1294410 九、發明說明·· • 【發明所屬之技術領域】 、 本發_有關於-種非金屬基板_設備及其方法，特別是 適用於在_各_金屬基板（例如：胁製造諸如_電晶^ 液晶顯示器（TFT_LCD)、電漿顯示器⑽卜有機發光顯曰㈣ -(OLED)等平面顯示㈣玻璃基板）時，_透過調整短波雷射 .光束的聚焦位置來控制切割深度的方式，同時切割上基板和^基 φ 板，或者係選擇性切割上基板或下基板。 【先前技術】 -般而言’在製造諸如_電晶體_液晶顯示器（tft_lcd)、 電衆顯示ϋ (PDP)、有機發光顯示器(⑽D)等平面顯示裝置 ^ 在單元製簡預處理完祕，將_基板切割成相存於 每-模_尺寸大小。並且，於此亦賴選擇僅蝴於黏合基板 上之上板的玻璃。 # 習知的玻璃切割方法是透過使用例如金剛石砂輪的機械器具 -進行蝴。於此，__觀賴由減裂紋和第二裂紋而決 -定；此初始裂紋係由概正面踫撞而產生，而第二裂紋係由再處 理初始裂紋而產生。由於產生之初始裂紋和第二裂紋的尺寸互不 相同’因此切割深度亦不一致，以致於基板的切割表面不精確。 另-習知的切割方法是為二氧化碳（⑽）雷射切财法， 其包括有下列步驟··利用砂輪作為機械器具，在刻劃線起始點形 成一初始微裂，纹；其次，使用⑽雷射的加熱光束加熱玻璃；然 1294410 後使用冷部盗（qUencher)快速冷卻玻璃的加熱部分，以因為瞬 間熱量的變化而在玻璃上產生一第二裂紋。 在上述的切财法中，由於不能精確控制玻璃的切割深度， 因此玻璃的切割面不精確。 在上述兩種切割方法中，關於使用習知# c〇2雷射切割方法 的裝置説明如下。 首先，習知的雷射切割機包括：一支樓台或工作臺，用以支 •托所要切割的玻璃基板；一輔助破碎器，用以形成與基板切割方 向一致的-輔助裂紋；-光學加熱系統，藉由沿一劃線施加加熱 光束到基板上而加熱基板；以及一冷卻器，藉由冷卻光學加熱系 統所加熱的部分而產生一裂紋。 習知之雷射切割機的玻璃切割方法，係利用砂輪形成一 辅助裂紋，·再根據輔助裂紋進行的加熱；接著，利用冷卻器以相 同方向移祕喷灑冷卻劑，如統，賴由快速冷卻而形成切割 _裂紋；然後，執行舰㈣光束之重複照射的步驟以及再冷 • 步驟。 • f知之f射切的詳細構造和·方法，可參考韓國專 公開號第2002-88258號。 然而，上述習知之切割方法允許切割一單一基板，因而需要 於基板的^織供切難置，明時切_合板的上板和下板。 也就是說，在使用例如金剛石雜等機械裝置之習知的切割 1294410 方去中’-個砂輪僅能切割—個基板。因此，為了同時切割黏合 」板#下板萬分別提供一專用砂輪給上板和下板。並且， 也而刀別提供用以支撐專用砂輪之支獲滾轴給黏合板的上、下表 面此外’财-分料置來分離切獅。因此，致使切割機的 系雌構化，频習知之切财法和祕不紐用。 特別是，絲合板上、下部分提供有砂輪之習知的機械切巧 裝置中，應精確對準上、下專用砂輪，以執行切割工作。因此， 伴隨有-校正無，以使上、下_砂辦⑽定位重合。若發生 校正失誤時，域面會不重合，進叫低產品品質。 、" 运射光束的切割方法中，C02雷射、輔助破碎器 冷卻器等設備應配置於黏合1294410 IX. OBJECT DESCRIPTION OF THE INVENTION ················································· Crystal ^ liquid crystal display (TFT_LCD), plasma display (10), organic light-emitting display (four) - (OLED) and other flat display (four) glass substrate), _ through the adjustment of the short-wave laser. The focus position of the beam to control the depth of cut, while The upper substrate and the φ plate are cut, or the upper substrate or the lower substrate is selectively cut. [Prior Art] - Generally speaking, in the manufacture of flat display devices such as _transistor_liquid crystal display (tft_lcd), electric display ϋ (PDP), organic light emitting display ((10)D), etc. The _ substrate is cut into phases for each die size. Moreover, it is also preferred to select a glass that is only bonded to the upper plate of the bonded substrate. # A conventional glass cutting method is performed by using a mechanical device such as a diamond grinding wheel. Here, the __ depends on the reduction of the crack and the second crack; the initial crack is caused by the frontal collision, and the second crack is generated by the reprocessing of the initial crack. Since the initial crack and the second crack are different in size from each other', the depth of the cut is also inconsistent, so that the cut surface of the substrate is not accurate. Another-known cutting method is a carbon dioxide ((10)) laser cutting method, which includes the following steps: using a grinding wheel as a mechanical device, forming an initial micro-crack and grain at the starting point of the scribe line; secondly, using (10) The heating beam of the laser heats the glass; after 1294410, the cold part of the glass is rapidly cooled by the qUencher to generate a second crack on the glass due to the change of instantaneous heat. In the above-described cut-off method, since the cutting depth of the glass cannot be precisely controlled, the cut surface of the glass is not accurate. Among the above two cutting methods, the apparatus for using the conventional #c〇2 laser cutting method is explained below. First, the conventional laser cutting machine comprises: a floor or a workbench for supporting the glass substrate to be cut; an auxiliary breaker for forming an auxiliary crack corresponding to the cutting direction of the substrate; - optical heating The system heats the substrate by applying a heated beam to the substrate along a scribe line; and a cooler that creates a crack by cooling the portion heated by the optical heating system. The glass cutting method of the conventional laser cutting machine uses an abrasive wheel to form an auxiliary crack, and then heats according to the auxiliary crack; then, the cooler is used to spray the coolant in the same direction, and the cooling is rapidly cooled. The cutting_crack is formed; then, the step of repeating the irradiation of the ship (four) beam and the step of re-cooling are performed. • For details on the detailed construction and method of the f-cutting, refer to Korean Patent Publication No. 2002-88258. However, the above-described conventional cutting method allows cutting a single substrate, and thus it is necessary to make the substrate difficult to cut, and to cut the upper and lower plates of the plate. That is to say, in the conventional cutting 1294410 using a mechanical device such as a diamond hybrid, only one substrate can be cut. Therefore, in order to simultaneously cut the adhesive "plate", the lower plate is provided with a special grinding wheel for the upper plate and the lower plate, respectively. Moreover, the knife is also provided to support the special grinding wheel to obtain the roller for the upper and lower surfaces of the bonding plate, and the stalk is separated. Therefore, the cutting machine is made to be female, and it is known that the cutting method and the secret are not used. In particular, in the conventional mechanical cutting device in which the upper and lower portions of the wire are provided with a grinding wheel, the upper and lower special grinding wheels should be precisely aligned to perform the cutting work. Therefore, there is no correction, so that the upper and lower shovel (10) are positioned to coincide. In the event of a correction error, the domain will not coincide and the product quality will be low. , " C02 laser cutting, auxiliary breaker cooler and other equipment should be placed in the bonding method
H ^板上方和下方，因此使得整個系統才J 么谡雜化，進而降低了生産率。 並且，在使用C〇2雷射光束的切割方法中，由於配置於⑽ ^上方和下謂⑽__分顺確解，喊行切^ 乍，因此需進行上、下專用砂輪的對準校正。一旦 ^ 會造成切割面不重合，進而降低品質。 一\^正失 特別是，上述切割方法不能夠準確控 度，因此大大降低了切割面的精確度。·璃基板的切割謂 【發明内容】 鑒於以上的問題， 板切割設備及其方法， 1294410Above and below the H ^ board, the entire system is noisy, which reduces productivity. Moreover, in the cutting method using the C〇2 laser beam, since it is arranged above (10)^ and below, the (10)__ is determined to be correct, and the line is cut, so the alignment correction of the upper and lower special grinding wheels is required. Once ^ will cause the cutting surfaces to not coincide, thus reducing the quality. In particular, the above cutting method is not able to accurately control, thus greatly reducing the accuracy of the cutting surface. ·Cutting of glass substrate [Invention] In view of the above problems, the board cutting apparatus and method thereof, 1294410
根據本㈣之非金屬基板切歡備及其方法，在蝴各種非 金屬基板，例如：用於製造諸如薄膜電㈣·液晶顯示器 jTFTLCD)、電漿顯# (pDp)、有機發光顯示器（QLED)等 平面顯示㈣_基板時，_透過娜短波#射的聚焦位置來 控制切割深⑽方式，可同時_上基板和下基板，或者係選擇 性切割上基板或下基板。 因此，為達上述目的，本發明所揭露之非金屬基板切割設備， 包括：-雷射光束產生ϋ ’用以產生料線（uv)短波雷射光束； 一雷射頭’肋將短波雷射光束射出至非金屬基板上的特定位置 處’以進仃切n點移絲置，贱沿著基板的深度方向改 變雷射光束㈣紐置；以及—相騎體移練置，肋允許基 板與雷射光束產生一相對移動，藉以切割基板。 本發明更揭露-種非金屬基板切備，包括，—雷射光束 產生器，用以產生紫外線（UV)短波雷射光束；一雷射頭，用以 將短波雷射光束射出至非金屬基板的特定位置處，以進行切割； -雷射移位制器，肋測量雷射頭和基板之_麟以及基板 和雷射光束之間的相對距離；一焦點移動裝置，用以沿基板的深 度方向改變雷射光束的聚焦位置，以及用以改變基板到雷射頭的 高度以相符於測量到的相對距離，進而維持於切割過程中切割深 度的一致；以及一相對物體移動裝置·，用以允許基板與雷射光束 1294410 產生一相對移動，藉以切割基板。 本u更揭路-種非金屬基板切割方法，包括下列步驟：提 •供m(uv)短波t射光束；設定雷射縣絲板的深度方 向上的聚焦位置；測量—雷射頭和—主要基板面之間的距離；以 及根據雷射酬主要基板面的距離和設定的聚焦位置資料，移動 雷射光束的聚焦位置。 本發明更揭露-種非金屬基板切割方法，包括下列步弊：提 • i:务外線（UV)紐波雷射光束；提供一可變焦距透鏡，以改變 雷射光束之焦距；設定雷射光束於基板的深度方向上的聚焦位 置’測置-雷射頭和-主要基板面之間的距離；以及根據雷射頭 到主要基板_距離和設定的聚焦位置資料，移動雷射光束的聚 焦位置至設定的聚焦位置。 本發明更揭露-種非金屬基板切割方法，包括下列步驟：安 置非金屬基板至工作臺上，並固定於其上；提供―紫外線（則 » 射束；將雷射絲於基板的深度方向上的粒位置設定為 寺疋值’；貝J里田射頭和一主要基板面之間的距離丨根據雷射 碩到主要基板面祕離和設定㈣減置㈣，藉由轉雷射光 束的貫際聚纽置贿預設的聚紐置—致，來校正基板和雷射 光束之間的相對位置；藉由#獅_卜線⑽）短波雷射光束 射出至基板上的一預定位置;相對移動基板和雷射光束，以將基 板切割成一特定形狀。 10 1294410 因此’在切割各種非金屬美4 卩、屬基板例如.用以製造諸如薄膜電 )、_示器（PDP)、有機發光顯 『（獅）等平面顯示器的朗基板時，本發明可透過調整短 波雷射光絲_置，崎確地控㈣怖謂深度。特別地， 本發明在顯不賴組製造過程中，可同時切_合板（P)的上、 下基板，或者選擇性切割上基板或者下基板。 有關本發_植與實作，賊合圖式作最佳實施例詳細說 明如下。 【實施方式】 、以下舉Φ頻實關以詳細朗本發明之内容，並以圖示作 為輔助_。朗巾提及之符號係參關式舰。 弟1圖為根據本發明第-實施例之用於製造平面顯示器之非 金屬基板切割設備的透視圖。 參照第1圖，根據本發明第-實施例之用於製造平面顯示器 之非金屬基板切·備包括有K作臺2，其係設置於基座： 的中心部分，以支抛璃基板（關中未顯示）；前後導向柱4分 另J»又置於工作堂2的兩侧，以及直線馬達和推進器5設置於每一 前後導向柱4上。 ' 而於推進器5上設置有一左右導向柱3,係用以引導一雷射頭 6沿左右方向義。並且，此左轉向柱3上設置有—直線馬達和 推進Μ其不同於别述設置在别後導向柱4上的直線馬達和推進 11 1294410 器5〇 在左右導向柱3 _職上钱有—雷射·定塊7,以致於 可將雷射頭6安裝在推進器上。並且，將雷射頭6安餘雷射頭 ®定塊7上’其中雷射頭6可聚集紫外線短波雷射光束並照射到 破璃基板的一指定區域。 • 並且，根據本發明實施例之非金屬基板切割設備，包括有〜 光，系統11，以引導雷射光束射向雷射頭6 ;以及一雷射光束產 #生器10，以產生紫外線短波雷射光束。 π w q亚嘴丞饥刀吾y玫備包括一量測裝 9 ’以測量基板與雷射光束的焦點之間的相對距離，以及測量雷」 頭6和主要基板面，例如：基板的上表面，之間的距離。 篁測裝置9包括-非接觸式移位感測器，特別是，一雷射1 位感測器（®中未顯示）’其係設置於树_光束的前端，以; 射出雷射光束。 並且，-發光二極管（LED)感測器（例如:光電感測器） 超聲波感·或者其他類型之感測料均可肋作為此非接心 移位感測器。 在切割前之用以定位基板切割深度的焦點調整過程中，根鴻 本發明之非金屬基油備具H轉練£ 8，肋沿著^ 板深度方秘卿嫩軸_，_聚録^ 切割深度重合。 / Μ 1294410 夕於此’在基板切割過程中，為了保持切割深度的一致性，焦 點私動裝置8也可軸缓基板到雷_ 6的高度，使其符合量 測得之雷射光絲點與主要基板面之_相對距離。 牡’㈣光核师職置8可包括有：—步進馬達（圖 中未顯不）’用以作為—驅動源；—滾珠螺旋軸（圖中未顯示）， 裝配於步進馬達上；以及一滾珠螺旋部件（圖中未顯示》連結滾 珠螺旋軸，以將雷射頭6連接其上。 或者’雷縣錢师練置8可包括：—魏馬達，以及 一推進器。此推進器係裝配於直線馬達上，用以上下移動，以將 雷射頭ό連接其上。 或者’雷射光束焦點移動裝置8包括：電元件，其· 配於雷射頭6上。當施加預定f壓至此壓電元件上時，此壓電天 件可產生顧變化，以鷄訪頭6驗置。 同了可以辟峨絲代機齡置縦而實麟雷射光束 焦點的移動。因此，射頭6中設置有—變焦透鏡如，其用途 如同於雷射光束焦點移動裝置。 於此’其係不同於在不改變焦距下透過改變雷射頭和基板之 間雜離來控_位敎。在不改變_ 6和基板之間 距離=況下可藉m透鏡Sa t構成之透鏡_距離調整來 達到改懸、距，進而實輯切贿度的蝴。 同時，較佳提供至少兩個雷射頭6，以提高切割速度。因此， 13 1294410 存在一種方法係使用兩個雷射振盪裝置，來使得雷射光束分別出 現在雷射頭上。並且，另一種方法則係使用兩個具有路徑轉向裝 置（反射鏡）之雷射頭。此時，路徑轉向裝置允許來自一雷射振 盪裝置的雷射光束可選擇性地出現在每個雷射頭上。 或者’另一種切割方法，則係可將來自一雷射振盪裝置之雷 .射在分光鏡分離後，施加到每個雷射頭上。此時，將減少分離後 之雷射的能量。然而，若可保證獲得的能量足以切割，此方法仍 •是可適用的。 在上述結構中，透過雷射頭6的相對移動以及紫外線（UV) 短波雷射光束的施加，對置於工作臺2上的基板進行切割，其中 雷射頭6的相鄉動是由包括馬達、滾珠螺絲等的驅動裝置以及 導向裝置完成的。然而，用以藉由允許基板和雷射光束產生相對 私動而切副基板的相對物體移動裝置之構造並不限於上述範例。 丨者’不同於上述結構，當驅動馬達引導工作臺2沿前後和 •左右方向移動時’透過雷射頭施加紫外線（則短波雷射光束， V以執行破璃基板的切割工作。或者是使得基板和雷卿6均發生 ，移動，進而可同樣完成切割工作。 同寸田射光束產生器10包括一摻鈥釔鋁石榴石（Nd-YAG) ^ ^射紐☆，—雷射二鋪，肋提供—激發光源給雷射 振蓋裔，以及—波長轉換器，用以將雷射振產生的雷射光束 之波長轉換為一短波。 14 1294410 透過波長轉換所用之晶體將摻斂纪鋁石權石（Nd_YAG)介質 毛出的長波長雷射光束轉換成波長為2⑻〜的紫外線（uv) •短波。 同時’雷射光束的頻率係位於l〜1〇〇KHz之間。 • 特別地，雷射光束的頻率至少為1〇KHz，並且較佳係介於 • 1〇〜30KHz。當然，根據不同的情況，雷射光束的頻率也可根據對 應的情狀而為至少30KHz，或者超出3〇KHz。 • 用於參考，紀紹石榴石（YAG)相應於妃（Yttrium)、鋁 (Aluminum)和石榴石（Garnet)的合成，係用於製造產生雷射 光束的振盪器。斂（Nd ··原子序數60，原子量144.2)可摻加到 釔鋁石榴石（YAG)中以形成摻鈦釔鋁石榴石（Nd-YAG)。 以下δ兒明使用上述結構之根據本發明之基板切割設備的平面 顯示器之玻璃基板的切割過程。 首先，在製造-平_示器，例如：晶體_液晶顯示器 _ (TFT-LCD)、電漿顯示器（pdp)、有機發光顯示器（qled)等， 中，是在基板黏接後，再進行黏接基板（此後稱作黏合板）的切 • 割處理。 此基板包括有位於一碟型玻璃基板上之複數個基板單元，並 且需要將此基板切割成複數個基板單元。 並且，為了控制基板的顯示資訊，將一自動銲接柔性線路板 (Tape Automatic Bonding ; TAB)貼附到基板的特定表面上。此 15 1294410 時，僅需要對包括-對黏合一起基㈣黏合板⑻中的一個基板 進行切割。 為此了透過運载自動控制裝置（carrier robot)等裝置將 玻璃基板從外部裝载到一可固定工作臺2上。 透過設置在工作臺2上的支釘（關中未示出）或者多個成 形於工作臺2上的真空孔，將放置在工作臺2上的基板水平地固 定在工作堂上’以將其穩固地支撐在工作臺上。According to the non-metal substrate cutting method of the present invention and the method thereof, various non-metal substrates are used, for example, for manufacturing such as thin film electric (four) liquid crystal display jTFTLCD, plasma display # (pDp), organic light emitting display (QLED). When the equal-surface display (4)_substrate, the focus position of the short-wave shot is controlled to control the depth of cut (10), and the upper substrate and the lower substrate may be simultaneously or the upper substrate or the lower substrate may be selectively cut. Therefore, in order to achieve the above object, the non-metal substrate cutting apparatus disclosed by the present invention comprises: - a laser beam generating ϋ 'for generating a uv short-wave laser beam; and a laser head rib rib short-wave laser The light beam is emitted to a specific position on the non-metal substrate, and the laser beam is placed at the n-point, and the laser beam is changed along the depth direction of the substrate (4); and the phase riding body is moved, the rib allows the substrate and The laser beam produces a relative movement whereby the substrate is cut. The invention further discloses a non-metal substrate cutting device, comprising: a laser beam generator for generating an ultraviolet (UV) short-wave laser beam; and a laser head for emitting a short-wave laser beam to a non-metal substrate Specific position for cutting; - laser shifting device, rib measuring the relative distance between the laser head and the substrate and the substrate and the laser beam; a focus moving device for depth along the substrate Changing the focus position of the laser beam, and changing the height of the substrate to the laser head to conform to the measured relative distance, thereby maintaining the uniformity of the cutting depth during the cutting process; and a relative object moving device for The substrate is allowed to move relative to the laser beam 1294410 to cut the substrate. This is a more non-metallic substrate cutting method, including the following steps: to provide m (uv) short-wave t-beam; set the focus position of the laser county wire plate in the depth direction; measurement - laser head and - The distance between the main substrate faces; and the focus position of the laser beam is moved according to the distance of the main substrate surface of the laser and the set focus position data. The invention further discloses a non-metal substrate cutting method, comprising the following steps: mentioning: i: an extra-line (UV) neon laser beam; providing a variable-focus lens to change the focal length of the laser beam; setting the laser The focus position of the light beam in the depth direction of the substrate 'measurement-the distance between the laser head and the main substrate surface; and the focus of the moving laser beam according to the laser head to the main substrate_distance and the set focus position data Position to the set focus position. The invention further discloses a non-metal substrate cutting method, comprising the steps of: arranging a non-metal substrate onto a workbench and fixing it thereon; providing "ultraviolet (ie) beam; placing the laser wire in the depth direction of the substrate The position of the grain is set to the value of the temple '; the distance between the head of the J. J. and the surface of the main substrate 丨 according to the laser to the main substrate surface and the setting (4) reduction (four), by rotating the beam The convergence of the preset bribes is preset to correct the relative position between the substrate and the laser beam; the short-wave laser beam is emitted to a predetermined position on the substrate by the #狮_布线(10); The substrate and the laser beam are moved to cut the substrate into a specific shape. 10 1294410 Therefore, the present invention can be used to cut a variety of non-metallic materials, such as substrates, for example, to fabricate a flat substrate such as a thin film, a PDP, or a luminescent display. By adjusting the short-wave laser light _ set, it is sure to control (four) horror depth. In particular, the present invention can simultaneously cut the upper and lower substrates of the board (P) or selectively cut the upper or lower substrate during the manufacturing process of the group. The best embodiment of the thief and the figure is described in detail below. [Embodiment] The following is a detailed description of the present invention, and is exemplified by the illustration. The symbol mentioned by Langshi is a parade. Figure 1 is a perspective view of a non-metal substrate cutting apparatus for manufacturing a flat panel display according to a first embodiment of the present invention. Referring to Fig. 1, a non-metal substrate for manufacturing a flat panel display according to a first embodiment of the present invention includes a K-stage 2 which is disposed at a central portion of the susceptor to support a glass substrate (Guanzhong Not shown); the front and rear guide posts 4 are placed on both sides of the work hall 2, and the linear motor and the pusher 5 are disposed on each of the front and rear guide posts 4. And a left and right guide post 3 is provided on the pusher 5 for guiding a laser head 6 in the left and right direction. Moreover, the left steering column 3 is provided with a linear motor and a propulsion cymbal which are different from the linear motor and the propulsion 11 1294410 which are disposed on the other rear guide post 4, and are disposed on the left and right guide columns 3 - The laser block 4 is so that the laser head 6 can be mounted on the propeller. Further, the laser head 6 is placed on the laser head of the laser head, and the laser head 7 is concentrated on a predetermined area of the glass substrate. And a non-metal substrate cutting apparatus according to an embodiment of the present invention, comprising a light, system 11 for directing a laser beam toward the laser head 6; and a laser beam generating device 10 for generating a short-wave ultraviolet light Laser beam. π wq 丞 丞 吾 吾 y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y ,the distance between. The detecting device 9 includes a non-contact displacement sensor, and in particular, a laser 1-bit sensor (not shown in the ®) is disposed at the front end of the tree beam to emit the laser beam. Moreover, a light-emitting diode (LED) sensor (for example, a photo-sensing device), a ultrasonic sensation, or other types of sensing materials can be used as the non-centering displacement sensor. In the focus adjustment process used to locate the cutting depth of the substrate before cutting, Genhong's non-metallic base oil preparation of the invention is H-transformed, and the ribs along the depth of the plate are the secret axis _, _ gathering ^ The cutting depth coincides. / Μ 1294410 On the other hand, in order to maintain the consistency of the cutting depth during the substrate cutting process, the focus private device 8 can also axially retard the height of the substrate to the Ray _ 6 so that it conforms to the measured laser light spot. The relative distance of the main substrate surface. Mu's (4) photonuclear position 8 may include: - a stepper motor (not shown in the figure) 'used as a drive source; - a ball screw shaft (not shown), mounted on a stepper motor; And a ball screw member (not shown) connects the ball screw shaft to connect the laser head 6 to it. Or 'Lei County Qian Shi practice 8 can include: - Wei motor, and a propeller. This propeller Mounted on a linear motor for moving up and down to connect the laser head to it. Or 'The laser beam focus moving device 8 includes: an electrical component, which is provided on the laser head 6. When a predetermined f is applied When pressed onto the piezoelectric element, the piezoelectric piece can produce a change, and the chicken visits the head 6 to check. The same can be used to set the 代 代 代 縦 縦 縦 縦 縦 縦 縦 縦 縦 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 6 is provided with a zoom lens, for example, which is used as a laser beam focus moving device. Here, it is different from controlling the gap between the laser head and the substrate without changing the focal length. Change _ 6 and the distance between the substrates = can be constructed by m lens Sa t The lens _ distance adjustment to achieve the suspension, distance, and then the degree of bribery. At the same time, preferably at least two laser heads 6 to improve the cutting speed. Therefore, 13 1294410 there is a method using two The laser oscillating device is such that the laser beam appears on the laser head, respectively, and the other method uses two laser heads with path steering devices (mirrors). At this time, the path steering device allows from a mine The laser beam of the oscillating device can be selectively present on each of the laser heads. Alternatively, another method of cutting can be applied to each of the lasers from a laser oscillating device after being separated by the beam splitter. On the laser head, at this time, the energy of the separated laser will be reduced. However, this method is still applicable if the energy obtained is guaranteed to be sufficient. In the above structure, the relative movement through the laser head 6 is applicable. And the application of an ultraviolet (UV) short-wave laser beam to cut the substrate placed on the table 2, wherein the phase of the laser head 6 is driven by a driving device including a motor, a ball screw, or the like. The guiding device is completed. However, the configuration of the relative object moving device for cutting the sub-substrate by allowing the substrate and the laser beam to be relatively privately moved is not limited to the above example. The latter is different from the above structure when the driving motor is guided. When the table 2 moves along the front and rear and the left and right directions, 'the ultraviolet light is applied through the laser head (the short-wave laser beam, V is used to perform the cutting work of the glass substrate. Or the substrate and the Leiqing 6 are both moved and moved, and then The cutting work is also completed. The same-in-field beam generator 10 includes a yttrium-doped garnet (Nd-YAG) ^ ^ ray ☆, a laser tiling, and the ribs provide an excitation source for the laser. And a wavelength converter for converting the wavelength of the laser beam generated by the laser to a short wave. 14 1294410 The crystal used for wavelength conversion will be fused with long wavelength Rays of the aragonite stone (Nd_YAG) medium. The beam is converted into ultraviolet (uv) wavelengths of 2 (8) ~ shortwaves. At the same time, the frequency of the laser beam is between 1 and 1 〇〇 KHz. • In particular, the laser beam has a frequency of at least 1 〇 KHz and is preferably between 1 〇 and 30 kHz. Of course, depending on the situation, the frequency of the laser beam can be at least 30 KHz or more than 3 KHz depending on the corresponding situation. • For reference, the yoghurt (YAG) corresponds to the synthesis of Yttrium, Aluminum and Garnet, and is used to make an oscillator that produces a laser beam. Convergence (Nd · · atomic number 60, atomic weight 144.2) can be added to yttrium aluminum garnet (YAG) to form titanium-doped yttrium aluminum garnet (Nd-YAG). The following δ shows the cutting process of the glass substrate of the flat display of the substrate cutting apparatus according to the present invention using the above structure. First, in the manufacturing-planar display, for example, a crystal-liquid crystal display (TFT-LCD), a plasma display (pdp), an organic light-emitting display (qled), etc., after the substrate is bonded, the adhesive is applied again. The cutting process of the substrate (hereinafter referred to as the bonding plate). The substrate includes a plurality of substrate units on a dish-shaped glass substrate, and the substrate needs to be cut into a plurality of substrate units. Further, in order to control the display information of the substrate, a self-welding flexible wiring board (TAB) is attached to a specific surface of the substrate. For this 15 1294410, it is only necessary to cut one of the substrates including the -to-bonded base (four) bonding plate (8). For this purpose, the glass substrate is externally loaded onto a fixable table 2 by means of a device such as a carrier robot. The substrate placed on the table 2 is horizontally fixed on the work hall through a nail (not shown in the closing) provided on the table 2 or a plurality of vacuum holes formed on the table 2 to securely hold it Supported on the workbench.
Ik後’杈正基板與施加於其上之雷射光束間的相對位置，以 致使可將駭在1作臺2上的基板魏特定的雜。 在校正相對位置的過程中，一圖像識別器（例如：可視照相 機）用以識別並確認形成於基板之上的校正標記的位置，並且照 射出雷射光束的雷射頭6對著工作臺2做相對地移動，以校正此 相對位置。 在雷射光束的位置確認過程中，施加一測試雷射光束到一虛 擬玻璃上，以在虛擬玻璃上形成雷射光束軌跡，並且隨後利用圖 像識別器，例如：可視照相機，擷取此雷射光束執跡，或者係隨 後利用設置在此雷射頭6下方的圖像識別器識別出發射出雷射光 束的雷射頭ό的位置。 同時’在基板與雷射光束間的相對位置校正完成後，基板和 雷射光束將進行相對地移動，以而將基板切割成特定的形狀。 即’從使用摻鈥釔鋁石榴石（Nd-YAG)作為介質的雷射振嚴 16 1294410 ™中所產生的雷射光束’經由光學系統u而提供給作為雷射光束 之聚光部件的訪頭6’錢得此雷概細侧基板上的預定位 置處。進而，具有基板承難上的工作臺2是固定錢移動的， 而雷射頭6是可移_。观，可透過_光束的移騎基板進 行切割。 .、，此情況下，雷射錄器產生的雷縣束係雷射二極體 作為光源產生的雷射光束可透過光學系統^改變其光線路徑， 籲其中此光學系統包括複數個反射鏡以及類似的褒置，係用以提供 給雷射頭6作為雷射光束聚光部件。由於雷射頭6和向雷射頭6 發送雷射光束的光料、統η的反射鏡_進行水平移動，因此， 無論雷射頭6的位置是否改變，均可將紫外線短波雷射光束施加 到基板上。因而，可將基板切割成設計的形狀。 在這種情況下，將自作為光源的二極體中所產生的光波提供 給雜健純l(Nd_YAG)介f，讀由i益介f而激發， 籲以致可震盪波長為1000nm的雷射光。振驗的雷射光通過波長轉 ' 換水晶體被振盪成為波長為200〜400nm之間的短波。 因此’係將雷射轉換成短波後才使用。當施加雷射光束到諸 如玻璃基板等非金屬物質上進行切割時，透過使用紫外線短波雷 射光束，可使得因長波光束產生之熱量變化所造成的產品破損量 減少到最小。 此外’為了提高雷射光束的能量，利用一光諧振器光學執行 17 1294410 Q開關（Q-switching)，以產生(毫微秒）的超短脈衝。 為了提高切魏度，產生超過數千馳（KHz)的頻率以施 •加到雷射光束中。如此一來，即使雷射頭6或工作臺2以高速^ 移動，仍可實現精確的切割。 ㈤時，在切割玻璃基板的過程中，其係大致上沿前後方向將 ^板切割成基板單元，當左右導向柱3在直線馬達的帶動下藉由 _導向柱4的引導沿前後方向移動時，可經由雷射頭6施加雷 ♦射絲’以致可沿前後方向祕板進概行切割。 並且，在切割玻璃基板的過程中，料沿左右方向將基板充 分地切割成基板單元，當雷射顯定塊7和安裝在此固定塊上的 雷射頭6在直線馬達的帶動下藉由左右導向柱3㈣導沿左右方 向移動時，可經由雷射頭6施加雷射光束，以致可沿左右方向對 基板進行進行切割。 鲁。目此’由於紫外線短波雷射光束可交替地重復前後和左右方 ° ^動進而使得玻璃基板上的各個基板單元彼此之間能夠單獨 且完全地相互分離開（以單數形式）。 Z 了在使用紫外線（UY)短波雷射光束切割玻璃基板中， 可在$際切歡作之前準確設定基板的切酶度。 ”為此’控制雷射光束的聚焦位置，以與所要切割基板的切割 深度重合，詳細說明如下。… "先參考第2B圖和第3B圖，將於基板深度方向上之雷射 18 1294410 光束之聚焦位置設定為-特定值。接著，測量發出雷射光束之雷 •射頭6與主要基板面之間的距離。 Λ 口此，根據主要基板面的距離和設定的聚焦位置資料，移動 雷射光束的實際聚焦位置以使其與設定的聚焦位置重合。After Ik, the relative position between the substrate and the laser beam applied thereto is such that the substrate on the stage 2 can be made specific. In the process of correcting the relative position, an image recognizer (for example, a video camera) is used to identify and confirm the position of the correction mark formed on the substrate, and the laser head 6 irradiating the laser beam faces the table 2 do relative movement to correct this relative position. During the position confirmation of the laser beam, a test laser beam is applied to a virtual glass to form a laser beam trajectory on the virtual glass, and then the image detector, such as a video camera, is used to capture the ray The beam of light is traced, or the position of the laser head 发射 that emits the laser beam is subsequently identified by an image recognizer disposed below the laser head 6. At the same time, after the relative positional correction between the substrate and the laser beam is completed, the substrate and the laser beam will be relatively moved to cut the substrate into a specific shape. That is, 'the laser beam generated from the laser vibration 16 1294410 TM using ytterbium-doped aluminum garnet (Nd-YAG) as a medium is supplied to the concentrating member as a laser beam via the optical system u The head 6' money is obtained at a predetermined position on the thin side substrate. Further, the table 2 having the substrate bearing is moved by the fixed money, and the laser head 6 is movable. The view can be cut through the substrate of the _beam. In this case, the laser beam generated by the Rayxian beam system laser diode generated by the laser recorder can change its light path through the optical system, and the optical system includes a plurality of mirrors and A similar arrangement is provided for the laser head 6 as a laser beam concentrating component. Since the laser head 6 and the light beam that transmits the laser beam to the laser head 6 and the mirror _ of the system _ are horizontally moved, the ultraviolet short-wave laser beam can be applied regardless of whether the position of the laser head 6 is changed or not. Onto the substrate. Thus, the substrate can be cut into a designed shape. In this case, the light wave generated from the diode as the light source is supplied to the hybrid pure l(Nd_YAG) f, and the read is excited by the i-f, so that the laser light having a wavelength of 1000 nm can be oscillated. . The vibrating laser light passes through the wavelength turn 'the water change crystal is oscillated to become a short wave with a wavelength between 200 and 400 nm. Therefore, it is used after converting the laser into a short wave. When a laser beam is applied to a non-metallic substance such as a glass substrate for cutting, the use of an ultraviolet short-wave laser beam can minimize the amount of product damage caused by the change in heat generated by the long-wave beam. Furthermore, in order to increase the energy of the laser beam, a 12 1294410 Q-switching is optically performed using an optical resonator to generate an ultrashort pulse of (nanoseconds). In order to increase the cut-off, a frequency of more than a few thousand chines (KHz) is generated to apply to the laser beam. In this way, even if the laser head 6 or the table 2 is moved at a high speed, precise cutting can be achieved. (5) In the process of cutting the glass substrate, the board is cut into the substrate unit substantially in the front-rear direction, and when the left and right guide pillars 3 are moved by the linear motor, the guide pillar 4 is guided in the front-rear direction. The laser can be applied through the laser head 6 so that the cutting can be performed in the front and rear direction. Moreover, in the process of cutting the glass substrate, the substrate is sufficiently cut into the substrate unit in the left-right direction, and the laser display block 7 and the laser head 6 mounted on the fixed block are driven by the linear motor. When the left and right guide posts 3 (4) are guided to move in the left-right direction, the laser beam can be applied via the laser head 6, so that the substrate can be cut in the left-right direction. Lu. Therefore, since the ultraviolet short-wave laser beam can alternately repeat the front-back and left-right directions, the respective substrate units on the glass substrate can be separated from each other individually and completely (in the singular form). Z In the use of ultraviolet (UY) short-wave laser beam to cut the glass substrate, the substrate's digestibility can be accurately set before the cut. For this purpose, the focus position of the laser beam is controlled to coincide with the cutting depth of the substrate to be cut, as described in detail below.... " Referring to Figures 2B and 3B, the laser will be in the depth direction of the substrate 18 1294410 The focus position of the beam is set to a specific value. Next, the distance between the laser beam emitting laser beam 6 and the main substrate surface is measured. Λ ,, according to the distance of the main substrate surface and the set focus position data, move The actual focus position of the laser beam is such that it coincides with the set focus position.
進而，透過提升或降落雷_ 6，以執行對雷射光束之聚焦位 —置的控制’如第2A圖和帛2B圖所示。或者，如第3A圖和第3B 圖所示，透過提升或降落基板，而執行對雷射光束聚焦位置的控 • 制。 即，透過雷射光束的聚焦位置的控制而確定切割深度，因此， 當雷射光束雷射頭6和主要基板面之間的距離隨著焦距（b1，B2， B3 ’其中bi=b2=B3)的改變而改變時，也使得切割深度（D1， D2，D3，其中D1<D2<D3)的變化成為可能。 參考弟4A圖和弟4B圖，透過改變焦距，可在不需調整雷射 頭6和基板間之距離的情況下，控制切割深度。 馨 在這種情況下，係沿著基板的深度方向設定雷射光束的聚焦 …位置，然後測量雷射光束雷射頭6和主要基板面間的距離。 - 隨後’根據主要基板面的距離和設定的聚焦位置資料，將雷 射光束的聚焦位置移動至設定位置。如此一來，藉由調整於雷射 頭ό内的變焦透鏡8a，可改變雷射光束的焦距（如於第4A圖中 之Bl，B2，B3，其中 B1<B2<B3)。 即透過延長或者縮短雷射光束的焦距，而可在不改變雷射 19 1294410 頭6和基板間之轉的情況下，實現對聚錄置的控制。 杂此時’利用照射距離測量雷射光束的非接觸式方法，可實現 對田射光束之雷射碩6和主要基板面間之距離的測量，其中上述 距離測量雷射絲_於切割的紫外線短波雷射光束或者超聲波 不同。 如上所述，根據本發gg之非金屬基板切割設備可以執行精確 的非金屬基板切割，藉以選擇性致使—黏合板⑺，例如：一平 面顯示器’的不同步切割（僅切割上基板或下基板），或者選擇性 同時切割黏合板（P)的上下基板。 即，為了透過同時切割黏合板⑺的上、下基板而將黏合板 分成基板單元，如第5A圖所示，可先使雷射光束焦點與黏 合板（P)的下基板底部重合，讀齡合板（p)的總厚度，然 後再執行基板的切割。 在切割黏合板⑺的上基板或下基板(例如上基板）的不同 V切剎中，會先根據黏合板（P)的總厚度，使雷射光束焦點與黏 合板（P)的上基板底部重合，以對應黏合板（P)的總厚度，然 後再執行基板的切割，如第5B圖所示。 以下說明光學執行Q開關，以提高雷射光束之能量，以及廡 用於Q開關的光諧振器。 首先，於一標準振盪模式下，雷射介質之增益相符於僅超出 損耗的一數值，其中此損耗包括一輸出排放分量。這樣，透過增 20 1294410 加反1分佈數值以超出―閾值，以獲得—更高能量的雷射光束。 寸別疋，可光谐振器的損耗來增加反向分佈數值以超過 振盡閾值。也就是，降低Q值。 士因此’在人為降低Q值後，若當反向分佈數值具有一預定高 值時^提高Q值，而增益係數將變得更加地高於振盪閾值，以產 生出高能雷射光束之振盪。上述技術即稱之為Q開關。 *同時，在光諳振器中，由於無法透過感應放電產生具有光束 增強之高效的雷射絲，_使贱夠啟動光綠振的平行反射 鏡。 田反向刀佈㉜日诗發生感應放電，並且藉由反射鏡使光束 反射回雷射介質部分’以猶此光束。若絲在—對反射鏡間來 回反射的時卿為—整數的倍數，便會產生—駐波，以突然地增 加感應放電。並且，此絲振器具有上述之可產生雷射光束的结 構。 、 於工業應用上’在製造如薄膜電晶體-液晶顯示器 (TFT-LCD)、電漿顯示器（pDp)、有機發光顯示器（〇咖）等 顯示設備模崎，在__伽巾，本發啊啸獅波雷射 光束的聚餘置❾対，來精糊㈣聽度。 亚且，本發明可應甩於任何類型之非金屬基板以及製造乎面 顯示器之玻穩板。舰本_具有高紅業實雜。 雖然本㈣^奴較佳實施例揭露如上，然其並翻以限 21 1294410 =明，任域細_者，在錢縣㈣之精神和範圍 月曰所附之申請專利範圍所界定者為準。 【圖式簡單說明】 目弟1 _根據本發明第—實施例之非金屬基板切割設備之透 板切割設備之雷=== 據本發明第—實施例之非金屬基 輕、‘指勤之示意®及其方法流程圖； 板二 Δ ^ 控制态之不意圖及其方法流程圖； 板切割賴象非金屬基 筮q回 JTO(不思圖及其方法流程圖；及 設備之實圖為用於解釋根據本發明之非金屬基板切割 上、下圖’其中第5Α圖顯示同時切割黏合板的 或者下;^^第職示利㈣步切·合板的上基板 【主要元件符號說明】 1 2 基座 工作臺 左右導向才主 前後導向检 22 4 1294410 5 直線馬達和推進器 6 雷射頭 7 雷射頭固定塊 8 焦點移動裝置 8a 變焦透鏡 9 量測裝置 10 雷射光束產生器 11 光學系統 P 黏合板 B 卜 B2、B3 雷射光束焦距 D 卜 D2、D3 切割深度 23Further, by raising or lowering the lightning _ 6, to perform control of the focus position of the laser beam, as shown in Figs. 2A and 2B. Alternatively, as shown in Figs. 3A and 3B, the control of the focus position of the laser beam is performed by lifting or lowering the substrate. That is, the depth of cut is determined by the control of the focus position of the laser beam, and therefore, the distance between the laser beam head 6 and the main substrate surface is in accordance with the focal length (b1, B2, B3 'where bi=b2=B3 When the change is changed, the change in the depth of cut (D1, D2, D3, where D1 < D2 < D3) is made possible. Referring to the brothers 4A and 4B, by changing the focal length, the cutting depth can be controlled without adjusting the distance between the laser head 6 and the substrate. Xin In this case, the focus position of the laser beam is set along the depth direction of the substrate, and then the distance between the laser beam head 6 and the main substrate surface is measured. - Then, the focus position of the laser beam is moved to the set position based on the distance of the main substrate surface and the set focus position data. As a result, the focal length of the laser beam can be changed by adjusting the zoom lens 8a in the laser head (as in B1, B2, B3 in Fig. 4A, where B1 < B2 < B3). That is, by extending or shortening the focal length of the laser beam, the control of the recording can be realized without changing the rotation between the head 6 and the substrate of the laser 19 1294410. At this time, the non-contact method of measuring the laser beam by the irradiation distance can realize the measurement of the distance between the laser beam 6 and the main substrate surface of the field beam, wherein the above distance measurement laser light_cut ultraviolet light Short-wave laser beams or ultrasonic waves are different. As described above, the non-metal substrate cutting apparatus according to the present invention can perform precise non-metal substrate cutting, thereby selectively causing the unsynchronized cutting of the bonding sheet (7), for example, a flat display (only cutting the upper substrate or the lower substrate) ), or selectively cutting the upper and lower substrates of the bonding sheet (P) at the same time. That is, in order to divide the adhesive sheet into the substrate unit by simultaneously cutting the upper and lower substrates of the adhesive sheet (7), as shown in FIG. 5A, the focus of the laser beam can be first overlapped with the bottom of the lower substrate of the adhesive sheet (P), and the reading age is read. The total thickness of the ply (p) is then diced and then the substrate is cut. In the different V-cutting brakes of the upper substrate or the lower substrate (for example, the upper substrate) of the cutting adhesive board (7), the laser beam focus and the bottom of the upper substrate of the bonding board (P) are firstly made according to the total thickness of the bonding board (P). Coincident to correspond to the total thickness of the bonded sheet (P), and then the cutting of the substrate is performed as shown in Fig. 5B. The following describes the optical execution of the Q switch to increase the energy of the laser beam, and the optical resonator used for the Q switch. First, in a standard oscillation mode, the gain of the laser medium corresponds to a value that only exceeds the loss, where the loss includes an output emission component. Thus, by adding 20 1294410 plus 1 to the value of the distribution to exceed the "threshold" to obtain - a higher energy laser beam. Insufficient, the loss of the optical resonator increases the inverse distribution value beyond the oscillation threshold. That is, lower the Q value. Therefore, after artificially lowering the Q value, if the reverse distribution value has a predetermined high value, the Q value is increased, and the gain coefficient will become higher than the oscillation threshold to generate an oscillation of the high-energy laser beam. The above technique is called a Q switch. *At the same time, in the optical oscillating device, since the laser beam with high beam enhancement can not be generated by the inductive discharge, the parallel mirror which activates the green light is activated. The field reverse knife cloth is inductively discharged on the 32nd day, and the light beam is reflected back to the portion of the laser medium by the mirror. If the wire is reflected in the reflection between the mirrors, it is a multiple of the integer, and a standing wave is generated to suddenly increase the induced discharge. Also, the wire shaker has the above-described structure capable of generating a laser beam. In industrial applications, 'manufacturing such as thin film transistor-liquid crystal display (TFT-LCD), plasma display (pDp), organic light-emitting display (〇 )) and other display devices, Miyazaki, in __ 伽巾, this hair ah The gathering of the lion's wave laser beam is set to be fine (4). Further, the present invention can be applied to any type of non-metallic substrate and to a glass plate for a surface display. Shipyard _ has a high red industry. Although the preferred embodiment of this (4) ^ slave is disclosed above, it is limited to 21 1294410 = Ming, and the domain is fine, as defined in the scope of the patent application scope attached to the spirit and scope of Qianxian (4). . BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Schematic® and its method flow chart; plate two Δ ^ control state is not intended and its method flow chart; plate cutting image non-metal base 筮 q back JTO (not thinking and its method flow chart; and the actual picture of the device is used for Explain the cutting of the non-metal substrate according to the present invention, and the following figure, wherein the fifth drawing shows the simultaneous cutting of the bonding plate or the lower surface; ^^ The upper substrate of the fourth (step) cutting and plywood [main component symbol description] 1 2 base Front and rear guides for front and rear guidance of the workbench 22 4 1294410 5 Linear motor and thruster 6 Laser head 7 Laser head fixed block 8 Focus moving device 8a Zoom lens 9 Measuring device 10 Laser beam generator 11 Optical system P Binder B B B2, B3 Laser beam focal length D Bu D2, D3 Cutting depth 23