TW200709460A - Thermal efficient package structure for high power LED - Google Patents

Thermal efficient package structure for high power LED

Info

Publication number
TW200709460A
TW200709460A TW094128095A TW94128095A TW200709460A TW 200709460 A TW200709460 A TW 200709460A TW 094128095 A TW094128095 A TW 094128095A TW 94128095 A TW94128095 A TW 94128095A TW 200709460 A TW200709460 A TW 200709460A
Authority
TW
Taiwan
Prior art keywords
package structure
high power
power led
substrate
led
Prior art date
Application number
TW094128095A
Other languages
Chinese (zh)
Other versions
TWI275191B (en
Inventor
Dawson Liu
Randy Chi
Original Assignee
Lustrous Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lustrous Technology Ltd filed Critical Lustrous Technology Ltd
Priority to TW094128095A priority Critical patent/TWI275191B/en
Application granted granted Critical
Publication of TW200709460A publication Critical patent/TW200709460A/en
Publication of TWI275191B publication Critical patent/TWI275191B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Led Device Packages (AREA)

Abstract

A light emitting diode (LED) package structure is provided. The LED package structure includes a substrate on which there are at least one cavity and circuits on one side, a piece of silicon wafer coated with conduction layer on one side and the other side is attached to the substrate. LED chip is attached to the conduction layer of the silicon wafer and then disposed on the top surface of the substrate by eutectic bonding or silver filler epoxy. After wire bonding and silicone sealing, the structure is formed.
TW094128095A 2005-08-17 2005-08-17 Thermal efficient package structure for high power LED TWI275191B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW094128095A TWI275191B (en) 2005-08-17 2005-08-17 Thermal efficient package structure for high power LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094128095A TWI275191B (en) 2005-08-17 2005-08-17 Thermal efficient package structure for high power LED

Publications (2)

Publication Number Publication Date
TW200709460A true TW200709460A (en) 2007-03-01
TWI275191B TWI275191B (en) 2007-03-01

Family

ID=38624304

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094128095A TWI275191B (en) 2005-08-17 2005-08-17 Thermal efficient package structure for high power LED

Country Status (1)

Country Link
TW (1) TWI275191B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381562B (en) * 2009-06-26 2013-01-01 Ind Tech Res Inst Method for manufacturing reflective led die bonding structure at low temperature

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201110430A (en) * 2009-09-04 2011-03-16 yi-zhang Chen Heat dissipation substrate of light-emitting diode and its manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI381562B (en) * 2009-06-26 2013-01-01 Ind Tech Res Inst Method for manufacturing reflective led die bonding structure at low temperature

Also Published As

Publication number Publication date
TWI275191B (en) 2007-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees