TW200511369A - Load lock system for supercritical fluid cleaning - Google Patents
Load lock system for supercritical fluid cleaningInfo
- Publication number
- TW200511369A TW200511369A TW093116737A TW93116737A TW200511369A TW 200511369 A TW200511369 A TW 200511369A TW 093116737 A TW093116737 A TW 093116737A TW 93116737 A TW93116737 A TW 93116737A TW 200511369 A TW200511369 A TW 200511369A
- Authority
- TW
- Taiwan
- Prior art keywords
- load lock
- substrate
- pressure
- supercritical fluid
- door
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S134/00—Cleaning and liquid contact with solids
- Y10S134/902—Semiconductor wafer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
- Y10S414/138—Wafers positioned vertically within cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/465,906 US7226512B2 (en) | 2003-06-18 | 2003-06-18 | Load lock system for supercritical fluid cleaning |
Publications (1)
Publication Number | Publication Date |
---|---|
TW200511369A true TW200511369A (en) | 2005-03-16 |
Family
ID=33517599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093116737A TW200511369A (en) | 2003-06-18 | 2004-06-10 | Load lock system for supercritical fluid cleaning |
Country Status (4)
Country | Link |
---|---|
US (2) | US7226512B2 (zh) |
JP (1) | JP2007524229A (zh) |
TW (1) | TW200511369A (zh) |
WO (1) | WO2004114394A1 (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050227187A1 (en) * | 2002-03-04 | 2005-10-13 | Supercritical Systems Inc. | Ionic fluid in supercritical fluid for semiconductor processing |
US7226512B2 (en) * | 2003-06-18 | 2007-06-05 | Ekc Technology, Inc. | Load lock system for supercritical fluid cleaning |
US20060102282A1 (en) * | 2004-11-15 | 2006-05-18 | Supercritical Systems, Inc. | Method and apparatus for selectively filtering residue from a processing chamber |
US20060185694A1 (en) * | 2005-02-23 | 2006-08-24 | Richard Brown | Rinsing step in supercritical processing |
US20060226117A1 (en) * | 2005-03-29 | 2006-10-12 | Bertram Ronald T | Phase change based heating element system and method |
US20060225769A1 (en) * | 2005-03-30 | 2006-10-12 | Gentaro Goshi | Isothermal control of a process chamber |
US20060223899A1 (en) * | 2005-03-30 | 2006-10-05 | Hillman Joseph T | Removal of porogens and porogen residues using supercritical CO2 |
US20060219268A1 (en) * | 2005-03-30 | 2006-10-05 | Gunilla Jacobson | Neutralization of systemic poisoning in wafer processing |
JP2007149866A (ja) * | 2005-11-25 | 2007-06-14 | Elpida Memory Inc | 半導体シリコン基板の製造方法およびその製造装置 |
JP2008075135A (ja) * | 2006-09-21 | 2008-04-03 | Nippon Dempa Kogyo Co Ltd | 真空処理装置および大気開放方法 |
US7695080B2 (en) * | 2007-06-05 | 2010-04-13 | King Slide Works Co., Ltd. | Securing device for a drawer slide |
JP4494523B2 (ja) * | 2007-11-09 | 2010-06-30 | キヤノンアネルバ株式会社 | インライン型ウェハ搬送装置および基板搬送方法 |
JP2009212307A (ja) * | 2008-03-04 | 2009-09-17 | Elpida Memory Inc | 超臨界成膜装置およびこれを用いた超臨界成膜方法 |
DE102010048043A1 (de) | 2010-10-15 | 2012-04-19 | Ev Group Gmbh | Vorrichtung und Verfahren zur Prozessierung von Wafern |
US20120266810A1 (en) * | 2011-04-20 | 2012-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Planarization system for high wafer topography |
EP2876674A1 (de) * | 2013-11-25 | 2015-05-27 | Roth & Rau AG | Vorrichtung zur Rückgewinnung von Inertgas aus Schleusenkammern |
US20170252991A1 (en) * | 2016-03-03 | 2017-09-07 | Juicero, Inc. | Juicer with flexible seal |
US10224224B2 (en) | 2017-03-10 | 2019-03-05 | Micromaterials, LLC | High pressure wafer processing systems and related methods |
US10622214B2 (en) | 2017-05-25 | 2020-04-14 | Applied Materials, Inc. | Tungsten defluorination by high pressure treatment |
KR102358561B1 (ko) | 2017-06-08 | 2022-02-04 | 삼성전자주식회사 | 기판 처리 장치 및 집적회로 소자 제조 장치 |
KR102405723B1 (ko) | 2017-08-18 | 2022-06-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 및 고온 어닐링 챔버 |
US10276411B2 (en) | 2017-08-18 | 2019-04-30 | Applied Materials, Inc. | High pressure and high temperature anneal chamber |
JP7274461B2 (ja) | 2017-09-12 | 2023-05-16 | アプライド マテリアルズ インコーポレイテッド | 保護バリア層を使用して半導体構造を製造する装置および方法 |
CN111357090B (zh) | 2017-11-11 | 2024-01-05 | 微材料有限责任公司 | 用于高压处理腔室的气体输送系统 |
KR20200075892A (ko) | 2017-11-17 | 2020-06-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 고압 처리 시스템을 위한 컨덴서 시스템 |
KR20230079236A (ko) | 2018-03-09 | 2023-06-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 금속 함유 재료들을 위한 고압 어닐링 프로세스 |
US10950429B2 (en) | 2018-05-08 | 2021-03-16 | Applied Materials, Inc. | Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom |
US10748783B2 (en) | 2018-07-25 | 2020-08-18 | Applied Materials, Inc. | Gas delivery module |
US10675581B2 (en) | 2018-08-06 | 2020-06-09 | Applied Materials, Inc. | Gas abatement apparatus |
KR20210077779A (ko) | 2018-11-16 | 2021-06-25 | 어플라이드 머티어리얼스, 인코포레이티드 | 강화된 확산 프로세스를 사용한 막 증착 |
WO2020117462A1 (en) | 2018-12-07 | 2020-06-11 | Applied Materials, Inc. | Semiconductor processing system |
US11901222B2 (en) | 2020-02-17 | 2024-02-13 | Applied Materials, Inc. | Multi-step process for flowable gap-fill film |
Family Cites Families (24)
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US4693777A (en) * | 1984-11-30 | 1987-09-15 | Kabushiki Kaisha Toshiba | Apparatus for producing semiconductor devices |
US5013366A (en) * | 1988-12-07 | 1991-05-07 | Hughes Aircraft Company | Cleaning process using phase shifting of dense phase gases |
ES2130295T3 (es) * | 1989-10-20 | 1999-07-01 | Applied Materials Inc | Aparato de tipo robot. |
US5447409A (en) * | 1989-10-20 | 1995-09-05 | Applied Materials, Inc. | Robot assembly |
US5558482A (en) * | 1992-07-29 | 1996-09-24 | Tokyo Electron Limited | Multi-chamber system |
US6048154A (en) * | 1996-10-02 | 2000-04-11 | Applied Materials, Inc. | High vacuum dual stage load lock and method for loading and unloading wafers using a high vacuum dual stage load lock |
US6224312B1 (en) * | 1996-11-18 | 2001-05-01 | Applied Materials, Inc. | Optimal trajectory robot motion |
US5955858A (en) * | 1997-02-14 | 1999-09-21 | Applied Materials, Inc. | Mechanically clamping robot wrist |
US6071055A (en) * | 1997-09-30 | 2000-06-06 | Applied Materials, Inc. | Front end vacuum processing environment |
US6517303B1 (en) * | 1998-05-20 | 2003-02-11 | Applied Komatsu Technology, Inc. | Substrate transfer shuttle |
KR100283425B1 (ko) * | 1998-09-24 | 2001-04-02 | 윤종용 | 반도체소자의금속배선형성공정및그시스템 |
US6748960B1 (en) * | 1999-11-02 | 2004-06-15 | Tokyo Electron Limited | Apparatus for supercritical processing of multiple workpieces |
WO2001033615A2 (en) * | 1999-11-02 | 2001-05-10 | Tokyo Electron Limited | Method and apparatus for supercritical processing of multiple workpieces |
US6460369B2 (en) * | 1999-11-03 | 2002-10-08 | Applied Materials, Inc. | Consecutive deposition system |
AU2001255656A1 (en) * | 2000-04-25 | 2001-11-07 | Tokyo Electron Limited | Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module |
US6860965B1 (en) * | 2000-06-23 | 2005-03-01 | Novellus Systems, Inc. | High throughput architecture for semiconductor processing |
US20020061248A1 (en) * | 2000-07-07 | 2002-05-23 | Applied Materials, Inc. | High productivity semiconductor wafer processing system |
US6444587B1 (en) * | 2000-10-02 | 2002-09-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Plasma etch method incorporating inert gas purge |
JP4937459B2 (ja) * | 2001-04-06 | 2012-05-23 | 東京エレクトロン株式会社 | クラスタツールおよび搬送制御方法 |
US6672864B2 (en) * | 2001-08-31 | 2004-01-06 | Applied Materials, Inc. | Method and apparatus for processing substrates in a system having high and low pressure areas |
US6763840B2 (en) * | 2001-09-14 | 2004-07-20 | Micell Technologies, Inc. | Method and apparatus for cleaning substrates using liquid carbon dioxide |
TW545693U (en) * | 2002-05-15 | 2003-08-01 | Macronix Int Co Ltd | Air inlet structure of vacuum isolating chamber |
US6896513B2 (en) * | 2002-09-12 | 2005-05-24 | Applied Materials, Inc. | Large area substrate processing system |
US7226512B2 (en) * | 2003-06-18 | 2007-06-05 | Ekc Technology, Inc. | Load lock system for supercritical fluid cleaning |
-
2003
- 2003-06-18 US US10/465,906 patent/US7226512B2/en not_active Expired - Fee Related
-
2004
- 2004-06-10 TW TW093116737A patent/TW200511369A/zh unknown
- 2004-06-14 WO PCT/US2004/019355 patent/WO2004114394A1/en active Application Filing
- 2004-06-14 JP JP2006517349A patent/JP2007524229A/ja active Pending
-
2007
- 2007-06-05 US US11/806,956 patent/US20070246074A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
JP2007524229A (ja) | 2007-08-23 |
US20040255979A1 (en) | 2004-12-23 |
WO2004114394A1 (en) | 2004-12-29 |
US7226512B2 (en) | 2007-06-05 |
US20070246074A1 (en) | 2007-10-25 |
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