M357645 八、新型說明： 【新型所屬之技術領域】 種液冷式散熱模組，尤指一種以熱導管作為傳熱與散熱之 媒介’並透過液冷裝置作冷卻的散熱模組。 【先前技術】 按，隨著電子設備計算效能日漸增強，其内部所設置之電子元 ，於運作時會產生A量熱量’通於電子元件战置散熱器或 放U以增加賴面舰酸升散熱躲，但散減紐熱鑛 片僅藉由輻射方式作散熱，所達到之散熱效果有限，故現行習知 技術便大量_具魏冷式雜聽作柄強賴效能之解決方 式。 請參閱第1®，如圖所示於習知技術中，水冷式散熱模組i 包含有：散溢單元u、系浦14、水管12、散熱器13、及水管15 等元件’並前述散溢單元u具有容置空間（圖巾未表示）、流道 (圖中未絲）、出水σ (财未絲）、及人水nil卜並前述容 置空間中注入有流體，前述泵浦14接設於前述出水口，並透過前 述泵浦14對流體加魔令流體可於前述容置空間及流道中流動，另 者’前述散熱器13係為一中空殼體並頂部具有一注水孔132及〆 排水孔131，底部具有一接觸面133可與至少一發熱源（圖中未表 不)一接觸傳導_，前述散熱器13内部具有—容置空間（圖中未 表不），並刖述容置空間係與前述散熱器13上端之注水孔脱及 131相通連’且如述容置空間可供流體流動循環並將前述 M357645 散熱器13所受之熱量帶離，前述水管12係一端接設於前述栗浦 14 ’另端接設於前述注水孔132 ’另—水管15 一端係接設於前述 入水口 m，另端係接設於前述排水孔131，當前述泵浦14作動 時驅使流前述各元件帽觀動進行散熱，但紐容易因與 各元件間之密閉效果不佳而產生溢漏，使電子設備造成損壞，且 組成件複雜*裝不易又佔m相對的生產成本綠高；故習 知技術具有下列缺點： 1. 組成元件複雜； 2. 安裝不易； 3.容易造成溢漏； 4·較佔空間； 5.生產成本較高。 故，創作人有鏗於上述缺失，乃搜集相關資料，經由多方評估 及考量’ JUx從事於此行㈣積之抖職，經由稍試作及修 改，始設計出此種液冷式散熱模組之新型專利者。 【新型内容】 羑此’本創作之主要目的， 溢漏的液冷式散熱模組。 係提供一種結構簡單且不造成流體 本創作切目的’储供—齡餘㈣齡式散熱模 置。 〜本創作再—目的’係提供—種可有效將熱量排㈣統内部且令 則述系統中不積熱之液冷式散熱模組。 M357645 為達上述之目的，糊作係提供—觀冷式散讎組，包含： 液冷裝置及至少-熱導管’前述熱導管具有一吸熱端及一散熱 端，前述吸熱端雜至少-雜元件連接，該發紅件與液冷震 置分別設於-系統内及外並透過前述熱導管連接，前述熱導管之 散熱端係連接位於前述系統外部之液冷裝置，當前述吸熱端吸附 前述發熱元件所產生之熱量同時將熱量傳導至遠端與前述液冷裝 置接設之散熱端’再藉由前述液冷裝置對前述散熱端作散熱，透 #過前述熱導管傳導熱源可有效防止習知技術產生流體溢漏問題， 且經由熱導管將發熱元件難生之缝帶轉料部可令前 述系統内部紐產生積熱魏確實具魏佳之散触果；故本創 作具有下列優點： 1.結構簡單； 2·流體不溢漏； 3. 組裝簡單不占空間； 4. 殼體内部不積熱。 _ 【實施方式】 \ 祕成上述目的及功效’本創作所採用之技術手段及構造，兹 繪圖就本卿難纽靖加說繼與魏如下，俾利完全 了解。 本創作係提供一種「液冷式散熱模組」，請參閱第2、3、4圖， ㈣:^創作之液冷式散熱模組’係包含：一液冷裝置2及至 少-熱導# 3，前述熱導管3具有—吸熱端31及—散 述吸熱端31係呈扁平狀並與至少一發熱元件4 _ 述發熱元件41 ’麵發件41驗冷健 一口统月 7 M357645 =部及1 卜部，且該熱導管3係貫穿前述系統4，並吸熱端31連接 月j述發‘、、、元件41月g述散熱端32連接前述液冷裝置2 ，並將吸熱 端31吸收之熱里傳導至前述液冷裝置2散熱，藉由前述熱導管3 吸附,、、、源並將熱源確實傳遞至遠端液冷裝置2作散熱，不僅可令 熱源不滯=於前述發航件41顯，亦可使前絲統4中之熱量 確實排出别述系統4内部。 刖述液冷裝置2 -側凸設有複數鰭片22，且該鰭片22與至少 =風扇5接設’前述液冷裝置2更具有至少—散溢空間四及一系 浦二1與-流道24，^前述散溢空間a裝填有流體且前述流道％ · 與刖述mi相通連，可透猶述泵浦21驅使祕鍾於前述 散溢空間23中流動，並藉由前述流體對前述熱導管3之散熱端32 冷卻。 以下，係對本創作之液冷式散熱模組另一實施例作說明，請復 參閱第3、4圖’如圖所示’前述系統4内部係具有至少一發熱元 件4卜前述祕4外部係具有—液冷裝置2，並前述發熱元件μ 及液冷裝置2係透過至少—鮮管3作為連接，並前舰冷裝置2 内係具有一散溢空間23及一泵浦21與-流道24，前述散溢空間， 23内裝填有流體且前述流道24與前述栗浦21相通連可透過前述· 泵浦21驅使前述流體於前述散溢空間23中流動。 别述熱導管3係具有一吸熱端31及一散熱端犯，並前述吸熱 端31與前述發熱元件41貼合，t前述發熱元件41產生熱量時^ 透過前述熱導管3之吸熱端3卜細熱量並將熱量傳遞至遠端之散 熱端32，前述散熱端32係插設於位於前述系統4外部之液冷襞置 2的散溢空間23巾’並藉由散溢空間23内之流體對前述散熱端 8 M357645 32冷部以達到散熱之目的，另，因本創作係透過鮮管3作為傳 導熱篁之媒介不僅可確實將熱源傳遞至系統4外部，可令執量不 積熱於前«、統切，且因傳導熱量之齡係為龄# 3，故不產 生流體溢2之魏更可防止系統4_之電子元件損壞。 另者刖述熱導管3之吸熱端31與至少一散熱器6接設，則前 述散熱II 6貼觸前述發熱树41，可增大前述吸熱端31之接觸面 積。 • ±前述系統4係可為一電子設備機殼或一電信機箱或電腦主機機 威或ϋ鮮其巾任―，本創作細電齡機機殼作為實施例。 而Ρ月者以上所述僅為本案之較佳實施例，並非用以限制 本創作#依本創作之構想所作之改變，在不脫離本創作精神範 圍内’例如：對於構形或佈置型態加以變換，對於各種變化，修 飾與應用’所產生等效作用，均應包含於本案之權利範圍内，合 予陳明。 ψ Τ上所述本創作之液冷式散熱模組於使用時，為確實能達 •'、力效及㈣故本創作誠為-實雜優異之創作，為符合新 型專利之申請要件，爰依法提出申請，盼料早日賜准本案， 以保障創作人之辛苦創作，齡肖局審委有任何稽疑，請不吝 來函指示，齡人定當竭力配合，實感德便。 【圖式簡單說明】 第1圖為習知技術水冷式散熱模組立體圖。 :圖為本創作之實婦彳之液冷式散舰組之立體組合圖。 第圖為本創作之液冷裳置立體剖視圖。 9 M357645 第4圖為本創作之另一實施例之液冷式散熱模組之立體組合圖。 【主要元件符號說明】 液冷裝置2 泵浦21 鰭片22 散溢空間23 流道24 熱導管3 吸熱端31 散熱端32 系統4 發熱元件41 風扇5 散熱器6M357645 VIII. New Description: [New technical field] A liquid-cooled heat-dissipating module, especially a heat-dissipating module that uses a heat pipe as a medium for heat transfer and heat dissipation and is cooled by a liquid cooling device. [Prior Art] Press, as the computing power of electronic devices increases, the electronic components installed inside it will generate A amount of heat during operation. The heat dissipation is hidden, but the heat-reducing film is only radiated by the radiation method, and the heat dissipation effect is limited. Therefore, the current conventional technology has a large number of solutions. Please refer to the 1®. As shown in the figure, the water-cooled heat dissipation module i includes components such as the overflow unit u, the pump 14, the water pipe 12, the radiator 13, and the water pipe 15 The overflow unit u has a accommodating space (not shown), a flow path (not shown in the figure), an effluent σ (财未丝), and a human water nil, and the fluid is injected into the accommodating space, and the pump 14 Connected to the water outlet, and the fluid is enchanted by the pump 14 to flow in the accommodating space and the flow channel. The radiator 13 is a hollow casing and has a water injection hole at the top. 132 and the drain hole 131, the bottom portion has a contact surface 133 which can be in contact with at least one heat source (not shown), and the heat sink 13 has an internal space (not shown). The accommodating space is connected to the water injection hole 131 of the upper end of the radiator 13 and the accommodating space is used for fluid flow circulation and the heat received by the M357645 radiator 13 is removed. One end is connected to the chestnut 14' and the other end is connected to the water injection hole 132. In addition, one end of the water pipe 15 is connected to the water inlet m, and the other end is connected to the drain hole 131. When the pump 14 is actuated, the flow of the above-mentioned component caps is driven to dissipate heat, but the new element is easy to be used with each component. The sealing effect is not good and the leakage is caused, which causes damage to the electronic equipment, and the components are complicated. * The installation cost is not easy and the production cost is relatively high. Therefore, the conventional technology has the following disadvantages: 1. The constituent components are complicated; Installation is not easy; 3. It is easy to cause spills; 4. More space; 5. Higher production costs. Therefore, the creators are not satisfied with the above-mentioned deficiencies. They are collecting relevant information. Through multi-party evaluation and consideration of 'Juxx's work in this line (4), the liquid-cooled heat-dissipating module was designed through a little trial and modification. New patents. [New content] The main purpose of this creation is the liquid-cooled heat-dissipating module that overflows. The system provides a simple structure and does not cause the fluid to be tailored to the purpose of storage-aged (four) age-type heat dissipation modules. ~ This creation is again - the purpose of providing a liquid-cooled heat-dissipating module that can effectively dissipate heat (four) and not accumulate heat in the system. M357645 For the above purposes, the paste system provides a cold-discharge type, comprising: a liquid cooling device and at least a heat pipe. The heat pipe has a heat absorbing end and a heat radiating end, and the heat absorbing end is at least a hetero-component. Connecting, the red-hot component and the liquid-cooling device are respectively disposed inside and outside the system and connected through the heat pipe, and the heat-dissipating end of the heat pipe is connected to a liquid cooling device located outside the system, and the heat-absorbing end absorbs the heat The heat generated by the component simultaneously conducts heat to the heat radiating end of the distal end and the liquid cooling device, and then dissipates the heat radiating end by the liquid cooling device, and the heat conduction source of the heat pipe can effectively prevent the conventional heat conduction. The technology creates a fluid spill problem, and the seaming part of the seam that is difficult to heat through the heat pipe can cause the heat generated by the internal system of the system to have the heat of Wei Jiazhi; therefore, the creation has the following advantages: 1. Structure Simple; 2. Fluid does not leak; 3. Simple assembly does not take up space; 4. No heat is accumulated inside the casing. _ [Implementation] \ Secrets of the above purposes and effects 'The technical means and structure used in this creation, the drawing is on the basis of this Qing dynasty, New Zealand, and Wei as follows, and Philip fully understands. This creation provides a "liquid-cooled heat-dissipation module", please refer to Figures 2, 3, and 4, (4): ^Created liquid-cooled heat-dissipation module' contains: a liquid cooling device 2 and at least - heat conduction # 3, the heat pipe 3 has a heat absorbing end 31 and a heat absorbing end 31 is flat and with at least one heat generating component 4 _ the heating element 41 'face hair piece 41 cold test and a mouthful of the month 7 M357645 = and 1 卜, and the heat pipe 3 is inserted through the system 4, and the heat absorbing end 31 is connected to the month, and the component 41 is connected to the liquid cooling device 2, and the heat absorbed by the heat absorbing end 31 is absorbed. The heat is radiated to the liquid cooling device 2, and the heat pipe 3 adsorbs, and the source is passed, and the heat source is reliably transmitted to the remote liquid cooling device 2 for heat dissipation, so that the heat source is not stagnant = the aforementioned traveling member 41 It is also obvious that the heat in the front wire system 4 can be surely discharged from the inside of the system 4. The liquid cooling device 2 is provided with a plurality of fins 22 laterally convex, and the fins 22 are connected to at least the fan 5, and the liquid cooling device 2 has at least a space for overflowing four and a pair of Pu 2 and The flow passage 24, the overflow space a is filled with a fluid, and the flow passage % is connected to the above-described mi, and the pump 21 is driven to drive the secret clock to flow in the overflow space 23, and the fluid is The heat radiating end 32 of the heat pipe 3 is cooled. In the following, another embodiment of the liquid-cooled heat-dissipating module of the present invention will be described. Please refer to Figures 3 and 4 as shown in the figure. The system 4 has at least one heating element 4 and the external system. There is a liquid cooling device 2, and the heating element μ and the liquid cooling device 2 are connected through at least the fresh tube 3, and the front ship cooling device 2 has an overflow space 23 and a pump 21 and a flow path. 24, the overflow space 23 is filled with a fluid, and the flow passage 24 is connected to the chestnut 21 to drive the fluid to flow through the overflow space 23 through the pump 21. The heat pipe 3 has a heat absorbing end 31 and a heat radiating end, and the heat absorbing end 31 is attached to the heat generating component 41. When the heat generating component 41 generates heat, it passes through the heat absorbing end 3 of the heat pipe 3. The heat is transferred to the remote heat radiating end 32, and the heat radiating end 32 is inserted into the overflow space 23 of the liquid cooling device 2 located outside the system 4 and is separated by the fluid in the overflow space 23. The heat-dissipating end 8 M357645 32 is used for the purpose of heat dissipation. In addition, the creative system transmits the heat source to the outside of the system 4 through the fresh tube 3 as a medium for conducting heat, so that the heat is not accumulated before the creation. «, cut, and because of the age of conduction heat is age # 3, so does not produce fluid overflow 2 Wei can prevent the damage of electronic components of system 4_. In addition, the heat absorbing end 31 of the heat pipe 3 is connected to at least one of the heat sinks 6, and the heat radiating fins 6 are attached to the heat generating trees 41 to increase the contact area of the heat absorbing end 31. • The aforementioned system 4 can be an electronic device case or a telecom chassis or a computer mainframe machine or a fresh towel. The present invention is an embodiment of a fine electric machine casing. However, the above descriptions are only preferred embodiments of the present invention, and are not intended to limit the changes made by this creation according to the concept of the present creation, without departing from the spirit of the present invention, for example: for configuration or arrangement Changes, for the various changes, the equivalent effect of the modification and application, should be included in the scope of the case, and combined with Chen Ming. ψ Τ 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液 液Applying in accordance with the law, I hope that the case will be granted as soon as possible, in order to protect the arduous creation of the creators. The auditors of the Shouxiao Bureau have any doubts. Please do not hesitate to give instructions to the people, and the young people will try their best to cooperate with them. [Simple description of the drawings] Fig. 1 is a perspective view of a conventional water-cooled heat dissipation module. : The picture is a three-dimensional combination of the liquid-cooled bulkships of the real women. The figure is a three-dimensional cross-sectional view of the liquid cooling skirt of the creation. 9 M357645 Fig. 4 is a perspective assembled view of a liquid-cooled heat dissipation module according to another embodiment of the present invention. [Explanation of main component symbols] Liquid cooling device 2 Pump 21 Fin 22 Spilled space 23 Flow path 24 Heat pipe 3 Heat absorbing end 31 Heat sink 32 System 4 Heating element 41 Fan 5 Heat sink 6