TW200509334A - Integrated heat spreader lid - Google Patents

Integrated heat spreader lid

Info

Publication number
TW200509334A
TW200509334A TW093115384A TW93115384A TW200509334A TW 200509334 A TW200509334 A TW 200509334A TW 093115384 A TW093115384 A TW 093115384A TW 93115384 A TW93115384 A TW 93115384A TW 200509334 A TW200509334 A TW 200509334A
Authority
TW
Taiwan
Prior art keywords
lid
substrate board
center region
lip
induced
Prior art date
Application number
TW093115384A
Other languages
English (en)
Inventor
Jack Bish
Kevin Hanrahan
Damon Brink
Original Assignee
Honeywell Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honeywell Int Inc filed Critical Honeywell Int Inc
Publication of TW200509334A publication Critical patent/TW200509334A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H01L2924/1616—Cavity shape

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Micromachines (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW093115384A 2003-05-30 2004-05-28 Integrated heat spreader lid TW200509334A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/449,940 US6906413B2 (en) 2003-05-30 2003-05-30 Integrated heat spreader lid
PCT/US2004/016517 WO2004109759A2 (en) 2003-05-30 2004-05-25 Integrated heat spreader lid

Publications (1)

Publication Number Publication Date
TW200509334A true TW200509334A (en) 2005-03-01

Family

ID=33451903

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093115384A TW200509334A (en) 2003-05-30 2004-05-28 Integrated heat spreader lid

Country Status (7)

Country Link
US (3) US6906413B2 (zh)
EP (1) EP1629532A4 (zh)
JP (1) JP2006528846A (zh)
KR (1) KR20060004996A (zh)
CN (1) CN1799141A (zh)
TW (1) TW200509334A (zh)
WO (1) WO2004109759A2 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
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TWI672777B (zh) * 2017-05-12 2019-09-21 美商格芯（美國）集成電路科技有限公司 撓性散熱器蓋

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Also Published As

Publication number Publication date
US6906413B2 (en) 2005-06-14
EP1629532A4 (en) 2009-02-18
CN1799141A (zh) 2006-07-05
WO2004109759A2 (en) 2004-12-16
US7518219B2 (en) 2009-04-14
US20040238944A1 (en) 2004-12-02
WO2004109759A3 (en) 2005-05-06
US7186585B2 (en) 2007-03-06
KR20060004996A (ko) 2006-01-16
JP2006528846A (ja) 2006-12-21
EP1629532A2 (en) 2006-03-01
US20060027914A1 (en) 2006-02-09
US20070152323A1 (en) 2007-07-05

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