CN1610101A - 固态成像器件 - Google Patents
固态成像器件 Download PDFInfo
- Publication number
- CN1610101A CN1610101A CNA2004100859327A CN200410085932A CN1610101A CN 1610101 A CN1610101 A CN 1610101A CN A2004100859327 A CNA2004100859327 A CN A2004100859327A CN 200410085932 A CN200410085932 A CN 200410085932A CN 1610101 A CN1610101 A CN 1610101A
- Authority
- CN
- China
- Prior art keywords
- pedestal
- imaging element
- image
- timber
- forming component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 41
- 239000000853 adhesive Substances 0.000 claims abstract description 12
- 230000001070 adhesive effect Effects 0.000 claims abstract description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 53
- 239000007787 solid Substances 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 15
- 210000002445 nipple Anatomy 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 description 13
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000014509 gene expression Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000005394 sealing glass Substances 0.000 description 2
- 208000034189 Sclerosis Diseases 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- VYMDGNCVAMGZFE-UHFFFAOYSA-N phenylbutazonum Chemical compound O=C1C(CCCC)C(=O)N(C=2C=CC=CC=2)N1C1=CC=CC=C1 VYMDGNCVAMGZFE-UHFFFAOYSA-N 0.000 description 1
- 239000000088 plastic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
Claims (4)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003363609A JP3838573B2 (ja) | 2003-10-23 | 2003-10-23 | 固体撮像装置 |
JP363609/2003 | 2003-10-23 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1610101A true CN1610101A (zh) | 2005-04-27 |
CN100433301C CN100433301C (zh) | 2008-11-12 |
Family
ID=34386532
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100859327A Expired - Fee Related CN100433301C (zh) | 2003-10-23 | 2004-10-25 | 固态成像器件及其制造方法 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7586529B2 (zh) |
EP (1) | EP1526578A3 (zh) |
JP (1) | JP3838573B2 (zh) |
KR (1) | KR100644180B1 (zh) |
CN (1) | CN100433301C (zh) |
TW (1) | TW200515575A (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101937923A (zh) * | 2009-06-30 | 2011-01-05 | 三星泰科威株式会社 | 拍摄模块 |
CN101945213A (zh) * | 2009-07-07 | 2011-01-12 | 三洋电机株式会社 | 摄像装置 |
CN104517985A (zh) * | 2013-09-26 | 2015-04-15 | 上海澳华光电内窥镜有限公司 | 一种内窥镜用成像器件的切割封装方法以及内窥镜用成像器件 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007059581A (ja) | 2005-08-24 | 2007-03-08 | Konica Minolta Opto Inc | 固体撮像装置及びカメラモジュール |
TWI273325B (en) * | 2005-11-18 | 2007-02-11 | Innolux Display Corp | Liquid crystal display |
US7964945B2 (en) * | 2007-09-28 | 2011-06-21 | Samsung Electro-Mechanics Co., Ltd. | Glass cap molding package, manufacturing method thereof and camera module |
JP4961398B2 (ja) * | 2008-06-30 | 2012-06-27 | 株式会社日立製作所 | 半導体装置 |
JP4560121B2 (ja) * | 2008-12-17 | 2010-10-13 | 株式会社東芝 | センサー固定装置およびカメラモジュール |
JP6110673B2 (ja) * | 2012-02-17 | 2017-04-05 | エスアイアイ・セミコンダクタ株式会社 | 光センサ装置 |
KR101319707B1 (ko) * | 2012-02-29 | 2013-10-17 | 주식회사 팬택 | 카메라 모듈, 이를 포함하는 이동 통신 단말기 및 그 제조 방법 |
JP2017041615A (ja) * | 2015-08-21 | 2017-02-23 | 株式会社フジクラ | 光学素子モジュール、光学素子モジュールの製造方法 |
DE102018122515B4 (de) * | 2018-09-14 | 2020-03-26 | Infineon Technologies Ag | Verfahren zum Herstellen eines Halbleiteroxid- oder Glas-basierten Verbindungskörpers mit Verdrahtungsstruktur |
WO2020175619A1 (ja) * | 2019-02-28 | 2020-09-03 | 京セラ株式会社 | 電子部品搭載用パッケージ、電子装置及び発光装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62140742A (ja) | 1985-12-13 | 1987-06-24 | Hitachi Seiki Co Ltd | 自動加工機における加工領域分割処理装置 |
US5081520A (en) * | 1989-05-16 | 1992-01-14 | Minolta Camera Kabushiki Kaisha | Chip mounting substrate having an integral molded projection and conductive pattern |
CA2092165C (en) * | 1992-03-23 | 2001-05-15 | Tuyosi Nagano | Chip carrier for optical device |
JPH05343658A (ja) | 1992-06-09 | 1993-12-24 | Sony Corp | 固体撮像装置のパッケージ構造 |
JP2001077277A (ja) | 1999-09-03 | 2001-03-23 | Sony Corp | 半導体パッケージおよび半導体パッケージ製造方法 |
JP4302279B2 (ja) | 2000-02-29 | 2009-07-22 | 富士フイルム株式会社 | 固体撮像装置及びその製造方法 |
JP3494948B2 (ja) | 2000-03-22 | 2004-02-09 | シャープ株式会社 | 固体撮像装置およびその製造方法 |
JP4296685B2 (ja) | 2000-04-14 | 2009-07-15 | ソニー株式会社 | 半導体パッケージとその製造方法 |
JP2002134762A (ja) * | 2000-10-19 | 2002-05-10 | Shinko Electric Ind Co Ltd | 光学装置及びその製造方法 |
JP2003078123A (ja) | 2001-09-06 | 2003-03-14 | Sony Corp | 撮像装置 |
JP3801025B2 (ja) | 2001-11-16 | 2006-07-26 | ソニー株式会社 | 半導体装置 |
JP3956199B2 (ja) * | 2002-02-20 | 2007-08-08 | シャープ株式会社 | 固体撮像装置の製造方法およびその製造方法において使用するマスク |
TW563986U (en) | 2002-12-16 | 2003-11-21 | Kingpak Tech Inc | Image sensor structure with better sensing effect |
US20040140419A1 (en) * | 2003-01-16 | 2004-07-22 | Jackson Hsieh | Image sensor with improved sensor effects |
DE20301346U1 (de) | 2003-01-29 | 2003-03-27 | Kingpak Technology Inc., Chupei, Hsinchu | Bildsensor |
-
2003
- 2003-10-23 JP JP2003363609A patent/JP3838573B2/ja not_active Expired - Fee Related
-
2004
- 2004-10-20 KR KR1020040083974A patent/KR100644180B1/ko not_active IP Right Cessation
- 2004-10-21 TW TW093131954A patent/TW200515575A/zh unknown
- 2004-10-21 US US10/969,822 patent/US7586529B2/en not_active Expired - Fee Related
- 2004-10-22 EP EP04025122A patent/EP1526578A3/en not_active Withdrawn
- 2004-10-25 CN CNB2004100859327A patent/CN100433301C/zh not_active Expired - Fee Related
-
2009
- 2009-07-28 US US12/510,562 patent/US7719585B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101937923A (zh) * | 2009-06-30 | 2011-01-05 | 三星泰科威株式会社 | 拍摄模块 |
CN101945213A (zh) * | 2009-07-07 | 2011-01-12 | 三洋电机株式会社 | 摄像装置 |
CN104517985A (zh) * | 2013-09-26 | 2015-04-15 | 上海澳华光电内窥镜有限公司 | 一种内窥镜用成像器件的切割封装方法以及内窥镜用成像器件 |
Also Published As
Publication number | Publication date |
---|---|
EP1526578A3 (en) | 2006-04-12 |
US7719585B2 (en) | 2010-05-18 |
US20090290054A1 (en) | 2009-11-26 |
JP3838573B2 (ja) | 2006-10-25 |
KR100644180B1 (ko) | 2006-11-10 |
CN100433301C (zh) | 2008-11-12 |
EP1526578A2 (en) | 2005-04-27 |
US7586529B2 (en) | 2009-09-08 |
TW200515575A (en) | 2005-05-01 |
KR20050039588A (ko) | 2005-04-29 |
JP2005129721A (ja) | 2005-05-19 |
US20050088565A1 (en) | 2005-04-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: KELAIBO INNOVATION CO., LTD. Free format text: FORMER OWNER: MATSUSHITA ELECTRIC INDUSTRIAL CO, LTD. Effective date: 20141203 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20141203 Address after: American California Patentee after: Craib Innovations Ltd Address before: Osaka Japan Patentee before: Matsushita Electric Industrial Co., Ltd. |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081112 Termination date: 20161025 |
|
CF01 | Termination of patent right due to non-payment of annual fee |