TW200603219A - Circuit board, method of producing the circuit board and display device having the circuit board - Google Patents
Circuit board, method of producing the circuit board and display device having the circuit boardInfo
- Publication number
- TW200603219A TW200603219A TW094110241A TW94110241A TW200603219A TW 200603219 A TW200603219 A TW 200603219A TW 094110241 A TW094110241 A TW 094110241A TW 94110241 A TW94110241 A TW 94110241A TW 200603219 A TW200603219 A TW 200603219A
- Authority
- TW
- Taiwan
- Prior art keywords
- resin film
- circuit board
- photosensitive resin
- producing
- exposed
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 239000011347 resin Substances 0.000 abstract 7
- 229920005989 resin Polymers 0.000 abstract 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 abstract 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 abstract 1
- 238000000137 annealing Methods 0.000 abstract 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 238000005530 etching Methods 0.000 abstract 1
- 229910052731 fluorine Inorganic materials 0.000 abstract 1
- 239000011737 fluorine Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 238000009832 plasma treatment Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 abstract 1
- 238000004528 spin coating Methods 0.000 abstract 1
- 239000000126 substance Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/481—Insulating layers on insulating parts, with or without metallisation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136286—Wiring, e.g. gate line, drain line
- G02F1/136295—Materials; Compositions; Manufacture processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0568—Resist used for applying paste, ink or powder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/09—Treatments involving charged particles
- H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49155—Manufacturing circuit on or in base
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Liquid Crystal (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004108559 | 2004-03-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200603219A true TW200603219A (en) | 2006-01-16 |
Family
ID=35064169
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094110241A TW200603219A (en) | 2004-03-31 | 2005-03-31 | Circuit board, method of producing the circuit board and display device having the circuit board |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070209200A1 (zh) |
JP (1) | JPWO2005096684A1 (zh) |
KR (1) | KR20070007172A (zh) |
CN (1) | CN1947478A (zh) |
TW (1) | TW200603219A (zh) |
WO (1) | WO2005096684A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400583B (zh) * | 2008-02-15 | 2013-07-01 | Psk Inc | Substrate manufacturing method |
TWI458568B (zh) * | 2011-07-19 | 2014-11-01 | Innolux Corp | 利用紫外光改質表面特性之方法 |
TWI732450B (zh) * | 2019-03-20 | 2021-07-01 | 日商斯庫林集團股份有限公司 | 基板處理方法、半導體製造方法以及基板處理裝置 |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008016444A (ja) * | 2006-06-09 | 2008-01-24 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
KR20090024244A (ko) * | 2006-06-09 | 2009-03-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제작 방법 |
JP5102467B2 (ja) | 2006-06-29 | 2012-12-19 | 東京エレクトロン株式会社 | 基板処理方法 |
JP2008103653A (ja) * | 2006-09-22 | 2008-05-01 | Tohoku Univ | 半導体装置及び半導体装置の製造方法 |
JP5329038B2 (ja) * | 2006-12-21 | 2013-10-30 | 宇部日東化成株式会社 | 半導体装置及び半導体装置の製造方法 |
CN101765869A (zh) * | 2007-10-23 | 2010-06-30 | 夏普株式会社 | 显示装置和显示装置的制造方法 |
KR100968949B1 (ko) * | 2008-05-19 | 2010-07-14 | 삼성전기주식회사 | 인쇄 회로 패턴 형성 방법, 가이드 형성 방법 및 가이드형성용 잉크 |
US20110198117A1 (en) * | 2008-08-25 | 2011-08-18 | Kanto Gakuin University Surface Engineering Research Institute | Laminate and process for producing the laminate |
CN101965103B (zh) * | 2010-04-20 | 2012-04-18 | 力帆实业(集团)股份有限公司 | 一种印刷电路板封装方法 |
KR101148112B1 (ko) * | 2010-07-15 | 2012-05-23 | 엘지이노텍 주식회사 | 액정표시장치용 인쇄판 및 그 제조방법 |
KR20120090594A (ko) * | 2011-02-08 | 2012-08-17 | 삼성전자주식회사 | 고분자 전극의 제조방법 및 고분자 전극을 채용한 고분자 구동기 |
US10934408B2 (en) * | 2014-04-09 | 2021-03-02 | Shanghai Institute Of Ceramics, Chinese Academy Of Sciences | Surface modification method for polyether-ether-ketone material |
CN106561070B (zh) * | 2015-10-06 | 2019-06-11 | 鹏鼎控股(深圳)股份有限公司 | 柔性电路板制作方法 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4797178A (en) * | 1987-05-13 | 1989-01-10 | International Business Machines Corporation | Plasma etch enhancement with large mass inert gas |
JP2700316B2 (ja) * | 1987-06-10 | 1998-01-21 | 三菱電機株式会社 | 有機物質表面の改質方法 |
JPH06347637A (ja) * | 1993-06-14 | 1994-12-22 | Dainippon Ink & Chem Inc | 印刷方法 |
JP3074634B2 (ja) * | 1994-03-28 | 2000-08-07 | 三菱瓦斯化学株式会社 | フォトレジスト用剥離液及び配線パターンの形成方法 |
US5650453A (en) * | 1995-04-28 | 1997-07-22 | General Electric Company | UV curable epoxysilicone blend compositions |
US5853953A (en) * | 1996-09-06 | 1998-12-29 | Shipley Company, L.L.C. | Polymers and photoresist compositions comprising same |
JP2002055222A (ja) * | 2000-08-11 | 2002-02-20 | Canon Inc | 光学素子とその製造方法、液晶素子 |
TW533446B (en) * | 2000-12-22 | 2003-05-21 | Koninkl Philips Electronics Nv | Electroluminescent device and a method of manufacturing thereof |
JP3698138B2 (ja) * | 2001-12-26 | 2005-09-21 | セイコーエプソン株式会社 | 撥水化処理の方法、薄膜形成方法及びこの方法を用いた有機el装置の製造方法、有機el装置、電子機器 |
TWI273352B (en) * | 2002-01-24 | 2007-02-11 | Jsr Corp | Radiation sensitive composition for forming an insulating film, insulating film and display device |
US6984476B2 (en) * | 2002-04-15 | 2006-01-10 | Sharp Kabushiki Kaisha | Radiation-sensitive resin composition, forming process for forming patterned insulation film, active matrix board and flat-panel display device equipped with the same, and process for producing flat-panel display device |
-
2005
- 2005-03-30 JP JP2006511760A patent/JPWO2005096684A1/ja not_active Withdrawn
- 2005-03-30 KR KR1020067022701A patent/KR20070007172A/ko not_active Application Discontinuation
- 2005-03-30 CN CNA2005800131721A patent/CN1947478A/zh active Pending
- 2005-03-30 WO PCT/JP2005/006150 patent/WO2005096684A1/ja active Application Filing
- 2005-03-30 US US10/594,596 patent/US20070209200A1/en not_active Abandoned
- 2005-03-31 TW TW094110241A patent/TW200603219A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI400583B (zh) * | 2008-02-15 | 2013-07-01 | Psk Inc | Substrate manufacturing method |
TWI458568B (zh) * | 2011-07-19 | 2014-11-01 | Innolux Corp | 利用紫外光改質表面特性之方法 |
TWI732450B (zh) * | 2019-03-20 | 2021-07-01 | 日商斯庫林集團股份有限公司 | 基板處理方法、半導體製造方法以及基板處理裝置 |
Also Published As
Publication number | Publication date |
---|---|
CN1947478A (zh) | 2007-04-11 |
KR20070007172A (ko) | 2007-01-12 |
US20070209200A1 (en) | 2007-09-13 |
WO2005096684A1 (ja) | 2005-10-13 |
JPWO2005096684A1 (ja) | 2008-02-21 |
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