TW200510152A - Brittle material subscribing device and scribing method and automatic analysis line - Google Patents

Brittle material subscribing device and scribing method and automatic analysis line

Info

Publication number
TW200510152A
TW200510152A TW093100427A TW93100427A TW200510152A TW 200510152 A TW200510152 A TW 200510152A TW 093100427 A TW093100427 A TW 093100427A TW 93100427 A TW93100427 A TW 93100427A TW 200510152 A TW200510152 A TW 200510152A
Authority
TW
Taiwan
Prior art keywords
blind crack
brittle material
region
automatic analysis
scribing method
Prior art date
Application number
TW093100427A
Other languages
English (en)
Other versions
TWI319744B (zh
Inventor
Masahiro Fujii
Original Assignee
Mitsuboshi Diamond Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Ind Co Ltd filed Critical Mitsuboshi Diamond Ind Co Ltd
Publication of TW200510152A publication Critical patent/TW200510152A/zh
Application granted granted Critical
Publication of TWI319744B publication Critical patent/TWI319744B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
TW093100427A 2003-01-10 2004-01-08 Brittle material subscribing device and scribing method and automatic analysis line TW200510152A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003004282 2003-01-10

Publications (2)

Publication Number Publication Date
TW200510152A true TW200510152A (en) 2005-03-16
TWI319744B TWI319744B (zh) 2010-01-21

Family

ID=32708944

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093100427A TW200510152A (en) 2003-01-10 2004-01-08 Brittle material subscribing device and scribing method and automatic analysis line

Country Status (8)

Country Link
US (1) US7723641B2 (zh)
EP (1) EP1595668B1 (zh)
JP (1) JPWO2004062868A1 (zh)
KR (1) KR20050091069A (zh)
CN (1) CN100506500C (zh)
AT (1) ATE524285T1 (zh)
TW (1) TW200510152A (zh)
WO (1) WO2004062868A1 (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100497820B1 (ko) * 2003-01-06 2005-07-01 로체 시스템즈(주) 유리판절단장치
US7820941B2 (en) * 2004-07-30 2010-10-26 Corning Incorporated Process and apparatus for scoring a brittle material
DE102006024825A1 (de) * 2006-05-23 2007-11-29 Jenoptik Automatisierungstechnik Gmbh Verfahren und Vorrichtung zum Randbeschneiden eines Floatglasbandes
JP5029804B2 (ja) * 2006-11-02 2012-09-19 澁谷工業株式会社 脆性材料の割断方法
US7982162B2 (en) * 2007-05-15 2011-07-19 Corning Incorporated Method and apparatus for scoring and separating a brittle material with a single beam of radiation
JP5328209B2 (ja) * 2007-06-15 2013-10-30 三菱電機株式会社 基板加工方法
JP5027606B2 (ja) * 2007-09-26 2012-09-19 株式会社キーエンス レーザ加工装置、加工データ生成方法及びコンピュータプログラム
TWI490176B (zh) * 2009-03-20 2015-07-01 Corning Inc 分離玻璃板材的製程與設備
WO2011002089A1 (ja) * 2009-07-03 2011-01-06 旭硝子株式会社 脆性材料基板の割断方法及び割断装置並びにその割断方法により得られる車両用窓ガラス
US8932510B2 (en) * 2009-08-28 2015-01-13 Corning Incorporated Methods for laser cutting glass substrates
US8426767B2 (en) * 2009-08-31 2013-04-23 Corning Incorporated Methods for laser scribing and breaking thin glass
CN102030468B (zh) * 2009-09-30 2013-05-08 富士迈半导体精密工业（上海）有限公司 激光切割装置及激光切割方法
US8946590B2 (en) 2009-11-30 2015-02-03 Corning Incorporated Methods for laser scribing and separating glass substrates
US8482837B2 (en) 2010-03-05 2013-07-09 Sage Electrochromics, Inc. Lamination of electrochromic device to glass substrates
FR2962682B1 (fr) 2010-07-16 2015-02-27 Saint Gobain Vitrage electrochimique a proprietes optiques et/ou energetiques electrocommandables
TWI513670B (zh) * 2010-08-31 2015-12-21 Corning Inc 分離強化玻璃基板之方法
JP2013071335A (ja) * 2011-09-28 2013-04-22 Mitsuboshi Diamond Industrial Co Ltd マザー基板の分断方法
US8677783B2 (en) 2011-11-28 2014-03-25 Corning Incorporated Method for low energy separation of a glass ribbon
JP6378167B2 (ja) * 2012-04-05 2018-08-22 セイジ・エレクトロクロミクス，インコーポレイテッド エレクトロクロミック素子を製造するためのサーマルレーザースクライブ切断の方法及び装置、並びに対応する切断されたガラスパネル
US9938180B2 (en) 2012-06-05 2018-04-10 Corning Incorporated Methods of cutting glass using a laser
US9610653B2 (en) 2012-09-21 2017-04-04 Electro Scientific Industries, Inc. Method and apparatus for separation of workpieces and articles produced thereby
EP3174169B1 (en) * 2014-07-25 2019-04-24 Mitsuboshi Diamond Industrial Co., Ltd. Optical fiber cooling device and laser oscillator
JP6555002B2 (ja) * 2015-08-19 2019-08-07 三星ダイヤモンド工業株式会社 スクライブラインの検査方法

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US4229865A (en) * 1978-12-28 1980-10-28 Western Electric Company, Incorporated Machine for laser scribing and winding metallized film capacitor blanks
DE3041342A1 (de) 1980-11-03 1982-06-09 Fichtel & Sachs Ag, 8720 Schweinfurt Mehrscheiben-kupplung mit zwangsabhub und vereinfachter montage
JPS6039054A (ja) * 1984-04-25 1985-02-28 Hitachi Ltd ダイシング装置
US5120927A (en) * 1988-06-03 1992-06-09 Insite Peripherals, Inc. High track density media with optical servo tracks and method and apparatus for inscribing the tracks on the media
JPH0750987B2 (ja) 1989-06-23 1995-05-31 オリジン電気株式会社 共振形ｄｃ―ｄｃコンバータの制御方法
JPH052152A (ja) * 1990-12-19 1993-01-08 Hitachi Ltd 光ビーム作成方法、装置、それを用いた寸法測定方法、外観検査方法、高さ測定方法、露光方法および半導体集積回路装置の製造方法
US5759428A (en) * 1996-03-15 1998-06-02 International Business Machines Corporation Method of laser cutting a metal line on an MR head
JPH10156668A (ja) * 1996-12-03 1998-06-16 Seiko Seiki Co Ltd ダイシング装置の加工状態表示装置
US5952058A (en) * 1997-01-15 1999-09-14 Seagate Technology, Inc. Laser texturing magnetic recording medium using fiber optics
US5951891A (en) * 1997-03-24 1999-09-14 International Business Machines Corporation Optical apparatus for monitoring profiles of textured spots during a disk texturing process
JP4396953B2 (ja) * 1998-08-26 2010-01-13 三星電子株式会社 レーザ切断装置および切断方法
US6211488B1 (en) * 1998-12-01 2001-04-03 Accudyne Display And Semiconductor Systems, Inc. Method and apparatus for separating non-metallic substrates utilizing a laser initiated scribe
JP2000281375A (ja) * 1999-03-31 2000-10-10 Nec Corp ガラス基板の割断方法及び割断装置
US6795274B1 (en) * 1999-09-07 2004-09-21 Asahi Glass Company, Ltd. Method for manufacturing a substantially circular substrate by utilizing scribing
JP2001130921A (ja) * 1999-10-29 2001-05-15 Mitsuboshi Diamond Industrial Co Ltd 脆性基板の加工方法及び装置
KR100701013B1 (ko) * 2001-05-21 2007-03-29 삼성전자주식회사 레이저 빔을 이용한 비금속 기판의 절단방법 및 장치

Also Published As

Publication number Publication date
US7723641B2 (en) 2010-05-25
CN1747820A (zh) 2006-03-15
EP1595668A1 (en) 2005-11-16
US20060101858A1 (en) 2006-05-18
TWI319744B (zh) 2010-01-21
JPWO2004062868A1 (ja) 2006-05-18
EP1595668A4 (en) 2008-09-17
ATE524285T1 (de) 2011-09-15
EP1595668B1 (en) 2011-09-14
CN100506500C (zh) 2009-07-01
KR20050091069A (ko) 2005-09-14
WO2004062868A1 (ja) 2004-07-29

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