2011-10-14
US8188534B2 (en) 2012-05-29

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Legal Events

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