TW200513483A - Curable composition - Google Patents

Curable composition

Info

Publication number
TW200513483A
TW200513483A TW093118659A TW93118659A TW200513483A TW 200513483 A TW200513483 A TW 200513483A TW 093118659 A TW093118659 A TW 093118659A TW 93118659 A TW93118659 A TW 93118659A TW 200513483 A TW200513483 A TW 200513483A
Authority
TW
Taiwan
Prior art keywords
molecule
carbon
carbon atoms
group
unsubstituted
Prior art date
Application number
TW093118659A
Other languages
English (en)
Chinese (zh)
Other versions
TWI314154B (enExample
Inventor
Eiichi Tabei
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW200513483A publication Critical patent/TW200513483A/zh
Application granted granted Critical
Publication of TWI314154B publication Critical patent/TWI314154B/zh

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/045Polysiloxanes containing less than 25 silicon atoms
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/12Polysiloxanes containing silicon bound to hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04Polysiloxanes
    • C08G77/14Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/485Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms containing less than 25 silicon atoms

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW093118659A 2003-10-10 2004-06-25 Curable composition TW200513483A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003352714 2003-10-10

Publications (2)

Publication Number Publication Date
TW200513483A true TW200513483A (en) 2005-04-16
TWI314154B TWI314154B (enExample) 2009-09-01

Family

ID=34419862

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093118659A TW200513483A (en) 2003-10-10 2004-06-25 Curable composition

Country Status (3)

Country Link
US (1) US7176270B2 (enExample)
DE (1) DE102004046837B4 (enExample)
TW (1) TW200513483A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI410461B (zh) * 2006-09-12 2013-10-01 Shinetsu Chemical Co Polyoxymethylene-containing hardening composition containing polycyclic hydrocarbon groups
TWI424005B (zh) * 2007-04-23 2014-01-21 Adeka Corp A compound containing silicon, a hardened composition and a hardened product
TWI425031B (zh) * 2007-04-23 2014-02-01 Adeka Corp A compound containing silicon, a hardened composition and a hardened product

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005272697A (ja) * 2004-03-25 2005-10-06 Shin Etsu Chem Co Ltd 硬化性シリコーン樹脂組成物、光半導体用封止材および光半導体装置
JP2007023021A (ja) * 2005-05-19 2007-02-01 Shin Etsu Chem Co Ltd 新規な環状シロキサン化合物及びその製造方法
JP2007077252A (ja) * 2005-09-13 2007-03-29 Shin Etsu Chem Co Ltd 硬化性シリコーン組成物
JP4242403B2 (ja) * 2006-07-13 2009-03-25 信越化学工業株式会社 酸素富化膜及び該膜形成用組成物
JP5279197B2 (ja) * 2007-05-07 2013-09-04 信越化学工業株式会社 硬化性有機ケイ素組成物およびその硬化物
JP2008274184A (ja) * 2007-05-07 2008-11-13 Shin Etsu Chem Co Ltd ケイ素原子に結合した水素原子を有する多環式炭化水素基含有有機ケイ素化合物およびその製造方法
AU2011224346A1 (en) * 2010-03-12 2012-09-27 The Regents Of The University Of California Nanostructured polymer membranes for selective alcohol transport
JP6397823B2 (ja) * 2013-09-20 2018-09-26 信越化学工業株式会社 シリコーン変性エポキシ樹脂およびその組成物と硬化物
JP5956698B1 (ja) * 2014-12-18 2016-07-27 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 成形用ポリオルガノシロキサン組成物、光学用部材、光源用レンズまたはカバー、および成形方法
JP6347237B2 (ja) * 2015-08-21 2018-06-27 信越化学工業株式会社 付加硬化型オルガノポリシロキサン組成物及び半導体装置
JP6428595B2 (ja) 2015-12-22 2018-11-28 信越化学工業株式会社 付加硬化性樹脂組成物及び半導体装置
US9751989B2 (en) 2015-12-22 2017-09-05 Shin-Etsu Chemical Co., Ltd. Condensation curable resin composition and semiconductor package
US10287400B2 (en) * 2016-04-14 2019-05-14 Momentive Performance Materials Inc. Curable silicone composition and applications and uses thereof
JP6672991B2 (ja) 2016-04-25 2020-03-25 信越化学工業株式会社 縮合硬化性樹脂組成物及び半導体装置
JP6784637B2 (ja) 2017-04-13 2020-11-11 信越化学工業株式会社 硬化性樹脂組成物
US10385210B2 (en) * 2017-06-20 2019-08-20 Momentive Performance Materials Inc. Curable silicone composition and applications and uses thereof
JP6915405B2 (ja) 2017-06-29 2021-08-04 信越化学工業株式会社 ポリ(メタ)アクリレート並びにそれを含むコーティング組成物および被覆物品

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207334A (ja) * 1986-03-08 1987-09-11 Nippon Petrochem Co Ltd 炭化珪素ポリマ−
JPS62207333A (ja) * 1986-03-08 1987-09-11 Nippon Petrochem Co Ltd シリコ−ン共重合体
US4877820A (en) * 1987-03-20 1989-10-31 Hercules Incorporated Cross-linked organosiloxane polymers
US5013809A (en) * 1987-07-30 1991-05-07 Hercules Incorporated Organosilicon compositions
US5077134A (en) * 1989-10-10 1991-12-31 Hercules Incorporated Organosilicon compositions
US5068303A (en) * 1989-10-16 1991-11-26 Hercules Incorporated Organosilicon materials
US5340644A (en) * 1990-10-05 1994-08-23 Hercules Incorporated Organosilicon compositions
US5147945A (en) * 1990-12-31 1992-09-15 Hercules Incorporated Organosilicon polymers and prepolymers comprising a coupling monomer
US5171817A (en) * 1991-04-15 1992-12-15 Hercules Incorporated Organosilicon compositions containing siloxane elastomers
US5196498A (en) * 1991-09-24 1993-03-23 Hercules Incorporated Organosilicon polymers
US5298536A (en) * 1992-02-21 1994-03-29 Hercules Incorporated Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
JP2927279B2 (ja) 1996-07-29 1999-07-28 日亜化学工業株式会社 発光ダイオード
JPH10228249A (ja) 1996-12-12 1998-08-25 Nichia Chem Ind Ltd 発光ダイオード及びそれを用いたled表示装置
JP4286935B2 (ja) 1998-10-14 2009-07-01 株式会社朝日ラバー 調色照明装置
US6911518B2 (en) * 1999-12-23 2005-06-28 Hybrid Plastics, Llc Polyhedral oligomeric -silsesquioxanes, -silicates and -siloxanes bearing ring-strained olefinic functionalities
JP3909826B2 (ja) 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
JP4280449B2 (ja) 2001-02-23 2009-06-17 株式会社カネカ 発光ダイオード
JP4037125B2 (ja) 2001-02-23 2008-01-23 株式会社カネカ 発光ダイオード及びその製造方法
JP4988123B2 (ja) 2001-02-23 2012-08-01 株式会社カネカ 発光ダイオード
JP3910080B2 (ja) 2001-02-23 2007-04-25 株式会社カネカ 発光ダイオード
US7019100B2 (en) * 2003-04-23 2006-03-28 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI410461B (zh) * 2006-09-12 2013-10-01 Shinetsu Chemical Co Polyoxymethylene-containing hardening composition containing polycyclic hydrocarbon groups
TWI424005B (zh) * 2007-04-23 2014-01-21 Adeka Corp A compound containing silicon, a hardened composition and a hardened product
TWI425031B (zh) * 2007-04-23 2014-02-01 Adeka Corp A compound containing silicon, a hardened composition and a hardened product

Also Published As

Publication number Publication date
DE102004046837A1 (de) 2005-09-22
DE102004046837B4 (de) 2018-01-11
US7176270B2 (en) 2007-02-13
TWI314154B (enExample) 2009-09-01
US20050080154A1 (en) 2005-04-14

Similar Documents

Publication Publication Date Title
TW200513483A (en) Curable composition
US6815520B2 (en) Addition curing type silicone resin composition
EP0509373B1 (en) Organosilicon compositions containing siloxane elastomers
KR940014677A (ko) 경화가능하거나 경화된 오가노실리콘 조성물
US5928564A (en) Liquid injection molding inhibitors for curable compositions
MX2007001150A (es) Composiciones de silano, procesos para su preparacion y composiciones de caucho que contienen las mismas.
TW200636010A (en) Silicon-containing curable composition and its cured product
NO20044847L (no) Epoxy modifisert organpolysiloxan resin basert sammensetninger anvendbare som beskyttende belegg
KR910015640A (ko) 유기 규소 화합물로 개질된 충진제의 제조방법, 개질된 충진제 및 이의 용도.
ATE463537T1 (de) Härtbare organopolysiloxanzusammensetzung und halbleitervorrichtung
JP2005133073A (ja) 硬化性組成物
KR950005871A (ko) 액체 에폭시 수지 조성물
JP5939723B2 (ja) ポリカルボシラン、およびポリカルボシランを含んでなるled向け封入剤用硬化性組成物
CA2008027A1 (en) Organosilicon compositions
US5173529A (en) Adhesive organopolysiloxane composition
JPS61180792A (ja) ビス(アミノアルキル)ジシロキサンの製造方法
TW200732384A (en) Polysilane and resin composition comprising the same
KR910004936B1 (ko) 폴리오르가노 실록산 조성물
KR920008123A (ko) 반응성기 함유 규소계 u.a.안정화제
SG126709A1 (en) Process for producing modified polypropylene resin
EP1565511B1 (en) Organosiloxane resin-polyene materials
US4849461A (en) Acryl functional silicone compounds
MY131899A (en) Phenol resin, epoxy resin, production method therefor, and epoxy resin compositions
JP7088879B2 (ja) 付加硬化型シリコーン組成物、硬化物および光半導体素子
JPS595219B2 (ja) ゴム状に硬化しうるポリオルガノシロキサン組成物

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees