TW200600479A - Apparatus for cutting nonmetallic substrate and method thereof - Google Patents

Apparatus for cutting nonmetallic substrate and method thereof

Info

Publication number
TW200600479A
TW200600479A TW094115268A TW94115268A TW200600479A TW 200600479 A TW200600479 A TW 200600479A TW 094115268 A TW094115268 A TW 094115268A TW 94115268 A TW94115268 A TW 94115268A TW 200600479 A TW200600479 A TW 200600479A
Authority
TW
Taiwan
Prior art keywords
substrate
laser beam
cutting
short wavelength
nonmetallic
Prior art date
Application number
TW094115268A
Other languages
Chinese (zh)
Other versions
TWI294410B (en
Inventor
Kyu-Yong Bang
Jong-Wook Kim
Chang-Bok Lee
Young-Min Kim
Original Assignee
Top Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Top Eng Co Ltd filed Critical Top Eng Co Ltd
Publication of TW200600479A publication Critical patent/TW200600479A/en
Application granted granted Critical
Publication of TWI294410B publication Critical patent/TWI294410B/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/076—Laminated glass comprising interlayers
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D33/00—Containers or accessories specially adapted for handling powdery toiletry or cosmetic substances
    • A45D33/20—Containers with movably mounted drawers
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
    • A45D40/22—Casings characterised by a hinged cover
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
    • A45D40/24—Casings for two or more cosmetics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D33/00—Containers or accessories specially adapted for handling powdery toiletry or cosmetic substances
    • A45D2033/001—Accessories
    • A—HUMAN NECESSITIES
    • A45—HAND OR TRAVELLING ARTICLES
    • A45D—HAIRDRESSING OR SHAVING EQUIPMENT; EQUIPMENT FOR COSMETICS OR COSMETIC TREATMENTS, e.g. FOR MANICURING OR PEDICURING
    • A45D40/00—Casings or accessories specially adapted for storing or handling solid or pasty toiletry or cosmetic substances, e.g. shaving soaps or lipsticks
    • A45D40/22—Casings characterised by a hinged cover
    • A45D2040/225—Casings characterised by a hinged cover characterised by the opening or closing movement of the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

An apparatus for cutting a nonmetallic substrate and method thereof are disclosed. The present invention is suitable for cutting upper and lower substrates simultaneously or for cutting either an upper or lower substrate selectively in a manner of controlling a cutting depth by adjusting a focus position of a short wavelength laser beam in cutting various nonmetallic substrates such as a glass substrate for fabricating a flat panel display such as TFT-LCD, PDP, OLED, etc. The present invention includes a laser beam generator generating a UV short wavelength laser beam, a torch applying the short wavelength laser beam to a specific location on the nonmetallic substrate to be cut, a focus moving means for varying a focus location of the laser beam in a depth direction of the substrate, and a relative object moving means for allowing the substrate and the laser beam to make a relative movement to cut the substrate.
TW094115268A 2004-05-11 2005-05-11 Apparatus for cutting nonmetallic substrate and method thereof TWI294410B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040033078A KR100626554B1 (en) 2004-05-11 2004-05-11 Device for Cutting Glass Substrate in Manufacturing Process of Flat Type Display and Method for controlling depth of cutting for the Glass Substrate

Publications (2)

Publication Number Publication Date
TW200600479A true TW200600479A (en) 2006-01-01
TWI294410B TWI294410B (en) 2008-03-11

Family

ID=35320100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094115268A TWI294410B (en) 2004-05-11 2005-05-11 Apparatus for cutting nonmetallic substrate and method thereof

Country Status (5)

Country Link
JP (1) JP2007537124A (en)
KR (1) KR100626554B1 (en)
CN (1) CN100528455C (en)
TW (1) TWI294410B (en)
WO (1) WO2005107999A1 (en)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100809534B1 (en) 2007-01-12 2008-03-04 삼성중공업 주식회사 Membrane cutting device and cutting method
KR100921662B1 (en) * 2007-07-13 2009-10-14 주식회사 코윈디에스티 Apparatus and method for cutting substrate using UV laser
CN101386112B (en) * 2007-09-13 2013-06-05 常州英诺激光科技有限公司 Laser cutting method based on inner carving
JP5417639B2 (en) * 2008-04-14 2014-02-19 株式会社村谷機械製作所 Laser welding method and laser welding apparatus
CN101422848B (en) * 2008-11-21 2013-07-17 陈伟良 Distance-measurement focusing method applied for laser cutting processing
US9701581B2 (en) * 2009-06-04 2017-07-11 Corelase Oy Method and apparatus for processing substrates using a laser
JP2011209645A (en) * 2010-03-30 2011-10-20 Hoya Corp Dye application device for plastic lens
CN102179881A (en) * 2011-04-01 2011-09-14 石金精密科技（深圳）有限公司 System for adsorbing and fixing plane thin plate
TWI474982B (en) * 2012-04-27 2015-03-01 Taiwan Mitsuboshi Diamond Ind Co Ltd Processing method and cutting apparatus for a strengthened glass substrate
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
KR101417924B1 (en) * 2013-02-20 2014-07-11 (주)미래컴퍼니 Method and apparatus of laser process
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
WO2015024652A1 (en) 2013-08-20 2015-02-26 Boehringer Ingelheim Vetmedica Gmbh Inhaler
CN104563976B (en) * 2013-10-11 2018-04-27 中国石油化工股份有限公司 Laser perforation system and laser perforating methods
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US11556039B2 (en) 2013-12-17 2023-01-17 Corning Incorporated Electrochromic coated glass articles and methods for laser processing the same
CN106029591B (en) * 2014-05-23 2019-08-23 日本电气硝子株式会社 The manufacturing method of panel
EP3166895B1 (en) 2014-07-08 2021-11-24 Corning Incorporated Methods and apparatuses for laser processing materials
KR20170028943A (en) 2014-07-14 2017-03-14 코닝 인코포레이티드 System for and method of processing transparent materials using laser beam focal lines adjustable in length and diameter
CN104124401B (en) * 2014-07-21 2016-11-09 四川虹视显示技术有限公司 A kind of OLED laser edging device
US10357843B2 (en) * 2014-11-19 2019-07-23 Corning Incorporated Apparatuses and methods for scoring a glass article
EP3274306B1 (en) 2015-03-24 2021-04-14 Corning Incorporated Laser cutting and processing of display glass compositions
US11420894B2 (en) * 2015-04-24 2022-08-23 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
WO2016175530A1 (en) * 2015-04-27 2016-11-03 한서대학교 산학협력단 Movable laser engraving and cutting device
US11186060B2 (en) 2015-07-10 2021-11-30 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
CN106925888A (en) * 2015-12-30 2017-07-07 常州天正工业发展股份有限公司 Digitalized laser cutting head
MY194570A (en) 2016-05-06 2022-12-02 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
CN106503151B (en) * 2016-10-21 2019-12-13 北京源著智能科技有限公司 Plate processing method and system
WO2018081031A1 (en) * 2016-10-24 2018-05-03 Corning Incorporated Substrate processing station for laser-based machining of sheet-like glass substrates
CN106346142A (en) * 2016-11-02 2017-01-25 江苏弘信华印电路科技有限公司 Method for producing single PCS substrate by UV laser cutting
CN106773211A (en) * 2016-12-29 2017-05-31 深圳市华星光电技术有限公司 A kind of display panel cutting machine and its cutting method
KR102582734B1 (en) * 2017-09-27 2023-09-27 주식회사 탑 엔지니어링 Substrate cutting apparatus
DE102018114973A1 (en) * 2018-06-21 2019-12-24 Schott Ag Flat glass with at least one predetermined breaking point
CN110936027B (en) * 2018-09-21 2022-05-03 大族激光科技产业集团股份有限公司 Laser cutting method and laser cutting device
CN112171071A (en) * 2020-09-28 2021-01-05 歌尔科技有限公司 Laser etching method, laser etching device, electronic equipment and laser etching system
CN115781044A (en) * 2022-11-16 2023-03-14 深圳锦邦达电子有限公司 Method and system for ensuring laser cutting flatness of PCB

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD128457A1 (en) * 1976-12-01 1977-11-16 Ivan Boschnakow DEVICE FOR GAS LASER CUTTING AND WELDING
US4503313A (en) * 1981-04-07 1985-03-05 Amada Engineering & Service Co., Inc. Relatively adjustable laser and optic system for laser processing
JP3024990B2 (en) * 1990-08-31 2000-03-27 日本石英硝子株式会社 Cutting method of quartz glass material
JP3036906B2 (en) * 1991-07-30 2000-04-24 ホーヤ株式会社 Glass processing method and apparatus
US5912912A (en) * 1997-09-05 1999-06-15 Coherent, Inc. Repetitively-pulsed solid-state laser having resonator including multiple different gain-media
JP3997450B2 (en) * 1998-03-13 2007-10-24 ソニー株式会社 Wavelength converter
JPH11309594A (en) * 1998-04-23 1999-11-09 Matsushita Electric Ind Co Ltd Laser beam machining device and its working parts
JP3522654B2 (en) * 2000-06-09 2004-04-26 住友重機械工業株式会社 Laser processing apparatus and processing method
KR100701013B1 (en) * 2001-05-21 2007-03-29 삼성전자주식회사 Method and Apparatus for cutting non-metal substrate using a laser beam
US6804269B2 (en) * 2001-06-19 2004-10-12 Hitachi Via Mechanics, Ltd. Laser beam delivery system with trepanning module
US6559411B2 (en) * 2001-08-10 2003-05-06 First Solar, Llc Method and apparatus for laser scribing glass sheet substrate coatings
JP2003119044A (en) * 2001-10-12 2003-04-23 Quantum Design Japan Inc Machining method and machining device for quartz by laser
JP4111800B2 (en) * 2002-11-05 2008-07-02 アルパイン株式会社 Inter-vehicle communication information processing device
JP2004160499A (en) * 2002-11-13 2004-06-10 Sony Corp Cutting method for multi-layer plate member and manufacturing method for display device
JP3929393B2 (en) * 2002-12-03 2007-06-13 株式会社日本エミック Cutting device
JP2005081715A (en) * 2003-09-09 2005-03-31 Sony Corp Laser beam machining apparatus and laser beam machining method
JP2005271563A (en) * 2004-03-26 2005-10-06 Daitron Technology Co Ltd Dividing processing method of hard and brittle plate and apparatus for it

Also Published As

Publication number Publication date
KR100626554B1 (en) 2006-09-21
CN101031383A (en) 2007-09-05
CN100528455C (en) 2009-08-19
WO2005107999A1 (en) 2005-11-17
TWI294410B (en) 2008-03-11
KR20050108043A (en) 2005-11-16
JP2007537124A (en) 2007-12-20

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Legal Events

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MM4A Annulment or lapse of patent due to non-payment of fees