TW200600479A - Apparatus for cutting nonmetallic substrate and method thereof - Google Patents

Apparatus for cutting nonmetallic substrate and method thereof

Info

Publication number
TW200600479A
TW200600479A TW094115268A TW94115268A TW200600479A TW 200600479 A TW200600479 A TW 200600479A TW 094115268 A TW094115268 A TW 094115268A TW 94115268 A TW94115268 A TW 94115268A TW 200600479 A TW200600479 A TW 200600479A
Authority
TW
Taiwan
Prior art keywords
substrate
laser beam
cutting
short wavelength
nonmetallic
Prior art date
Application number
TW094115268A
Other languages
Chinese (zh)
Other versions
TWI294410B (en
Inventor
Kyu-Yong Bang
Jong-Wook Kim
Chang-Bok Lee
Young-Min Kim
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200600479A publication Critical patent/TW200600479A/en
Application granted granted Critical
Publication of TWI294410B publication Critical patent/TWI294410B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D33/00—Containers or accessories specially adapted for handling powdery toiletry or cosmetic substances
    • A45D33/20—Containers with movably mounted drawers
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
    • A45D40/22—Casings characterised by a hinged cover
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
    • A45D40/24—Casings for two or more cosmetics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D33/00—Containers or accessories specially adapted for handling powdery toiletry or cosmetic substances
    • A45D2033/001—Accessories
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
    • A45D40/22—Casings characterised by a hinged cover
    • A45D2040/225—Casings characterised by a hinged cover characterised by the opening or closing movement of the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

An apparatus for cutting a nonmetallic substrate and method thereof are disclosed. The present invention is suitable for cutting upper and lower substrates simultaneously or for cutting either an upper or lower substrate selectively in a manner of controlling a cutting depth by adjusting a focus position of a short wavelength laser beam in cutting various nonmetallic substrates such as a glass substrate for fabricating a flat panel display such as TFT-LCD, PDP, OLED, etc. The present invention includes a laser beam generator generating a UV short wavelength laser beam, a torch applying the short wavelength laser beam to a specific location on the nonmetallic substrate to be cut, a focus moving means for varying a focus location of the laser beam in a depth direction of the substrate, and a relative object moving means for allowing the substrate and the laser beam to make a relative movement to cut the substrate.
TW094115268A 2004-05-11 2005-05-11 Apparatus for cutting nonmetallic substrate and method thereof TWI294410B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040033078A KR100626554B1 (en) 2004-05-11 2004-05-11 Device for Cutting Glass Substrate in Manufacturing Process of Flat Type Display and Method for controlling depth of cutting for the Glass Substrate

Publications (2)

Publication Number Publication Date
TW200600479A true TW200600479A (en) 2006-01-01
TWI294410B TWI294410B (en) 2008-03-11

Family

ID=35320100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115268A TWI294410B (en) 2004-05-11 2005-05-11 Apparatus for cutting nonmetallic substrate and method thereof

Country Status (5)

Country Link
JP (1) JP2007537124A (en)
KR (1) KR100626554B1 (en)
CN (1) CN100528455C (en)
TW (1) TWI294410B (en)
WO (1) WO2005107999A1 (en)

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KR100921662B1 (en) * 2007-07-13 2009-10-14 주식회사 코윈디에스티 Apparatus and method for cutting substrate using UV laser
CN101386112B (en) * 2007-09-13 2013-06-05 常州英诺激光科技有限公司 Laser cutting method based on inner carving
JP5417639B2 (en) * 2008-04-14 2014-02-19 株式会社村谷機械製作所 Laser welding method and laser welding apparatus
CN101422848B (en) * 2008-11-21 2013-07-17 陈伟良 Distance-measurement focusing method applied for laser cutting processing
WO2010139841A1 (en) * 2009-06-04 2010-12-09 Corelase Oy Method and apparatus for processing substrates
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KR101417924B1 (en) * 2013-02-20 2014-07-11 (주)미래컴퍼니 Method and apparatus of laser process
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
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US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
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CN104124401B (en) * 2014-07-21 2016-11-09 四川虹视显示技术有限公司 A kind of OLED laser edging device
CN107207316A (en) * 2014-11-19 2017-09-26 康宁股份有限公司 The apparatus and method of indentation are carried out to glassware
EP3848334A1 (en) 2015-03-24 2021-07-14 Corning Incorporated Alkaline earth boro-aluminosilicate glass article with laser cut edge
US11420894B2 (en) * 2015-04-24 2022-08-23 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
WO2016175530A1 (en) * 2015-04-27 2016-11-03 한서대학교 산학협력단 Movable laser engraving and cutting device
CN107835794A (en) 2015-07-10 2018-03-23 康宁股份有限公司 The method of continuous manufacturing hole and product related to this in flexible substrate plate
CN106925888A (en) * 2015-12-30 2017-07-07 常州天正工业发展股份有限公司 Digitalized laser cutting head
EP3452418B1 (en) 2016-05-06 2022-03-02 Corning Incorporated Laser cutting and removal of contoured shapes from transparent substrates
CN106503151B (en) * 2016-10-21 2019-12-13 北京源著智能科技有限公司 Plate processing method and system
US11542190B2 (en) 2016-10-24 2023-01-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
CN106346142A (en) * 2016-11-02 2017-01-25 江苏弘信华印电路科技有限公司 Method for producing single PCS substrate by UV laser cutting
CN106773211A (en) * 2016-12-29 2017-05-31 深圳市华星光电技术有限公司 A kind of display panel cutting machine and its cutting method
KR102582734B1 (en) * 2017-09-27 2023-09-27 주식회사 탑 엔지니어링 Substrate cutting apparatus
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Also Published As

Publication number Publication date
CN100528455C (en) 2009-08-19
TWI294410B (en) 2008-03-11
KR20050108043A (en) 2005-11-16
WO2005107999A1 (en) 2005-11-17
CN101031383A (en) 2007-09-05
JP2007537124A (en) 2007-12-20
KR100626554B1 (en) 2006-09-21

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees