TW200525668A - Bump leveling equipment - Google Patents

Bump leveling equipment Download PDF

Info

Publication number
TW200525668A
TW200525668A TW093135611A TW93135611A TW200525668A TW 200525668 A TW200525668 A TW 200525668A TW 093135611 A TW093135611 A TW 093135611A TW 93135611 A TW93135611 A TW 93135611A TW 200525668 A TW200525668 A TW 200525668A
Authority
TW
Taiwan
Prior art keywords
leveler
bump
stage
plate
moving
Prior art date
Application number
TW093135611A
Other languages
English (en)
Chinese (zh)
Other versions
TWI323014B (ja
Inventor
Hirobumi Moroe
Yasuyuki Komachi
Kazunori Ota
Original Assignee
Shinkawa Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Kk filed Critical Shinkawa Kk
Publication of TW200525668A publication Critical patent/TW200525668A/zh
Application granted granted Critical
Publication of TWI323014B publication Critical patent/TWI323014B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/40—Details of apparatuses used for either manufacturing connectors or connecting the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW093135611A 2004-01-19 2004-11-19 Bump leveling equipment TW200525668A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004010659A JP4056979B2 (ja) 2004-01-19 2004-01-19 バンプレベリング装置

Publications (2)

Publication Number Publication Date
TW200525668A true TW200525668A (en) 2005-08-01
TWI323014B TWI323014B (ja) 2010-04-01

Family

ID=34823324

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093135611A TW200525668A (en) 2004-01-19 2004-11-19 Bump leveling equipment

Country Status (3)

Country Link
JP (1) JP4056979B2 (ja)
KR (1) KR100647434B1 (ja)
TW (1) TW200525668A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101190662B1 (ko) 2010-05-20 2012-10-15 주식회사 로보스타 웨이퍼 이송장비 및 이송방법
KR101152233B1 (ko) * 2010-06-17 2012-06-08 에이피시스템 주식회사 기판 접합 장치

Also Published As

Publication number Publication date
KR20050076592A (ko) 2005-07-26
JP2005203692A (ja) 2005-07-28
KR100647434B1 (ko) 2006-11-23
TWI323014B (ja) 2010-04-01
JP4056979B2 (ja) 2008-03-05

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees