TW200515575A - Solid-state imaging device - Google Patents

Solid-state imaging device

Info

Publication number
TW200515575A
TW200515575A TW093131954A TW93131954A TW200515575A TW 200515575 A TW200515575 A TW 200515575A TW 093131954 A TW093131954 A TW 093131954A TW 93131954 A TW93131954 A TW 93131954A TW 200515575 A TW200515575 A TW 200515575A
Authority
TW
Taiwan
Prior art keywords
base
imaging element
internal space
protrusions
solid
Prior art date
Application number
TW093131954A
Other languages
English (en)
Inventor
Katsutoshi Shimizu
Masanori Minamio
Kouichi Yamauchi
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Publication of TW200515575A publication Critical patent/TW200515575A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW093131954A 2003-10-23 2004-10-21 Solid-state imaging device TW200515575A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003363609A JP3838573B2 (ja) 2003-10-23 2003-10-23 固体撮像装置

Publications (1)

Publication Number Publication Date
TW200515575A true TW200515575A (en) 2005-05-01

Family

ID=34386532

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093131954A TW200515575A (en) 2003-10-23 2004-10-21 Solid-state imaging device

Country Status (6)

Country Link
US (2) US7586529B2 (zh)
EP (1) EP1526578A3 (zh)
JP (1) JP3838573B2 (zh)
KR (1) KR100644180B1 (zh)
CN (1) CN100433301C (zh)
TW (1) TW200515575A (zh)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007059581A (ja) 2005-08-24 2007-03-08 Konica Minolta Opto Inc 固体撮像装置及びカメラモジュール
TWI273325B (en) * 2005-11-18 2007-02-11 Innolux Display Corp Liquid crystal display
US7964945B2 (en) * 2007-09-28 2011-06-21 Samsung Electro-Mechanics Co., Ltd. Glass cap molding package, manufacturing method thereof and camera module
JP4961398B2 (ja) * 2008-06-30 2012-06-27 株式会社日立製作所 半導体装置
JP4560121B2 (ja) * 2008-12-17 2010-10-13 株式会社東芝 センサー固定装置およびカメラモジュール
KR20110001659A (ko) * 2009-06-30 2011-01-06 삼성테크윈 주식회사 카메라 모듈
JP2011018954A (ja) * 2009-07-07 2011-01-27 Sanyo Electric Co Ltd 撮像装置
JP6110673B2 (ja) * 2012-02-17 2017-04-05 エスアイアイ・セミコンダクタ株式会社 光センサ装置
KR101319707B1 (ko) * 2012-02-29 2013-10-17 주식회사 팬택 카메라 모듈, 이를 포함하는 이동 통신 단말기 및 그 제조 방법
CN104517985B (zh) * 2013-09-26 2017-10-10 上海澳华光电内窥镜有限公司 一种内窥镜用成像器件的切割封装方法以及内窥镜用成像器件
JP2017041615A (ja) * 2015-08-21 2017-02-23 株式会社フジクラ 光学素子モジュール、光学素子モジュールの製造方法
DE102018122515B4 (de) * 2018-09-14 2020-03-26 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiteroxid- oder Glas-basierten Verbindungskörpers mit Verdrahtungsstruktur
JPWO2020175619A1 (ja) * 2019-02-28 2021-12-16 京セラ株式会社 電子部品搭載用パッケージ、電子装置及び発光装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62140742A (ja) 1985-12-13 1987-06-24 Hitachi Seiki Co Ltd 自動加工機における加工領域分割処理装置
US5081520A (en) 1989-05-16 1992-01-14 Minolta Camera Kabushiki Kaisha Chip mounting substrate having an integral molded projection and conductive pattern
CA2092165C (en) * 1992-03-23 2001-05-15 Tuyosi Nagano Chip carrier for optical device
JPH05343658A (ja) 1992-06-09 1993-12-24 Sony Corp 固体撮像装置のパッケージ構造
JP2001077277A (ja) 1999-09-03 2001-03-23 Sony Corp 半導体パッケージおよび半導体パッケージ製造方法
JP4302279B2 (ja) 2000-02-29 2009-07-22 富士フイルム株式会社 固体撮像装置及びその製造方法
JP3494948B2 (ja) 2000-03-22 2004-02-09 シャープ株式会社 固体撮像装置およびその製造方法
JP4296685B2 (ja) 2000-04-14 2009-07-15 ソニー株式会社 半導体パッケージとその製造方法
JP2002134762A (ja) * 2000-10-19 2002-05-10 Shinko Electric Ind Co Ltd 光学装置及びその製造方法
JP2003078123A (ja) 2001-09-06 2003-03-14 Sony Corp 撮像装置
JP3801025B2 (ja) 2001-11-16 2006-07-26 ソニー株式会社 半導体装置
JP3956199B2 (ja) * 2002-02-20 2007-08-08 シャープ株式会社 固体撮像装置の製造方法およびその製造方法において使用するマスク
TW563986U (en) 2002-12-16 2003-11-21 Kingpak Tech Inc Image sensor structure with better sensing effect
US20040140419A1 (en) * 2003-01-16 2004-07-22 Jackson Hsieh Image sensor with improved sensor effects
DE20301346U1 (de) 2003-01-29 2003-03-27 Kingpak Tech Inc Bildsensor

Also Published As

Publication number Publication date
EP1526578A2 (en) 2005-04-27
JP3838573B2 (ja) 2006-10-25
EP1526578A3 (en) 2006-04-12
KR100644180B1 (ko) 2006-11-10
KR20050039588A (ko) 2005-04-29
US20050088565A1 (en) 2005-04-28
US7719585B2 (en) 2010-05-18
US7586529B2 (en) 2009-09-08
CN100433301C (zh) 2008-11-12
CN1610101A (zh) 2005-04-27
JP2005129721A (ja) 2005-05-19
US20090290054A1 (en) 2009-11-26

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