TW200515588A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- TW200515588A TW200515588A TW093130492A TW93130492A TW200515588A TW 200515588 A TW200515588 A TW 200515588A TW 093130492 A TW093130492 A TW 093130492A TW 93130492 A TW93130492 A TW 93130492A TW 200515588 A TW200515588 A TW 200515588A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal wire
- semiconductor device
- pieces
- wire layer
- coil
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- 239000002184 metal Substances 0.000 abstract 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Integrated Circuits (AREA)
- Coils Or Transformers For Communication (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003363943A JP4059498B2 (ja) | 2003-10-24 | 2003-10-24 | 半導体装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200515588A true TW200515588A (en) | 2005-05-01 |
Family
ID=34510082
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093130492A TW200515588A (en) | 2003-10-24 | 2004-10-08 | Semiconductor device |
Country Status (5)
Country | Link |
---|---|
US (1) | US7167073B2 (zh) |
JP (1) | JP4059498B2 (zh) |
KR (1) | KR20050039575A (zh) |
CN (1) | CN1610112A (zh) |
TW (1) | TW200515588A (zh) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8749054B2 (en) * | 2010-06-24 | 2014-06-10 | L. Pierre de Rochemont | Semiconductor carrier with vertical power FET module |
JP4764668B2 (ja) * | 2005-07-05 | 2011-09-07 | セイコーエプソン株式会社 | 電子基板の製造方法および電子基板 |
JP4779606B2 (ja) * | 2005-11-29 | 2011-09-28 | セイコーエプソン株式会社 | 電子基板、その製造方法および電子機器 |
JP2008103602A (ja) * | 2006-10-20 | 2008-05-01 | Seiko Epson Corp | 電子基板、その製造方法および電子機器 |
EP1978472A3 (en) * | 2007-04-06 | 2015-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
US8217748B2 (en) * | 2007-11-23 | 2012-07-10 | Alpha & Omega Semiconductor Inc. | Compact inductive power electronics package |
US7884452B2 (en) | 2007-11-23 | 2011-02-08 | Alpha And Omega Semiconductor Incorporated | Semiconductor power device package having a lead frame-based integrated inductor |
US7884696B2 (en) * | 2007-11-23 | 2011-02-08 | Alpha And Omega Semiconductor Incorporated | Lead frame-based discrete power inductor |
US7868431B2 (en) * | 2007-11-23 | 2011-01-11 | Alpha And Omega Semiconductor Incorporated | Compact power semiconductor package and method with stacked inductor and integrated circuit die |
CN102360730B (zh) * | 2008-01-25 | 2014-03-05 | 万国半导体股份有限公司 | 基于引线框架的分立功率电感 |
TWI390561B (en) * | 2008-12-31 | 2013-03-21 | Innovation inductance and power protective device and power outlet | |
US7955942B2 (en) * | 2009-05-18 | 2011-06-07 | Stats Chippac, Ltd. | Semiconductor device and method of forming a 3D inductor from prefabricated pillar frame |
US8325002B2 (en) * | 2010-05-27 | 2012-12-04 | Advanced Semiconductor Engineering, Inc. | Power inductor structure |
US8558344B2 (en) | 2011-09-06 | 2013-10-15 | Analog Devices, Inc. | Small size and fully integrated power converter with magnetics on chip |
US8432017B2 (en) * | 2011-09-28 | 2013-04-30 | Chipbond Technology Corporation | Method for fabricating a three-dimensional inductor carrier with metal core and structure thereof |
US9111933B2 (en) * | 2012-05-17 | 2015-08-18 | International Business Machines Corporation | Stacked through-silicon via (TSV) transformer structure |
US11197374B2 (en) | 2012-09-11 | 2021-12-07 | Ferric Inc. | Integrated switched inductor power converter having first and second powertrain phases |
US9844141B2 (en) | 2012-09-11 | 2017-12-12 | Ferric, Inc. | Magnetic core inductor integrated with multilevel wiring network |
US11058001B2 (en) | 2012-09-11 | 2021-07-06 | Ferric Inc. | Integrated circuit with laminated magnetic core inductor and magnetic flux closure layer |
US11064610B2 (en) | 2012-09-11 | 2021-07-13 | Ferric Inc. | Laminated magnetic core inductor with insulating and interface layers |
US11116081B2 (en) | 2012-09-11 | 2021-09-07 | Ferric Inc. | Laminated magnetic core inductor with magnetic flux closure path parallel to easy axes of magnetization of magnetic layers |
US10893609B2 (en) | 2012-09-11 | 2021-01-12 | Ferric Inc. | Integrated circuit with laminated magnetic core inductor including a ferromagnetic alloy |
US10244633B2 (en) | 2012-09-11 | 2019-03-26 | Ferric Inc. | Integrated switched inductor power converter |
KR20150065679A (ko) * | 2012-10-04 | 2015-06-15 | 아이치 세이꼬 가부시키 가이샤 | 마그네토 임피던스 소자 및 그 제조 방법 |
US20140203902A1 (en) * | 2013-01-18 | 2014-07-24 | Geoffrey D. Shippee | Cards, devices, electromagnetic field generators and methods of manufacturing electromagnetic field generators |
US9337251B2 (en) * | 2013-01-22 | 2016-05-10 | Ferric, Inc. | Integrated magnetic core inductors with interleaved windings |
US8786393B1 (en) * | 2013-02-05 | 2014-07-22 | Analog Devices, Inc. | Step up or step down micro-transformer with tight magnetic coupling |
US9293997B2 (en) | 2013-03-14 | 2016-03-22 | Analog Devices Global | Isolated error amplifier for isolated power supplies |
JP2015082524A (ja) * | 2013-10-21 | 2015-04-27 | ソニー株式会社 | 配線基板、半導体装置 |
US9647053B2 (en) | 2013-12-16 | 2017-05-09 | Ferric Inc. | Systems and methods for integrated multi-layer magnetic films |
US9991040B2 (en) | 2014-06-23 | 2018-06-05 | Ferric, Inc. | Apparatus and methods for magnetic core inductors with biased permeability |
US10629357B2 (en) | 2014-06-23 | 2020-04-21 | Ferric Inc. | Apparatus and methods for magnetic core inductors with biased permeability |
US11302469B2 (en) | 2014-06-23 | 2022-04-12 | Ferric Inc. | Method for fabricating inductors with deposition-induced magnetically-anisotropic cores |
US10354950B2 (en) | 2016-02-25 | 2019-07-16 | Ferric Inc. | Systems and methods for microelectronics fabrication and packaging using a magnetic polymer |
US11380632B2 (en) * | 2018-04-27 | 2022-07-05 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor package device with integrated inductor and manufacturing method thereof |
CN115359999A (zh) | 2018-11-02 | 2022-11-18 | 台达电子企业管理(上海)有限公司 | 变压器模块及功率模块 |
CN111145996A (zh) | 2018-11-02 | 2020-05-12 | 台达电子企业管理(上海)有限公司 | 磁性元件的制造方法及磁性元件 |
CN111145987B (zh) * | 2018-11-02 | 2021-07-06 | 台达电子企业管理(上海)有限公司 | 变压器模块及功率模块 |
JP7219136B2 (ja) * | 2019-03-27 | 2023-02-07 | 本田技研工業株式会社 | 半導体装置 |
CN111584457B (zh) * | 2020-04-02 | 2023-11-24 | 西安理工大学 | 一种基于tsv的嵌套磁芯电感器 |
CN112864136B (zh) * | 2021-01-14 | 2023-04-18 | 长鑫存储技术有限公司 | 半导体结构及其制作方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3858138A (en) * | 1973-03-05 | 1974-12-31 | Rca Corp | Tuneable thin film inductor |
JPS58188115A (ja) | 1982-04-27 | 1983-11-02 | Sanyo Electric Co Ltd | 誘導性素子の形成方法 |
JPS6367264U (zh) | 1986-10-23 | 1988-05-06 | ||
JPH02181961A (ja) | 1989-01-09 | 1990-07-16 | Nec Corp | 集積回路装置 |
JPH0476057U (zh) | 1990-11-14 | 1992-07-02 | ||
JPH04335531A (ja) | 1991-05-10 | 1992-11-24 | Mitsubishi Electric Corp | 半導体装置 |
US5336921A (en) * | 1992-01-27 | 1994-08-09 | Motorola, Inc. | Vertical trench inductor |
JPH0621347A (ja) | 1992-07-01 | 1994-01-28 | Seiko Epson Corp | 半導体装置 |
JPH07273292A (ja) | 1994-03-31 | 1995-10-20 | Matsushita Electron Corp | 半導体集積回路 |
JPH10335165A (ja) | 1997-05-28 | 1998-12-18 | Murata Mfg Co Ltd | フライバックトランス |
KR100233237B1 (ko) * | 1997-09-10 | 1999-12-01 | 정선종 | 삼차원 코일 구조 미세 인덕터 및 그 형성 방법 |
US6013939A (en) * | 1997-10-31 | 2000-01-11 | National Scientific Corp. | Monolithic inductor with magnetic flux lines guided away from substrate |
JPH11261325A (ja) * | 1998-03-10 | 1999-09-24 | Shiro Sugimura | コイル素子と、その製造方法 |
US7107666B2 (en) * | 1998-07-23 | 2006-09-19 | Bh Electronics | Method of manufacturing an ultra-miniature magnetic device |
-
2003
- 2003-10-24 JP JP2003363943A patent/JP4059498B2/ja not_active Expired - Fee Related
-
2004
- 2004-10-08 TW TW093130492A patent/TW200515588A/zh unknown
- 2004-10-19 KR KR1020040083423A patent/KR20050039575A/ko not_active Application Discontinuation
- 2004-10-20 US US10/969,578 patent/US7167073B2/en not_active Expired - Fee Related
- 2004-10-20 CN CNA2004100869085A patent/CN1610112A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP4059498B2 (ja) | 2008-03-12 |
CN1610112A (zh) | 2005-04-27 |
US7167073B2 (en) | 2007-01-23 |
US20050088269A1 (en) | 2005-04-28 |
KR20050039575A (ko) | 2005-04-29 |
JP2005129736A (ja) | 2005-05-19 |
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