TW200514873A - Electrochemical processing cell - Google Patents
Electrochemical processing cellInfo
- Publication number
- TW200514873A TW200514873A TW093120480A TW93120480A TW200514873A TW 200514873 A TW200514873 A TW 200514873A TW 093120480 A TW093120480 A TW 093120480A TW 93120480 A TW93120480 A TW 93120480A TW 200514873 A TW200514873 A TW 200514873A
- Authority
- TW
- Taiwan
- Prior art keywords
- solution compartment
- processing cell
- electrochemical processing
- ionic membrane
- plating cell
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Fuel Cell (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/616,044 US7128823B2 (en) | 2002-07-24 | 2003-07-08 | Anolyte for copper plating |
US10/627,336 US20040134775A1 (en) | 2002-07-24 | 2003-07-24 | Electrochemical processing cell |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200514873A true TW200514873A (en) | 2005-05-01 |
Family
ID=34083682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093120480A TW200514873A (en) | 2003-07-08 | 2004-07-08 | Electrochemical processing cell |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1644557B1 (zh) |
JP (1) | JP4448133B2 (zh) |
CN (1) | CN1816650A (zh) |
AT (1) | ATE487811T1 (zh) |
TW (1) | TW200514873A (zh) |
WO (1) | WO2005007933A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI810250B (zh) * | 2019-02-27 | 2023-08-01 | 大陸商盛美半導體設備(上海)股份有限公司 | 電鍍裝置 |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040217005A1 (en) * | 2002-07-24 | 2004-11-04 | Aron Rosenfeld | Method for electroplating bath chemistry control |
KR101424623B1 (ko) | 2007-11-02 | 2014-08-01 | 에이씨엠 리서치 (상하이) 인코포레이티드 | 반도체 워크피스 상의 메탈리제이션을 위한 도금 장치 |
US8496790B2 (en) * | 2011-05-18 | 2013-07-30 | Applied Materials, Inc. | Electrochemical processor |
JP5834986B2 (ja) * | 2012-02-14 | 2015-12-24 | 三菱マテリアル株式会社 | Sn合金電解めっき方法 |
US9068272B2 (en) * | 2012-11-30 | 2015-06-30 | Applied Materials, Inc. | Electroplating processor with thin membrane support |
JP5938426B2 (ja) | 2014-02-04 | 2016-06-22 | 株式会社豊田中央研究所 | 電気めっきセル、及び、金属皮膜の製造方法 |
JP5995906B2 (ja) | 2014-05-19 | 2016-09-21 | 株式会社豊田中央研究所 | 隔膜の製造方法、及び金属被膜の製造方法 |
CN109056002B (zh) * | 2017-07-19 | 2022-04-15 | 叶旖婷 | 一种通孔隔离法酸性电镀铜工艺及其装置 |
SG11202001659PA (en) * | 2017-08-30 | 2020-03-30 | Acm Res Shanghai Inc | Plating apparatus |
CN107641821B (zh) * | 2017-09-14 | 2019-06-07 | 上海新阳半导体材料股份有限公司 | 一种硫酸铜电镀液、其制备方法和应用及电解槽 |
WO2019164920A1 (en) * | 2018-02-23 | 2019-08-29 | Lam Research Corporation | Electroplating system with inert and active anodes |
CN111074307A (zh) * | 2020-01-04 | 2020-04-28 | 安徽工业大学 | 一种隔膜电解法镀铜镀液稳定工艺 |
US20230313406A1 (en) * | 2022-04-04 | 2023-10-05 | Applied Materials, Inc. | Electroplating systems and methods with increased metal ion concentrations |
US20230313405A1 (en) * | 2022-04-04 | 2023-10-05 | Applied Materials, Inc. | Electroplating systems and methods with increased metal ion concentrations |
CN118147727B (zh) * | 2024-05-10 | 2024-09-10 | 苏州智程半导体科技股份有限公司 | 一种晶圆电镀设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CH691209A5 (de) * | 1993-09-06 | 2001-05-15 | Scherrer Inst Paul | Herstellungsverfahren für einen Polmerelektrolyten und elektrochemische Zelle mit diesem Polymerelektrolyten. |
US5883762A (en) * | 1997-03-13 | 1999-03-16 | Calhoun; Robert B. | Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations |
US7247222B2 (en) * | 2002-07-24 | 2007-07-24 | Applied Materials, Inc. | Electrochemical processing cell |
US7128823B2 (en) * | 2002-07-24 | 2006-10-31 | Applied Materials, Inc. | Anolyte for copper plating |
US20040118694A1 (en) * | 2002-12-19 | 2004-06-24 | Applied Materials, Inc. | Multi-chemistry electrochemical processing system |
-
2004
- 2004-07-08 EP EP04756864A patent/EP1644557B1/en not_active Expired - Lifetime
- 2004-07-08 JP JP2006518950A patent/JP4448133B2/ja not_active Expired - Fee Related
- 2004-07-08 WO PCT/US2004/022183 patent/WO2005007933A1/en active Application Filing
- 2004-07-08 AT AT04756864T patent/ATE487811T1/de not_active IP Right Cessation
- 2004-07-08 CN CN200480019317.4A patent/CN1816650A/zh active Pending
- 2004-07-08 TW TW093120480A patent/TW200514873A/zh unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI810250B (zh) * | 2019-02-27 | 2023-08-01 | 大陸商盛美半導體設備(上海)股份有限公司 | 電鍍裝置 |
Also Published As
Publication number | Publication date |
---|---|
EP1644557A1 (en) | 2006-04-12 |
EP1644557B1 (en) | 2010-11-10 |
JP2007523996A (ja) | 2007-08-23 |
ATE487811T1 (de) | 2010-11-15 |
CN1816650A (zh) | 2006-08-09 |
WO2005007933A1 (en) | 2005-01-27 |
JP4448133B2 (ja) | 2010-04-07 |
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