TW200820404A - Water-cooled heat sink and water-cooled system - Google Patents

Water-cooled heat sink and water-cooled system Download PDF

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Publication number
TW200820404A
TW200820404A TW096123093A TW96123093A TW200820404A TW 200820404 A TW200820404 A TW 200820404A TW 096123093 A TW096123093 A TW 096123093A TW 96123093 A TW96123093 A TW 96123093A TW 200820404 A TW200820404 A TW 200820404A
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TW
Taiwan
Prior art keywords
flow path
heat transfer
water
heat
plate
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Application number
TW096123093A
Other languages
Chinese (zh)
Inventor
Jiro Nakajima
Hitoshi Onishi
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Alps Electric Co Ltd
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Publication of TW200820404A publication Critical patent/TW200820404A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
    • F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

There is provided a water-cooled heat sink including first and second heat transfer channel plates that are stacked and coupled together. The first heat transfer channel plate is provided with a continuous recess that is located in a facing surface thereof that faces the second heat transfer channel plate, corresponds to the coolant channel, and is open at the facing surface, the second heat transfer channel plate is provided with a continuous protrusion, which is fitted into the recess of the first heat transfer channel plate with a gap therebetween, in a facing surface thereof that faces the first heat transfer channel plate, and the first and second heat transfer channel plates are stacked and coupled together to define the coolant channel between the recess and the protrusion.

Description

200820404 (1) 九、發明說明 【發明所屬之技術領域】 本發明涉及使發熱源散熱的水冷式散熱器（heat sink )以及水冷系統。 【先前技術】 水冷式散熱器，例如用於發熱的CPU (熱源）的散熱 ，在與發熱源進行熱接觸的導熱塊內，都具備冷卻液流路 。爲了使冷卻液流路的有效長度變長，設法將冷卻液流路 的形狀做成漩渦狀等（專利文獻1、2、3 )。通過水（冷 卻液）的流動，吸取與散熱器接觸的熱源的熱量而使其冷 卻，這一基本思想是共通的。 專利文獻1:日本特開平8 - 97337號公報 專利文獻2:日本特開平8— 204079號公報 專利文獻3:日本特開2003— 234589號公報 在此種方式的水冷式散熱器中，若增大流路的剖面面 積（與冷卻液接觸的面積），則散熱效果變好。但是，若 爲了增加流路剖面面積而使流路槽變細（增加壁的數量） ’則會使加工性變差，增加流路阻力。 【發明內容】 本發明的目的在於，獲得加工性好、流路阻力低、散 熱性好的水冷式散熱器以及使用該水冷式散熱器的冷卻系 統。 -4- 200820404 (2) 本發明提供一種水冷式散熱器，在與發熱源直接或間 接接觸的導熱體內，形成有冷卻液流動的冷卻液流路，其 中，其是著眼於通過形狀簡單的層疊結合的第一、第二導 熱流路板構成水冷式散熱器而提出的，在第一導熱流路板 上’在與第二導熱流路板相對的相對面上設有與冷卻液流 路對應的該相對面側開放了的連續的凹部，在第二導熱流 路板上’在與第一導熱流路板相對的相對面上，設有保持 間隙地嵌入第一導熱流路板的凹部內的連續的凸部，層疊 結合該第一、第二導熱流路板，在上述凹部與凸部之間構 成冷卻液流路。 本發明的水冷式散熱器，可以用於具備液體泵和散熱 部的水冷系統中，其中，前述液體泵的噴出口與冷卻液流 路入口孔連通’吸入口與出口孔連通；前述散熱部形成于 連結出口孔與吸入口的流路。 發熱源可以與第二導熱流路板進行直接或間接的熱接 觸。 第一導熱流路板的凹部與第二導熱流路板的凸部的剖 面形狀有自由度’但例如可以分別形成爲剖面是矩形、或 剖面是半圓形或長圓形。進而’也可以分別形成爲剖面是 三角形。 【實施方式】 圖1是具備本發明的水冷式散熱器1 0的水冷系統的 槪念圖。水冷式散熱器1 0由導熱性金屬材料製成，內部 -5- 200820404 (3) 具有連續的冷卻液流路Π，此冷卻液流路1 1的兩端部， 與面向水冷式散熱器1 〇外面的入口孔（入口端）12和出 口孔（出口端）13相連。入口孔12通過吸入連通路14 與液體泵15的噴出口 16連通，出口孔13通過噴出連通 路17與液體泵15的吸入口 18連通。在噴出連通路17上 具備由散熱器（radiator) 19a和冷卻風扇19b組成的散熱 部19。作爲發熱源舉例說明的CPU20，與水冷式散熱器 1 0進行熱接觸。若驅動液體泵1 5，則冷卻液從噴出口 1 6 、吸入連通路14、入口孔12進入水冷式散熱器10的冷 卻液流路1 1，流經該流路1 1吸收來自CPU20的熱量’升 溫後的冷卻液，在從出口孔1 3、噴出連通路1 7、吸入口 1 8返回液體泵1 5的過程中，被散熱部1 9冷卻。 水冷式散熱器10，如圖2至圖4所示’具備互相層 疊結合的第一導熱流路板1 01和第二導熱流路板1 〇2，在 第一導熱流路板101固定有具有入口孔12和出口孔13的 輸入輸出塊103。在第一導熱流路板1〇1上，如圖2所示 ，在與第二導熱流路板1 0 2相對的相對面上，形成有向該 相對面側開放的連續凹部1 1 a。連續凹部1 1 a形成爲：從 入口孔1 2以漩渦狀到達第一導熱流路板1 〇 1的中心部， 又以漩渦狀被導向第一導熱流路板1 〇 1的外側，到達出口 孔1 3。該連續凹部1 1 a，如圖4、圖5所示，剖面形成爲 矩形。連續凹部1 1 a的平面形狀雖然有自由度，但圖示的 例子是漩渦狀的平面形狀的例子，其在有限的空間內確保 足夠的有效長度上有效。 -6 - 200820404 (4) 在第二導熱流路板1 02上，如圖3所示，在與 熱流路板1 〇 1相對的相對面上，形成有嵌入到連 1 1 a內的連續凸部1 1 b。如圖4、圖5所示，連續凸 的剖面爲小於連續凹部1 1 a的矩形，在層疊第一導 板101與第二導熱流路板102、並由固定螺栓1〇4固 的狀態下，在連續凸部1 1 b與連續凹部1 ! a之間形成 爲“ 3 ”字形的冷卻液流路Π。在第一導熱流路板 與第二導熱流路板1 02之間，在除去凹部丨丨a的部分 可以夾入密封部件或粘合劑。另外，也可以用金屬彼 間的接合（鐳射焊接、擴散接合）。 如此，冷卻液流路1 1由如下部分構成，即：由 的矩形形狀的槽構成的連續凹部1 1 a、以及保持間隙 入該連續凹部11a內的連續凸部lib，並且只通過相 疊第一導熱流路板1 0 1與第二導熱流路板！ 02就形成 液流路1 1。所以，加工性好。並且，第一導熱流路板 或者第二導熱流路板1 02，例如，也可以獨立形成連 部等，進一步將其分割成兩部分。 另外，若由連續凹部1 1 a和連續凸部1 1 b構成冷 流路1 1，則散熱性也好。假設，若第二導熱流路板 由堵塞連續凹部1 1 a的平面1 1 c (圖5 )形成，則此 第二導熱流路板1 02側的導熱面積，對應於連續凹音 的開放側的寬度s。與此相對，若在第二導熱流路板 形成有連續凸部1 1 b，則第二導熱流路板1 〇2側的導 積，只增加了與連續凸部1 1 b向連續凹部1 1 a側突出 一導 凹部 5 11b 流路 定了 剖面 101 ，也 此之 簡單 地嵌 互層 冷卻 101 續凸 卻液 102 時的 11a 102 熱面 的突 -7- 200820404 (5) 出長度x的2倍（2x )對應的量。因此，流經 1 1的冷卻水，可以有效地吸收第二導熱流路相 熱量。CPU20也可以與第二導熱流路板102進 觸，也可以隔著熱傳導潤滑脂等進行間接接觸 圖6至圖8，表示連續凹部iia和連續凸 冷卻液流路1 1 )的其他形狀例。圖6是連續[ 連續凸部1 1 b都是三角形（正三角形）的例子 續凹部1 1 a和連續凸部1 1 b都是剖面半圓狀的 是連續凹部1 1 a和連續凸部1 1 b都是剖面長圓 的外側有半圓狀部）的例子。根據這些實施方 夠提高導熱性。特別是若形成爲圖6的三角形 成爲矩形形狀的情況，能夠進一步提高導熱性 據連續凸部1 1 b的大小，如圖5的虛線所示， 導熱面積增加狹縫1 1 b >。 【圖式簡單說明】 圖1是具備本發明的水冷式散熱器的水冷 圖； 圖2是圖1的水冷系統中的水冷式散熱器 熱流路板的俯視圖和側視圖； 圖3是該水冷式散熱器的另一方的導熱流 圖和側視圖； 圖4是層疊了圖2與圖3的導熱流路板的 兩圖的IV — IV線的剖面圖； 冷卻液流路 泛側的 行直接熱接 〇 部1 1 b (即 H]部1 1 a和 ，圖7是連 例子，圖8 狀（平行部 式也同樣能 ，相比于形 。並且，根 也可以形成 系統的槪念 的一方的導 路板的俯視 狀態下的沿 -8 · 200820404 (6) 圖5是表示冷卻水流路的剖面形狀的傾斜情況的圖4 的一部分放大剖面圖； 圖6是表示冷卻水流路的其他形狀例的與圖5相對應 的放大剖面圖； 圖7是表示冷卻水流路的另一個其他形狀例的與圖5 相對應的放大剖面圖； 圖8是表示冷卻水流路的另一個其他形狀例的與圖5 相對應的放大剖面圖。 【主要元件符號說明】 1 〇 :散熱器 1 1 :冷卻液流路 1 1 a :連續凹部 1 1 b :連續凸部 1 1 c :平面 12 :入口孔（入口端） 1 3 :出口孔（出口端） 1 4 :吸入連通路 1 5 :液體泵 1 6 :噴出口 1 7 :噴出連通路 1 8 :吸入口 1 9 :散熱部 19a :散熱器 -9 - 200820404 (7) 1 9 b :冷卻風扇 1 〇 1 :第一導熱流路板 102 :第二導熱流路板 103 :輸入輸出塊 1 〇 4 :固定螺栓 -10200820404 (1) Description of the Invention [Technical Field] The present invention relates to a water-cooled heat sink and a water-cooling system that dissipate heat from a heat source. [Prior Art] A water-cooled heat sink, for example, a heat sink (heat source) for heat generation, has a coolant flow path in a heat transfer block that is in thermal contact with a heat source. In order to increase the effective length of the coolant flow path, it is sought to make the shape of the coolant flow path spiral or the like (Patent Documents 1, 2, and 3). The basic idea is that the water (cooling liquid) flows through the heat of the heat source in contact with the radiator to cool it. Patent Document 1: Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The cross-sectional area of the flow path (the area in contact with the coolant) is improved. However, if the flow path groove is made thinner (the number of increased walls) in order to increase the cross-sectional area of the flow path, the workability is deteriorated and the flow path resistance is increased. SUMMARY OF THE INVENTION An object of the present invention is to obtain a water-cooled heat sink having good workability, low flow path resistance, and good heat dissipation, and a cooling system using the water-cooled heat sink. -4- 200820404 (2) The present invention provides a water-cooled heat sink in which a coolant flow path through which a coolant flows is formed in a heat-conducting body which is in direct or indirect contact with a heat source, wherein the focus is on cascading through a simple shape. The combined first and second heat transfer flow path plates are formed by forming a water-cooled heat sink, and the first heat transfer flow path plate is disposed on the opposite surface opposite to the second heat transfer flow path plate to correspond to the coolant flow path. The continuous concave portion on the opposite surface side is provided on the second heat transfer passage plate on the opposite surface opposite to the first heat transfer flow path plate, and is provided in the concave portion of the first heat transfer flow path plate with a gap therebetween. The continuous convex portion is laminated and coupled to the first and second heat transfer passage plates, and a coolant flow path is formed between the concave portion and the convex portion. The water-cooled heat sink of the present invention can be used in a water-cooling system including a liquid pump and a heat radiating portion, wherein a discharge port of the liquid pump communicates with a coolant flow path inlet hole; a suction port communicates with an outlet hole; and the heat radiating portion is formed The flow path connecting the outlet hole and the suction port. The heat source can be in direct or indirect thermal contact with the second heat transfer flow path plate. The concave shape of the first heat transfer flow path plate and the convex shape of the second heat transfer flow path plate have a degree of freedom ', but may be formed, for example, as a rectangular cross section or a semicircular or oblong cross section. Further, it may be formed such that the cross section is a triangle. [Embodiment] Fig. 1 is a view showing a water cooling system including a water-cooled radiator 10 of the present invention. The water-cooled radiator 10 is made of a thermally conductive metal material, and the interior -5 - 200820404 (3) has a continuous coolant flow path, both ends of the coolant flow path 1 1 , and the water-cooled radiator 1 The outer inlet hole (inlet end) 12 and the outlet hole (outlet end) 13 are connected to each other. The inlet port 12 communicates with the discharge port 16 of the liquid pump 15 through the suction communication passage 14, and the outlet port 13 communicates with the suction port 18 of the liquid pump 15 through the discharge communication passage 17. The discharge communication path 17 is provided with a heat radiating portion 19 composed of a radiator 19a and a cooling fan 19b. The CPU 20 exemplified as a heat source is in thermal contact with the water-cooled heat sink 110. When the liquid pump 15 is driven, the coolant enters the coolant flow path 1 of the water-cooled radiator 10 from the discharge port 16 , the suction communication path 14 , and the inlet port 12 , and flows through the flow path 1 1 to absorb heat from the CPU 20 . The coolant after the temperature rise is cooled by the heat radiating portion 19 in the process of returning from the outlet port 13 to the discharge port 17 and the suction port 18 to the liquid pump 15. The water-cooled heat sink 10, as shown in FIGS. 2 to 4, has a first heat transfer flow path plate 101 and a second heat transfer flow path plate 1 〇2 laminated to each other, and has a fixed structure on the first heat transfer flow path plate 101. The input and output blocks 103 of the inlet hole 12 and the outlet hole 13 are provided. On the first heat transfer passage plate 1'1, as shown in Fig. 2, on the opposite surface facing the second heat transfer passage plate 102, a continuous recess 11a open to the opposite surface side is formed. The continuous recess 1 1 a is formed so as to spirally reach the center portion of the first heat transfer channel plate 1 〇 1 from the inlet hole 1 2 , and is guided to the outside of the first heat transfer channel plate 1 〇 1 in a spiral shape to reach the exit. Hole 1 3. The continuous recess 1 1 a has a rectangular cross section as shown in Figs. 4 and 5 . Although the planar shape of the continuous recess 1 1 a has a degree of freedom, the illustrated example is an example of a spiral planar shape which is effective in securing a sufficient effective length in a limited space. -6 - 200820404 (4) On the second heat transfer flow path plate 102, as shown in Fig. 3, on the opposite surface opposite to the heat flow path plate 1 〇1, a continuous convex embedded in the continuous 1 1 a is formed. Part 1 1 b. As shown in FIG. 4 and FIG. 5, the continuous convex cross section is a rectangle smaller than the continuous concave portion 11a, and the first guide plate 101 and the second heat transfer flow path plate 102 are stacked and fixed by the fixing bolts 1〇4. A cooling liquid flow path of a "3" shape is formed between the continuous convex portion 1 1 b and the continuous concave portion 1 a. Between the first heat transfer passage plate and the second heat transfer passage plate 102, a sealing member or an adhesive may be sandwiched in the portion where the recess 丨丨a is removed. Alternatively, metal bonding (laser welding or diffusion bonding) may be used. In this way, the coolant flow path 1 1 is composed of a continuous concave portion 1 1 a composed of a rectangular-shaped groove and a continuous convex portion lib holding the gap into the continuous concave portion 11a, and only by the overlapping A heat transfer flow plate 1 0 1 and a second heat transfer flow plate! 02 forms a liquid flow path 1 1 . Therefore, the processability is good. Further, the first heat transfer passage plate or the second heat transfer passage plate 102 may be formed, for example, by forming a joint or the like separately, and further dividing the portion into two. Further, if the cold flow path 1 1 is constituted by the continuous concave portion 1 1 a and the continuous convex portion 1 1 b, the heat dissipation property is also good. It is assumed that if the second heat transfer flow path plate is formed by the plane 1 1 c ( FIG. 5 ) that blocks the continuous recess 1 1 a , the heat transfer area of the second heat transfer flow path plate 102 corresponds to the open side of the continuous concave sound. Width s. On the other hand, when the continuous heat transfer portion 1 1 b is formed in the second heat transfer passage plate, the conduction on the second heat transfer passage plate 1 〇 2 side is increased only by the continuous convex portion 1 1 b toward the continuous concave portion 1 1 a side protrudes a guide recess 5 11b The flow path defines a section 101, and thus simply intercalates the layer 101 to cool the swell of the liquid 102 when the 11a 102 hot surface is -7-200820404 (5) the length x 2 The amount corresponding to (2x). Therefore, the cooling water flowing through the passage 1 can effectively absorb the heat of the second heat transfer path. The CPU 20 may be in contact with the second heat transfer passage plate 102 or may be indirectly contacted via a heat transfer grease or the like. Figs. 6 to 8 show another example of the shape of the continuous recess iia and the continuous convex coolant flow path 1 1 ). Fig. 6 is a continuous example [continuous convex portion 1 1 b is a triangle (orthogonal triangle). The continuous concave portion 1 1 a and the continuous convex portion 1 1 b are both semicircular in cross section and are a continuous concave portion 1 1 a and a continuous convex portion 1 1 b is an example of a semicircular portion on the outer side of the long circle of the section. The thermal conductivity is improved according to these implementations. In particular, when the triangular shape of Fig. 6 is formed into a rectangular shape, the thermal conductivity can be further increased according to the size of the continuous convex portion 1 1 b, and the heat transfer area is increased by the slit 1 1 b > as indicated by a broken line in Fig. 5 . BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a water-cooling diagram of a water-cooled radiator having the present invention; Fig. 2 is a plan view and a side view of a water-cooled radiator heat flow passage in the water-cooling system of Fig. 1; The other side of the heat sink has a heat transfer flow diagram and a side view; Fig. 4 is a cross-sectional view taken along line IV-IV of the two layers of the heat transfer flow path board of Fig. 2 and Fig. 3; direct heat of the line on the flood side of the coolant flow path The joint portion 1 1 b (i.e., the H) portion 1 1 a and Fig. 7 are connected examples, and the Fig. 8 shape (the parallel portion type is also similar to the shape, and the root can also form the mourning side of the system). FIG. 5 is a partially enlarged cross-sectional view showing the inclination of the cross-sectional shape of the cooling water flow path, and FIG. 6 is a view showing another example of the shape of the cooling water flow path. FIG. 7 is an enlarged cross-sectional view corresponding to FIG. 5 showing another example of the shape of the cooling water flow path. FIG. 8 is a view showing another example of the shape of the cooling water flow path. Figure 5 corresponds to an enlarged cross-sectional view. [Main component symbols Description] 1 〇: radiator 1 1 : coolant flow path 1 1 a : continuous recess 1 1 b : continuous projection 1 1 c : plane 12 : inlet hole (inlet end) 1 3 : outlet hole (outlet end) 1 4: Suction communication path 1 5 : Liquid pump 1 6 : Ejection port 1 7 : Discharge communication path 1 8 : Suction port 1 9 : Heat dissipating portion 19a : Radiator -9 - 200820404 (7) 1 9 b : Cooling fan 1 〇 1 : First heat transfer flow path plate 102 : second heat transfer flow path plate 103 : input and output block 1 〇 4 : fixing bolt -10

Claims (1)

200820404 (1) 十、申請專利範圍 1 · 一種水冷式散熱器，在與發熱源直接或間接接觸的 導熱體內，形成有冷卻液流動的冷卻液流路，其特徵在於 具備層疊結合的第一、第二導熱流路板， 該第一導熱流路板在與第二導熱流路板相對的相對面 上，具有與上述冷卻液流路對應的該相對面側開放的連續 的凹部， 上述第二導熱流路板在與第一導熱流路板相對的相對 面上，具有保持間隙地嵌入第一導熱流路板的凹部內的連 續的凸部， 層疊結合上述第一、第二導熱流路板，在上述凹部與 凸之間構成上述冷卻液流路。 2 ·如申請專利範圍第〗項所述的水冷式散熱器，其中 ’發熱源與第二導熱流路板直接或間接熱接觸。 3 ·如申請專利範圍第1項所述的水冷式散熱器，其中 ’凹部與凸部的剖面形狀分別爲矩形。 4 ·如申請專利範圍第1項所述的水冷式散熱器，其中 ’凹部與凸部的剖面形狀分別爲半圓形或長圓形。 5 ·如申請專利範圍第1項所述的水冷式散熱器，其中 ’凹部與凸部的剖面形狀分別爲三角形。 6 · —種水冷系統，其具備： 水冷式散熱器，其在與發熱源直接或間接接觸的導熱 體內’形成有冷卻液流動的冷卻液流路； -11 - 200820404 (2) 液體栗’前述液體栗的噴出口與該水冷式散熱器的冷 卻液流路入口孔連通，吸入口與冷卻液流路出口孔連通； 以及 散熱部，其形成於連結上述出口孔與吸入□的流路， 上述水冷系統的特徵在於， 上述水冷式散熱器， 具備層疊結合的第一、第二導熱流路板， 該第一導熱流路板在與第二導熱流路板相對的相對面 上，具有與上述冷卻液流路對應的該相對面側開放的連續 的凹部， 上述第二導熱流路板在與第一導熱流路板相對的相對 面上，具有保持間隙地嵌入第一導熱流路板的凹部內的連 續的凸部， 層疊結合上述第一、第二導熱流路板，在上述凹部與 凸部之間構成上述冷卻液流路。 7.如申請專利範圍第6項所述的水冷系統，其中， 發熱源與第二導熱流路板直接或間接熱接觸。 8 .如申請專利範圍第6項所述的水冷系統，其中， 第一導熱流路板的凹部與第二導熱流路板的凸部的剖 面形狀分別爲矩形。 9.如申請專利範圍第6項所述的水冷系統，其中， 第一導熱流路板的凹部與第二導熱流路板的凸部的剖 面形狀分別爲半圓形或長圓形。 1 0 ·如申請專利範圍第6項所述的水冷系統，其中’ -12- 200820404 (3) 第一導熱流路板的凹部與第二導熱流路板的凸部的剖 面形狀分別爲三角形。 -13-200820404 (1) X. Patent application scope 1 · A water-cooled heat sink in which a coolant flow path through which a coolant flows is formed in a heat conductor directly or indirectly in contact with a heat source, and is characterized in that it has a first combination of lamination and a second heat transfer channel plate having a continuous concave portion open on the opposite surface side corresponding to the coolant flow path on a surface opposite to the second heat transfer passage plate, the second heat transfer plate The heat transfer flow path plate has a continuous convex portion embedded in the concave portion of the first heat conduction flow path plate on the opposite surface opposite to the first heat conduction flow path plate, and laminated and combined with the first and second heat conduction flow path plates The coolant flow path is formed between the concave portion and the convex portion. 2. The water-cooled heat sink of claim 1, wherein the heat source is in direct or indirect thermal contact with the second heat transfer channel. The water-cooled heat sink according to the first aspect of the invention, wherein the recessed portion and the convex portion have a rectangular shape in cross section. The water-cooled heat sink according to the first aspect of the invention, wherein the recessed portion and the convex portion have a semicircular shape or an oblong shape, respectively. The water-cooled heat sink according to the first aspect of the invention, wherein the recessed portion and the convex portion have a triangular cross-sectional shape. 6 · A water-cooling system comprising: a water-cooled radiator that forms a coolant flow path through which a coolant flows in a heat-conducting body that is in direct or indirect contact with a heat source; -11 - 200820404 (2) Liquid chestnut a discharge port of the liquid pump communicates with a coolant flow path inlet hole of the water-cooled heat sink, the suction port communicates with the coolant flow path outlet hole, and a heat dissipation portion formed in a flow path connecting the outlet hole and the suction port, The water-cooling system is characterized in that the water-cooling heat sink has first and second heat transfer flow path plates laminated and coupled, and the first heat transfer flow path plate has an opposite surface to the second heat transfer flow path plate a continuous concave portion on the opposite surface side corresponding to the coolant flow path, wherein the second heat transfer flow path plate has a recess in which the gap is inserted into the first heat transfer flow path plate on a surface opposite to the first heat transfer flow path plate The continuous convex portion in the inner layer is laminated and coupled to the first and second heat transfer passage plates, and the coolant flow path is formed between the concave portion and the convex portion. 7. The water cooling system of claim 6, wherein the heat source is in direct or indirect thermal contact with the second heat transfer flow path plate. 8. The water-cooling system according to claim 6, wherein the concave portion of the first heat transfer passage plate and the convex portion of the second heat transfer passage plate have a rectangular shape, respectively. 9. The water-cooling system according to claim 6, wherein the concave portion of the first heat transfer flow path plate and the convex portion of the second heat transfer flow path plate have a semicircular shape or an oblong shape, respectively. The water-cooling system according to claim 6, wherein the recessed portion of the first heat transfer passage plate and the convex portion of the second heat transfer passage plate are respectively triangular in shape. -13-
TW096123093A 2006-08-02 2007-06-26 Water-cooled heat sink and water-cooled system TW200820404A (en)

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JP2011185457A (en) * 2010-03-04 2011-09-22 Kiko Kagi Kofun Yugenkoshi Heat exchanger structure
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JP5287919B2 (en) 2011-04-01 2013-09-11 トヨタ自動車株式会社 Heat sink and electronic component with heat sink
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KR102561617B1 (en) 2017-02-24 2023-08-01 다이니폰 인사츠 가부시키가이샤 Vapor chamber, electronic device, metal sheet for vapor chamber, and method for manufacturing vapor chamber
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KR102153475B1 (en) * 2019-06-14 2020-09-08 연세대학교 산학협력단 Flexible heat sink using channel flow and manufacturing method thereof
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