TW200511538A - Heat dissipating structure and semiconductor package with the heat dissipating structure - Google Patents
Heat dissipating structure and semiconductor package with the heat dissipating structureInfo
- Publication number
- TW200511538A TW200511538A TW092125310A TW92125310A TW200511538A TW 200511538 A TW200511538 A TW 200511538A TW 092125310 A TW092125310 A TW 092125310A TW 92125310 A TW92125310 A TW 92125310A TW 200511538 A TW200511538 A TW 200511538A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat dissipating
- dissipating structure
- groove
- semiconductor package
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/163—Connection portion, e.g. seal
- H01L2924/16315—Shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092125310A TWI242863B (en) | 2003-09-15 | 2003-09-15 | Heat dissipating structure and semiconductor package with the heat dissipating structure |
US10/851,288 US7203072B2 (en) | 2003-09-15 | 2004-05-21 | Heat dissipating structure and semiconductor package with the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW092125310A TWI242863B (en) | 2003-09-15 | 2003-09-15 | Heat dissipating structure and semiconductor package with the heat dissipating structure |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200511538A true TW200511538A (en) | 2005-03-16 |
TWI242863B TWI242863B (en) | 2005-11-01 |
Family
ID=34271485
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW092125310A TWI242863B (en) | 2003-09-15 | 2003-09-15 | Heat dissipating structure and semiconductor package with the heat dissipating structure |
Country Status (2)
Country | Link |
---|---|
US (1) | US7203072B2 (zh) |
TW (1) | TWI242863B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI555146B (zh) * | 2014-02-10 | 2016-10-21 | 旭宏科技有限公司 | 具有粗糙面之晶片散熱片 |
CN108615715A (zh) * | 2018-07-11 | 2018-10-02 | 日月光半导体(昆山)有限公司 | 半导体封装件及其使用的导线框架条 |
CN108644743A (zh) * | 2018-05-31 | 2018-10-12 | 深圳实现创新科技有限公司 | 一种日光灯电路板封装结构 |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20060091542A1 (en) * | 2004-11-03 | 2006-05-04 | Broadcom Corporation | Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same |
US7271479B2 (en) * | 2004-11-03 | 2007-09-18 | Broadcom Corporation | Flip chip package including a non-planar heat spreader and method of making the same |
JP4746358B2 (ja) * | 2005-06-09 | 2011-08-10 | 新光電気工業株式会社 | 半導体装置および半導体装置の製造方法 |
JP4798222B2 (ja) * | 2006-04-07 | 2011-10-19 | 株式会社村田製作所 | 電子部品の接合構造およびその製造方法 |
US20090027859A1 (en) * | 2007-07-26 | 2009-01-29 | Giacoma Lawrence M | Surface mounted heat sink and electromagnetic shield |
US8390112B2 (en) * | 2008-09-30 | 2013-03-05 | Intel Corporation | Underfill process and materials for singulated heat spreader stiffener for thin core panel processing |
US8810028B1 (en) * | 2010-06-30 | 2014-08-19 | Xilinx, Inc. | Integrated circuit packaging devices and methods |
DE102010055627A1 (de) * | 2010-12-22 | 2012-06-28 | Epcos Ag | Elektrisches Modul zur Aufnahme durch Bestückungsautomaten mittels Erzeugung eines Vakuums |
US8476115B2 (en) * | 2011-05-03 | 2013-07-02 | Stats Chippac, Ltd. | Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material |
US9368843B2 (en) * | 2012-06-04 | 2016-06-14 | Graftech International Holdings, Inc. | Battery pack assembly |
CN104900612B (zh) * | 2015-06-09 | 2017-10-27 | 华进半导体封装先导技术研发中心有限公司 | 一种具有凹陷型散热片底座的封装体堆叠散热结构及其制作方法 |
JP6711098B2 (ja) * | 2016-04-15 | 2020-06-17 | オムロン株式会社 | 半導体装置の放熱構造 |
FR3055509B1 (fr) * | 2016-08-26 | 2018-09-21 | Stmicroelectronics (Grenoble 2) Sas | Boitier electronique comprenant un capot a rainure |
CN110164829A (zh) * | 2019-03-04 | 2019-08-23 | 昆山丘钛微电子科技有限公司 | 防水指纹模组 |
CN109887891B (zh) * | 2019-03-08 | 2021-01-22 | 苏州通富超威半导体有限公司 | 封装结构及其形成方法 |
US11721644B2 (en) * | 2021-05-03 | 2023-08-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor package with riveting structure between two rings and method for forming the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5473512A (en) * | 1993-12-16 | 1995-12-05 | At&T Corp. | Electronic device package having electronic device boonded, at a localized region thereof, to circuit board |
US6552264B2 (en) * | 1998-03-11 | 2003-04-22 | International Business Machines Corporation | High performance chip packaging and method |
US6191360B1 (en) * | 1999-04-26 | 2001-02-20 | Advanced Semiconductor Engineering, Inc. | Thermally enhanced BGA package |
US6282096B1 (en) * | 2000-04-28 | 2001-08-28 | Siliconware Precision Industries Co., Ltd. | Integration of heat conducting apparatus and chip carrier in IC package |
US6775140B2 (en) * | 2002-10-21 | 2004-08-10 | St Assembly Test Services Ltd. | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices |
TWI273680B (en) * | 2003-03-27 | 2007-02-11 | Siliconware Precision Industries Co Ltd | Semiconductor package with embedded heat spreader abstract of the disclosure |
TWI242862B (en) * | 2003-08-21 | 2005-11-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with heat sink |
-
2003
- 2003-09-15 TW TW092125310A patent/TWI242863B/zh not_active IP Right Cessation
-
2004
- 2004-05-21 US US10/851,288 patent/US7203072B2/en not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI555146B (zh) * | 2014-02-10 | 2016-10-21 | 旭宏科技有限公司 | 具有粗糙面之晶片散熱片 |
CN108644743A (zh) * | 2018-05-31 | 2018-10-12 | 深圳实现创新科技有限公司 | 一种日光灯电路板封装结构 |
CN108615715A (zh) * | 2018-07-11 | 2018-10-02 | 日月光半导体(昆山)有限公司 | 半导体封装件及其使用的导线框架条 |
Also Published As
Publication number | Publication date |
---|---|
TWI242863B (en) | 2005-11-01 |
US7203072B2 (en) | 2007-04-10 |
US20050056926A1 (en) | 2005-03-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |