ATE487811T1 - Elektrochemische verarbeitungszelle - Google Patents

Elektrochemische verarbeitungszelle

Info

Publication number
ATE487811T1
ATE487811T1 AT04756864T AT04756864T ATE487811T1 AT E487811 T1 ATE487811 T1 AT E487811T1 AT 04756864 T AT04756864 T AT 04756864T AT 04756864 T AT04756864 T AT 04756864T AT E487811 T1 ATE487811 T1 AT E487811T1
Authority
AT
Austria
Prior art keywords
solution compartment
processing cell
electrochemical processing
ionic membrane
plating cell
Prior art date
Application number
AT04756864T
Other languages
English (en)
Inventor
Michael X Yang
Dmitry Lubomirsky
Yezdi N Dordi
Saravjeet Singh
Sheshraj L Tulshibagwale
Nicolay Y Kovarsky
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/616,044 external-priority patent/US7128823B2/en
Priority claimed from US10/627,336 external-priority patent/US20040134775A1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of ATE487811T1 publication Critical patent/ATE487811T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Fuel Cell (AREA)
AT04756864T 2003-07-08 2004-07-08 Elektrochemische verarbeitungszelle ATE487811T1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/616,044 US7128823B2 (en) 2002-07-24 2003-07-08 Anolyte for copper plating
US10/627,336 US20040134775A1 (en) 2002-07-24 2003-07-24 Electrochemical processing cell
PCT/US2004/022183 WO2005007933A1 (en) 2003-07-08 2004-07-08 Electrochemical processing cell

Publications (1)

Publication Number Publication Date
ATE487811T1 true ATE487811T1 (de) 2010-11-15

Family

ID=34083682

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04756864T ATE487811T1 (de) 2003-07-08 2004-07-08 Elektrochemische verarbeitungszelle

Country Status (6)

Country Link
EP (1) EP1644557B1 (de)
JP (1) JP4448133B2 (de)
CN (1) CN1816650A (de)
AT (1) ATE487811T1 (de)
TW (1) TW200514873A (de)
WO (1) WO2005007933A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040217005A1 (en) * 2002-07-24 2004-11-04 Aron Rosenfeld Method for electroplating bath chemistry control
WO2009055992A1 (en) * 2007-11-02 2009-05-07 Acm Research (Shanghai) Inc. Plating apparatus for metallization on semiconductor workpiece
US8496790B2 (en) * 2011-05-18 2013-07-30 Applied Materials, Inc. Electrochemical processor
JP5834986B2 (ja) * 2012-02-14 2015-12-24 三菱マテリアル株式会社 Ｓｎ合金電解めっき方法
US9068272B2 (en) * 2012-11-30 2015-06-30 Applied Materials, Inc. Electroplating processor with thin membrane support
JP5938426B2 (ja) 2014-02-04 2016-06-22 株式会社豊田中央研究所 電気めっきセル、及び、金属皮膜の製造方法
JP5995906B2 (ja) * 2014-05-19 2016-09-21 株式会社豊田中央研究所 隔膜の製造方法、及び金属被膜の製造方法
CN109056002B (zh) * 2017-07-19 2022-04-15 叶旖婷 一种通孔隔离法酸性电镀铜工艺及其装置
JP6999195B2 (ja) * 2017-08-30 2022-01-18 エーシーエム リサーチ （シャンハイ） インコーポレーテッド めっき装置
CN107641821B (zh) * 2017-09-14 2019-06-07 上海新阳半导体材料股份有限公司 一种硫酸铜电镀液、其制备方法和应用及电解槽
WO2019164920A1 (en) * 2018-02-23 2019-08-29 Lam Research Corporation Electroplating system with inert and active anodes
TWI810250B (zh) * 2019-02-27 2023-08-01 大陸商盛美半導體設備（上海）股份有限公司 電鍍裝置
CN111074307A (zh) * 2020-01-04 2020-04-28 安徽工业大学 一种隔膜电解法镀铜镀液稳定工艺
US20230313406A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations
US20230313405A1 (en) * 2022-04-04 2023-10-05 Applied Materials, Inc. Electroplating systems and methods with increased metal ion concentrations

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH691209A5 (de) * 1993-09-06 2001-05-15 Scherrer Inst Paul Herstellungsverfahren für einen Polmerelektrolyten und elektrochemische Zelle mit diesem Polymerelektrolyten.
US5883762A (en) * 1997-03-13 1999-03-16 Calhoun; Robert B. Electroplating apparatus and process for reducing oxidation of oxidizable plating anions and cations
US7128823B2 (en) * 2002-07-24 2006-10-31 Applied Materials, Inc. Anolyte for copper plating
US20040118694A1 (en) * 2002-12-19 2004-06-24 Applied Materials, Inc. Multi-chemistry electrochemical processing system
US7247222B2 (en) * 2002-07-24 2007-07-24 Applied Materials, Inc. Electrochemical processing cell

Also Published As

Publication number Publication date
TW200514873A (en) 2005-05-01
JP4448133B2 (ja) 2010-04-07
CN1816650A (zh) 2006-08-09
EP1644557A1 (de) 2006-04-12
WO2005007933A1 (en) 2005-01-27
EP1644557B1 (de) 2010-11-10
JP2007523996A (ja) 2007-08-23

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Legal Events

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