JP2008175448A - Cooling device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact cooling device by a liquid cooling method having superior cooling performance. <P>SOLUTION: A first flow channel portion 12 and a second flow channel portion 13 are formed on a part of a heat absorbing face 11b and a heat sink face 11a of a cooling portion 11 having a Peltier element, an outflow port of the first flow channel portion 12 and an inflow port of the second flow channel portion 13 are connected by a connection pipe 14, and a refrigerant flowing out from the first flow channel portion 12 flows into the second flow channel portion 13 through the connection pipe 14. By cooling the heat sink face 11a by the refrigerant cooled in the first flow channel portion 12, the cooling performance can be improved and the miniaturization of the device can be achieved. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid cooling type cooling device using a Peltier element.

  Various liquid cooling type cooling devices using Peltier elements have been proposed. FIG. 5 is a cross-sectional view showing a configuration example of a conventional typical cooling device.

  In FIG. 5, 51 is a Peltier element, 52 is a flow path part for cooling the heat radiation surface 51b of the Peltier element 51 with a refrigerant such as water, 53 is a tank for storing the refrigerant 54, 55 is a pump, and 56 is a flow path part. 52 is an inlet, 57 is an outlet of the flow path 52, and 58 is a pipe.

The pump 55 is driven to recirculate the refrigerant 54 from the tank 53 to the flow path portion 52 in the direction indicated by the arrow in the drawing, and the heat radiating surface 51b (heat generating surface) is cooled by the refrigerant 54. It is configured to reduce the temperature.
JP-A-7-260287

  In order to improve the cooling performance in the conventional cooling device, in addition to improving the cooling performance of the Peltier element itself, a method of lowering the temperature of the refrigerant is effective. However, in the conventional apparatus, the temperature of the refrigerant cannot be lowered below the heat dissipation performance of the tank and the pipe. Of course, the temperature of the refrigerant can be lowered by attaching a heat exchanger such as a fin type heat exchanger or a plate type heat exchanger to the pipe or the tank. However, the method of attaching the heat exchanger has a problem that the apparatus cost increases and the apparatus becomes large.

  Accordingly, an object of the present invention is to solve the conventional problems and to provide a small cooling device having excellent cooling performance.

  The cooling device of the present invention includes a cooling unit having a Peltier element, a first flow path unit provided on a part of the heat absorption surface of the cooling unit, a second flow path unit provided on the heat dissipation surface of the cooling unit, And a reflux part for refluxing the refrigerant from the flow path part to the second flow path part.

  By adopting such a configuration, the heat radiation surface of the cooling unit is cooled by the refrigerant cooled in the first flow path unit, so that the temperature of the heat radiation surface is lower than that of the conventional device, and as a result, the temperature of the heat absorption surface is reduced. It can be made lower than the conventional example. Accordingly, it is possible to improve the cooling performance and reduce the size of the apparatus.

  According to the present invention, it is possible to provide an effect capable of providing a small cooling device excellent in cooling performance.

  Hereinafter, an embodiment of a cooling device according to the present invention will be described with reference to the drawings of FIGS. In the drawings, the same components are denoted by the same reference numerals, and the description of the overlapping components is omitted.

(Embodiment 1)
FIG. 1 is a schematic view showing a configuration example of a cooling device according to the present invention. 1A is a cross-sectional view showing the entire cooling device, FIG. 1B and FIG. 1C are a front view showing a configuration example of a first flow path portion provided on the heat absorption surface of the cooling portion, and FIG. d) is a bottom view showing a configuration example of a second flow path portion provided on the heat radiation surface of the cooling portion. FIG. 2 is a perspective view showing an embodiment of the main part of the cooling device according to the present invention. FIG. 3 is an exploded perspective view of the cooling device of FIG. 2 as viewed from the heat absorption surface of the cooling unit. FIG. 4 is an exploded perspective view of the cooling device of FIG. 2 as viewed from the heat radiation surface of the cooling unit. In each figure, the direction of the arrow given in the figure indicates the direction in which the refrigerant flows.

  In FIG. 1, 11 is a cooling unit having a Peltier element, 11a is a heat radiating surface of the cooling unit 11, 11b is a heat absorbing surface of the cooling unit 11, and 12 is a first flow path having an outlet / inlet provided at a part of the heat absorbing surface 11b. , 13 is a second flow path portion having an outflow inlet provided on the heat radiation surface 11a, 14 is a connection pipe connecting the outlet of the first flow path section 12 and the inlet of the second flow path section 13, 15 is A refrigerant such as water, 16 is a tank for storing the refrigerant 15, 17 is a pump, 18 is a pipe for pumping the refrigerant 15 in the tank 16 to the inlet of the first flow path portion, and 19 is a second flow path. This pipe guides the refrigerant 15 flowing out from the outlet of the tank to the tank 16. When the pump 17 is driven, the refrigerant 15 flows in the direction of the arrow given in the figure, and is configured to recirculate between the tank 16, the first flow path portion 12, and the second flow path portion. Here, a component for recirculating the refrigerant, that is, a component composed of the connection pipe 14, the pipes 18 and 19, and the pump 17 is defined as a reflux part.

  For example, as shown in FIG. 1B, the first flow path portion 12 may be provided close to one side of the endothermic surface 11b, or as shown in FIG. Either may be provided. Among these, the annular arrangement as shown in FIG. 1C is preferable in that the cooling efficiency of the refrigerant is improved. An endothermic surface A surrounded by a dotted line in FIG. 1B and an endothermic surface B surrounded by a dotted line in FIG. 1C indicate a place where an object to be cooled is placed.

  For example, as shown in FIG. 1D, the second flow path portion 13 is formed with a serpentine flow path so that the entire heat radiation surface 11 a is cooled by the refrigerant 15.

  When the pump 17 is driven to recirculate the refrigerant 15 in the direction of the arrow, the heat radiating surface 11 a is cooled by the refrigerant 15 cooled by the first flow path portion 12. Therefore, since it cools with the refrigerant | coolant of temperature lower than the conventional cooling device demonstrated in FIG. 5, the temperature of the heat absorption surface 11b can be made lower.

(Example 1)
The embodiment of the cooling device described in FIG. 1C will be described below with reference to FIGS.

  The cooling unit 11 is configured by sandwiching a Peltier element with a heat conductive member such as pure copper or pure aluminum.

  The first flow path portion 12 is made of a heat conductive member such as pure copper or pure aluminum, and is provided in an annular shape along the peripheral edge of the heat absorbing surface 11b of the cooling portion 11 as shown in FIG. And as shown in FIG. 3, the flow path 24 is formed so that the refrigerant | coolant which flowed in from the inflow port 22 may flow out from the outflow port 23. FIG. The flow path 32 on the side opposite to the endothermic surface 11 b is sealed with a lid 31. In addition, the 1st flow path part 12 by the side of the heat absorption surface 11b is adhere | attached on the heat absorption surface 11b with an adhesive etc., and it is comprised so that a refrigerant | coolant may contact the heat absorption surface 11b. 21 is an object to be cooled.

  The 2nd flow-path part 13 is comprised with heat conductive members, such as pure copper and pure aluminum, and is provided so that the thermal radiation surface 11a of the cooling part 11 may be covered as shown in FIG. And as shown in FIG. 4, the meandering flow path 42 is formed so that the whole heat radiation surface 11a may be cooled with the refrigerant | coolant which flowed in from the inflow port 24. As shown in FIG. The flow path 42 opposite to the heat radiating surface 11 a is sealed with a lid 41. In addition, the 2nd flow path part 13 by the side of the thermal radiation surface 11a is adhere | attached on the thermal radiation surface 11a with an adhesive etc., and it is comprised so that a refrigerant | coolant may contact the thermal radiation surface 11a.

  The outlet 23 of the first flow path portion 12 and the inlet 24 of the second flow path portion 13 are connected by a connection pipe 14 made of a heat insulating member such as resin. Therefore, the refrigerant maintains the temperature cooled in the first flow path portion 12 and flows into the second flow path portion 13, so that the heat radiation surface 11a can be efficiently cooled.

  The cooling device according to the present invention is useful as a cooling device for cooling a heating element such as a semiconductor.

Schematic showing one configuration example of a cooling device according to the present invention The perspective view which shows one Example of the principal part of the cooling device by this invention The exploded perspective view which looked at the cooling device of FIG. 2 from the heat absorption surface of the Peltier device The exploded perspective view which looked at the cooling device of FIG. 2 from the heat radiating surface of the Peltier device Schematic showing one configuration example of a conventional cooling device

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Cooling part 12 1st flow path part 13 2nd flow path part 14 Connection pipe

Claims (2)

A cooling section having a Peltier element, a first flow path section provided on a part of the heat absorption surface of the cooling section, a second flow path section provided on the heat dissipation surface of the cooling section, and the first flow path section. A cooling device comprising: a recirculation part that recirculates the refrigerant to the second flow path part. The cooling device according to claim 1, wherein the first flow path portion is provided in an annular shape along a peripheral edge of the endothermic surface.