TWI400421B - Heat exchanger structure - Google Patents

Heat exchanger structure Download PDF

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Publication number
TWI400421B
TWI400421B TW099100907A TW99100907A TWI400421B TW I400421 B TWI400421 B TW I400421B TW 099100907 A TW099100907 A TW 099100907A TW 99100907 A TW99100907 A TW 99100907A TW I400421 B TWI400421 B TW I400421B
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TW
Taiwan
Prior art keywords
heat exchanger
exchanger structure
spoiler unit
guiding groove
spiral guiding
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TW099100907A
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Chinese (zh)
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TW201020494A (en
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Asia Vital Components Co Ltd
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Priority to TW099100907A priority Critical patent/TWI400421B/en
Priority to US12/710,299 priority patent/US20110168360A1/en
Publication of TW201020494A publication Critical patent/TW201020494A/en
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Publication of TWI400421B publication Critical patent/TWI400421B/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/04Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

熱交換器結構Heat exchanger structure

本發明係有關於一種熱交換器,尤指一種提高熱傳效率之熱交換器結構。The present invention relates to a heat exchanger, and more particularly to a heat exchanger structure that improves heat transfer efficiency.

隨著電子資訊科技的日益進步,使得電子設備(如電腦、筆記型電腦、通訊機箱…等)的使用日趨普及且應用更為廣泛;然而,電子設備在高速運作時其內的電子元件會產生廢熱,倘若無法及時將前述廢熱排出電子設備外,極容易使這些廢熱囤積在電子設備內,使電子設備內部及其內電子元件的溫度不斷地攀升,進而導致電子元件因過熱而發生故障、損壞或運作效率降低等情況。With the advancement of electronic information technology, the use of electronic devices (such as computers, notebook computers, communication chassis, etc.) is becoming more and more popular and widely used; however, electronic components in electronic devices generate high-speed operation. Waste heat, if the waste heat is not discharged into the electronic equipment in time, it is easy to accumulate the waste heat in the electronic equipment, so that the temperature of the electronic components inside and inside the electronic equipment continues to rise, which causes the electronic components to malfunction and damage due to overheating. Or the operation efficiency is reduced.

而習知為了改善上述散熱問題,一般較常見都是在電子設備內裝設一散熱風扇來強制散熱,但因其散熱風扇之氣流量受限,使其散熱效果難以提升,且降溫幅度也受限的情況,所以業者便尋求另一種解決方式,即使用一水冷式散熱裝置直接貼附在發熱元件上,如(中央處理器(CPU)、MPU、南、北橋晶片等),並由一泵浦自儲水槽內將冷卻液體導入到水冷式散熱裝置中,使冷卻液體與該水冷式散熱裝置從發熱元件吸收的熱量作熱交換後,冷卻液體再由水冷式散熱裝置的一出水口流出至一散熱模組,再經由冷卻後再送回前述儲水槽,所以藉由冷卻液體循環來幫助散熱,降低發熱元件溫度,使其發熱元件能順利運作。In order to improve the above heat dissipation problem, it is generally common to install a cooling fan in the electronic device to force heat dissipation. However, due to the limited air flow of the cooling fan, the heat dissipation effect is difficult to be improved, and the cooling rate is also affected. In the limited case, the operator has sought another solution, that is, using a water-cooled heat sink directly attached to the heating element, such as (central processing unit (CPU), MPU, south, north bridge wafer, etc.), and by a pump The cooling liquid is introduced into the water-cooled heat sink in the water storage tank, and the cooling liquid is exchanged with the heat absorbed by the water-cooling heat sink from the heat-generating component, and then the cooling liquid is discharged from a water outlet of the water-cooling heat sink to the water outlet. A heat dissipation module is sent back to the water storage tank after cooling, so that the cooling liquid is circulated to help dissipate heat, and the temperature of the heating element is lowered, so that the heating element can operate smoothly.

然而,雖所述水冷式散熱裝置能改善利用氣流散熱的問題,但卻延伸出另一個問題,即水冷式散熱裝置緊貼靠該發熱元件的端面(即為吸熱面)僅集中在同一處的關係,使得在水冷式裝置內的冷卻液體僅有一最下層之流體部份與吸熱面產生熱交換作用,且所述冷卻液體滯留在水冷式散熱裝置之時間過短,以導致冷卻液體尚未吸收足夠的熱量,便立即快速的由前述出水口導出,所以俾使水冷功能大打折扣致使其熱傳效果不佳,進而令散熱效果極不彰顯。However, although the water-cooling heat dissipating device can improve the problem of heat dissipation by using airflow, it extends another problem that the water-cooling heat dissipating device is close to the end surface of the heating element (ie, the heat absorbing surface) and is concentrated only at the same place. The relationship is such that only a lowermost fluid portion of the cooling liquid in the water-cooled device exchanges heat with the heat absorbing surface, and the cooling liquid stays in the water-cooling heat sink for too short a time, so that the cooling liquid has not yet absorbed enough The heat is quickly and quickly exported from the aforementioned water outlet, so that the water cooling function is greatly reduced, resulting in poor heat transfer effect, which makes the heat dissipation effect extremely inconspicuous.

請參閱第1圖所示,習知技術揭露一種水冷式散熱結構,係包含一底座10及一蓋體11,其中該蓋體11具有一容置空間111、一進水管112及一出水管113,前述進水管112及出水管113分別形成在該蓋體11的兩相對側上,且與容置空間111彼此相連通,而該底座10係與蓋體11相蓋合一起,且底座10上配設有複數散熱鰭片(鰭柱)13,該等散熱鰭片13包覆在該蓋體11的容置空間111內,且其彼此間形成複數單向流道131,並分別與所述進水管112及出水管113相對應,所以當一冷卻液體由該進水管112導入至該容置空間111內後,透過複數單向流道131引導冷卻液體通過,使冷卻液體與該等散熱鰭片13作熱交換,以有效提升散熱的效果。As shown in FIG. 1 , the prior art discloses a water-cooled heat dissipating structure, which comprises a base 10 and a cover 11 . The cover 11 has an accommodating space 111 , an inlet pipe 112 and an outlet pipe 113 . The water inlet pipe 112 and the water outlet pipe 113 are respectively formed on opposite sides of the cover body 11 and communicate with the accommodating space 111, and the base 10 is covered with the cover body 11 and is mounted on the base 10. And a plurality of heat dissipating fins (fins) 13 are disposed in the accommodating space 111 of the cover 11 and form a plurality of unidirectional flow channels 131 therebetween, and respectively The inlet pipe 112 and the outlet pipe 113 correspond to each other. Therefore, after a cooling liquid is introduced into the accommodating space 111 from the inlet pipe 112, the cooling liquid is guided through the plurality of unidirectional channels 131 to cool the liquid and the fins. The sheet 13 is heat exchanged to effectively enhance the heat dissipation effect.

然而,雖上述之散熱結構中,可利用該等散熱鰭片13之設立,藉以增加散熱面積,以使冷卻液體流過複數單向流道131時,可增加冷卻液體於該等流道之停滯時間以便帶走較多之熱源以作熱交換,但由於因單向流道131係以多數鰭片之間隔形成,致使流體之摩擦阻力增加,於定泵功率之條件下,冷卻流體流速低,熱對流係數低且伴隨高壓損係數,進而影響冷卻液體自散熱鰭片13之對流熱傳量,因此,俾使整體的熱交換效率及熱傳效果明顯不佳,相對的其散熱效果更未盡理想。However, in the above heat dissipation structure, the heat dissipation fins 13 can be used to increase the heat dissipation area, so that when the cooling liquid flows through the plurality of unidirectional flow channels 131, the stagnation of the cooling liquid in the flow channels can be increased. Time to take more heat sources for heat exchange, but since the one-way flow passages 131 are formed at intervals of a plurality of fins, the frictional resistance of the fluid is increased, and the flow rate of the cooling fluid is low under the condition of constant pump power. The thermal convection coefficient is low and the high pressure loss coefficient is accompanied by the convective heat transfer of the cooling liquid from the fins 13. Therefore, the overall heat exchange efficiency and heat transfer effect are obviously poor, and the relative heat dissipation effect is not completed. ideal.

以上所述,習知技術具有下列缺點:As described above, the prior art has the following disadvantages:

1.冷卻液體於底座過短,致使熱傳效果不彰;1. The cooling liquid is too short at the base, resulting in poor heat transfer effect;

2.冷卻液體僅下層與傳導之熱源接觸,致熱傳效果不佳;2. The cooling liquid only contacts the heat source of the lower layer, and the heat transfer effect is not good;

3.熱交換效率不佳;3. The heat exchange efficiency is not good;

4.散熱效果不佳。4. The heat dissipation effect is not good.

緣是,有鑑於上述習用品所衍生的各項缺點,本案之發明人遂竭其心智,以從事該行業多年之經驗,潛心研究加以創新改良,終於成功研發完成本件「熱交換器結構」案,實為一具功效增進之創作。The reason is that in view of the shortcomings arising from the above-mentioned goods, the inventor of this case exhausted his mind, engaged in the industry's many years of experience, researched and innovated and improved, and finally successfully developed the "heat exchanger structure" case. It is actually an effect-enhancing creation.

爰此,為解決上述習知技術之缺點,本發明之主要目的,係提供一種具有螺旋導引槽設計之熱交換器結構,令該螺旋導引槽提高熱傳遞能力及熱性能係數者。Therefore, in order to solve the above disadvantages of the prior art, the main object of the present invention is to provide a heat exchanger structure having a spiral guiding groove design, which makes the spiral guiding groove improve heat transfer capability and thermal performance coefficient.

為達上述之目的,本發明係提供一種熱交換器結構,其包括:一本體,該本體具有一中心,及從該中心朝相對該中心的外側徑向環繞延伸之一螺旋導引槽,且該螺旋導引槽的徑向迴轉半徑從該中心往外側逐漸增加,及一第一通口與一第二通口分別連通該螺旋導引槽,亦此可藉由本發明之螺旋導引槽的設計,俾使能夠增強在該螺旋導引槽其內流動的一流體混合效果,更進而有效達到絕佳的熱傳效果者。To achieve the above object, the present invention provides a heat exchanger structure including: a body having a center, and a spiral guiding groove extending radially from the center toward an outer side opposite the center, and The radial radius of rotation of the spiral guiding groove gradually increases from the center to the outside, and a first opening and a second opening respectively communicate with the spiral guiding groove, and the spiral guiding groove of the present invention can also be used. The design is such that it can enhance the mixing effect of a fluid flowing in the spiral guiding groove, and further effectively achieve an excellent heat transfer effect.

本發明係另提供一種熱交換器結構,包括:一本體,具有一中心,及一螺旋導引槽從該中心朝相對該中心的外側徑向環繞延伸,且該螺旋導引槽的徑向迴轉半徑從本體中心往外側逐漸增加,及一第一通口與一第二通口分別連通該螺旋導引槽;及至少一第一擾流單元,係設於螺旋導引槽之壁面。The invention further provides a heat exchanger structure, comprising: a body having a center, and a spiral guiding groove extending radially from the center toward an outer side opposite to the center, and the radial guiding of the spiral guiding groove The radius gradually increases from the center of the body to the outside, and a first port and a second port respectively communicate with the spiral guiding groove; and at least one first spoiler unit is disposed on the wall surface of the spiral guiding groove.

根據本發明上述實施所述之螺旋導引槽在該本體的一側形成一開放側,另一側為封閉側,且包括至少一第一蓋體相對該開放側,並蓋合該本體以封閉該開放側,且該第一蓋體具有至少一第二擾流單元對應該螺旋導引槽之開放側,並該第一蓋體具有一軸管連通該第一通口。The spiral guiding groove according to the above embodiment of the present invention has an open side on one side of the body and a closed side on the other side, and includes at least one first cover body opposite to the open side, and covers the body to close The open side, and the first cover has at least one second spoiler unit corresponding to the open side of the spiral guide groove, and the first cover has a shaft tube communicating with the first port.

根據本發明上述實施所述之螺旋導引槽在該本體的兩側分別形成一開放側,且包括一第一蓋體及一第二蓋體,分別相對兩開放側,並蓋合本體以封閉該開放側,且該第一蓋體及第二蓋體分別具有至少一第二擾流單元及至少一第三擾流單元對應該螺旋導引槽之開放側。The spiral guiding groove according to the above embodiment of the present invention has an open side on each side of the body, and includes a first cover body and a second cover body respectively opposite to the two open sides, and covers the body to close The open side, and the first cover body and the second cover body respectively have at least one second spoiler unit and at least one third spoiler unit corresponding to an open side of the spiral guide groove.

根據本發明上述實施所述之螺旋導引槽具有一第一通道,該第一通道係連通該第二通口,且該第一通道經由該第二通口相通該螺旋導引槽與第一通口。The spiral guiding groove according to the above embodiment of the present invention has a first passage, the first passage is connected to the second opening, and the first passage communicates with the spiral guiding slot and the first through the second opening Pass.

本發明之上述目的及其結構與功能上的特性,將依據所附圖式之較佳實施例予以說明。The above object of the present invention, as well as its structural and functional features, will be described in accordance with the preferred embodiments of the drawings.

本發明係提供一種熱交換器結構,圖示係為本發明較佳實施例,請參閱第2、3、4、5圖,本發明係一種熱交換器結構,在本發明之第一較佳實施例,該熱交換器結構係包括一本體2,該本體2具有一中心21(如圖中虛線軸表示),從該中心21朝相對該中心21的外側徑向環繞延伸有一螺旋導引槽22,且該螺旋導引槽22的徑向迴轉半徑從該中心21外側逐漸增加,換言之,就是說前述螺旋導引槽22從該中心21朝相對該本體2內側方向徑向環繞延伸,以使其形成螺旋彎道(即為前述所稱螺旋導引槽22);如參閱第2圖所示該螺旋導引槽22整體形成渦漩的形態。The present invention provides a heat exchanger structure, which is a preferred embodiment of the present invention. Referring to Figures 2, 3, 4, and 5, the present invention is a heat exchanger structure, which is the first preferred embodiment of the present invention. In an embodiment, the heat exchanger structure comprises a body 2 having a center 21 (indicated by a broken line axis in the figure), and a spiral guiding groove extending radially from the center 21 toward the outside of the center 21 22, and the radial radius of gyration of the spiral guiding groove 22 gradually increases from the outer side of the center 21, in other words, the spiral guiding groove 22 extends radially from the center 21 toward the inner side of the body 2, so that It forms a spiral curve (that is, the aforementioned spiral guide groove 22); as shown in Fig. 2, the spiral guide groove 22 integrally forms a form of a spiral.

另者,該本體更具有一第一通口221及一第二通口222,該第一通口221係設在中心21處,該第二通口222則設在中心21的外側,並且前述第一通口221與第二通口222分別連通該螺旋導引槽22。In addition, the body further has a first opening 221 and a second opening 222. The first opening 221 is disposed at the center 21, and the second opening 222 is disposed outside the center 21, and the foregoing The first port 221 and the second port 222 respectively communicate with the spiral guiding groove 22.

前述螺旋導引槽22具有一第一通道225,該第一通道225設在該螺旋導引槽22與該第二通口222之間,且連通該第二通口222,以使一流體(如冷卻液體、水)可從該螺旋導引槽22之第二通口222流入,並透過該螺旋導引槽22的徑向迴轉半徑的離心力,以增強該流體混合,並經該第一通口221將前述流體導引出至一軸管31外。The spiral guiding groove 22 has a first passage 225 disposed between the spiral guiding groove 22 and the second opening 222 and communicating with the second opening 222 to make a fluid ( For example, a cooling liquid, water) may flow from the second port 222 of the spiral guiding groove 22 and pass through a centrifugal force of a radial radius of rotation of the spiral guiding groove 22 to enhance the fluid mixing and pass through the first pass. The port 221 guides the aforementioned fluid out of a shaft tube 31.

即前述流體由該第二通口222流過該第一通道225後,並隨著該螺旋彎道(即前述螺旋導引槽22)朝該第一通口221方向流動,此時的流體會因螺旋彎道之迴轉半徑朝該中心21方向逐漸減小,令流體因為離心力及慣性力在螺旋導引槽22的內壁雙重作用下產生三維的二次流作用(Secondary Flow),也就是Dean渦流(Dean Vortics)的發生,亦即螺旋導引槽22中的流場同時發生兩對稱但繞轉方向相反的渦流(如參閱第4、5圖),這個渦流(第5圖中箭頭所示)在螺旋導引槽22的內壁外側227(遠離中心21的一側)與內壁內側228(靠近中心21的一側)之間流動。That is, the fluid flows from the second port 222 through the first passage 225, and flows along the spiral curve (ie, the spiral guide groove 22) toward the first port 221, and the fluid at this time As the radius of gyration of the spiral curve gradually decreases toward the center 21, the fluid generates a three-dimensional secondary flow (Secondary Flow) due to the centrifugal force and the inertial force acting on the inner wall of the spiral guiding groove 22, that is, Dean The eddy current (Dean Vortics) occurs, that is, the flow field in the spiral guide groove 22 simultaneously has two symmetrical eddies (see Figures 4 and 5), which are shown by the arrows in Fig. 5. ) flows between the outer side wall 227 of the spiral guide groove 22 (the side away from the center 21) and the inner side inner side 228 (the side close to the center 21).

俟,前述流體流經該第一通口221後,會由該軸管31導出至對接的一泵浦(圖中未示),再由該泵浦將流體輸送回到該第二通口222,因此,使得前述流體在螺旋導引槽22內與泵浦間一直持續循環下,以達到極佳的水循環散熱效果。After the fluid flows through the first port 221, the shaft tube 31 is led out to a pump (not shown), and the pump returns the fluid to the second port 222. Therefore, the fluid is continuously circulated in the spiral guiding groove 22 and the pump to achieve an excellent water circulation heat dissipation effect.

此外,本發明主要係藉由該螺旋導引槽22使其內流動的流體,受到二次流的影響而增強流體的混合,以有效提升整體熱交換效率,進而熱傳效果也相對提高。In addition, the present invention mainly enhances the mixing of the fluid by the fluid flowing through the spiral guiding groove 22 by the secondary flow, so as to effectively improve the overall heat exchange efficiency, and the heat transfer effect is relatively improved.

請復參閱第2、3圖所示,該熱交換器結構更包括至少一第一蓋體3,該第一蓋體3相對蓋合該本體2,且前述第一蓋體3具有前述軸管31,該軸管31連通該第一通口221,且該軸管31與第一通口221及該螺旋導引槽22及該第二通口222形成一貫通的狀態;並且,該螺旋導引槽22在該本體2一側形成一開放側223,且該開放側223相對一封閉側224,即前述螺旋導引槽22貫通在本體2的一側,並在貫通側形成所述開放側223,且本體2的另一側不被螺旋導引槽22貫通,因此形成封閉側224相對該開放側223。Referring to FIGS. 2 and 3, the heat exchanger structure further includes at least one first cover 3, the first cover 3 is opposite to the body 2, and the first cover 3 has the aforementioned shaft tube. 31, the shaft tube 31 communicates with the first port 221, and the shaft tube 31 forms a through state with the first port 221 and the spiral guiding groove 22 and the second port 222; and the spiral guide The guiding groove 22 defines an open side 223 on the side of the body 2, and the open side 223 is opposite to a closed side 224, that is, the spiral guiding groove 22 penetrates through one side of the body 2, and the open side is formed on the through side. 223, and the other side of the body 2 is not penetrated by the helical guide groove 22, thus forming the closed side 224 opposite the open side 223.

而前述第一蓋體3封閉該開放側223,就是所述第一蓋體3朝對應前述開放側223方向移動,以使該第一蓋體3蓋合在該本體2上並封閉該開放側223,以構成所述熱交換器結構。The first cover body 3 closes the open side 223, that is, the first cover body 3 moves toward the corresponding open side 223, so that the first cover body 3 covers the body 2 and closes the open side. 223 to constitute the heat exchanger structure.

並且,本發明係應用在對一發熱源散熱,這個發熱源尤指電子設備(如電腦、筆記型電腦、通訊機箱或其他工業電子設備)內的電子元件因為運作所產生的電能物理轉化為熱能的作用,將本體2的一側(即為該本體2相反該開放側223的端面)相對該發熱源,利用該螺旋導引槽22其內的流體對發熱源產生的熱作熱交換後,透過該螺旋導引槽22之徑向迴轉半徑的離心力及慣性力,使在螺旋導引槽22中靠近發熱源一側的流體(這一側的流體溫度較高)與遠離發熱源一側的流體(這一側的流體故溫度相對較低)快速混合一起,以有效增加流體的混合效果,更進而有效達到絕佳熱交換之熱傳效果(或提升流體的熱傳遞效率)。Moreover, the present invention is applied to heat dissipation to a heat source, especially an electronic component in an electronic device (such as a computer, a notebook computer, a communication case, or other industrial electronic device). The electrical energy generated by the operation is physically converted into heat energy. The side of the body 2 (that is, the end surface of the body 2 opposite to the open side 223) is heat-exchanged by the heat generated by the fluid in the spiral guiding groove 22 with respect to the heat source. Through the centrifugal force and the inertial force of the radial radius of gyration of the spiral guiding groove 22, the fluid in the spiral guiding groove 22 close to the heat source side (the temperature of the fluid on the side is higher) and the side away from the heat source side The fluid (the fluid on this side is relatively low in temperature) is rapidly mixed together to effectively increase the mixing effect of the fluid, and more effectively achieve the heat transfer effect of the excellent heat exchange (or increase the heat transfer efficiency of the fluid).

請參閱第6圖所示,係本發明之第二較佳實施例,該較佳實施例大致與前第一較佳實施例相同,在此不另外贅述,其兩者不同處為:前述熱交換器結構更包括一第二蓋體7,該第二蓋體7與前述第一蓋體3相對蓋合該本體2的兩側,並且該螺旋導引槽22在該本體2的兩側分別形成一開放側223,並藉由前述第一、二蓋體3、7分別封閉對應該開放側223。Referring to FIG. 6 , which is a second preferred embodiment of the present invention, the preferred embodiment is substantially the same as the first preferred embodiment, and is not further described herein. The difference between the two is: the aforementioned heat. The switch body structure further includes a second cover body 7 opposite to the first cover body 3 to cover both sides of the body 2, and the spiral guide groove 22 is respectively disposed on two sides of the body 2 An open side 223 is formed, and the corresponding open side 223 is closed by the first and second covers 3, 7 respectively.

請參閱第7、8、9圖所示,係本發明之第三較佳實施例,該較佳實施例大致與前第一較佳實施例相同,其不同處在於:更包括至少一第一擾流單元4,該第一擾流單元4係設置於該螺旋導引槽22之壁面226,在本較佳實施例該第一擾流單元4係設置於其螺旋導引槽22之封閉側224,並且該第一蓋體3相對於螺旋導引槽22之開放側223位置處具有至少一第二擾流單元5,因此在本較佳實施例中,其第一擾流單元4與第二擾流單元5係分別設置於螺旋導引槽22之封閉側224與開放側223,且其第一擾流單元4與第二擾流單元5為凸體設置於螺旋導引槽22之封閉側224與開放側223。Referring to Figures 7, 8, and 9, which are the third preferred embodiment of the present invention, the preferred embodiment is substantially the same as the first preferred embodiment, except that it further includes at least one first The spoiler unit 4 is disposed on the wall surface 226 of the spiral guiding groove 22. In the preferred embodiment, the first spoiler unit 4 is disposed on the closed side of the spiral guiding groove 22 224, and the first cover 3 has at least one second spoiler unit 5 at a position opposite to the open side 223 of the spiral guide groove 22, so in the preferred embodiment, the first spoiler unit 4 The two spoiler units 5 are respectively disposed on the closed side 224 and the open side 223 of the spiral guiding groove 22, and the first spoiler unit 4 and the second spoiler unit 5 are closed and disposed on the spiral guiding groove 22 Side 224 and open side 223.

請同時配合參照第5、9、10圖所示,其熱交換器內之流體係可選擇從第二通口222進入朝第一通口221流出,或者從第一通口221進入朝第二通口222流出,本說明表示流體從第二通口222進入並朝第一通口221經過軸管31流出(如第10圖箭頭所示),也就是說,其流體係從第二通口222進入並流入至螺旋導引槽22的第一通道225,當流體通過第一通道225後即進入徑向迴轉的螺旋導引槽22,並沿著螺旋導引槽22往本體2的中心21流動,由於其流體在繞曲的螺旋導引槽22中流動,使得流體因為慣性力及離心力的雙重作用下產生三維的二次流現象(second flow),也就是Dean渦流(Dean Vortices)的發生,亦即螺旋導引槽22中的流場同時發生兩對稱但繞轉方向相反的渦流,此渦流(第5圖中箭頭所示)在螺旋導引槽22的外側227(遠離中心21的一側)與內側228(靠近中心21的一側)之間流動。Please also refer to the figures 5, 9, and 10, and the flow system in the heat exchanger can be selected to enter the first port 221 from the second port 222, or enter the second port 221. The port 222 flows out, and the description indicates that fluid enters from the second port 222 and flows out through the shaft tube 31 toward the first port 221 (as indicated by the arrow in FIG. 10), that is, the flow system is from the second port. The first passage 225 entering and flowing into the spiral guide groove 22 enters the radially-rotating spiral guide groove 22 when the fluid passes through the first passage 225, and proceeds to the center 21 of the body 2 along the spiral guide groove 22. The flow, due to the fluid flowing in the curved spiral guiding groove 22, causes the fluid to generate a three-dimensional secondary flow due to the inertial force and the centrifugal force, that is, the occurrence of Dean Vortices. That is, the flow field in the spiral guiding groove 22 simultaneously generates two symmetrical eddy currents in opposite directions, and the eddy current (shown by an arrow in FIG. 5) is on the outer side 227 of the spiral guiding groove 22 (a far from the center 21) The side flows between the side 228 and the side 228 (the side close to the center 21).

同時在螺旋導引槽22內的流體沿著該壁面226與第一蓋體3上之第一擾流單元4與第二擾流單元5在螺旋導引槽22內的螺旋流道流動,以在螺旋導引槽22中產生渦流(Swirling flow),提高螺旋導引槽22內對流場之熱對流係數,而其第一擾流單元4與第二擾流單元5於螺旋導引槽22中也會使流體產生兩對稱但繞轉方向相反的渦流,此渦流(第5圖中箭頭所示)在螺旋導引槽22的外側227(遠離中心21的一側)與內側228(靠近中心21的一側)之間流動,以產生具有提高紊流強度之熱傳強化效果,又該第一擾流單元4與第二擾流單元5所導引出之渦流與Dean vortices同向,因此其流體可藉由第一擾流單元4與第二擾流單元5所導因出之二次流,亦可增強螺旋彎道之渦流強度,進一步提高此熱交換器之熱傳效果。At the same time, the fluid in the spiral guiding groove 22 flows along the wall surface 226 and the spiral flow path of the first spoiler unit 4 and the second spoiler unit 5 on the first cover 3 in the spiral guiding groove 22 to A Swirling flow is generated in the spiral guiding groove 22 to increase the thermal convection coefficient of the convection field in the spiral guiding groove 22, and the first spoiler unit 4 and the second spoiler unit 5 are in the spiral guiding groove 22 The fluid is also caused to produce two symmetrical vortices that are opposite in direction of rotation, as shown by the arrows in Figure 5, on the outer side 227 of the helical guide groove 22 (on the side away from the center 21) and on the inner side 228 (near the center 21). Flowing between one side) to produce a heat transfer enhancement effect with increased turbulence intensity, and the eddy currents guided by the first spoiler unit 4 and the second spoiler unit 5 are in the same direction as the Dean vortices, so that The secondary flow caused by the first spoiler unit 4 and the second spoiler unit 5 can also enhance the eddy current intensity of the spiral curve and further improve the heat transfer effect of the heat exchanger.

承上所述,相較習知本發明的結構提供流體沿著螺旋導引槽22及第一擾流單元4與第二擾流單元5流動,並使流體產生Dean渦流(Dean vortices)、渦流、層流及紊流的強度增加,不僅增加螺旋導引槽22內流體混合的次數,且進而提高流體的熱傳遞能力及熱性能係數。As described above, the structure of the present invention provides fluid flow along the helical guide groove 22 and the first spoiler unit 4 and the second spoiler unit 5, and causes the fluid to generate Dean vortices, eddy currents. The increase in the strength of the laminar flow and the turbulent flow not only increases the number of fluid mixing in the spiral guide groove 22, but also increases the heat transfer capability and thermal coefficient of the fluid.

請參照第11、12圖所示係為本發明第四較佳實施例,其大部分元件與連結關係與功用與第三較佳實施例相同,在此不對相同部分贅述,該較佳實施例與第三較佳實施例不同處為一螺旋導引槽61在本體2的兩側分別形成一開放側611、612,一第一蓋體3(與第三較佳實施例相同)及一第二蓋體7分別相對兩開放側611、612,並對應蓋合該本體2,進而封閉兩開放側611、612,該第一蓋體3具有一軸管31連通第一通口221,且其第一蓋體3與第二蓋體7分別具有第二擾流單元5與第三擾流單元8,亦可增強螺旋彎道之渦流強度,進一步提高此熱交換器之熱傳效果。The fourth embodiment of the present invention is the same as the third preferred embodiment. The components and functions of the present invention are the same as those of the third preferred embodiment. The preferred embodiment is not described herein. Different from the third preferred embodiment, a spiral guiding groove 61 defines an open side 611, 612 on both sides of the body 2, a first cover 3 (same as the third preferred embodiment) and a first The two cover bodies 7 are respectively opposite to the two open sides 611 and 612, and correspondingly cover the body 2, thereby closing the two open sides 611 and 612. The first cover body 3 has a shaft tube 31 communicating with the first through port 221, and The cover body 3 and the second cover body 7 respectively have a second spoiler unit 5 and a third spoiler unit 8, which can also enhance the eddy current intensity of the spiral curve and further improve the heat transfer effect of the heat exchanger.

請參照第13、14圖所示,係為本發明第五較佳實施例,其大部分元件與連結關係與功用與第三較佳實施例相同,在此不對相同部分贅述,該較佳實施例與第三較佳實施例不同處為該第一擾流單元4與第二擾流單元5係以凹槽形式設置於螺旋導引槽22之封閉側224與開放側223,因此其流體可藉由其第一擾流單元4與第二擾流單元5所導因出之二次流,亦可增強螺旋彎道之渦流強度,進而提高此熱交換器之熱傳效果。Referring to Figures 13 and 14, the fifth preferred embodiment of the present invention is the same as the third preferred embodiment, and the same components are not described herein. The difference from the third preferred embodiment is that the first spoiler unit 4 and the second spoiler unit 5 are disposed in a groove form on the closed side 224 and the open side 223 of the spiral guiding groove 22, so that the fluid can be The secondary flow caused by the first spoiler unit 4 and the second spoiler unit 5 can also enhance the eddy current intensity of the spiral curve, thereby improving the heat transfer effect of the heat exchanger.

綜上所述,本發明所提供之一種「熱交換器結構」,確符合准予專利之要件,爰依法提出專利申請,祈請 惠予專利,實為感禱。In summary, the "heat exchanger structure" provided by the present invention does meet the requirements for granting patents, and the patent application is filed according to law, praying for the patent, which is actually a prayer.

惟以上所述者,僅係本發明之較佳可行之實施例而已,舉凡利用本發明上述之方法、形狀、構造、裝置所為之變化,皆應包含於本案之權利範圍內。It is to be understood that the above-described methods, shapes, configurations, and devices of the present invention are intended to be included within the scope of the present invention.

2...本體2. . . Ontology

21...中心twenty one. . . center

22...螺旋導引槽twenty two. . . Spiral guide groove

221...第一通口221. . . First port

222...第二通口222. . . Second port

223...開放側223. . . Open side

224...封閉側224. . . Closed side

225...第一通道225. . . First channel

226...壁面226. . . Wall

227...外側227. . . Outside

228...內側228. . . Inside

3...第一蓋體3. . . First cover

31...軸管31. . . Shaft tube

4...第一擾流單元4. . . First spoiler unit

5...第二擾流單元5. . . Second spoiler unit

61...螺旋導引槽61. . . Spiral guide groove

611、612...開放側611, 612. . . Open side

7...第二蓋體7. . . Second cover

8...第三擾流單元8. . . Third spoiler unit

第1圖係習知之水冷式散熱結構分解示意圖;Figure 1 is a schematic exploded view of a conventional water-cooled heat dissipation structure;

第2圖係本發明之第一較佳實施例之分解示意圖;Figure 2 is an exploded perspective view of a first preferred embodiment of the present invention;

第3圖係本發明之第一較佳實施例之組合示意圖;Figure 3 is a schematic view showing the combination of the first preferred embodiment of the present invention;

第4圖係本發明之第一較佳實施例之螺旋導引槽局部立體透視圖;Figure 4 is a partial perspective perspective view of the spiral guiding groove of the first preferred embodiment of the present invention;

第5圖係為第4圖之截面流體產生Dean渦流之示意圖;Figure 5 is a schematic diagram showing the Dean vortex generated by the cross-section fluid of Figure 4;

第6圖係本發明之第二較佳實施例之分解示意圖;Figure 6 is an exploded perspective view of a second preferred embodiment of the present invention;

第7圖為本發明第三較佳實施例之立體分解示意圖;Figure 7 is a perspective exploded view of a third preferred embodiment of the present invention;

第8圖為本發明第三較佳實施例之立體組合示意圖;Figure 8 is a perspective view of a third preferred embodiment of the present invention;

第9圖為本發明第三較佳實施例之立體剖視示意圖;Figure 9 is a perspective cross-sectional view showing a third preferred embodiment of the present invention;

第10圖為本發明第三較佳實施例之實施示意圖;Figure 10 is a schematic view showing the implementation of a third preferred embodiment of the present invention;

第11圖為本發明第四較佳實施例之立體分解示意圖;Figure 11 is a perspective exploded view of a fourth preferred embodiment of the present invention;

第12圖為本發明第四較佳實施例之立體剖視示意圖;Figure 12 is a perspective cross-sectional view showing a fourth preferred embodiment of the present invention;

第13圖為本發明第五較佳實施例之立體分解示意圖;Figure 13 is a perspective exploded view of a fifth preferred embodiment of the present invention;

第14圖為本發明第五較佳實施例之立體剖視示意圖。Figure 14 is a perspective cross-sectional view showing a fifth preferred embodiment of the present invention.

2...本體2. . . Ontology

21...中心twenty one. . . center

22...螺旋導引槽twenty two. . . Spiral guide groove

221...第一通口221. . . First port

222...第二通口222. . . Second port

223...開放側223. . . Open side

224...封閉側224. . . Closed side

225...第一通道225. . . First channel

3...第一蓋體3. . . First cover

31...軸管31. . . Shaft tube

Claims (16)

一種熱交換器結構,包括:一本體,具有一中心,及一螺旋導引槽從該中心維持呈曲率半徑變化朝相對該中心的外側徑向環繞延伸,且該螺旋導引槽的徑向迴轉半徑從本體中心往外側逐漸增加,及一第一通口與一第二通口分別連通該螺旋導引槽,使螺旋導引槽內之流場同時發生兩對稱但繞轉方向相反的渦流;及至少一第一擾流單元,係設於螺旋導引槽之壁面,且沿著螺旋導引槽呈放射狀設置,使流體產生兩對稱但繞轉方向相反的渦流。 A heat exchanger structure comprising: a body having a center, and a spiral guiding groove extending from the center to have a radius of curvature change radially extending toward an outer side opposite the center, and a radial rotation of the spiral guiding groove The radius gradually increases from the center of the body to the outside, and a first port and a second port respectively communicate with the spiral guiding groove, so that the flow field in the spiral guiding groove simultaneously has two symmetrical eddy currents in opposite directions; And at least one first spoiler unit is disposed on the wall surface of the spiral guiding groove and radially disposed along the spiral guiding groove to cause the fluid to generate two symmetrical eddy currents with opposite directions of rotation. 如請求項1所述之熱交換器結構,其中該第一擾流單元為凸體。 The heat exchanger structure of claim 1, wherein the first spoiler unit is a convex body. 如請求項1所述之熱交換器結構,其中該第一擾流單元為凹槽。 The heat exchanger structure of claim 1, wherein the first spoiler unit is a groove. 如請求項1所述之熱交換器結構,其中該螺旋導引槽在該本體的一側形成有一開放側,另一側為封閉側。 The heat exchanger structure of claim 1, wherein the spiral guiding groove has an open side on one side of the body and a closed side on the other side. 如請求項1所述之熱交換器結構,其中該螺旋導引槽具有一第一通道連通該第二通口。 The heat exchanger structure of claim 1, wherein the spiral guiding groove has a first passage communicating with the second opening. 如請求項4所述之熱交換器結構,更包括至少一第一蓋體相對該開放側,並蓋合該本體以封閉該開放側,且該第一蓋體具有一軸管連通該第一通口。 The heat exchanger structure of claim 4, further comprising at least one first cover opposite to the open side, and covering the body to close the open side, and the first cover has a shaft tube communicating with the first pass mouth. 如請求項6所述之熱交換器結構,其中該第一蓋體具有至少一第二擾流單元對應該螺旋導引槽之開放側。 The heat exchanger structure of claim 6, wherein the first cover has at least one second spoiler unit corresponding to an open side of the spiral guide groove. 如請求項7所述之熱交換器結構,其中該第二擾流單元為凸體。 The heat exchanger structure of claim 7, wherein the second spoiler unit is a convex body. 如請求項7所述之熱交換器結構,其中該第二擾流單元為凹槽。 The heat exchanger structure of claim 7, wherein the second spoiler unit is a groove. 如請求項1所述之熱交換器結構,其中該螺旋導引槽在該本體的兩側分別形成一開放側。 The heat exchanger structure of claim 1, wherein the spiral guiding groove forms an open side on each side of the body. 如請求項10所述之熱交換器結構,更包括一第一蓋體及一第二蓋體,分別相對兩開放側,並蓋合本體以封閉該開放側。 The heat exchanger structure according to claim 10, further comprising a first cover body and a second cover body respectively opposite to the two open sides, and covering the body to close the open side. 如請求項11所述之熱交換器結構,其中該第一蓋體與第二蓋體分別具有至少一第二擾流單元及至少一第三擾流單元對應該螺旋導引槽之開放側。 The heat exchanger structure of claim 11, wherein the first cover and the second cover respectively have at least one second spoiler unit and at least one third spoiler unit corresponding to an open side of the spiral guide groove. 如請求項12所述之熱交換器結構,其中該第二擾流單元及第三擾流單元為凸體。 The heat exchanger structure of claim 12, wherein the second spoiler unit and the third spoiler unit are convex. 如請求項12所述之熱交換器結構,其中該第二擾流單元及第三擾流單元為凹槽。 The heat exchanger structure of claim 12, wherein the second spoiler unit and the third spoiler unit are grooves. 如請求項12所述之熱交換器結構,其中該第一擾流單元為凸體,而該第三擾流單元為凹槽。 The heat exchanger structure of claim 12, wherein the first spoiler unit is a convex body and the third spoiler unit is a groove. 如請求項12所述之熱交換器結構,其中該第一擾流單元為凹槽,而該第三擾流單元為凸體。 The heat exchanger structure of claim 12, wherein the first spoiler unit is a groove and the third spoiler unit is a protrusion.
TW099100907A 2010-01-14 2010-01-14 Heat exchanger structure TWI400421B (en)

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