TW200525779A - White-like light emitting device and its manufacturing method - Google Patents

White-like light emitting device and its manufacturing method Download PDF

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Publication number
TW200525779A
TW200525779A TW093101781A TW93101781A TW200525779A TW 200525779 A TW200525779 A TW 200525779A TW 093101781 A TW093101781 A TW 093101781A TW 93101781 A TW93101781 A TW 93101781A TW 200525779 A TW200525779 A TW 200525779A
Authority
TW
Taiwan
Prior art keywords
light
emitting
layer
emitting diode
white
Prior art date
Application number
TW093101781A
Other languages
English (en)
Chinese (zh)
Other versions
TWI314786B (enExample
Inventor
Mu-Jen Lai
Schang-Jing Hon
Original Assignee
Super Nova Optoelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Super Nova Optoelectronics Corp filed Critical Super Nova Optoelectronics Corp
Priority to TW093101781A priority Critical patent/TW200525779A/zh
Priority to JP2004091611A priority patent/JP2005217386A/ja
Priority to US10/878,406 priority patent/US20050161690A1/en
Priority to KR1020040059349A priority patent/KR20050077247A/ko
Publication of TW200525779A publication Critical patent/TW200525779A/zh
Priority to US11/496,547 priority patent/US20060267038A1/en
Application granted granted Critical
Publication of TWI314786B publication Critical patent/TWI314786B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body

Landscapes

  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
TW093101781A 2004-01-27 2004-01-27 White-like light emitting device and its manufacturing method TW200525779A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
TW093101781A TW200525779A (en) 2004-01-27 2004-01-27 White-like light emitting device and its manufacturing method
JP2004091611A JP2005217386A (ja) 2004-01-27 2004-03-26 白色発光装置及びその製造方法
US10/878,406 US20050161690A1 (en) 2004-01-27 2004-06-29 Manufacturing method and device for white light emitting
KR1020040059349A KR20050077247A (ko) 2004-01-27 2004-07-28 백색광 발광용 디바이스 및 제조 방법
US11/496,547 US20060267038A1 (en) 2004-01-27 2006-08-01 Manufacturing method and device for white light emitting

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW093101781A TW200525779A (en) 2004-01-27 2004-01-27 White-like light emitting device and its manufacturing method

Publications (2)

Publication Number Publication Date
TW200525779A true TW200525779A (en) 2005-08-01
TWI314786B TWI314786B (enExample) 2009-09-11

Family

ID=34793550

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093101781A TW200525779A (en) 2004-01-27 2004-01-27 White-like light emitting device and its manufacturing method

Country Status (4)

Country Link
US (2) US20050161690A1 (enExample)
JP (1) JP2005217386A (enExample)
KR (1) KR20050077247A (enExample)
TW (1) TW200525779A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8410507B2 (en) 2008-10-07 2013-04-02 Osram Opto Semiconductors Gmbh Thermal light source having a high color rendering quality
TWI506759B (zh) * 2010-11-05 2015-11-01 光芯科技股份有限公司 A light emitting element capable of emitting white light and a method of mixing the same

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* Cited by examiner, † Cited by third party
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TWI247439B (en) * 2004-12-17 2006-01-11 Genesis Photonics Inc Light-emitting diode device
TWI341420B (en) * 2005-10-26 2011-05-01 Epistar Corp Flat light emitting apparatus
CN100422288C (zh) * 2006-04-14 2008-10-01 厦门大学 钇铝石榴石制备方法
DE102007043355A1 (de) * 2007-09-12 2009-03-19 Lumitech Produktion Und Entwicklung Gmbh LED-Modul, LED-Leuchtmittel und LED Leuchte für die energie-effiziente Wiedergabe von weißem Licht
US8178888B2 (en) * 2008-02-01 2012-05-15 Cree, Inc. Semiconductor light emitting devices with high color rendering
DE102009053795A1 (de) * 2009-11-18 2011-05-26 Dräger Medical GmbH Ansteuervorrichtung für Operationsleuchten
CN103421507B (zh) * 2013-09-05 2014-11-26 中国地质大学（北京） 一种氮化镁基六铝酸镧荧光材料及其制备方法
CN103484112B (zh) * 2013-09-05 2014-12-10 青岛大学 一种稀土铕激活的单组分白光荧光粉及其制备方法
KR102357584B1 (ko) 2014-12-17 2022-02-04 삼성전자주식회사 질화물 형광체, 백색 발광장치, 디스플레이 장치 및 조명장치
CN108863439B (zh) * 2017-05-09 2021-03-16 中国计量大学 一种使表面未抛光蓝宝石增透的玻璃化处理方法
US10685941B1 (en) 2019-07-09 2020-06-16 Intematix Corporation Full spectrum white light emitting devices
US10371325B1 (en) 2018-06-25 2019-08-06 Intematix Corporation Full spectrum white light emitting devices
DE202019102069U1 (de) 2019-04-10 2019-05-22 Aceproducts B.V. Haltevorrichtung für Fahrzeuge mit Hohlachse
US11887973B2 (en) 2019-07-09 2024-01-30 Intematix Corporation Full spectrum white light emitting devices
CN120882181A (zh) * 2025-09-26 2025-10-31 江西兆驰半导体有限公司 一种多波段led外延结构及其制备方法

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JP2001513828A (ja) * 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー 酸素含有蛍光粉体、該蛍光粉体の製造方法、該蛍光粉体を利用してなる装置
JP2001053336A (ja) * 1999-08-05 2001-02-23 Toyoda Gosei Co Ltd Ｉｉｉ族窒化物系化合物半導体発光素子
KR100683364B1 (ko) * 1999-09-27 2007-02-15 필립스 루미리즈 라이팅 캄파니 엘엘씨 완전한 형광 물질 변환에 의해 백색광을 생성하는 발광다이오드 소자
DE19952932C1 (de) * 1999-11-03 2001-05-03 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit breitbandiger Anregung
US6501100B1 (en) * 2000-05-15 2002-12-31 General Electric Company White light emitting phosphor blend for LED devices
CN1203557C (zh) * 2000-05-29 2005-05-25 电灯专利信托有限公司 基于发光二极管的发射白光的照明设备
JP2002057376A (ja) * 2000-05-31 2002-02-22 Matsushita Electric Ind Co Ltd Ｌｅｄランプ
JP2002050795A (ja) * 2000-07-31 2002-02-15 Kansai Tlo Kk ＩｎＧａＮ系発光ダイオード
JP5110744B2 (ja) * 2000-12-21 2012-12-26 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー 発光装置及びその製造方法
US6685852B2 (en) * 2001-04-27 2004-02-03 General Electric Company Phosphor blends for generating white light from near-UV/blue light-emitting devices
DE10146719A1 (de) * 2001-09-20 2003-04-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
JP2003101078A (ja) * 2001-09-25 2003-04-04 Toyoda Gosei Co Ltd 発光装置
DE10147040A1 (de) * 2001-09-25 2003-04-24 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Beleuchtungseinheit mit mindestens einer LED als Lichtquelle
JP2003110151A (ja) * 2001-10-01 2003-04-11 Okaya Electric Ind Co Ltd 発光ダイオード
JP2003124526A (ja) * 2001-10-11 2003-04-25 Taiwan Lite On Electronics Inc 白色光光源製造方法
US6734465B1 (en) * 2001-11-19 2004-05-11 Nanocrystals Technology Lp Nanocrystalline based phosphors and photonic structures for solid state lighting
ATE521092T1 (de) * 2002-04-25 2011-09-15 Nichia Corp Lichtemittierendes bauelement mit einer fluoreszenten substanz

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8410507B2 (en) 2008-10-07 2013-04-02 Osram Opto Semiconductors Gmbh Thermal light source having a high color rendering quality
TWI398024B (zh) * 2008-10-07 2013-06-01 歐斯朗奧托半導體股份有限公司 發光媒體
TWI506759B (zh) * 2010-11-05 2015-11-01 光芯科技股份有限公司 A light emitting element capable of emitting white light and a method of mixing the same

Also Published As

Publication number Publication date
JP2005217386A (ja) 2005-08-11
US20060267038A1 (en) 2006-11-30
KR20050077247A (ko) 2005-08-01
TWI314786B (enExample) 2009-09-11
US20050161690A1 (en) 2005-07-28

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