AU2001262326A1 - Electrolysis cell for restoring the concentration of metal ions in processes of electroplating - Google Patents
Electrolysis cell for restoring the concentration of metal ions in processes of electroplatingInfo
- Publication number
- AU2001262326A1 AU2001262326A1 AU2001262326A AU6232601A AU2001262326A1 AU 2001262326 A1 AU2001262326 A1 AU 2001262326A1 AU 2001262326 A AU2001262326 A AU 2001262326A AU 6232601 A AU6232601 A AU 6232601A AU 2001262326 A1 AU2001262326 A1 AU 2001262326A1
- Authority
- AU
- Australia
- Prior art keywords
- electroplating
- restoring
- concentration
- processes
- metal ions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
- C25D21/14—Controlled addition of electrolyte components
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrolytic Production Of Metals (AREA)
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITMI200A001207 | 2000-05-31 | ||
IT2000MI001207A IT1318545B1 (en) | 2000-05-31 | 2000-05-31 | ELECTROLYSIS CELL FOR THE RESTORATION OF THE CONCENTRATION OF IONIMETALLIC IN ELECTRODEPOSITION PROCESSES. |
PCT/EP2001/006161 WO2001092604A2 (en) | 2000-05-31 | 2001-05-30 | Electrolysis cell for restoring the concentration of metal ions in processes of electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001262326A1 true AU2001262326A1 (en) | 2001-12-11 |
Family
ID=11445158
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001262326A Abandoned AU2001262326A1 (en) | 2000-05-31 | 2001-05-30 | Electrolysis cell for restoring the concentration of metal ions in processes of electroplating |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001262326A1 (en) |
IT (1) | IT1318545B1 (en) |
WO (1) | WO2001092604A2 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ITMI20011374A1 (en) * | 2001-06-29 | 2002-12-29 | De Nora Elettrodi Spa | ELECTROLYSIS CELL FOR THE RESTORATION OF THE CONCENTRATION OF METAL IONS IN ELECTRODEPOSITION PROCESSES |
DE102010044551A1 (en) * | 2010-09-07 | 2012-03-08 | Coventya Gmbh | Anode and their use in an alkaline electroplating bath |
CN104894633A (en) * | 2015-05-22 | 2015-09-09 | 北京中冶设备研究设计总院有限公司 | Continuous nickel electroplating solution supply device |
CN104947173A (en) * | 2015-05-22 | 2015-09-30 | 北京中冶设备研究设计总院有限公司 | Device and method for improving pH value of continuous electronickelling solution |
US9920448B2 (en) | 2015-11-18 | 2018-03-20 | Applied Materials, Inc. | Inert anode electroplating processor and replenisher with anionic membranes |
WO2020042870A1 (en) * | 2018-08-27 | 2020-03-05 | 叶涛 | Plating solution production and regeneration process and device for insoluble anode acid copper electroplating |
US11339483B1 (en) | 2021-04-05 | 2022-05-24 | Alchemr, Inc. | Water electrolyzers employing anion exchange membranes |
CN113463156B (en) * | 2021-07-23 | 2022-09-20 | 中国科学院青海盐湖研究所 | Magnesium hydroxide film layer and preparation method and system thereof |
WO2024078627A1 (en) * | 2022-10-14 | 2024-04-18 | 叶涛 | Electrolytic copper dissolution-integrated insoluble anode copper plating process optimization method and apparatus |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2479856A1 (en) * | 1980-04-04 | 1981-10-09 | Electricite De France | Regeneration of metal plating soln. - using cell contg. anodic membrane and soluble metal anode |
JP2671013B2 (en) * | 1988-06-16 | 1997-10-29 | ディップソール株式会社 | Method for supplying nickel ions in alkaline nickel or nickel alloy plating |
JPH0270087A (en) * | 1988-09-01 | 1990-03-08 | Nippon Kinzoku Co Ltd | Method and apparatus for plating tin |
JPH0826480B2 (en) * | 1989-03-28 | 1996-03-13 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | Plating device and plating metal supply method |
US5082538A (en) * | 1991-01-09 | 1992-01-21 | Eltech Systems Corporation | Process for replenishing metals in aqueous electrolyte solutions |
US5100517A (en) * | 1991-04-08 | 1992-03-31 | The Goodyear Tire & Rubber Company | Process for applying a copper layer to steel wire |
JPH04362199A (en) * | 1991-06-06 | 1992-12-15 | Nec Corp | Electroplating device |
JPH05302199A (en) * | 1992-04-24 | 1993-11-16 | Bridgestone Bekaert Steel Code Kk | Method for controlling composition of copper plating bath in copper plating using insoluble anode |
JPH06158397A (en) * | 1992-11-18 | 1994-06-07 | Asahi Glass Co Ltd | Method for electroplating metal |
KR100683268B1 (en) * | 1998-09-08 | 2007-02-15 | 가부시키가이샤 에바라 세이사꾸쇼 | Substrate plating device |
-
2000
- 2000-05-31 IT IT2000MI001207A patent/IT1318545B1/en active
-
2001
- 2001-05-30 AU AU2001262326A patent/AU2001262326A1/en not_active Abandoned
- 2001-05-30 WO PCT/EP2001/006161 patent/WO2001092604A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
ITMI20001207A1 (en) | 2001-12-01 |
ITMI20001207A0 (en) | 2000-05-31 |
WO2001092604A2 (en) | 2001-12-06 |
IT1318545B1 (en) | 2003-08-27 |
WO2001092604A3 (en) | 2002-04-25 |
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