TW200532386A - Exposure device for stripline work - Google Patents

Exposure device for stripline work Download PDF

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Publication number
TW200532386A
TW200532386A TW093136043A TW93136043A TW200532386A TW 200532386 A TW200532386 A TW 200532386A TW 093136043 A TW093136043 A TW 093136043A TW 93136043 A TW93136043 A TW 93136043A TW 200532386 A TW200532386 A TW 200532386A
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TW
Taiwan
Prior art keywords
workpiece
stage
vacuum
work
exposure
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TW093136043A
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Chinese (zh)
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TWI276925B (en
Inventor
Atsushi Mito
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Ushio Electric Inc
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Publication of TW200532386A publication Critical patent/TW200532386A/en
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Publication of TWI276925B publication Critical patent/TWI276925B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/70791Large workpieces, e.g. glass substrates for flat panel displays or solar panels
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/708Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825Mounting of individual elements, e.g. mounts, holders or supports
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046Strategy, e.g. mark, sensor or wavelength selection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

To securely detecting a work which has unevenness and is hardly sucked on a work stage, is sucked by holding the work on the work stage so as to suck while preventing a leak. The work stage (10) comprises a 1st stage (10a) on which an exposed area of the work (W) is mounted and 2nd stages (10b) which are provided upstream and downstream in the conveying direction of the stripline work (W) and on which parts other than the exposed area are mounted. Individual vacuum supply systems (16a and 16b) are connected to a 1st hole group (13a) and a 2nd hole group (13b) provided to the 1st and 2nd stages (10a and 10b ), and a vacuum sensor (14) which detects the work being sucked is provided to the vacuum supply system (16a). Then the parts other than the exposed area of the work (W) are sucked through the 2nd hole group (13b) to prevent a wrinkle in the peripheral part of the exposed area of the work (W), and the exposed area of the work (W) is sucked without causing a leak.

Description

200532386 (1) 九、發明說明 【發明所屬之技術領域】 本發明是關於一種經由光罩照射光,而將形成在光罩 的電路等的光罩圖案轉印至較長的薄膜電路基板(帶狀工 件)上的帶狀工件的曝光裝置;尤其是關於一種帶狀工件 的曝光裝置的吸附保持工件的工件載物台。 【先前技術】 在液晶等的顯示板、行動電話、數位相機,1C卡等, 使用著將積體電路安裝於厚度約2 5 // m至1 2 5 // m的聚酯 或聚醯亞胺等樹脂薄膜上的薄膜電路基板。 薄膜電路基板是在其製程中,例如爲寬度25 0mm,厚 度1 〇〇 // m,長度數百m的帶狀工件,通常被捲繞在捲盤 〇 又,薄膜電路基板是在上述樹脂薄膜上,黏貼著導電 體(例如銅箔)。製造薄膜電路基板是重複進行如4次至 5次塗佈光阻的工程,轉印所期望的電路圖案的曝光工程 ,光阻的顯像工程,除去不需要的導電體的蝕刻工程等。 在各工程中,從捲盤捲出薄膜電路基板,經處理加工 後’再被捲取在捲盤。以下將薄膜電路基板稱爲帶狀工件 〇 在第5圖表示帶狀工件的曝光裝置的例子。 帶狀工件W (以下也單單地稱爲工件w )是與保護工 件W的間隔物重疊而輥子狀地捲在捲出輥1。由捲出輥i -4- 200532386 (2) 拉出時’間隔物是被捲取在間隔物捲反輥1 a。 由捲出輥1所拉出的帶狀工件W是經過鬆弛部A 1, 中間導輥R2而藉由編碼輥R3與推壓輥R3’被夾持。編碼 輥R3是在工件搬運時,用以確認在下述的搬運輥是否產 生滑移的輥子。 從捲出輥1所拉出的帶狀工件W,是經曝光部3,而 藉由搬運輥R4與推壓輥R4’被夾持。帶狀工件W是搬運 藉由搬運輥R4進行旋轉所設定的所定量,被搬運至曝光 部3的工件載物台1 〇上。 在曝光部3上設有;由燈4a與聚光鏡4b所構成的光 照射部4,及具有光罩圖案的光罩Μ,及投影透鏡5。又 ,工件載物台10是被安裝在工件載物台驅動機構6上, 可朝上下,左右方向驅動,同時以垂直於工件載物台面的 軸作爲中心可進行旋轉。 在曝光部3,帶狀工件W是被曝光的領域背面側,藉 由真空吸附等保持手段被保持在工件載物台1 0表面。此 爲在藉由投影透鏡5所投影的光罩圖案的成像位置,固定 元件W曝光的領域,用以防止在曝光中工件W朝光軸方 向或搬運方向移動。 然後,驅動工件載物台驅動機構6,俾對位形成電路 等光罩圖案的光罩Μ與工件W的曝光領域。完成對位之 後,從光照射部4所放射的曝光光線經由光罩Μ,投影透 鏡5被照射在工件W,使得光罩圖案轉印至工件W。 完成曝光,帶狀工件 W是藉由搬運輥R4與推壓輥 -5 - 10 200532386 (3) R4 ’被夾持,被搬運至下一曝光領域會到達工件載物台 上而被曝光。 輥 起 箔 或 脹 部 在 工 如 等 件 件 同 方 作成如此地帶狀工件W是依次被曝光’經導輥R 5 鬆弛部 A2被捲取在捲取輥2。這時候,從間隔物捲出 2 a送出間隔物,而已曝光的帶狀工件W是與間隔物一 被捲取在捲取輥2。 在上述帶狀工件,如TAB帶地,有如銅箔的金屬 黏貼在聚醯亞胺等的樹脂薄膜者。銅箔的黏貼是施以熱 壓力來進行之故,因而藉由銅箔與有機化合物薄膜的熱 係數的不相同,而有朝寬度方向產生彎曲。 又,在事先工程中,藉由具有因應於設在工件周邊 的打眼孔的節距的突起的鏈輪輥來搬運帶狀工件W,則 打眼孔附近的薄膜會產生延伸或變形的情形。 在此種帶狀工件中,如上述地重複曝光工程,顯像 程,蝕刻工程,則彎曲或縐紋會變大,如第6圖所示地 在帶狀工件W的打眼孔PH附近的薄膜會產生凹凸,而 裙帶菜地有成爲縐紋產生在整體的狀態的情形。 如上述地,曝光時,帶狀工件 W是藉由真空吸附 的保持手段被保持在平面的工件載物台1 〇上,帶狀工 W被保持在工件載物台1 〇上的情形,藉由被供給於工 載物台1 0的真空壓力進行檢測。 在第7圖表示習知工件載物台1 〇的槪略構成,由 圖來說明上述保持手段。又,同圖是從帶狀工件的寬度 向(正交於工件載物台搬運方向的方向)觀看的斷面圖< -6 - 200532386 (4) 如第7圖所不地,在工件載物台1 0內部設有真空供 糸δ室1 1 ’而在真空供給室1 1 ’經由電磁閥1 5連接有來自 真空泵1 2的真空供給系統。 在工件載物台1 0的表面設有多數真空吸附孔1 3,在 真空吸附孔1 3經由真空供給室丨1供給有真空,使得工件 W被吸附保持在工件載物台1 〇的表面。 在真空供給系統設有檢測真空壓力的真空感測器1 4, 來檢測工件W的吸附。亦即,若在工件載物台1 〇表面來 吸附工件W時’即使在真空供給室11供給真空,也由真 空吸附孔1 3吸進大氣之故,因而真空供給系統是幾乎不 會減壓’壓力是仍接近於大氣壓。 但是,當在工件載物台1 0表面吸附著工件 W,不會 吸進來自真空吸附孔1 3的大氣而使真空供給系統。因此 會降低壓力。 真空感測器1 4是檢測上述真空供給系統的壓力,而 該壓力比設定的閾値壓力還低時,則將導通(ON )信號 發訊至曝光裝置的控制部3 0 ;而還高時則將斷開(Ο F F ) 信號發訊至曝光裝置的控制部3 0。控制部3 0是當ON信 號被輸入時,則認識爲工件W被吸附在工件載物台1 0表 面,曝光裝置是移至爲了曝光的下一動作;例如移至光罩 Μ與工件W的對位動作或實際的曝光動作。 光罩Μ的圖案能淸晰度優異地成像在工件W表面般 地’工件載物台1 〇的表面位置是事先藉由上述工件載物 台驅動機構6,被設定在所定位置。 200532386 (5) 但是,如第6圖所示地,若縐紋或彎曲所致的凹凸產 生在帶狀工件W,當帶狀工件w被吸附在工件載物台1 0 時’則在工件w被吸附的領域(被曝光的領域)的周邊 部’間隙產生在工件W與工件載物台1 〇之間,如第7圖 所示地真空從該間隙洩漏。200532386 (1) IX. Description of the invention [Technical field to which the invention belongs] The present invention relates to a method of transferring a photomask pattern such as a circuit formed on the photomask to a long thin-film circuit board A belt-shaped workpiece exposure device on a strip-shaped workpiece); in particular, the invention relates to a strip-shaped workpiece exposure device that holds and holds a workpiece. [Prior technology] Polyester or polyurethane, which is used to mount integrated circuits to a thickness of about 2 5 // m to 1 2 5 // m, is used in display panels such as liquid crystals, mobile phones, digital cameras, 1C cards, etc. Thin-film circuit boards on resin films such as amines. The thin film circuit substrate is a strip-shaped workpiece having a width of 250 mm, a thickness of 1000 // m, and a length of several hundred m in the manufacturing process, and is usually wound on a reel. The thin film circuit substrate is made of the above resin film. On the surface, a conductive body (such as copper foil) is stuck. Manufacturing thin-film circuit substrates involves repeating the process of coating photoresist 4 to 5 times, exposing process of transferring desired circuit patterns, developing process of photoresist, etching process of removing unnecessary conductors, and the like. In each process, the thin-film circuit board is taken out from the reel, and after being processed, it is taken up on the reel. Hereinafter, a thin-film circuit board is referred to as a strip-shaped workpiece. FIG. 5 shows an example of an exposure apparatus for a strip-shaped workpiece. The belt-shaped workpiece W (hereinafter also referred to simply as the workpiece w) is wound on the take-up roller 1 in a roll shape while overlapping with the spacer for protecting the workpiece W. By the unwinding roller i -4- 200532386 (2) When the 'spacer' is pulled out, it is wound on the spacer roll reverse roller 1 a. The belt-shaped workpiece W pulled out by the take-up roller 1 passes through the slack portion A1, the intermediate guide roller R2, and is held by the encoding roller R3 and the pressing roller R3 '. The coding roller R3 is a roller for confirming whether or not a slip occurs in the transfer roller described below when the workpiece is transferred. The belt-shaped workpiece W pulled out from the unwinding roller 1 passes through the exposure section 3 and is held by the conveying roller R4 and the pressing roller R4 '. The belt-shaped workpiece W is conveyed by a predetermined amount set by rotation of the conveying roller R4, and is conveyed to the workpiece stage 10 of the exposure section 3. The exposure unit 3 is provided with a light irradiation unit 4 composed of a lamp 4a and a condenser lens 4b, a mask M having a mask pattern, and a projection lens 5. The workpiece stage 10 is mounted on the workpiece stage driving mechanism 6 and can be driven in the up-down and left-right directions while being rotatable about an axis perpendicular to the workpiece stage surface. In the exposure section 3, the strip-shaped workpiece W is the back side of the exposed area, and is held on the surface of the workpiece stage 10 by holding means such as vacuum suction. This is an area where the exposure of the element W is fixed at the imaging position of the mask pattern projected by the projection lens 5 to prevent the workpiece W from moving in the optical axis direction or the conveying direction during the exposure. Then, the workpiece stage driving mechanism 6 is driven to expose the mask M of the mask pattern such as the alignment forming circuit and the exposure area of the workpiece W. After the alignment is completed, the exposure light radiated from the light irradiating section 4 passes through the mask M, and the projection lens 5 is irradiated to the workpiece W, so that the mask pattern is transferred to the workpiece W. After the exposure is completed, the belt-shaped workpiece W is clamped by the conveying roller R4 and the pressing roller -5-10 200532386 (3) R4 ′, which is conveyed to the next exposure area and will be exposed on the workpiece stage. The roll-up foil or bulging portion is formed in the same way as the pieces so that the strip-shaped workpieces W are sequentially exposed 'via the guide roller R 5 slack portion A2 and wound on the take-up roller 2. At this time, the spacer is taken out from the spacer 2a, and the exposed strip-shaped workpiece W is taken up by the take-up roll 2 with the spacer. In the above-mentioned strip-shaped workpiece, such as a TAB strip, a metal such as a copper foil is adhered to a resin film such as polyimide. The copper foil is adhered by applying thermal pressure. Therefore, due to the difference in thermal coefficient between the copper foil and the organic compound film, there is a warp in the width direction. Further, in the prior process, the belt-shaped workpiece W is conveyed by a sprocket roller having a protrusion corresponding to the pitch of the perforations provided on the periphery of the workpiece, and the film near the perforations may be stretched or deformed. In such a strip-shaped workpiece, as described above, the exposure process, the development process, and the etching process are repeated, and the curvature or crepe becomes larger. As shown in FIG. 6, the film is near the perforation PH of the strip-shaped workpiece W. Unevenness may occur, and wakame may become a state where crepe is generated as a whole. As described above, during the exposure, the strip-shaped workpiece W is held on the flat workpiece stage 10 by the vacuum suction holding means, and the strip-shaped worker W is held on the workpiece stage 10. Detection is performed by the vacuum pressure supplied to the work stage 10. The schematic structure of the conventional workpiece stage 10 is shown in FIG. 7, and the holding means is described with reference to the figure. The same figure is a sectional view viewed from the width direction of the strip-shaped workpiece (orthogonal to the direction in which the workpiece stage is transported) < -6-200532386 (4) As shown in Figure 7, A vacuum supply chamber δ chamber 1 1 ′ is provided inside the stage 10, and a vacuum supply system from a vacuum pump 12 is connected to the vacuum supply chamber 11 1 ′ via a solenoid valve 15. A plurality of vacuum suction holes 13 are provided on the surface of the workpiece stage 10, and a vacuum is supplied to the vacuum suction holes 13 through the vacuum supply chamber 1 so that the workpiece W is sucked and held on the surface of the workpiece stage 10. The vacuum supply system is provided with a vacuum sensor 14 for detecting a vacuum pressure to detect the adsorption of the workpiece W. That is, if the workpiece W is adsorbed on the surface of the workpiece stage 10, even if a vacuum is supplied in the vacuum supply chamber 11, it is sucked into the atmosphere through the vacuum suction holes 13, so the vacuum supply system hardly decompresses. 'Pressure is still close to atmospheric pressure. However, when the workpiece W is adsorbed on the surface of the workpiece stage 10, the air is not sucked into the atmosphere from the vacuum suction hole 13 and the vacuum is supplied to the system. This reduces stress. The vacuum sensor 14 detects the pressure of the above-mentioned vacuum supply system, and when the pressure is lower than the set threshold pressure, it sends an ON signal to the control unit 30 of the exposure device; when it is still high, Send the OFF (0 FF) signal to the control unit 30 of the exposure device. The control unit 30 recognizes that the workpiece W is attracted to the surface of the workpiece stage 10 when the ON signal is input, and the exposure device moves to the next action for exposure; for example, it moves to the photomask M and the workpiece W. Registration action or actual exposure action. The pattern of the photomask M can be imaged on the surface of the workpiece W with excellent sharpness. The surface position of the workpiece stage 10 is set to a predetermined position in advance by the workpiece stage driving mechanism 6 described above. 200532386 (5) However, as shown in FIG. 6, if the unevenness caused by the crepe or bending is generated on the band-shaped workpiece W, when the band-shaped workpiece w is adsorbed on the workpiece stage 10, 'the workpiece w A gap “periphery” of the attracted area (exposed area) is generated between the workpiece W and the workpiece stage 10, and a vacuum leaks from the gap as shown in FIG. 7.

若產生浅漏’則真空供給系統是不會被減壓,而真空 感測器1 4是不會輸出ON信號。因此,不僅工件W雖存 在於工件載物台1 0表面,控制部3 〇是無法認識工件W 的吸附,成爲吸附錯誤,裝置是無法移至爲了曝光的下一 動作。 爲了錯由真空感測器1 4來檢測工件W吸附,防止來 自工件W被吸附的領域(被曝光的領域)的周邊部的洩 漏就可以。 作爲防止來自帶狀工件W的寬度方向兩側(形成有 打眼孔的邊緣部分)的洩漏方法,例如提案著將工件的周 邊部機械式地推壓至工件載物台的方法(參照專利文獻1 )。形成有打眼孔的邊緣部分是被曝光的領域外之故,因 而即使機械式地推壓也沒有問題。 又’在專利文獻2,提案著不會產生彎曲或縐紋,爲 了將工件真空吸附在工件載物台,將設於工件載物台上的 曝光領域內的真空吸附孔,區分成複數孔群,並將各孔群 分別連接於不相同的連通室,依次真空吸引各連通室的方 法。 專利文獻1 :日本特開平3 — 2 8 2 4 7 3號公報 200532386 (6) 專利文獻2 :日本特許第2 8 04 1 5 1號公報 但是,如上述第6圖所示地彎曲或縐紋變大,若在帶 狀工件 W的邊緣部分整體產生凹凸的狀態,如記載於上 述專利文獻1所述地,即使將工件 W的邊緣部分推壓至 帶狀工件1 0,邊緣部分的縐紋會出現在帶狀工件的長度方 向,如上述第7圖所示地,仍然產生縐紋之狀態下被吸引 至載物台而產生洩漏。 又,如來自第8圖的搬運方向的斷面圖所示地,藉由 上述專利文獻1所述的工件推壓部2 1,即使將工件W的 邊緣部分推壓至帶狀工件1 0,成爲除了縐紋之外的部分, 是黏貼於工件載物台1 0惟縐紋部分是對於工件載物台1 0 也成爲浮起狀態,而從該部分產生洩漏。 產生在該長度方向的縐紋是即使增多供給於工件載物 台的真空量,也不會消失,而不會阻止洩漏。 又,針對於帶狀工件W的長度方向,爲形成有圖案 的領域,若機械式地推壓,則有成爲在所形成的圖案有傷 痕或附著有灰塵等不方便的原因的情形,因此無法採取機 械式地推壓工件的手段。 另一方面,如上述專利文獻2所述地,也可考量使用 將設在工件載物台上的曝光領域內的真空吸附孔,區分成 複數孔群,依次真空吸引各孔群,惟對於如上述第6圖所 示地產生凹凸的帶狀工件,無法期待效果。 亦即,若依次真空吸引設在工件載物台的曝光領域內 的孔群,則曝光領域的中心部分,是被吸附在工件載物台 -9 - 200532386 (7) ,惟在曝光領域的周邊部分’如上述第7圖所示地留下縐 紋,則縐紋部分是對於工件載物台成爲仍浮起之狀態,由 該部分產生浅漏° 所以,上述真空感測器14是未輸出Ο N信號,如上 述地,裝置是無法移行至爲了曝光的下一動作。 【發明內容】 本發明是爲了解決上述先前技術的缺點問題而創作者 ,本發明的目的是對於整體上產生凹凸而不容易吸附在工 件載物台的帶狀工件,不必機械式地推壓形成有圖案的領 域,一面防止洩漏一面可吸附保持在工件載物台上,使得 帶狀工件可確實地檢測被吸附在工件載物台的情形。 在本發明中,如下地解決上述課題。 在工件載物台,除了用以真空吸附工件被曝光的領域 的多數第一孔群之外,至少在工件搬運方向的上游側與下 游惻,設置檢測吸附上述工件的感測器。 又,在工件載物台搬運工件時,以上述第二孔群來吸 引工件被曝光的領域外的部分,防止發生工件被曝光的領 域的周邊部的總紋。由此,不會發生洩漏而可吸附工件被 曝露的領域。 在本發明中,可得到以下的效果。 (1 )藉由被連接於與吸附工件所曝光的領域的第一 孔群另一個的真空供給系統的第二孔群來吸引對於工件被 曝光的領域除了工件搬運方向上游側與下游側被曝光的領 -10- 200532386 (8) 域之外的領域之故’因而在工件被曝光的領域周邊’工件 是減少縐紋而成爲平面,使得間隙不會產生在工件被曝光 的領域與工件載物台之間。 因此可防止吸附工件被曝光的領域的第一孔群的洩漏 〇 所以,即使在彎曲或縐紋變大的工件,也藉由設於被 連接於上述第一孔群的真空供給系統的真空感測器,可確 實地檢測工作被吸附的情形,成爲可移行至用以曝光的下 一動作。 又,在除了設有上述第二孔群的曝光的領域之外的領 域,雖產生洩漏,惟連接著與吸附工件被曝光的領域的第 一孔群另一個的真空供給系統之故,因而連接於第一孔群 的真空供給系統是不會有以其洩漏影響而使得壓力上昇的 情形,可正確地認識工件的吸附。 (2)未機械式地推壓形成有工件的圖案之故,因而 不會有在圖案受到傷痕或附著灰塵的情形。 【實施方式】 在第1圖及第2圖表示本發明的實施例的工件載物台 的構成。第1圖是表示從帶狀工件的寬度方向(正交於帶 狀工件的搬運方向的方向)觀看的工件載物台的斷面圖; 第2圖是表示從上方觀看工件載物台的圖式(在同圖省略 了推壓下述的帶狀工件的邊緣部分的工件推壓機構)。 又’本實施例的帶狀工件的曝光裝置的整體構成,是 -11 - 200532386 Ο) 與表示於上述第5圖者相同,如上所述地’從捲出輥1被 拉出的帶狀工件W,是被送至設於曝光部3的表示於上述 第1圖,及第2圖的工件載物台10上,藉由真空吸附被 保持。又,完成對位之後,光罩圖案被轉印至施以帶狀工 件W的領域。帶狀工件W是依次被搬運至上述工件載物 台10而被曝光,曝光後,被捲取在捲取輥2。 如第1圖,及第2圖所示地,本實施例的工件載物台 10是由:載置有曝光時,載置有帶狀工件W被曝光的領 域的第一載物台(曝光載物台)1 〇 a,及設於帶狀工件 W 的搬運方向上游側與下游側,載置有被曝光的領域外的部 分的第二載物台(補助載物台)1 〇b所構成。 又,第一載物台l〇a與第二載物台l〇b,是由同一平 面的一體載物台可構成,第一載物台10a與第二載物台 1 〇b是僅將真空供給系統作成不相同,由上方觀看的外觀 相同。又,在第一載物台l〇a載置有帶狀工件W被曝光的 領域之故,因而第一載物台1 0 a的大小是與表示於上述第 7圖的工件載物台大約相同,本實施例的工件載物台1 〇是 僅上述第二載物台1 〇 b的分量,比先前的工件載物台朝帶 狀工件W的搬運方向較長。 如第1圖所示地,第一載物台(曝光載物台);! 〇 a的 斷面構造,是與先前的工件載物台同樣的構造。 在內部設:有真空供給室11a,又在表面設有多數真空 吸附孔(第一孔群)1 3 a,在真空供給室丨丨a連接有來自 真空泵1 2 a的第一真空供給系統1 6 a。在第一真空供給系 -12· 200532386 (10) 統1 6 a設有檢測工件W的吸附的真空感測器1 4與將真空 供給於第一載物台1 0 a的第一電磁閥1 5 a。真空感測器1 4 是如上所述地檢測上述真空供給系統的壓力,該壓力比所 設定的閾値壓力還低時則將Ο N信號,若還高時則將〇 F F 信號發訊至曝光裝置的控制部3 0。控制部3 0是當輸入 ON信號’則認識爲工件W被吸附在工件載物台1 〇的表 面,曝光裝置是移至用以曝光的下一動作,例如光罩Μ與 工件W的對位動作或實際的曝光動作。 在第一載物台1 〇a的帶狀工件搬運方向的上游側,下 游側,設有第二載物台(輔助載物台0b。 第二載物台l〇b的斷面構造,也與第一載物台〗〇的 斷面構造同樣,在內部設有真空供給室i丨b,在表面設有 多數真空吸附孔(第二孔群)13b,在真空供給室nb連 接有來自真空泵12b的第二真空供給系統16b。在第二真 空供給系統1 6 b安裝有第二電磁閥丨5 b,惟並不必設置真 空感測器 在此’將真空供給於第一載物台1 〇 a的第一真空供給 系統1 6a,及將真空供給於第二載物台;[〇b的第二真空供 給系統1 6b,是獨立的另一個系統;第一真空供給系統 1 6a是被連接於第一真空泵12a,而第二真空供給系統Ub 是被連接於第二真空泵12b。 因此’即使第一真空供給系統1 6 b的壓力變動有所變 動’由此,第一真空供給系統1 6 a的壓力不會變化。 上述的「獨立的另一個系統」,是指另一方面的真空 -13- 200532386 (11) 供給系統的壓力變動,對於另一方的壓力不會有影響的養: 思。在同圖中,使用兩台真空泵作成完全不相同的系統, 惟若如工廠的大容量的沒有壓力變動的真空供給線,則連 接在真空供給線也不會有問題。 在上述工件載物台1 0的帶狀工件寬度方向兩側(第1 圖的紙面前後方向),爲了防止來自帶狀工件W的寬度 方向兩側的洩漏,設有推壓上述的帶狀工件的邊緣部分的 工件推壓機構20。 在第3圖表示上述工件推壓機構的構成例。 如同圖所示地,工件推壓機構20是設在被安裝於工 件載物台1 0的兩側的機框2 5上,由推壓帶狀工件w的 邊緣部分的工件推壓部2 1,及驅動該工件推壓部2 1的工 件推壓部驅動部.2 2所構成。 工件推壓部驅動部22是具備:被連結於上述工件推 壓部21的L形構件23,及驅動該L形構件23的氣缸24 〇 工件推壓部2 1是藉由上述工件推壓部驅動部22被驅 動,如同圖所示地當帶狀工件 W被曝光的領域搬運至曝 光位置,則從上方推壓設有帶狀工件W的打根孔PH的邊 緣部分,推壓至工件載物台10。又,在工件 W,設有用 以對位工件 W的工件標記 WAM,爲了避開該工件標記 WAM,在工件推壓部21設有缺口部21a。 第4圖是表示說明上述工件推壓機構20的動作的圖 式。如第4(a)圖所示地,在未推壓工件 W的邊緣部分 -14- 200532386 (12) 的狀態下,氣缸24的軸24a是後退,而工件推壓部2 1是 從工件載物台1 0隔開。 氣缸2 4被驅動,而使得軸2 4 a前進,則如第4 ( b ) 圖所示地,藉由軸2 4 a使得L形構件2 4 a被推壓,以軸 2 3 a爲中心進行旋轉,而使工件推壓部2 1朝工件載物台 1 〇推壓帶狀工件W的邊緣部分。 以下,藉由上述第1圖至第3圖來說明被吸附在第一 載物台10a與第二載物台l〇b之際的動作。 (1)帶狀工件W被搬運至工件載物台10上,在這 一次欲進行曝光的領域被放在工件載物台1 0的第一載物 台l〇a上。工件的寬度方向邊緣部分,藉由表示於第3圖 的工件推壓機構20,被推壓至工件載物台10。 (2 )表示於第1圖的第一電磁閥15a與第二電磁閥 15b進行動作,而在第一載物台10a與第二載物台i〇b供 給有真空。 (3 )工件W被曝光的領域(的背面側)被吸附在第 一載物台1 〇a。又,對於曝光領域,工件長度方向的搬運 方向上游側與下游側的領域。也藉由第二載物台1 〇b,從 表示於第1圖的虛線的狀態和同圖的箭號所示地被拉到第 二載物台1 0 b側。 (4 )在第二載物台l〇b中,帶狀工件W是在有洩漏 的狀態下被吸引。這時候的狀態,是與表示於上述第8圖 者同樣狀態。亦即,藉由表示於第3圖的工件推壓部2 1, 即使將工件W的邊緣部分推壓至工件載物台1 〇,皺紋部 -15- 200532386 (13) 分是對於工件載物台1 〇仍成爲浮起之狀態’而從該部分 產生洩漏。 但是在第二載物台1 0 b的外側,雖仍留下稍微縐紋, 惟隨著接近內側,亦即接近於被曝光的領域的方向,沿著 第二載物台10b的表面被矯正而大致成爲平面。 (5 )由此,在第一載物台1 〇 a所吸附的被曝光領域 的習知發生縐紋而有洩漏的周邊部分,工件W成爲平面 ,而在工件W與第一載物台1 0a之間不會有間隙,工件 W是不會有洩漏地被吸附在第一載物台10a。 (6 )所以’第一真空供給系統丨6a是無洩漏地被減 壓而使壓力下降’俾使真空感測器1 4將ON信號輸出至 控制部3 0。 控制部3 0是依據來自真空感測器1 4的信號,在第一 載物台1 0 a吸附有工件W被曝光的領域,而在投影透鏡5 (參照上述第5圖)的成像位置認識被保持在平面的情形 ’裝置是可移至用以曝光的下一動作,如光罩與工作的對 位動作或曝光動作。 在此,在第二載物台10b中,藉由產生在工件 W的 凹凸而產生浅漏’第二真空供給系統16b是壓力不會下降 ’或是利用空氣的流進而會變動。 但是’如上所述地,第一真空供給系統〗6 a與第二真 空供給系統1 6 b是獨立的另一個的系統之故,因而第一真 空供給系統1 6a是不會受到其影響而被減壓,真空感測器 1 4是可正確地檢測工件W被曝光的領域被吸附至第一工 -16 - 200532386 (14) 件載物台l〇a的情形。 又,也可錯開第一電磁閥15a與第二電磁閥15b的動 作的時機。亦即,首先動作第一電磁閥1 5 a,將工件W被 吸附在第一載物台1 0 a,之後動作第二電磁閥1 5 b,藉由 第二載物台1 Ob來吸引工件W。 如此地,當動作電磁閥1 5 a,1 5 b,即使凹凸較多的工 件’也可使工件從曝光領域朝其周邊部被吸附。因此可防 止縐紋留在被曝光的領域,結果,藉由真空感測器可檢測 保持的情形。 又,在第1圖及第2圖中,將第一載物台l〇a與第二 載物台l〇b作成一體構造,惟將工件載物台與輔助吸引載 物台作成另外構件也可以。 【圖式簡單說明】 第1圖是表示本發明的實施例的工件載物台的構成的 斷面圖。 第2圖是表示從上方觀看圖示於第1圖的工件載物台 的圖式。 第3圖是表示工件推壓機構的構成例的圖式。 第4(a)圖及第4(b)圖是表示說明工件推壓機構 的動作的圖式。 第5圖是表示帶狀工件的曝光裝置的一例子的圖式。 第6圖是表示產生總紋或彎曲所致的凹凸的帶狀工件 的一例子的圖式。 -17- 200532386 (15) 第7圖是表示先前的工件載物台的構成的斷面圖。 第8圖是表示在先前的工件載物台中,藉由工件推壓 機構來推壓工件的邊緣部分的狀態的圖式。 【主要元件之符號說明】 1 0 :工件載物台 10a :第一載物台(曝光載物台) 10b :第二載物台(輔助載物台) 1 1 a,1 1 b :真空供給室 12a , 12b :真空泵 1 3 a :第一孔群 1 3 b :第二孔群 1 4 :真空感測器 1 5 a,1 5 b :電磁閥 16a :第一真空供給系統 16b :第二真空供給系統 2 0 :工件推壓機構 2 1 :工件推壓部 22 :工件推壓部驅動部 2 3 : L形構件 24 :氣缸 3 0 :控制部If a shallow leak occurs, the vacuum supply system will not be decompressed, and the vacuum sensor 14 will not output an ON signal. Therefore, not only the workpiece W exists on the surface of the workpiece stage 10, but the control unit 30 cannot recognize the adsorption of the workpiece W, which is an adsorption error, and the device cannot move to the next operation for exposure. In order to detect the suction of the workpiece W by the vacuum sensor 14, it is sufficient to prevent leakage from the peripheral portion of the area (the exposed area) where the workpiece W is sucked. As a method of preventing leakage from both sides in the width direction of the band-shaped workpiece W (edge portions where perforations are formed), for example, a method of mechanically pressing the peripheral portion of the workpiece to the workpiece stage is proposed (see Patent Document 1) ). The edge portion where the perforations are formed is outside the area to be exposed, so there is no problem even if it is pressed mechanically. Also, in Patent Document 2, it is proposed that no bending or wrinkles are generated. In order to vacuum-absorb a workpiece on a workpiece stage, vacuum suction holes provided in the exposure area on the workpiece stage are divided into a plurality of hole groups. , And each hole group is connected to a different communication chamber, and the method of vacuum suction each communication chamber in turn. Patent Document 1: Japanese Patent Laid-Open No. 3-2 8 2 4 7 3 200532386 (6) Patent Document 2: Japanese Patent No. 2 8 04 1 5 1 However, it is bent or wrinkled as shown in FIG. 6 described above. If the edge portion of the band-shaped workpiece W becomes uneven as described above, as described in the above-mentioned Patent Document 1, even if the edge portion of the workpiece W is pushed to the band-shaped workpiece 10, the wrinkles at the edge portion become large. It will appear in the longitudinal direction of the band-shaped workpiece. As shown in Figure 7 above, the crepe is still attracted to the stage and leakage occurs. As shown in the cross-sectional view from the conveying direction in FIG. 8, even if the edge portion of the workpiece W is pushed to the band-shaped workpiece 10 by the workpiece pressing portion 21 described in the aforementioned Patent Document 1, The portion other than the crepe is adhered to the workpiece stage 10, but the crepe portion is in a floating state with respect to the workpiece stage 10, and leakage occurs from the portion. The crepe generated in this longitudinal direction is such that even if the amount of vacuum supplied to the work stage is increased, it does not disappear, and leakage is not prevented. In addition, in the longitudinal direction of the band-shaped workpiece W, in the area where a pattern is formed, if it is mechanically pushed, it may cause inconveniences such as scratches or dust on the formed pattern, so it cannot be used. By means of mechanically pushing the workpiece. On the other hand, as described in the above-mentioned Patent Document 2, it is also possible to consider using a vacuum suction hole provided in the exposure area on the workpiece stage to divide into a plurality of hole groups, and sequentially vacuum suction each hole group. The band-shaped workpiece having unevenness as shown in the above-mentioned FIG. 6 cannot be expected. That is, if the hole group provided in the exposure area of the workpiece stage is vacuum-sucked in order, the central part of the exposure area is attracted to the workpiece stage-9-200532386 (7), but only around the exposure area. The part crepe is left as shown in FIG. 7 above, the crepe part is still in a floating state with respect to the workpiece stage, and a shallow leak is generated by this part. Therefore, the vacuum sensor 14 is not output. 〇 N signal, as described above, the device cannot move to the next action for exposure. [Summary of the Invention] The present invention was created by the inventor to solve the above-mentioned disadvantages of the prior art. The object of the present invention is to eliminate the need for mechanical pressing to form a strip-shaped workpiece that generates unevenness as a whole and is not easily adsorbed on the workpiece stage. In the patterned area, it can be sucked and held on the workpiece stage while preventing leakage, so that the strip-shaped workpiece can be reliably detected on the workpiece stage. In this invention, the said subject is solved as follows. The workpiece stage is provided with a sensor for detecting the adsorption of the workpiece, at least on the upstream side and downstream of the workpiece conveyance direction, in addition to most of the first hole groups in the area where the workpiece is exposed by vacuum suction. Moreover, when the workpiece is carried by the workpiece stage, the second hole group is used to attract the part outside the area where the workpiece is exposed, so as to prevent the occurrence of gross lines in the peripheral portion of the area where the workpiece is exposed. Thereby, the area where the workpiece is exposed can be adsorbed without leaking. In the present invention, the following effects can be obtained. (1) The second hole group of the vacuum supply system connected to the first hole group and the second hole group of the area exposed by the suction workpiece is attracted to the exposed area of the workpiece except the upstream and downstream sides of the workpiece conveyance direction. -10-200532386 (8) The reason for areas outside the field 'therefore around the area where the workpiece is exposed' The workpiece is reduced to creases and becomes flat, so that the gap does not occur in the area where the workpiece is exposed and the workpiece load Between stations. Therefore, it is possible to prevent the leakage of the first hole group in the area where the suction workpiece is exposed. Therefore, even in the case of a workpiece having a large curvature or crease, the vacuum feeling provided by the vacuum supply system connected to the first hole group The detector can reliably detect the situation where the work is sucked, and can move to the next action for exposure. In addition, in areas other than the exposure area where the second hole group is provided, although a leak occurs, it is connected to another vacuum supply system of the first hole group in the area where the suction workpiece is exposed, so it is connected. Since the vacuum supply system of the first hole group does not cause the pressure to rise due to its leakage, it is possible to correctly recognize the adsorption of the workpiece. (2) Since the pattern on which the workpiece is formed is not mechanically pushed, there is no possibility that the pattern is scratched or dust is attached. [Embodiment] Figs. 1 and 2 show the structure of a work stage according to an embodiment of the present invention. FIG. 1 is a cross-sectional view of the workpiece stage viewed from the width direction of the strip-shaped workpiece (a direction orthogonal to the conveyance direction of the strip-shaped workpiece). FIG. 2 is a diagram illustrating the workpiece stage viewed from above. (The workpiece pushing mechanism for pushing the edge portion of the strip-shaped workpiece described below is omitted in the same figure). (The overall configuration of the exposure device for the strip-shaped workpiece of this embodiment is -11-200532386 〇) The same as that shown in FIG. 5 described above, as described above, the strip-shaped workpiece pulled out from the take-up roll 1 W is sent to the workpiece stage 10 provided in the exposure section 3 and shown in the above-mentioned first and second figures, and is held by vacuum suction. After the registration is completed, the mask pattern is transferred to the area where the belt-shaped workpiece W is applied. The belt-shaped workpiece W is sequentially conveyed to the above-mentioned workpiece stage 10 and exposed, and after being exposed, it is taken up by the take-up roll 2. As shown in FIG. 1 and FIG. 2, the workpiece stage 10 of the present embodiment is formed by placing the first stage (exposure) of the area where the strip-shaped workpiece W is exposed when exposure is placed. Stage) 1 〇a, and a second stage (subsidiary stage) 1 〇b located on the upstream and downstream sides of the belt-shaped workpiece W in the conveying direction and placing a part outside the area to be exposed. Make up. In addition, the first stage 10a and the second stage 10b may be constituted by an integrated stage on the same plane, and the first stage 10a and the second stage 10b are only The vacuum supply system is different, and the appearance is the same when viewed from above. Since the strip-shaped workpiece W is exposed on the first stage 10a, the size of the first stage 10a is approximately the same as that of the workpiece stage shown in FIG. 7 described above. Similarly, the workpiece stage 10 of this embodiment is only a component of the second stage 10b described above, and is longer than the previous workpiece stage in the direction of conveying the band-shaped workpiece W. As shown in Fig. 1, the first stage (exposure stage);! 〇 a cross-sectional structure is the same structure as the previous workpiece stage. Inside is provided: a vacuum supply chamber 11a, and a plurality of vacuum suction holes (first hole group) 1 3a on the surface, and a first vacuum supply system 1 from a vacuum pump 1 2a is connected to the vacuum supply chamber 丨 a 6 a. The first vacuum supply system-12 · 200532386 (10) system 16a is provided with a vacuum sensor 14 which detects the adsorption of the workpiece W, and a first solenoid valve 1 which supplies a vacuum to the first stage 10a 5 a. The vacuum sensor 1 4 detects the pressure of the vacuum supply system as described above. When the pressure is lower than the set threshold pressure, it sends a 0 N signal, and when it is high, it sends a 0FF signal to the exposure device. Control section 30. The control unit 30 recognizes that the workpiece W is attracted to the surface of the workpiece stage 10 when the ON signal is input. The exposure device moves to the next operation for exposure, for example, the alignment of the mask M and the workpiece W. Action or actual exposure action. A second stage (auxiliary stage 0b) is provided on the upstream side and downstream side of the strip-shaped workpiece conveying direction of the first stage 10a. The cross-sectional structure of the second stage 10b is also provided. Similar to the cross-sectional structure of the first stage, a vacuum supply chamber i 丨 b is provided inside, a plurality of vacuum suction holes (second hole groups) 13b are provided on the surface, and a vacuum pump is connected to the vacuum supply chamber nb 12b of the second vacuum supply system 16b. The second vacuum supply system 16b is provided with a second solenoid valve 5b, but it is not necessary to install a vacuum sensor here to supply vacuum to the first stage 1 〇 a's first vacuum supply system 16a, and a vacuum supply to the second stage; [0b's second vacuum supply system 16b, is another independent system; the first vacuum supply system 16a is connected The first vacuum pump 12a, and the second vacuum supply system Ub is connected to the second vacuum pump 12b. Therefore, 'even if the pressure of the first vacuum supply system 16b changes,' as a result, the first vacuum supply system 16 The pressure of a will not change. The above "independent another system", Refers to the vacuum on the other hand-13- 200532386 (11) The pressure change of the supply system will not affect the pressure of the other side: Thinking. In the same figure, two vacuum pumps are used to make completely different systems. However, if there is a large-capacity vacuum supply line without pressure fluctuations in the factory, there is no problem in connecting to the vacuum supply line. The strip-shaped workpiece on both sides of the workpiece stage 10 (the paper surface of FIG. 1) Front and rear directions), in order to prevent leakage from both sides in the width direction of the strip-shaped workpiece W, a workpiece-pressing mechanism 20 is provided to press the edge portion of the strip-shaped workpiece W. The structure of the workpiece-pressing mechanism is shown in FIG. For example, as shown in the figure, the workpiece pressing mechanism 20 is a workpiece pressing portion provided on the frame 25 mounted on both sides of the workpiece stage 10, and presses an edge portion of the band-shaped workpiece w. 21, and a workpiece pressing section driving section .2 2 which drives the workpiece pressing section 21. The workpiece pressing section driving section 22 includes an L-shaped member 23 connected to the workpiece pressing section 21, And the cylinder 24 that drives the L-shaped member 23 The pressing part 21 is driven by the workpiece pressing part driving part 22 described above. When the area where the belt-shaped workpiece W is exposed is transported to the exposure position as shown in the figure, the driving part provided with the belt-shaped workpiece W is pressed from above. The edge portion of the root hole PH is pushed to the workpiece stage 10. The workpiece W is provided with a workpiece mark WAM for aligning the workpiece W, and in order to avoid the workpiece mark WAM, a workpiece pressing portion 21 is provided. The notch portion 21a. Fig. 4 is a diagram illustrating the operation of the workpiece pressing mechanism 20. As shown in Fig. 4 (a), the edge portion of the workpiece W is not pushed by 14-200532386 (12). In the state, the shaft 24a of the air cylinder 24 is retracted, and the workpiece pressing portion 21 is separated from the workpiece stage 10. The cylinder 2 4 is driven and the shaft 2 4 a is advanced. As shown in FIG. 4 (b), the L-shaped member 2 4 a is pushed by the shaft 2 4 a, and the shaft 2 3 a is centered. By rotating, the workpiece pressing portion 21 presses the edge portion of the belt-shaped workpiece W toward the workpiece stage 10. The operation when the first stage 10a and the second stage 10b are attracted will be described below with reference to the first to third figures. (1) The belt-shaped workpiece W is transferred to the workpiece stage 10, and the area to be exposed at this time is placed on the first stage 10a of the workpiece stage 10. The widthwise edge portion of the workpiece is pressed against the workpiece stage 10 by the workpiece pressing mechanism 20 shown in Fig. 3. (2) The first solenoid valve 15a and the second solenoid valve 15b shown in Fig. 1 are operated, and a vacuum is supplied to the first stage 10a and the second stage iOb. (3) The area (back side) where the workpiece W is exposed is attracted to the first stage 10a. In the exposure area, the area in the longitudinal direction of the workpiece is conveyed in the upstream and downstream areas. The second stage 10b is also pulled to the second stage 10b from the state shown by the dotted line in Fig. 1 and the arrow shown in the same figure. (4) In the second stage 10b, the band-shaped workpiece W is attracted in a state where there is a leak. The state at this time is the same as that shown in Fig. 8 above. That is, with the workpiece pressing portion 21 shown in FIG. 3, even if the edge portion of the workpiece W is pushed to the workpiece stage 10, the wrinkle portion -15-200532386 (13) points are for the workpiece loading The stage 10 is still in a floating state, and a leak occurs from this part. However, although a slight crepe remains on the outside of the second stage 10b, it is corrected along the surface of the second stage 10b as it approaches the inside, that is, in the direction close to the area to be exposed. It becomes roughly flat. (5) As a result, in the peripheral portion of the exposure area that is known to be exposed to the first stage 10a, wrinkles occur and the work W becomes a flat surface, and the work W and the first stage 1 There is no gap between 0a, and the workpiece W is attracted to the first stage 10a without leakage. (6) Therefore, "the first vacuum supply system 6a is depressurized without leakage to reduce the pressure", and the vacuum sensor 14 outputs an ON signal to the control unit 30. The control unit 30 recognizes the area where the workpiece W is adsorbed on the first stage 10a based on the signal from the vacuum sensor 14 and recognizes it at the imaging position of the projection lens 5 (see FIG. 5 above). In the case of being held on a plane, the device can be moved to the next action for exposure, such as the alignment action of the mask and the work or the exposure action. Here, in the second stage 10b, a shallow leak occurs due to the unevenness generated in the workpiece W. 'The second vacuum supply system 16b does not drop in pressure' or fluctuates depending on the air flow. However, as described above, the first vacuum supply system 6a and the second vacuum supply system 16b are independent of each other. Therefore, the first vacuum supply system 16a is not affected by this and is affected. The decompression and vacuum sensor 14 can accurately detect the case where the exposed area of the workpiece W is adsorbed to the first stage -16-200532386 (14) the stage 10a. The timings of the operations of the first solenoid valve 15a and the second solenoid valve 15b may be shifted. That is, first the first solenoid valve 15a is operated, the workpiece W is attracted to the first stage 10a, and then the second solenoid valve 15b is operated, and the workpiece is attracted by the second stage 1 Ob W. In this way, when the solenoid valves 15a and 15b are operated, even workpieces with large irregularities can attract the workpieces from the exposure area toward their peripheral portions. Therefore, it is possible to prevent the crepe from remaining in the exposed area, and as a result, the holding condition can be detected by the vacuum sensor. In FIGS. 1 and 2, the first stage 10a and the second stage 10b are integrated into a single structure. However, the workpiece stage and the auxiliary suction stage are formed as separate components. can. [Brief Description of the Drawings] Fig. 1 is a sectional view showing the structure of a work stage according to an embodiment of the present invention. Fig. 2 is a view showing the workpiece stage shown in Fig. 1 as viewed from above. FIG. 3 is a diagram showing a configuration example of a workpiece pressing mechanism. Figures 4 (a) and 4 (b) are diagrams illustrating the operation of the workpiece pressing mechanism. FIG. 5 is a diagram showing an example of an exposure apparatus for a band-shaped workpiece. Fig. 6 is a view showing an example of a band-shaped workpiece having irregularities caused by ridges or bending. -17- 200532386 (15) Figure 7 is a sectional view showing the structure of a conventional work stage. Fig. 8 is a view showing a state in which an edge portion of a workpiece is pressed by a workpiece pressing mechanism in a conventional workpiece stage. [Description of Symbols of Main Components] 1 0: Workpiece stage 10a: First stage (exposure stage) 10b: Second stage (auxiliary stage) 1 1 a, 1 1 b: Vacuum supply Chambers 12a, 12b: Vacuum pump 1 3a: First hole group 1 3b: Second hole group 1 4: Vacuum sensor 1 5a, 1 5b: Solenoid valve 16a: First vacuum supply system 16b: Second Vacuum supply system 2 0: Workpiece pressing mechanism 2 1: Workpiece pressing section 22: Workpiece pressing section driving section 2 3: L-shaped member 24: Air cylinder 3 0: Control section

Claims (1)

200532386 (1) 十、申請專利範圍 1 · 一種帶狀工件的曝光裝置,屬於間歇地搬運帶狀 工件;將上述搬運的工件真空吸附在載物台並進行曝光的 帶狀工件的曝光裝置,其特徵爲: 在上述載物台’除了用以真空吸附上述工件被曝光的 領域的多數第一孔群之外,至少在工件搬運方向的上游側 與下游側,設有吸引上述被曝光的領域以外的領域的第二 孔群; 在上述第一孔群與第二孔群,分別連接有另一個的真 空供給系統; 在至少供給於第一孔群的真空供給系統,設有檢測上 述工件吸附的感測器。 -19-200532386 (1) X. Patent application scope 1 · An exposure device for a belt-shaped workpiece, which belongs to the belt-shaped workpiece intermittently conveyed; an exposure device for a belt-shaped workpiece that vacuum-absorbs the conveyed workpiece on a stage and performs exposure, It is characterized in that, in addition to the majority of the first hole groups used to vacuum-absorb the area where the workpiece is exposed, the stage 'is provided at least on the upstream side and the downstream side of the workpiece conveying direction, in addition to attracting the exposed area. The second hole group in the field; another vacuum supply system is connected to the first hole group and the second hole group respectively; and the vacuum supply system supplied to at least the first hole group is provided with a device for detecting the adsorption of the workpiece. Sensor. -19-
TW093136043A 2004-03-23 2004-11-23 Exposure device for stripline work TWI276925B (en)

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JP5117052B2 (en) * 2006-04-26 2013-01-09 株式会社オーク製作所 Exposure apparatus and exposure method
JP4908958B2 (en) * 2006-07-21 2012-04-04 本田技研工業株式会社 Manufacturing method and apparatus for electrolyte / electrode assembly
JP4949195B2 (en) * 2007-10-26 2012-06-06 株式会社アドテックエンジニアリング Exposure apparatus and substrate correction apparatus
JP5117243B2 (en) * 2008-03-27 2013-01-16 株式会社オーク製作所 Exposure equipment
JP5424803B2 (en) * 2009-10-07 2014-02-26 株式会社オーク製作所 Exposure equipment
JP5908744B2 (en) * 2012-02-24 2016-04-26 株式会社アドテックエンジニアリング Exposure drawing apparatus, program, and exposure drawing method
JP5908745B2 (en) * 2012-02-24 2016-04-26 株式会社アドテックエンジニアリング Exposure drawing apparatus, program, and exposure drawing method
CN107004574B (en) * 2014-12-12 2020-06-30 佳能株式会社 Substrate holding device, lithographic apparatus and article manufacturing method

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