TW200520178A - Anti-warpage package and method for making the same - Google Patents
Anti-warpage package and method for making the sameInfo
- Publication number
- TW200520178A TW200520178A TW092133698A TW92133698A TW200520178A TW 200520178 A TW200520178 A TW 200520178A TW 092133698 A TW092133698 A TW 092133698A TW 92133698 A TW92133698 A TW 92133698A TW 200520178 A TW200520178 A TW 200520178A
- Authority
- TW
- Taiwan
- Prior art keywords
- warpage
- package
- making
- same
- chips
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 238000000465 moulding Methods 0.000 abstract 2
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092133698A TWI231578B (en) | 2003-12-01 | 2003-12-01 | Anti-warpage package and method for making the same |
US10/904,760 US7352071B2 (en) | 2003-12-01 | 2004-11-26 | Method of fabricating anti-warp package |
JP2004344216A JP4184333B2 (ja) | 2003-12-01 | 2004-11-29 | ゆがみ防止パッケージおよびその製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092133698A TWI231578B (en) | 2003-12-01 | 2003-12-01 | Anti-warpage package and method for making the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI231578B TWI231578B (en) | 2005-04-21 |
TW200520178A true TW200520178A (en) | 2005-06-16 |
Family
ID=34618014
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092133698A TWI231578B (en) | 2003-12-01 | 2003-12-01 | Anti-warpage package and method for making the same |
Country Status (3)
Country | Link |
---|---|
US (1) | US7352071B2 (zh) |
JP (1) | JP4184333B2 (zh) |
TW (1) | TWI231578B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104752372A (zh) * | 2013-12-30 | 2015-07-01 | 财团法人工业技术研究院 | 模封组件及模封材料 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080085572A1 (en) * | 2006-10-05 | 2008-04-10 | Advanced Chip Engineering Technology Inc. | Semiconductor packaging method by using large panel size |
JP4769697B2 (ja) | 2006-11-29 | 2011-09-07 | 富士通株式会社 | プリント基板の製造方法、プリント基板組立体の製造方法、及びプリント基板の反り矯正方法 |
KR101282627B1 (ko) * | 2011-09-07 | 2013-07-12 | 현대자동차주식회사 | 휨 방지 플레이트를 갖는 연료전지용 엔드 플레이트 |
JP2014138088A (ja) * | 2013-01-17 | 2014-07-28 | Dainippon Printing Co Ltd | 樹脂付きリードフレームの多面付け体、光半導体装置の多面付け体 |
US10032692B2 (en) | 2013-03-12 | 2018-07-24 | Nvidia Corporation | Semiconductor package structure |
US9760132B2 (en) * | 2013-09-19 | 2017-09-12 | Nvidia Corporation | Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad |
JP6468455B1 (ja) * | 2017-10-13 | 2019-02-13 | 第一精工株式会社 | 樹脂封止金型及び樹脂封止方法 |
JP7065617B2 (ja) * | 2018-01-12 | 2022-05-12 | 新光電気工業株式会社 | 支持体付基板及びその製造方法 |
CN115954277B (zh) * | 2023-02-21 | 2023-12-22 | 深圳市芯海微电子有限公司 | 一种超薄芯片的封装工艺 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5518964A (en) * | 1994-07-07 | 1996-05-21 | Tessera, Inc. | Microelectronic mounting with multiple lead deformation and bonding |
US5766982A (en) * | 1996-03-07 | 1998-06-16 | Micron Technology, Inc. | Method and apparatus for underfill of bumped or raised die |
JPH10284525A (ja) * | 1997-04-03 | 1998-10-23 | Shinko Electric Ind Co Ltd | 半導体装置の製造方法 |
JP2000223608A (ja) * | 1999-01-29 | 2000-08-11 | Nec Corp | 半導体パッケージ及びその製造方法 |
JP3339838B2 (ja) * | 1999-06-07 | 2002-10-28 | ローム株式会社 | 半導体装置およびその製造方法 |
US6469530B1 (en) * | 2000-02-15 | 2002-10-22 | Agilent Technologies, Inc. | Method and apparatus for testing of ball grid array circuitry |
US6355499B1 (en) * | 2000-07-06 | 2002-03-12 | Advanced Semiconductor Engineering. Inc. | Method of making ball grid array package |
US6348399B1 (en) * | 2000-07-06 | 2002-02-19 | Advanced Semiconductor Engineering, Inc. | Method of making chip scale package |
US6770959B2 (en) * | 2000-12-15 | 2004-08-03 | Silconware Precision Industries Co., Ltd. | Semiconductor package without substrate and method of manufacturing same |
US7259448B2 (en) * | 2001-05-07 | 2007-08-21 | Broadcom Corporation | Die-up ball grid array package with a heat spreader and method for making the same |
TW498443B (en) * | 2001-06-21 | 2002-08-11 | Advanced Semiconductor Eng | Singulation method for manufacturing multiple lead-free semiconductor packages |
JP2003031736A (ja) * | 2001-07-13 | 2003-01-31 | Hitachi Ltd | 半導体装置およびその製造方法 |
US6861750B2 (en) * | 2002-02-01 | 2005-03-01 | Broadcom Corporation | Ball grid array package with multiple interposers |
JP4002143B2 (ja) * | 2002-07-10 | 2007-10-31 | 株式会社ルネサステクノロジ | 半導体装置の製造方法 |
US20040058478A1 (en) * | 2002-09-25 | 2004-03-25 | Shafidul Islam | Taped lead frames and methods of making and using the same in semiconductor packaging |
TW571409B (en) * | 2002-12-03 | 2004-01-11 | Advanced Semiconductor Eng | Optical device and packaging method thereof |
KR20050083322A (ko) * | 2004-02-23 | 2005-08-26 | 삼성테크윈 주식회사 | 반도체 패키지용 리이드 프레임과 이의 제조방법 |
US7205178B2 (en) * | 2004-03-24 | 2007-04-17 | Freescale Semiconductor, Inc. | Land grid array packaged device and method of forming same |
-
2003
- 2003-12-01 TW TW092133698A patent/TWI231578B/zh not_active IP Right Cessation
-
2004
- 2004-11-26 US US10/904,760 patent/US7352071B2/en active Active
- 2004-11-29 JP JP2004344216A patent/JP4184333B2/ja not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104752372A (zh) * | 2013-12-30 | 2015-07-01 | 财团法人工业技术研究院 | 模封组件及模封材料 |
Also Published As
Publication number | Publication date |
---|---|
JP4184333B2 (ja) | 2008-11-19 |
JP2005167242A (ja) | 2005-06-23 |
US7352071B2 (en) | 2008-04-01 |
TWI231578B (en) | 2005-04-21 |
US20050116359A1 (en) | 2005-06-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |