TW200531578A - Circuit board structure and method for fabricating the same - Google Patents

Abstract

A circuit board structure and a method for fabricating the same are proposed, wherein a core substrate formed with a metal layer on surfaces thereof and a plurality of plated through holes therein is provided. A conductive layer is formed on the surface of the terminal portions of the plated through holes, and a patterned circuit layer is formed on the core substrate by patterning the metal layer. An insulating layer is respectively formed on the surface of circuit layer with a plurality of openings, wherein at least an opening on one side of circuit board is formed to expose the terminal portion of the plated through hole and the remaining openings on the other side of circuit board are covered by a resist layer. After a metal layer is formed on the plated through hole within the opening, the resist layer is removed. By the arrangement, the metal layer can be selectively formed on the partial plated through holes for electrical connection pads.

Description

200531578 V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a circuit board structure using a plated via hole junction in a circuit board and a manufacturing method thereof. [Previous technology] and its manufacturing method ', especially a multi-layer conductive connection between upper and lower circuit layers. With the vigorous development of the electronics industry, electronic products have gradually entered a multi-functional, high-performance research and development trend. In order to meet the packaging requirements of high integration and miniaturization of semiconductor packages, for more active and passive components and circuit connections, the electrical board carrying semiconductor wafers has also gradually changed from a double layer The board evolved into a multi-layer board (Multi-layer b〇ard) 俾 In a limited space, the use of interlayer connection technology (Interlayer c ο η necti ο η) to expand the available circuit layout area on the circuit board, thereby matching high Integrated circuit with circuit density needs to 'accommodate a larger number of circuits and components in the same unit area of the circuit board. 0 is a circuit that responds to the needs of high-performance chips such as microprocessors, chip sets, and graphics chips.' The board also needs to improve its functions of transmitting chip signals, improving bandwidth, and controlling impedance to achieve the development of high I / Q number packages. However, in line with the development direction of semiconductor packages, thin and short, multifunctional, high speed and high frequency, circuit boards have been developed towards fine lines and small apertures. The existing circuit board manufacturing process has been reduced from the traditional 100 micron line size, including wire width (Une width), line spacing (Space), and aspect ratio (Aspect rati〇), etc., to less than 30 microns, and continue to move towards more R & D with small line accuracy. also

200531578 V. Description of the invention (2) In order to improve the precision of the wiring of the circuit board, the industry has developed a layering technology (Bui 1 d-up), that is, using a circuit on the surface of a core circuit board to add layers. The technology alternately stacks multiple insulation layers and circuit layers, and opens conductive blind holes (C ο nduc ΐ ivevia) in the insulation layer for the electrical connection between upper and lower lines. Among them, the process of increasing the layer thickness of the circuit is the key to affecting the density of the circuit board. According to the current technology, many manufacturers use the increasing layer process to make multilayer circuit boards. Please refer to FIGS. 1A to 1C, which uses a layer-adding process such as a semi-additive process (SAP). First, a core circuit board 10 is provided, and an insulating layer is formed on the surface. 1 1. Use laser dr i 1 1 ing technology to form an opening 1 1 0 in the insulating layer 1 1 to communicate with the inner circuit layer 1 2 of the core circuit board 10 (such as the first A As shown). Next, a conductive seed layer 13 is formed on the insulating layer 11 by electroless copper plating, and a patterned resist layer ΐ 4 is applied on the seed layer 13 to perform electroplating on the seed layer 1. 3 Patterned circuit layer 1 5 is formed on the surface (as shown in Fig. 1B). After that, the resist layer 14 is peeled off and etched to remove the seed layer 1 3 previously covered under the resist layer 14 (as shown in FIG. Ϊ́c). In this way, using these steps to repeatedly form the insulating layer and Adding a circuit layer is to make a circuit board with a multilayer circuit structure. However, in the conventional multi-layer circuit board produced by the build-up method, if the electronic signal is to be transmitted from the upper layer of the circuit board to the lower layer, the signal must be from the upper build-up circuit layer, the conductive blind hole between the upper circuit layers, to The core circuit board has an upper circuit layer, and then passes through a keyed through hole (PTH) inside the core circuit board, the lower circuit layer of the core circuit board,

17659 Quan 懋 .ptd Page 11 200531578 V. Description of the invention (3) Lower layer-added circuit The lower layer of the circuit board. Crosstalk (Cross-wheel quality. In addition, in the subsequent production of its patterned (Pad) space, ^ not only waste the circuit because of the circuit layout > flexible use of the layout, or 'only in the plating plated through hole In the process of plugging the tree of the plated-through hole, the metal, because the metal is often troubled by the precision of the metal-for example, the equalization board process that can be pinned due to the pinnability of the circuit, and the conductive blindness between the layers of the integrated circuit process The hole and the lower layer increase the layer of the signal. The signal transmission path is too long, which can easily lead to increased inductance and ta 110 or noise. Damage to the electrical transmission is caused by the formation of the majority of the keys in the core circuit board. Hole, the core layer on the upper and lower surface of the circuit layer, the circuit layer must be extended from the plated through hole to form a connection 塾 | to form a conductive blind via (Conductive Via /, taxi board wiring area, not conducive to miniaturized packaging Trend ° At this time, it is necessary to avoid the position of the plated through hole and affect the circuit quality. The plate is blocked by the upper layer of the entire through hole grease with direct through holes. The layer is a pattern of the same layer thickness, and the non-reduced product package is packaged to have been reduced. On the electroplated circuit board, a conductive via is formed on the circuit board to form a sufficient conductive hole. The conductive conductive hole formed on the conductive surface has a sufficient thickness. Produced in the circuit or the thickness of the non-porous resin is too thick, the formation method to form a dense body circuit (IC) area has gradually become 20% to 50% of the package, to 0 · 0 9 // m and the electrical seal are integrated into one, because the metal raw split plate is uniformly conductive thin wires and has a market. Therefore, the metal layer must be on the layer to damage the two surface problems. The circuit and road structure are confidential. The master on the semi-conductor is also non-porous and must first be in> for the sake of avoidance-cent %% due to subsequent guidance, and after more and more, and Shi Zhao chip:

to

17659 All thoughts. Ptd Page 12 200531578 V. Description of the invention (4) When it is almost the same size as the chip (about 1.2 times that of the chip), how to develop a fine circuit (Finecircuit) and high line density that can be used with it The circuit board structure without increasing excessive manufacturing costs is undoubtedly an important R & D issue for the semiconductor industry and other related electronics industries to enter the next generation of technology. [Summary of the Invention] In view of the shortcomings of the conventional technology described above, the main object of the present invention is to provide a circuit board structure and a manufacturing method thereof, which can directly form an electrical connection end on a plated through hole, while providing the remaining electrical properties of the circuit board. The connection end and the conductive circuit have a fine and thin circuit structure. Another object of the present invention is to provide a circuit board structure and a manufacturing method thereof, so as to shorten the wiring space of a conductive blind hole, and to provide the conductive blind hole plating layer and the plated through hole to form a better electrical connection relationship. Another object of the present invention is to provide a circuit board structure and a manufacturing method thereof, so as to shorten a signal transmission path to avoid crosstalk and noise generation and further improve the electrical quality of the circuit board. Another object of the present invention is to provide a circuit board structure and a manufacturing method thereof, so as to enlarge the circuit layout area of the circuit board and improve the layout flexibility of interlayer circuits. In order to achieve the above and other objectives, the present invention discloses a manufacturing method of a circuit board structure, which includes: providing a core board, the surface of the core board having a metal layer, and forming a plurality of plated through holes; and the core layer is exposed A conductive layer is formed on the end surface of the plated via hole of the board; the metal layer on the surface of the core board is patterned to form a patterned circuit structure; an insulating layer is covered on the circuit structure to form a plurality of openings in the insulating layer. , And at least one opening is

17659 Quan 懋 .ptd Page 13 200531578 V. Description of the Invention (5) The end of the plated through hole is exposed, and a resistance layer is formed to cover the remaining opening on the other surface; the plated through hole is exposed to the insulation layer opening. Forming a metal layer at the end; and removing the resist layer. In this way, a metal layer can be selectively formed directly on some of the plated through holes for subsequent use as an electrical connection terminal. After that, a metal protective layer can be formed on the surface of the circuit structure part (that is, the electrical connection terminal for the subsequent electrical connection between the circuit board and the outside) that exposes the opening of the insulation layer, so that the circuit board can be effectively used. It is electrically connected to the conductive element, and the insulating layer can be a fresh-repelling layer. The conductive layer on the surface of the end of the plated via hole can be formed by direct plating (DP) to form a conductive film such as palladium on the plug insulating portion of the key via hole, or by chemical deposition to A conductive film, such as copper, is formed in the plug hole insulation portion of the plated through hole; afterwards, a thin metal layer may be formed on the entire surface of the core board by electroplating, which can be subsequently plated through the plated through hole by electroplating. A metal layer as an electrical connection terminal is directly formed on the end portion, and a metal protective layer can be formed on the electrical connection end of the patterned insulating layer (such as a solder resist layer) by using electroplated wires or chemical deposition. In order to protect the electrical connection end from the external environment, and to provide a good electrical connection between it and conductive elements (such as welding wires, tin balls, or metal bumps, etc.). In addition, after the electrical connection end is formed at the end of the plated-through hole, it can also be used to receive conductive blind holes in the subsequent layer buildup structure, so that conductive blind holes can be directly formed directly on the plated through-holes to shorten Conductive pathway, and effectively increase the wiring layout space, improve the flexibility of the layout of the circuit, and then continue to carry out the process of adding layers to form a circuit board with a multilayer circuit structure.

17659 Quan 懋 .ptd Page 14 200531578, description of the invention (6) That is, 'the metal layer is formed by covering the end of the hole where the fine circuit is to be formed through the above process layer, and the process of the circuit is上 ： ；: The electrical connection terminals required for blind holes effectively improve the wiring of the circuit. In addition, the aforementioned process ^ includes: a core board, the number of which runs through the core board has a large number of conductive lines and The electrical connection end is formed on the circuit structure formed by the electroplating, the electrical connection end is out, and the electrical connection end to ^; and the electrical connection end of an insulation layer opening is a multi-layered process. The circuit board therefore 'uses the nature of the present invention to form electrical connection terminals in some parts for subsequent connection of other electronic components (semiconductor crystals can be electrically conductive blind holes on the electroplated vias to reduce the habit of via ) When the connection needs to be extended, the present invention is a pre-area, and then the selectivity does not affect the remaining wires in one step applied to the electrical connection end of the line, and the installation and wiring account. The invention also reveals the surface Patterned into a through hole, wherein the plated vias of electrically conductive vias; FIG insulating layer is formed with a double opening system corresponds to a metallic protective layer was formed on the surface. In addition, the circuit board structure and its plated through holes have conductive elements, cymbals, or circuit boards. The sexual connection ends of the circuit board are directly shaped to form a conductive blind hole pad (Pad). In the layout space of the money conduction path and the thin layer increasing process, in order to reduce the space for receiving conductive circuit boards, a circuit board structured circuit structure is connected to a multi-patterned circuit structure, and at least one electrically-insulated insulation layer is exposed. The electroplated via hole end is formed to expose the core layer board. It can be a finished method. It is optional to directly form the electricity to provide the circuit board with electrical conduction, or to add a layer to increase the wiring. 17659 Full 懋 .ptd

Page 15 200531578 V. Description of the invention (7) Circuit density and flexibility, and can shorten the conductive path, reduce inductance, crosstalk and noise generation; In addition, the electrical connection ends on the plated vias are formed independently in the manufacturing process Without affecting the manufacturing process of the conductive circuit of the circuit board, in order to avoid the formation of electrical connection ends on the plated through holes in the conventional technology, it is necessary to form a metal layer with an excessively thick or uneven thickness on the entire circuit board. As a result, the precision of the conductive lines and electrical connection ends in the subsequent patterning process is troubled, and a circuit board with a fine circuit structure cannot be formed, so that a circuit with fine circuits and high wiring density can be provided. board. _Embodiment] The following is a description of specific embodiments of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied by other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the spirit of the present invention. Hereinafter, the preferred embodiments of the circuit board structure and the manufacturing method of the present invention will be described in detail with reference to FIGS. 2A to 2K. Among them, it should be noted that these drawings are simplified schematic diagrams, and the circuit board frame of the present invention is only illustrated schematically. However, the drawings only show the elements related to the present invention. The elements shown are not the actual implementation. The number, shape, and size ratio of the elements during actual implementation are an optional design. The layout pattern may be more complicated. As shown in Figures 2A and 2B, first, a surface is provided with a thin metal

17659 Quan 懋 .ptd Page 16 200531578 V. Description of the invention (8) The core board 20 is a layer, and the core board 20 can also be a multi-layer circuit board with pre-processing completed. In the drawing of this embodiment, the core layer board 20 is composed of an insulating layer 200 and a thin metal layer 2 01 formed on the surface of the insulating layer 200; further, a mechanical or laser drill is used. A plurality of through holes 2 0 2 are drilled in the core layer plate 20 in a manner such as holes (as shown in FIG. 2B). The insulating layer 200 may be epoxy resin, polyimide, cyanocyanine (

Cyanate Ester), broken glass fiber, bismaleimide / imide / triazine (BT) or FR 5 material mixed with epoxy resin and glass fiber, the metal thin layer 2 0 1 -Generally, copper (Cu) with better conductivity is used as the wire material for signal transmission, and the thin metal layer 2 01 can be laminated or deposited on the insulating layer 2 0 or resin pressure Resin coated copper (RCC). This embodiment is described by using a resin laminated copper foil (RCC) as an example. As shown in Figure 2C, next, physical vapor deposition (PVD), chemical vapor deposition (CVD), electroless plating, or chemical deposition are used, such as sputtering, evaporation, and arc vapor deposition. (Arc vapor deposit ion), ion beam sputtering (Ion beam sputter ing), laser fusing deposition (La ser ab 1 ati on deposition), plasma-assisted chemical vapor deposition or electroless ore, etc. A conductive layer (not shown) is formed on the surface of the core layer board 20 and the through hole 2, and the conductive layer is used as a current conduction path to form a conductive layer on the surface of the core board 20 and the through hole 2. A metal layer 203 having a sufficient thickness is electroplated on the wall of the hole. As shown in Figure 2D, fill with a filling material 2 0 4 (such as ink resin)

17659 Quan 懋 .ptd Page 17 200531578 V. Description of the invention (9) The residual void of the through hole 2 0 2 is filled, and a plated through hole (PTH) 2 0 5 is formed, thereby electrically conducting the core board 2 0 Upper and lower surface metal layers 2 0 3. As shown in FIG. 2E, a conductive layer is formed on the surface of the end of the plated-through hole 20 5 where the core layer board 20 is exposed. First, a conductive layer (not shown) is formed on the surface of the core board 20 by electroless plating or the like, and the conductive layer is used as a current conduction path to cover the surface of the core board 20 (including the A conductive thin layer 21 (thickness may generally be 3 to 10 # m), such as copper (cu), is electroplated on the end portion of the filling material 204 of the plated-through hole 2 0 5. In addition, as shown in FIG. 2E, a process such as a direct plating method (Direct _1 at ing, DP) can also be performed on the core board 20 to form, for example, palladium (P d) the conductive film 203a, and then undergo a chemical stripping process so that the palladium metal layer adheres to the end surface of the filling material 204 of the key via 205; or a process such as chemical copper is performed, A conductive film 203a is covered on the surface of the end of the filling material 204 of the plated-through hole 205. Among them, the conductive thin layer 21 or conductive film 203a formed on the end surface of the filling material 20 4 of the plated through hole 20 5 is mainly used as a current conduction path, and can be selectively conducted in the plated conductive during subsequent plating processes. A plated metal layer is formed on the holes 2 0 5. The following description of the subsequent process is mainly based on forming a conductive thin layer 21 such as copper (cu) on the core layer board 20, and filling the surface of the filling material 2 0 4 on the plated through hole 2 0 5 A conductive film 203a, which can be made of palladium or steel, is formed. The subsequent process is similar to the process steps described below, so it will not be described in detail here. As shown in FIG. 2F, a circuit patterning process is performed to form a patterned circuit structure on the metal layer on the surface of the core board. It can be in the core layer

17659 Quan 懋 .ptd Page 18 200531578 Five 'invention description (10)-a resist layer (not shown) such as a dry film or a photoresist is formed on the board 20, and it is subjected to exposure, development (DeVei). pment) and other processes so that the barrier / formation has a majority of the openings to expose the surface metal layer of the core layer board 20, and an etching process is performed to remove a portion of the metal layer that is not covered by the barrier layer to form a pattern by ^ The patterned circuit structure 22 may include a plurality of fine circuit structures. 1 As shown in FIG. 2G, an insulating layer 2 3 is covered on the circuit structure 22, and the insulating layer 23 is formed with a plurality of openings 2 3 0, and at least one opening 2 3 0 is exposed to the outside. Ends of the plated-through holes 205. Wherein, the material of the insulating layer 23 may be a solder resist layer such as green paint, and the insulating layer openings 2 3 0 are used to expose part of the conductive circuit of the circuit board that subsequently forms the electrical connection end. As shown in FIG. 2 (a), a resist layer 24 is formed to cover a part of the insulation layer opening 230 which does not expose the end of the plated-through hole 205. The resist layer 24 can be a dry film or a photoresist, which can be used as a plating resist layer in the subsequent plating process. As shown in FIG. 2I, the plating vias of the insulating layer opening 2 3 0 are exposed outside. A metal layer 25 is formed at the end of 20 5. It can form a plated metal layer 25 on the plated through hole 20 5 in the part of the insulation layer opening 2 3 0 which is not covered by the resist layer 24 by using a plating wire or the like. A metal layer 25 is directly formed on a part of the plated-through hole 25 for subsequent use as an electrical connection end. Among them, since the electric money metal layer 25 is selectively formed only on a part of the plated through-holes 205, in addition to the electrical connection ends that can be formed on the plated through-holes 205, the rest of the layered board The patterned circuit above can maintain a more detailed circuit structure.

17659 Quan 懋 .ptd Page 19 200531578 V. Description of the invention (π) As shown in Figure 2J, after the metal layer 2 5 is formed on the electrical clock via 2 0 5, the resistive layer 2 4 can be moved. In addition, the part of the patterned circuit structure on the surface of the core board that is to be used as an electrical connection terminal (including the metal layer 25 selectively formed on the plated through hole) is exposed to the insulating layer (such as a solder resist layer). ) 2 3 of the opening 2 3 0 ◦ As shown in Figure 2K, after that, the conductive metal of the opening 2 3 0 of the insulating layer can be exposed (that is, for subsequent electrical connection between the circuit board and the external electrical connection) Sexual connection end) a metal protective layer 26 is formed on the surface. It can be formed on the top surface of the conductive metal by exposing the opening 2 3 0 of the insulating layer by electroplated wires. A metal protective layer such as nickel / gold 2 6 can provide electrical connection through the metal protective layer 2 6. The terminal is effectively electrically connected to a conductive element (such as a wire, a solder ball, or a metal bump, etc.). Of course, the method of forming a metal protective layer on the electrical connection end is not limited to the aforementioned electroplated wire method. It can also be formed by chemical deposition (such as chemical nickel / gold process), but the method of forming the metal protective layer , It is only for the purpose of illustration, not to limit the implementable scope of the present invention. In addition, please refer to Fig. 2K ', which is shown in the previous Fig. 2E'. When a conductive film such as palladium is formed on the end surface of the filling material 2 0 4 of the plated through hole 2 0 5, it passes through the foregoing The manufacturing process selectively forms part of the plated through-holes 2 0 5 for subsequent use as the metal layer 25 of the electrical connection end, and on the electrical connection end which exposes the insulating layer (solder resist) opening 2 3 0 A metal protective layer 26 is formed on the surface to prepare a circuit board. Therefore, the above-mentioned manufacturing process of the circuit board structure of the present invention is mainly performed by direct bonding on the end surface of the key via hole (Direct

17659 Quan 懋 .ptd Page 20 200531578 V. Description of the invention (12) plat ing (DP) or chemical deposition method so that the plug insulating part of the plated through hole is covered with a conductive film such as palladium or copper, or by electroplating A conductive thin layer is formed by using electroplated wires to selectively form electrical connection ends on the ends of the plated vias. The patterned insulation layer can be exposed to the outside by electroplating wires or chemical deposition ( (Such as antirefreshment layer) to form a metal protective layer on the electrical connection end to protect the electrical connection end from the external environment, and provide a space between it and conductive components (such as solder wires, solder balls, or metal bumps, etc.) Good electrical connection. Please refer to FIG. 2K and 2K ′. Through the foregoing process, the present invention also discloses a circuit board structure, which includes a core layer board 20, and a patterned circuit structure 22 is formed on the surface, and most of the cores run through the core. The plated-through holes 2 0 5 of the layer plate 20, wherein the patterned circuit structure 22 has most of the conductive lines and the plated-through holes electrically connected, and at least one electrical connection end is formed in the plated-through holes 2 0 5; a patterned insulating layer 23 is formed on the circuit structure 22, the insulating layer 23 is formed with a plurality of openings 2 3 0 to expose the electrical connection terminal, and at least one opening 2 3 0 is The electrical connection end corresponding to the end of the plated through hole 205; and a metal protective layer 26 is formed on the surface of the electrical connection end which exposes the opening 230 of the insulation layer. Therefore, the present invention can selectively form an electrical connection end directly on a part of the plated through-holes, and use a resistive layer to cover the fine line structure formed in the previous process in advance without affecting the remaining line layout space and the process of the fine line. That is, the electrical connection ends on the plated through-holes are made after the rest of the same layer circuit structure is formed, and the electrical connection ends can be used as subsequent connection of conductive elements on the circuit board.

17659 Quan 懋 .ptd Page 21 200531578 V. Description of the invention (13) In addition, as shown in Fig. 3, an electrical connection end is formed at the end of the square γ of 9 π +, which is also referred to as a conductive via of a key. For 5 m to accept conductive blind holes 32, we have ::: = a conductive "L32" is formed on the layer buildup structure of the circuit, so :; = =; vias 305 "increase the wiring layout space and enhance: ς: bureau, electrical = , J = Line increase ..., 俾 formation-with multiple I lines :; Structure: 鼹 ^ = The previous illustration of the present invention uses a double-layer board as a 1-mustard _ process can also be applied to multiple layers =: = wishes It is clear that the present system can be a pre-made p ', and the core board of the diagram has a multilayer circuit structure. It can be formed in accordance with the foregoing process to apply the pre-m! Board of the present invention. As shown in FIG. 4A and the cut view, the circuit board 40A having a four-layer circuit structure with six-layer wires == is not limited to the foregoing; the structure of the circuit board 4β. Of course, the application of the present invention is applicable to any two-to-four-layer or six-layer circuit board. Therefore, the circuit board can be constructed accordingly. In the structure of part-shaped circuit board and its manufacturing method, it is optional to connect the end, and the electrical connection is formed directly on the plated through hole of the connection end. 仏 The conductive element is subsequently connected to provide the circuit board and its semiconductor (semiconductor wafer). Or circuit board) electrical connection, also can be Γίϊ ;! The electrical connection end on the through hole is directly formed with a line build-up structure ^ ¥ 'M and reduce the conventional formation of conductive blind holes (Conductive

Via Ri Shou ’needs to extend the space of the connection pad (Pad), in order to increase the degree of routing and flexibility, and shorten the conductive path, reduce inductance, crosstalk and

17659 Full 懋 .ptd

IH Page 22 200531578 V. Explanation of the invention (14) Noise is generated; in addition, the electrical connection ends of the plated through holes are formed independently during the manufacturing process, without affecting the manufacturing process of the conductive circuit of the circuit board, so as to avoid habituation In the technology, when an electrical connection terminal is to be formed on a plated-through hole, a metal layer with an excessively thick or uneven thickness must be formed on the entire circuit board, which leads to the subsequent formation of conductive lines and electrical connection terminals in the patterning process. Accuracy is troubled, and a thin circuit structure cannot be formed. Therefore, a circuit board with fine circuits and high wiring density is provided. The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the essential technical content of the present invention. The essential technical content of the present invention is broadly defined in the scope of patent applications described below, and any technology completed by others. Entities or methods that are completely the same as those defined in the scope of patent application described below, or the same equivalent changes, will be considered to be covered by this patent application scope.

17659 Quan 懋 .ptd Page 23 200531578 Simple description of the drawings [Simplified illustration of the drawings] Figures 1 A to 1 C are the conventional semi-additive process flow diagrams; Figures 2 A to 2 K are the original Schematic cross-sectional view of the invention's circuit board structure manufacturing method; Figures 2E 'and 2K' are schematic diagrams of another embodiment of the circuit board structure manufacturing method of the present invention, and Figure 3 is a circuit board structure of the present invention. A schematic sectional view of the manufacturing method applied to the build-up structure; and FIGS. 4A and 4B are schematic sectional views of the manufacturing method of the circuit board structure of the present invention applied to the multi-board. 10 Core circuit board 11 Insulation layer 1 10 Opening hole 12 Inner circuit layer 13 Seed layer 14 Resistance layer 15 Patterned circuit layer 20 Core board #) 0 Insulation layer 201 Thin metal layer 2 0 2 Through hole 2 0 3 Metal layer 2 0 3a conductive film

17659 Full 懋 .ptd Page 24 200531578

Brief description of the drawing 204 Filler material 205 Plating conductor L 21 Conductive thin layer 22 Circuit structure 23 Insulation layer 230 Open π 24 Resistive layer 25 Metal layer 26 Metal protective layer 30 Core board 305 Plating via 31 Circuit build-up structure 32 Conductive Blind hole 40A Four-layer circuit board 40B Six-layer circuit board 17659 Full 懋 .ptd Page 25

Claims (1)

200531578 VI. Scope of patent application 1. A method for manufacturing a circuit board structure includes: providing a core board, the core board having a metal layer on the surface, and the core board formed with a large number of plated through-holes; A conductive layer is formed on an end surface of the plated via hole of the core board; a metal layer on the surface of the core board is patterned to form a patterned circuit structure; an insulating layer is covered on the circuit structure, and the insulating layer is formed with A plurality of openings, and at least one of the openings exposes the end of the plated via hole; and a metal layer is formed at the end of the plated via hole which exposes the opening of the insulating layer as an electrical connection end. 2. For the method for manufacturing a circuit board structure according to item 1 of the patent application, wherein the conductive layer on the surface of the end of the plated-through hole is formed by direct plating (DP). 3. For example, the method for manufacturing a circuit board structure according to the scope of the patent application, wherein a plating material is used to fill the remaining gaps in the plating vias. 4. For the method for manufacturing a circuit board structure according to item 1 of the patent application, wherein the conductive layer on the surface of the end of the plated-through hole is formed by chemical deposition. 5. The manufacturing method of the circuit board structure according to item 4 of the scope of patent application, wherein the material of the conductive layer on the surface of the end of the plated through hole may be one of copper and palladium. 6. As for the manufacturing method of the circuit board structure according to the scope of patent application item 1, wherein, the 17659 Quan 懋 .ptd Page 26 200531578 6. Scope of Patent Application The conductive layer on the surface of the end of the plated-through hole is formed by electroless plating. 7. If the method of manufacturing a circuit board structure according to item 4 or 6 of the application for a patent, wherein the conductive layer on the surface of the end of the plated via is used as a current conduction path to form a plated metal layer on the end of the plated via . 8. The manufacturing method of the circuit board structure according to the first patent application scope, wherein the surface of the core board is offset from the conductive layer as a current conduction path 'to form a conductive thin layer on the surface of the core board by electroplating. 9. For the method for manufacturing a circuit board structure according to item 1 of the patent application scope, wherein the core board may be a resin laminated copper foil (RCC). 10. If the method of manufacturing a circuit board structure according to item 1 of the scope of the patent application, the core board may be a multi-layer circuit board that has completed the previous process. 11. The method for manufacturing a circuit board structure according to item 1 of the patent application scope, wherein the insulation layer is a freshness-preventing layer. 12. The method for manufacturing a circuit board structure according to item 1 of the scope of patent application, wherein after the end of the plated via hole is exposed with an insulating layer, a resist layer is formed to cover the remaining opening on the other surface of the circuit board. 1 3. According to the method for manufacturing a circuit board structure according to item 12 of the scope of patent application, wherein a metal layer is formed at the end of the plated through hole exposing the opening of the insulating layer as an electrical connection end, and the resist layer is removed. . 14. The method of manufacturing a circuit board structure according to item 1 of the scope of patent application, wherein a metal protective layer may be formed on the surface of the electrical connection end that exposes the opening of the insulating layer. 1 5. The manufacturing method of the circuit board structure according to item 14 of the scope of patent application, wherein: 17659 Quan 懋 .ptd Page 27 200531578 6. Scope of Patent Application The metal protective layer is a metal / gold metal layer. 16. The method for manufacturing a circuit board structure according to item 14 of the scope of patent application, wherein the metal protective layer can be formed by using one of a plating wire and a chemical deposition method. 17. According to the method for manufacturing a circuit board structure according to item 1 of the scope of patent application, wherein the metal layer on the plated through hole functions as an electrical connection end, it is selectively formed on part of the plated through hole and is used in advance. The barrier layer covers the area where the fine lines are formed. 1 8. If the method of manufacturing a circuit board structure according to item 1 or 17 of the scope of patent application, where φ, the electrical connection end can be used as a subsequent connection of conductive components on the circuit board. 9 If the scope of patent application is 1 or 17. The method for manufacturing a circuit board structure according to item 17, wherein the electrical connection end can be used to receive conductive blind holes in a subsequent layer build-up structure, so that conductive blind holes can be formed on the plated through holes to shorten the conductive path and increase Line layout space, and improve the flexibility of line layout. 2 0. A circuit board structure including: a core board, a patterned circuit structure and a plurality of plated vias penetrating through the core board are formed on the surface, and the patterned circuit structure has a majority of conductive circuits and plating The via is electrically conductive, and at least one electrical connection end is formed on the plated via; a patterned insulation layer is formed on the circuit structure, so that the insulation layer is formed with a plurality of openings to expose the electrical And the at least one opening corresponds to the electrical connection of the end of the plated through hole. 17659 Quan 懋 .ptd Page 28 200531578 VI. Scope of patent application; and a metal protective layer formed on the surface of the electrical connection end which exposes the opening of the patterned insulating layer. 2 1. The circuit board structure according to item 20 of the patent application scope, wherein the core board may be a resin-compressed copper box (RCC). 2 2. If the circuit board structure of item 20 of the patent application scope, wherein the core board can be a multi-layer circuit board that has completed the previous process. 23, The circuit board structure according to item 20 of the patent application scope, wherein the insulating layer is a solder resist layer. 24. For example, the circuit board structure of the 20th in the scope of patent application, wherein the electrical connection end can be used as a subsequent connection of the circuit board to conductive elements. 25. The circuit board structure according to item 20 of the scope of patent application, wherein the electrical connection ends on the plated through-holes are made after the formation of the rest of the same layer circuit structure. 2 6. If the circuit board structure of the patent application scope item 20 or 25, wherein the electrical connection end on the plated through hole is selectively formed on part of the plated through hole without affecting the remaining patterned circuit structure The process. 27. The circuit board structure according to item 20 of the patent application scope, wherein the metal protective layer is a nickel / gold metal layer. 17659 懋 .ptd Page 29