TW200508555A - Liquid-cooled system and electronic facilities utilizing the same - Google Patents

Liquid-cooled system and electronic facilities utilizing the same

Info

Publication number
TW200508555A
TW200508555A TW093104812A TW93104812A TW200508555A TW 200508555 A TW200508555 A TW 200508555A TW 093104812 A TW093104812 A TW 093104812A TW 93104812 A TW93104812 A TW 93104812A TW 200508555 A TW200508555 A TW 200508555A
Authority
TW
Taiwan
Prior art keywords
liquid
heat
coolant
ion
cooled system
Prior art date
Application number
TW093104812A
Other languages
English (en)
Other versions
TWI289647B (en
Inventor
Rintaro Minamitani
Shinji Matsushita
Shigeo Ohashi
Yoshihiro Kondo
Takashi Naganawa
Osamu Suzuki
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of TW200508555A publication Critical patent/TW200508555A/zh
Application granted granted Critical
Publication of TWI289647B publication Critical patent/TWI289647B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F15/00—Safety arrangements for slowing, redirecting or stopping errant vehicles, e.g. guard posts or bollards; Arrangements for reducing damage to roadside structures due to vehicular impact
    • E01F15/003—Individual devices arranged in spaced relationship, e.g. buffer bollards
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/60—Upright bodies, e.g. marker posts or bollards; Supports for road signs
    • E01F9/604—Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings
    • E01F9/608—Upright bodies, e.g. marker posts or bollards; Supports for road signs specially adapted for particular signalling purposes, e.g. for indicating curves, road works or pedestrian crossings for guiding, warning or controlling traffic, e.g. delineator posts or milestones
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/60—Upright bodies, e.g. marker posts or bollards; Supports for road signs
    • E01F9/658—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by means for fixing
    • E01F9/673—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by means for fixing for holding sign posts or the like
    • E01F9/681—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by means for fixing for holding sign posts or the like the sign posts being fastened by removable means, e.g. screws or bolts
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F9/00—Arrangement of road signs or traffic signals; Arrangements for enforcing caution
    • E01F9/60—Upright bodies, e.g. marker posts or bollards; Supports for road signs
    • E01F9/658—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by means for fixing
    • E01F9/673—Upright bodies, e.g. marker posts or bollards; Supports for road signs characterised by means for fixing for holding sign posts or the like
    • E01F9/685—Subsoil means, e.g. foundations
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Architecture (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
TW093104812A 2003-08-25 2004-02-25 Liquid-cooled system and electronic facilities utilizing the same TWI289647B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003299430A JP2005072216A (ja) 2003-08-25 2003-08-25 液冷システムおよびこれを用いた電子機器

Publications (2)

Publication Number Publication Date
TW200508555A true TW200508555A (en) 2005-03-01
TWI289647B TWI289647B (en) 2007-11-11

Family

ID=34101145

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093104812A TWI289647B (en) 2003-08-25 2004-02-25 Liquid-cooled system and electronic facilities utilizing the same

Country Status (6)

Country Link
US (1) US7296618B2 (zh)
EP (1) EP1511369A3 (zh)
JP (1) JP2005072216A (zh)
KR (1) KR20050022245A (zh)
CN (1) CN1591851A (zh)
TW (1) TWI289647B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006057920A (ja) * 2004-08-20 2006-03-02 Hitachi Ltd 電子機器の液冷システム、及び、これを用いた電子機器
JP2006261457A (ja) * 2005-03-17 2006-09-28 Fujitsu Ltd 受熱体、受熱装置及び電子機器
JP4439441B2 (ja) * 2005-07-01 2010-03-24 富士通株式会社 熱交換器
JP2008103263A (ja) * 2006-10-20 2008-05-01 Denso Corp 燃料電池システム
US20110186267A1 (en) * 2010-02-01 2011-08-04 Suna Display Co. Heat transfer device with anisotropic thermal conducting micro structures
US8711563B2 (en) 2011-10-25 2014-04-29 International Business Machines Corporation Dry-cooling unit with gravity-assisted coolant flow
WO2014145762A1 (en) * 2013-03-15 2014-09-18 G-Ro Technologies, Llc Variable ion generation and delivery
JP7478528B2 (ja) * 2019-10-09 2024-05-07 株式会社荏原製作所 キャンドモータポンプ

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2917685A (en) * 1957-07-01 1959-12-15 Ite Circuit Breaker Ltd Recirculating water system for cooling electrical components
US3965000A (en) * 1972-11-16 1976-06-22 Industrial Filter & Pump Mfg. Co. Method for operating ion exchange columns
JPH0682941B2 (ja) * 1987-10-22 1994-10-19 富士通株式会社 冷却液供給装置
JPH06342990A (ja) * 1991-02-04 1994-12-13 Internatl Business Mach Corp <Ibm> 統合冷却システム
US5572538A (en) * 1992-01-20 1996-11-05 Miyachi Technos Corporation Laser apparatus and accessible, compact cooling system thereof having interchangeable flow restricting members
US5406807A (en) * 1992-06-17 1995-04-18 Hitachi, Ltd. Apparatus for cooling semiconductor device and computer having the same
JP2002099356A (ja) * 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
JP2003185321A (ja) * 2001-12-14 2003-07-03 Tada Denki Kk 純水冷却装置

Also Published As

Publication number Publication date
EP1511369A2 (en) 2005-03-02
KR20050022245A (ko) 2005-03-07
JP2005072216A (ja) 2005-03-17
TWI289647B (en) 2007-11-11
EP1511369A3 (en) 2009-01-07
CN1591851A (zh) 2005-03-09
US20050047091A1 (en) 2005-03-03
US7296618B2 (en) 2007-11-20

Similar Documents

Publication Publication Date Title
AU2003293482A8 (en) Sealed and pressurized liquid cooling system for microprocessor
BRPI0510072A (pt) dispositivo e método de geração de terminais de material magneto-calórico
TW201019431A (en) Insulating and heat-dissipating structure of an electronic component
ATE356541T1 (de) Elektronisches leistungssystem mit passiver kühlung
CN103491745A (zh) 具有散热结构的电子装置
TW200508555A (en) Liquid-cooled system and electronic facilities utilizing the same
TW200630782A (en) Liquid cooling system
TW200506586A (en) Fanless heat sink for computer equipment
US20160163945A1 (en) Apparatus for thermoelectric recovery of electronic waste heat
TW200509353A (en) Frequency converter
ATE297110T1 (de) Elektronisches gerät mit wärmeerzeugenden teilen und wärmeabsorbierenden teilen
MXPA03010135A (es) CUBIERTA DE BLINDAJE CON DISIPADOR TERMICO PARA CIRCUITOS ELeCTRICOS.
CN205213244U (zh) 一种液冷板
JP2017017123A (ja) 筐体構造体およびこれを用いた電子機器
TWM357645U (en) Water cooling heat-dissipating module
US20050024824A1 (en) Arrangement for cooling heat-generating computer components
KR20120048934A (ko) 냉각장치 및 이를 이용한 물공급장치
CN202455710U (zh) 一种热流通道导热器及电子产品
JP2005072216A5 (zh)
TW200508323A (en) Heat dissipating member
JP2013143792A (ja) 発電システム
CN210837727U (zh) 适用电路板的散热装置
CN204517638U (zh) 一种变频器的散热组件
CN205807351U (zh) Uvled固化光源水冷散热系统
CN205681745U (zh) 一种散热器

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees