TW200602279A - Scribing apparatus and scribing method employing scribing apparatus - Google Patents

Scribing apparatus and scribing method employing scribing apparatus

Info

Publication number
TW200602279A
TW200602279A TW094102891A TW94102891A TW200602279A TW 200602279 A TW200602279 A TW 200602279A TW 094102891 A TW094102891 A TW 094102891A TW 94102891 A TW94102891 A TW 94102891A TW 200602279 A TW200602279 A TW 200602279A
Authority
TW
Taiwan
Prior art keywords
scribing
substrate
planed
scribe
line
Prior art date
Application number
TW094102891A
Other languages
English (en)
Chinese (zh)
Other versions
TWI344947B (enExample
Inventor
Takeki Nishisaka
Koji Yamamoto
Masato Matsumoto
Noboru Hanesaka
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200602279A publication Critical patent/TW200602279A/zh
Application granted granted Critical
Publication of TWI344947B publication Critical patent/TWI344947B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Liquid Crystal (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
TW094102891A 2004-02-02 2005-01-31 Scribing apparatus and scribing method employing scribing apparatus TW200602279A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004059787A JP4615231B2 (ja) 2004-02-02 2004-02-02 スクライブ装置およびこの装置を用いたスクライブ方法

Publications (2)

Publication Number Publication Date
TW200602279A true TW200602279A (en) 2006-01-16
TWI344947B TWI344947B (enExample) 2011-07-11

Family

ID=34909178

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094102891A TW200602279A (en) 2004-02-02 2005-01-31 Scribing apparatus and scribing method employing scribing apparatus

Country Status (2)

Country Link
JP (1) JP4615231B2 (enExample)
TW (1) TW200602279A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406828B (zh) * 2007-09-27 2013-09-01 Mitsuboshi Diamond Ind Co Ltd Method for processing brittle material substrates
CN115697621A (zh) * 2020-05-28 2023-02-03 通快机床欧洲股份公司 激光切割方法和激光切割设备

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8624157B2 (en) 2006-05-25 2014-01-07 Electro Scientific Industries, Inc. Ultrashort laser pulse wafer scribing
JP5185557B2 (ja) * 2007-03-30 2013-04-17 三菱重工業株式会社 管体の残留応力改善装置
US20090085254A1 (en) * 2007-09-28 2009-04-02 Anatoli Anatolyevich Abramov Laser scoring with flat profile beam
JP5074272B2 (ja) * 2008-04-15 2012-11-14 株式会社リンクスタージャパン 脆性材料基板の加工装置および切断方法
JP5220465B2 (ja) * 2008-04-15 2013-06-26 株式会社リンクスタージャパン 脆性材料基板の加工装置および加工方法
CN102686354B (zh) * 2009-03-20 2015-11-25 康宁股份有限公司 精密激光刻痕
US8932510B2 (en) 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8720228B2 (en) 2010-08-31 2014-05-13 Corning Incorporated Methods of separating strengthened glass substrates
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
CN106830658B (zh) * 2016-12-26 2019-04-16 上海科弦精密工具有限公司 一种平面镜刀具
CN112123591B (zh) * 2020-09-11 2022-06-14 湖北华恒景利建材有限公司 一种蒸压加气混凝土砌块底皮切除装置
CN114454240B (zh) * 2022-04-11 2022-06-17 中国空气动力研究与发展中心高速空气动力研究所 一种激波管膜片的划刻装置及划刻方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62104692A (ja) * 1985-11-01 1987-05-15 Fuji Electric Corp Res & Dev Ltd レ−ザ加工装置
JPH0390826A (ja) * 1989-09-04 1991-04-16 Toshiba Corp レーザビーム測定・監視装置
JP2520052B2 (ja) * 1990-04-19 1996-07-31 松下電工株式会社 エネルギ―ビ―ム接合方法
JPH079177A (ja) * 1993-06-25 1995-01-13 Honda Motor Co Ltd レーザービーム成形装置
JPH09155851A (ja) * 1995-12-07 1997-06-17 Sumitomo Heavy Ind Ltd ファインセラミックス加工装置
JPH1058177A (ja) * 1996-08-20 1998-03-03 Sony Corp レーザ加工機
WO2000053365A1 (en) * 1999-03-05 2000-09-14 Mitsubishi Denki Kabushiki Kaisha Laser machining apparatus
JP4112745B2 (ja) * 1999-06-02 2008-07-02 松下電器産業株式会社 レーザーラインパターンニング方法
JP2001209003A (ja) * 2000-01-26 2001-08-03 Mitsubishi Heavy Ind Ltd レーザ加工装置
JP2003112281A (ja) * 2001-09-28 2003-04-15 Matsushita Electric Ind Co Ltd レーザ加工装置とこれを用いた生産設備
JP4408607B2 (ja) * 2002-06-11 2010-02-03 三星ダイヤモンド工業株式会社 スクライブ方法及びスクライブ装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI406828B (zh) * 2007-09-27 2013-09-01 Mitsuboshi Diamond Ind Co Ltd Method for processing brittle material substrates
CN115697621A (zh) * 2020-05-28 2023-02-03 通快机床欧洲股份公司 激光切割方法和激光切割设备

Also Published As

Publication number Publication date
JP4615231B2 (ja) 2011-01-19
JP2005212473A (ja) 2005-08-11
TWI344947B (enExample) 2011-07-11

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MM4A Annulment or lapse of patent due to non-payment of fees