US20110168360A1 - Heat exchanger - Google Patents

Heat exchanger Download PDF

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Publication number
US20110168360A1
US20110168360A1 US12/710,299 US71029910A US2011168360A1 US 20110168360 A1 US20110168360 A1 US 20110168360A1 US 71029910 A US71029910 A US 71029910A US 2011168360 A1 US2011168360 A1 US 2011168360A1
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United States
Prior art keywords
heat exchanger
spiral guiding
guiding trough
cover
port
Prior art date
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Abandoned
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US12/710,299
Inventor
Shyy-Woei Chang
Kuei-feng Chiang
Yu-Min Lin
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Asia Vital Components Co Ltd
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Asia Vital Components Co Ltd
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Assigned to ASIA VITAL COMPONENTS CO., LTD. reassignment ASIA VITAL COMPONENTS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CHANG, SHYY-WOEI, MR., CHIANG, KUEI-FENG, MR., LIN, YU-MIN, MR.
Publication of US20110168360A1 publication Critical patent/US20110168360A1/en
Abandoned legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/04Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a heat exchanger, and in particular to a heat exchanger with an increased thermal-conducting efficiency.
  • a common solution is to install a heat-dissipating fan in the electronic apparatus to generate a compulsive airflow for heat dissipation.
  • the amount of airflow generated by the heat-dissipating fan is so limited that the heat-dissipating effect and the degree of lowering the temperature are restricted. Therefore, another solution is proposed, in which a water-cooling heat-dissipating device is directly adhered on a heat-generating element (such as a central processing unit, MPU, south bridge chip, north bridge chip or the like).
  • a pump introduces a cooling liquid from a reservoir into the water-cooling heat-dissipating device, so that the cooling liquid and the water-cooling heat-dissipating device absorb the heat generated by the heat-generating element. Then, the cooling liquid is exhausted from an outlet port of the water-cooling heat-dissipating device to a heat-dissipating module. After the cooling liquid is cooled in the heat-dissipating module, the cooling liquid is transferred to the reservoir again for circulation. With the circulation of the cooling liquid, the temperature of the heat-generating element can be reduced, thereby maintaining the normal operation of the heat-generating element.
  • the aforesaid water-cooling heat-dissipating device can generate a better heat-dissipating effect than that of air cooling, another problem is generated. That is, since the water-cooling heat-dissipating device abuts one surface of the heat-generating element (i.e. heat-absorbing surface), only the lowest layer of the cooling liquid in the water-cooling device is effective in exchanging the heat with the heat-absorbing surface. Further, the cooling liquid stayed in the water-cooling heat-dissipating device is so short that the cooling liquid is rapidly exhausted from the outlet port even not absorbing enough heat. As a result, the water-cooling effect is insufficient, which also affects the thermal-conducting effect and the heat-dissipating effect.
  • FIG. 1 showing a conventional water-cooling heat-dissipating structure, which includes a base 10 and a cover 11 .
  • the cover 11 has an accommodating space 111 , an inlet pipe 112 and an outlet pipe 113 .
  • the inlet pipe 112 and the outlet pipe 113 are formed on two opposite sides of the cover 11 in communication with the accommodating space 111 .
  • the base 10 is covered by the cover 11 .
  • the base 10 is provided with a plurality of heat-dissipating fins 13 protruding the accommodating space 111 of the cover 11 .
  • a plurality of one-way channels 131 is formed between the heat-dissipating fins 13 and corresponds to the inlet pipe 112 and the outlet pipe 113 respectively.
  • the plurality of one-way channels 131 guides the cooling liquid to pass through the heat-dissipating fins 13 , thereby exchanging the heat with the heat-dissipating fins 13 and achieving a better heat-dissipating effect.
  • the heat-dissipating fins 13 increases the total heat-dissipating area, so that the cooling fluid can flow through and stay in the plurality of one-way channels 131 for a longer period of time, thereby generating a better heat-exchanging effect.
  • the one-way channels 131 are formed between the fins, a larger frictional resistance is generated between the fins and the cooling liquid.
  • the cooling liquid can be driven at a smaller flowing rate.
  • the coefficient of thermal convection is low while the coefficient of pressure loss is high, which affects the amount of thermal convection and thermal conduction between the cooling liquid and the heat-dissipating fins 13 . Therefore, the whole heat-exchanging efficiency, the thermal-conducting effect and in turn the heat-dissipating effect of the whole structure are insufficient.
  • the conventional heat-dissipating structure has problems as follows;
  • the amount of the cooling liquid in the base is so small that the thermal-conducting effect is poor
  • the present inventor proposes a novel heat exchanger based on his expert experience and delicate researches.
  • an objective of the present invention is to provide a heat exchanger having a spiral guiding trough, whereby the thermal-conducting capacity and the coefficient of thermal performance can be increased.
  • the present invention is to provide a heat exchanger, which includes: a body having a center and a spiral guiding trough extending spirally and outwardly from the center to an outside of the center, a radius of the spiral guiding trough increasing gradually from the center to the outside of the center; and a first port and a second port in communication with the spiral guiding trough respectively.
  • a fluid can be mixed sufficiently in the spiral guiding trough, thereby achieving an excellent thermal-conducting effect.
  • the present invention further provides a heat exchanger, which includes: a body having a center and a spiral guiding trough extending spirally and outwardly from the center to an outside of the center, a radius of the spiral guiding trough increasing gradually from the center to the outside of the center; a first port and a second port in communication with the spiral guiding trough respectively; and at least one first turbulent unit provided on a wall surface of the spiral guiding trough.
  • the spiral guiding trough is formed with an open side on one side of the body and a closed end on the other side.
  • At least one first cover is provided on the open side for covering the body to seal the open side.
  • the first cover has at least one second turbulent unit to correspond to the open side of the spiral guiding trough.
  • the first cover has a tube in communication with the first port.
  • the spiral guiding trough is formed with an open side respectively on both sides of the body.
  • a first cover and a second cover are provided to correspond to two open sides and cover the body to seal the open sides.
  • the first cover and the second cover have at least one second turbulent unit and at least one third turbulent unit to correspond to the open sides of the spiral guiding trough respectively.
  • the spiral guiding trough has a first channel in communication with the second port.
  • the first channel is in communication with the spiral guiding trough and the second port by means of the first channel.
  • FIG. 1 is an exploded view showing a conventional water-cooling heat-dissipating assembly
  • FIG. 2 is an exploded view showing a first embodiment of the present invention
  • FIG. 3 is an assembled view showing the first embodiment of the present invention.
  • FIG. 4 is an partially perspective view showing the spiral guiding trough of the first embodiment of the present invention.
  • FIG. 5 is a schematic view showing Dean vortices generated by a fluid in the cross section of the spiral guiding trough in FIG. 4 ;
  • FIG. 6 is an exploded view showing a second embodiment of the present invention.
  • FIG. 7 is an exploded perspective view showing a third embodiment of the present invention.
  • FIG. 8 is an assembled perspective view showing the third embodiment of the present invention.
  • FIG. 9 is a cross-sectional perspective view showing the third embodiment of the present invention.
  • FIG. 10 is a schematic view showing the operating state of the third embodiment of the present invention.
  • FIG. 11 is an exploded perspective view showing a fourth embodiment of the present invention.
  • FIG. 12 is a cross-sectional perspective view showing the fourth embodiment of the present invention.
  • FIG. 13 is an exploded perspective view showing a fifth embodiment of the present invention.
  • FIG. 14 is a cross-sectional perspective view showing the fifth embodiment of the present invention.
  • the present invention is directed to a heat exchanger.
  • the drawings show several preferred embodiments of the present invention. Please refer to FIGS. 2 to 5 .
  • the heat exchanger of a first embodiment of the present invention includes a body 2 having a center 21 as shown by a dotted axis.
  • a spiral guiding trough 22 extends spirally and outwardly from the center 21 to the outside of the center 21 .
  • the radius of the spiral guiding trough 22 increases gradually from the center 21 to the outside of the center 21 .
  • the spiral guiding trough 22 extends spirally toward the inner wall of the body 2 , thereby forming a spiral channel (i.e. the spiral guiding trough 22 ).
  • FIG. 2 shows the spiral guiding trough 22 .
  • the body 2 further has a first port 221 and a second port 222 .
  • the first port 221 is provided in the center 21
  • the second port 222 is provided at the outside of the center 21 .
  • the first port 221 and the second port 222 are in communication with the spiral guiding trough 22 .
  • the spiral guiding trough 22 has a first channel 225 between the spiral guiding trough 22 and the second port 222 .
  • the first channel 225 is in communication with the second port 222 , so that a fluid (such as cooling liquid or water) can be introduced into the second port 222 of the spiral guiding trough 22 .
  • a centrifugal force generated by the spiral guiding trough can be used to enhance the mixing of the fluid.
  • the fluid flows through the first port 221 to exit a tube 31 .
  • the fluid in the spiral guiding trough 22 will generate a secondary flow (i.e. Dean vortices) due to a centrifugal force and an inertia force exerted by the inner walls of the spiral guiding trough 22 . That is, the fluid field in the spiral guiding trough 22 will generate two vortices that are symmetrical to each other with opposite rotating directions (as shown in FIGS. 4 and 5 ).
  • the vortices indicated by the arrows in FIG. 5 flow between an outer side 227 (the side away from the center 21 ) and an inner side 228 (the side close to the center 21 ) of the spiral guiding trough 22 .
  • the fluid flows through the first port 221 , the fluid flows to a pump (not shown) via the tube 31 . Then, the fluid is driven by the pump to return to the second port 222 .
  • the fluid continuously circulates in the spiral guiding trough 22 and the pump, thereby achieving an excellent heat-dissipating effect.
  • the heat exchanger further includes at least one first cover 3 .
  • the first cover 3 covers the body 2 .
  • the first cover 3 has the tube 31 in communication with the first port 221 .
  • the tube 31 , the first port 221 , the spiral guiding trough 22 and the second port 222 are in communication with each other.
  • the spiral guiding trough 22 is formed on one side of the body 2 with an open side 223 .
  • a closed side 224 is formed opposite to the open side 223 .
  • the spiral guiding trough 22 penetrates one side of the body 2 and thus the open side 223 is formed on the penetrating side. The other side of the body 2 is not penetrated by the spiral guiding trough 22 .
  • the closed side 224 is formed opposite to the open side 223 .
  • the first cover 3 closes the open side 223 . That is, the first cover 3 moves toward the open side 223 , so that the first cover 3 can cover the body 2 to close the open side 223 , thereby forming the heat exchanger.
  • the present invention can be applied to the heat dissipation of a heat-generating source (such as a computer, notebook computer, communication housing or other industrial electronic apparatus).
  • a heat-generating source such as a computer, notebook computer, communication housing or other industrial electronic apparatus.
  • the electronic elements in the heat-generating source convert electricity into heat energy.
  • One side of the body 2 i.e. the surface of the body 2 opposite to the open side 223 ) is positioned to face the heat-generating source.
  • the portion of the fluid in the spiral guiding trough 22 close to the heat-generating source (with a higher temperature) and the portion of the fluid in the spiral guiding trough 22 (with a lower temperature) can be mixed sufficiently, thereby achieving an excellent heat-exchanging effect of the heat exchanger (or enhancing the thermal-conducting efficiency of the fluid).
  • FIG. 6 shows a second embodiment of the present invention.
  • the second embodiment is substantially the same as the first embodiment, and thus the redundant description is omitted thereto.
  • the heat exchanger further includes a second cover 7 .
  • the second cover 7 and the first cover 3 cover both sides of the body 2 respectively.
  • the spiral guiding trough 22 are formed on both sides of the body 2 with an open side 223 respectively.
  • the first cover 3 and the second cover 7 are used to close the open sides 223 respectively.
  • FIGS. 7 to 9 show a third embodiment of the present invention.
  • the third embodiment is substantially the same as the first embodiment, and thus the redundant description is omitted thereto.
  • the heat exchanger further includes at least one first turbulent unit 4 provided on a wall surface 226 of the spiral guiding trough 22 .
  • the first turbulent unit 4 is provided on the closed side 224 of the spiral guiding trough 22 .
  • the first cover 3 has at least one second turbulent unit 5 facing the open side 223 of the spiral guiding trough 22 .
  • the first turbulent unit 4 and the second turbulent unit 5 are provided on the closed side 224 and the open side 223 of the spiral guiding trough 22 respectively.
  • the first turbulent unit 4 and the second turbulent unit 5 are protrusions provided on the closed side 224 and the open side 223 of the spiral guiding trough 22 respectively.
  • the fluid can enter the heat exchanger via the second port 222 and exit via the first port 221 .
  • the fluid can enter the heat exchanger via the first port 222 and exit via the second port 221 .
  • the fluid enters the heat exchanger via the second port 222 , flows toward the first port 221 and exits the heat exchanger via the tube 31 (as indicated by the arrows of FIG. 10 ). That is to say, the fluid flows into the heat exchanger via the second port 222 and into the first channel 225 of the spiral guiding trough 22 .
  • the fluid After the fluid flows through the first channel 225 , it enters the spiral guiding trough 22 and flows toward the center 21 of the body 2 along the spiral guiding trough 22 . Since the fluid generates a three-dimensional secondary flow (i.e. dean vortices) due to the inertia force and the centrifugal force, the fluid field in the spiral guiding trough 22 generates two vortices that are symmetrical to each other with two opposite rotating directions. The vortices (indicated by the arrows in FIG. 5 ) flow between the outer side 227 (the side away from the center 21 ) and the inner side 228 (the side close to the center 21 ).
  • a three-dimensional secondary flow i.e. dean vortices
  • the fluid in the spiral guiding trough 22 flows along the first turbulent unit 4 and the second turbulent unit 5 of the first cover 3 , thereby generating a swirling flow in the spiral guiding trough 22 to increase the coefficient of thermal convection therein.
  • the first turbulent unit 4 and the second turbulent unit 5 also generate two vortices that are symmetrical to each other with opposite rotating directions in the spiral guiding trough 22 .
  • the vortices (as indicated by the arrows in FIG. 5 ) flow between the outer side 227 (the side away from the center 21 ) and the inside side 227 (the side close to the center 21 ) in the spiral guiding trough 22 , thereby enhancing the strength of turbulence and thermal-conducting effect.
  • the vortices caused by the first turbulent unit 4 and the second turbulent unit 5 are of the same directions as that of Dean vortices.
  • the secondary flow caused by the first turbulent unit 4 and the second turbulent unit 5 also increases strength of turbulence in the spiral guiding trough 22 and the thermal-conducting effect of the heat exchanger.
  • the present invention allows the fluid to flow along the first turbulent unit 4 and the second turbulent unit 5 of the spiral guiding trough 22 , thereby increasing the strength of Dean vortices, swirling flow, turbulent flow, and laminar flow. Not only the fluid can be mixed in the spiral guiding trough 22 fore more times, but also the thermal-conducting capacity and the coefficient of thermal performance of the fluid can be increased.
  • FIGS. 11 and 12 show the fourth embodiment of the present invention.
  • the most components of the fourth embodiment are the same as those of the third embodiment, and thus the redundant description is omitted for clarity.
  • the only difference between the fourth embodiment and the third embodiment lies in that a spiral guiding trough 61 is formed on both sides of the body 2 with an open side 611 , 612 respectively.
  • a first cover 3 (the same as that of the third embodiment) and a second cover 7 face the open sides 611 and 612 respectively to cover the body 2 and close the open sides 611 , 612 .
  • the first cover 3 has a tube 31 in communication with the first port 221 .
  • the first cover 3 and the second cover 7 have the second turbulent unit 5 and the third turbulent unit 8 respectively, thereby increasing the strength of turbulent flow in the spiral guiding trough and the thermal-conducting effect of the heat exchanger.
  • FIGS. 13 and 14 show the fifth embodiment of the present invention.
  • the most components of the fifth embodiment are the same as those of the third embodiment, and thus the redundant description is omitted for clarity.
  • the only difference between the fifth embodiment and the third embodiment lies in that the first turbulent unit 4 and the second turbulent unit 5 are formed into troughs provided on the closed side 224 and the open side 223 of the spiral guiding trough 22 respectively.
  • the secondary flow caused by the first turbulent unit 4 and the second turbulent unit 5 can increase the strength of turbulent flow in the spiral guiding trough and the thermal-conducting effect in the heat exchanger.

Abstract

A heat exchanger includes a body having a center and a spiral guiding trough extending spirally and outwardly from the center toward an outside of the center. The radius of the spiral guiding trough increases gradually from the center toward the outside of the center. A first port and a second port are in communication with the spiral guiding trough respectively. With the combination of the spiral guiding trough and the body, the fluid can be sufficiently mixed in the spiral guiding trough, thereby achieving an excellent thermal-conducting effect.

Description

  • This application claims the priority benefit of Taiwan patent application number 099100907 filed on Jan. 14, 2010.
  • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention
  • The present invention relates to a heat exchanger, and in particular to a heat exchanger with an increased thermal-conducting efficiency.
  • 2. Description of Prior Art
  • With the continuous advancement of electronic information technology, electronic apparatuses (such as computers, notebook computer, communication housings, or the like) are getting more popular and widely used in our daily life. However, since electronic elements in the electronic apparatuses generate waste heat during their operation at high speed, the waste heat ma be accumulated in the electronic apparatuses if the waste heat cannot be dissipated to the outside of the electronic apparatuses. As a result, the temperature of the electronic elements inside the electronic apparatus increases continuously, which causes the electronic elements to suffer damage or deteriorate the efficiency in operation due to its high temperature.
  • In order to improve the heat dissipation of the above-mentioned electronic apparatus, a common solution is to install a heat-dissipating fan in the electronic apparatus to generate a compulsive airflow for heat dissipation. However, the amount of airflow generated by the heat-dissipating fan is so limited that the heat-dissipating effect and the degree of lowering the temperature are restricted. Therefore, another solution is proposed, in which a water-cooling heat-dissipating device is directly adhered on a heat-generating element (such as a central processing unit, MPU, south bridge chip, north bridge chip or the like). A pump introduces a cooling liquid from a reservoir into the water-cooling heat-dissipating device, so that the cooling liquid and the water-cooling heat-dissipating device absorb the heat generated by the heat-generating element. Then, the cooling liquid is exhausted from an outlet port of the water-cooling heat-dissipating device to a heat-dissipating module. After the cooling liquid is cooled in the heat-dissipating module, the cooling liquid is transferred to the reservoir again for circulation. With the circulation of the cooling liquid, the temperature of the heat-generating element can be reduced, thereby maintaining the normal operation of the heat-generating element.
  • Although the aforesaid water-cooling heat-dissipating device can generate a better heat-dissipating effect than that of air cooling, another problem is generated. That is, since the water-cooling heat-dissipating device abuts one surface of the heat-generating element (i.e. heat-absorbing surface), only the lowest layer of the cooling liquid in the water-cooling device is effective in exchanging the heat with the heat-absorbing surface. Further, the cooling liquid stayed in the water-cooling heat-dissipating device is so short that the cooling liquid is rapidly exhausted from the outlet port even not absorbing enough heat. As a result, the water-cooling effect is insufficient, which also affects the thermal-conducting effect and the heat-dissipating effect.
  • Please refer to FIG. 1 showing a conventional water-cooling heat-dissipating structure, which includes a base 10 and a cover 11. The cover 11 has an accommodating space 111, an inlet pipe 112 and an outlet pipe 113. The inlet pipe 112 and the outlet pipe 113 are formed on two opposite sides of the cover 11 in communication with the accommodating space 111. The base 10 is covered by the cover 11. The base 10 is provided with a plurality of heat-dissipating fins 13 protruding the accommodating space 111 of the cover 11. A plurality of one-way channels 131 is formed between the heat-dissipating fins 13 and corresponds to the inlet pipe 112 and the outlet pipe 113 respectively. Thus, when a cooling liquid is introduced into the accommodating space 111 from the inlet pipe 112, the plurality of one-way channels 131 guides the cooling liquid to pass through the heat-dissipating fins 13, thereby exchanging the heat with the heat-dissipating fins 13 and achieving a better heat-dissipating effect.
  • In the aforesaid heat-dissipating structure, the heat-dissipating fins 13 increases the total heat-dissipating area, so that the cooling fluid can flow through and stay in the plurality of one-way channels 131 for a longer period of time, thereby generating a better heat-exchanging effect. However, since the one-way channels 131 are formed between the fins, a larger frictional resistance is generated between the fins and the cooling liquid. Thus, with the same pump of a certain power, the cooling liquid can be driven at a smaller flowing rate. As a result, the coefficient of thermal convection is low while the coefficient of pressure loss is high, which affects the amount of thermal convection and thermal conduction between the cooling liquid and the heat-dissipating fins 13. Therefore, the whole heat-exchanging efficiency, the thermal-conducting effect and in turn the heat-dissipating effect of the whole structure are insufficient.
  • According to the above, the conventional heat-dissipating structure has problems as follows;
  • (1) the amount of the cooling liquid in the base is so small that the thermal-conducting effect is poor;
  • (2) only a lower layer of the cooling liquid is brought into thermal contact with a heat source, so that the thermal-conducting effect is poor;
  • (3) poor heat-exchanging efficiency; and
  • (4) poor heat-dissipating effect.
  • In view of the above, the present inventor proposes a novel heat exchanger based on his expert experience and delicate researches.
  • SUMMARY OF THE INVENTION
  • In order to solve the above problems, an objective of the present invention is to provide a heat exchanger having a spiral guiding trough, whereby the thermal-conducting capacity and the coefficient of thermal performance can be increased.
  • In order to achieve the above objective, the present invention is to provide a heat exchanger, which includes: a body having a center and a spiral guiding trough extending spirally and outwardly from the center to an outside of the center, a radius of the spiral guiding trough increasing gradually from the center to the outside of the center; and a first port and a second port in communication with the spiral guiding trough respectively. With the spiral guiding trough, a fluid can be mixed sufficiently in the spiral guiding trough, thereby achieving an excellent thermal-conducting effect.
  • The present invention further provides a heat exchanger, which includes: a body having a center and a spiral guiding trough extending spirally and outwardly from the center to an outside of the center, a radius of the spiral guiding trough increasing gradually from the center to the outside of the center; a first port and a second port in communication with the spiral guiding trough respectively; and at least one first turbulent unit provided on a wall surface of the spiral guiding trough.
  • According to the present invention, the spiral guiding trough is formed with an open side on one side of the body and a closed end on the other side. At least one first cover is provided on the open side for covering the body to seal the open side. The first cover has at least one second turbulent unit to correspond to the open side of the spiral guiding trough. The first cover has a tube in communication with the first port.
  • According to the present invention, the spiral guiding trough is formed with an open side respectively on both sides of the body. A first cover and a second cover are provided to correspond to two open sides and cover the body to seal the open sides. The first cover and the second cover have at least one second turbulent unit and at least one third turbulent unit to correspond to the open sides of the spiral guiding trough respectively.
  • According to the present invention, the spiral guiding trough has a first channel in communication with the second port. The first channel is in communication with the spiral guiding trough and the second port by means of the first channel.
  • The above objectives and structural and functional features of the present invention will be described in more detail with reference to preferred embodiment thereof shown in the accompanying drawings
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an exploded view showing a conventional water-cooling heat-dissipating assembly;
  • FIG. 2 is an exploded view showing a first embodiment of the present invention;
  • FIG. 3 is an assembled view showing the first embodiment of the present invention;
  • FIG. 4 is an partially perspective view showing the spiral guiding trough of the first embodiment of the present invention;
  • FIG. 5 is a schematic view showing Dean vortices generated by a fluid in the cross section of the spiral guiding trough in FIG. 4;
  • FIG. 6 is an exploded view showing a second embodiment of the present invention;
  • FIG. 7 is an exploded perspective view showing a third embodiment of the present invention;
  • FIG. 8 is an assembled perspective view showing the third embodiment of the present invention;
  • FIG. 9 is a cross-sectional perspective view showing the third embodiment of the present invention;
  • FIG. 10 is a schematic view showing the operating state of the third embodiment of the present invention;
  • FIG. 11 is an exploded perspective view showing a fourth embodiment of the present invention;
  • FIG. 12 is a cross-sectional perspective view showing the fourth embodiment of the present invention;
  • FIG. 13 is an exploded perspective view showing a fifth embodiment of the present invention; and
  • FIG. 14 is a cross-sectional perspective view showing the fifth embodiment of the present invention.
  • DETAILED DESCRIPTION OF THE INVENTION
  • The present invention is directed to a heat exchanger. The drawings show several preferred embodiments of the present invention. Please refer to FIGS. 2 to 5. The heat exchanger of a first embodiment of the present invention includes a body 2 having a center 21 as shown by a dotted axis. A spiral guiding trough 22 extends spirally and outwardly from the center 21 to the outside of the center 21. The radius of the spiral guiding trough 22 increases gradually from the center 21 to the outside of the center 21. In other words, the spiral guiding trough 22 extends spirally toward the inner wall of the body 2, thereby forming a spiral channel (i.e. the spiral guiding trough 22). FIG. 2 shows the spiral guiding trough 22.
  • The body 2 further has a first port 221 and a second port 222. The first port 221 is provided in the center 21, and the second port 222 is provided at the outside of the center 21. The first port 221 and the second port 222 are in communication with the spiral guiding trough 22.
  • The spiral guiding trough 22 has a first channel 225 between the spiral guiding trough 22 and the second port 222. The first channel 225 is in communication with the second port 222, so that a fluid (such as cooling liquid or water) can be introduced into the second port 222 of the spiral guiding trough 22. When the fluid flows through the spiral guiding trough 22, a centrifugal force generated by the spiral guiding trough can be used to enhance the mixing of the fluid. Then, the fluid flows through the first port 221 to exit a tube 31.
  • That is, after the fluid flows through the first channel 225 via the second port 222, the fluid will flow toward the first port 221 along the spiral guiding trough 22. At this time, since the radius of the spiral guiding trough 22 decreases gradually toward the center 21, the fluid in the spiral guiding trough 22 will generate a secondary flow (i.e. Dean vortices) due to a centrifugal force and an inertia force exerted by the inner walls of the spiral guiding trough 22. That is, the fluid field in the spiral guiding trough 22 will generate two vortices that are symmetrical to each other with opposite rotating directions (as shown in FIGS. 4 and 5). The vortices indicated by the arrows in FIG. 5 flow between an outer side 227 (the side away from the center 21) and an inner side 228 (the side close to the center 21) of the spiral guiding trough 22.
  • After the fluid flows through the first port 221, the fluid flows to a pump (not shown) via the tube 31. Then, the fluid is driven by the pump to return to the second port 222. Thus, the fluid continuously circulates in the spiral guiding trough 22 and the pump, thereby achieving an excellent heat-dissipating effect.
  • By means of the spiral guiding trough 22, the fluid flowing therein will be sufficiently mixed due to the secondary flow, thereby increasing the heat-exchanging efficiency and the thermal-conducting effect.
  • Please refer to FIGS. 2 and 3. The heat exchanger further includes at least one first cover 3. The first cover 3 covers the body 2. The first cover 3 has the tube 31 in communication with the first port 221. The tube 31, the first port 221, the spiral guiding trough 22 and the second port 222 are in communication with each other. The spiral guiding trough 22 is formed on one side of the body 2 with an open side 223. A closed side 224 is formed opposite to the open side 223. The spiral guiding trough 22 penetrates one side of the body 2 and thus the open side 223 is formed on the penetrating side. The other side of the body 2 is not penetrated by the spiral guiding trough 22. With this arrangement, the closed side 224 is formed opposite to the open side 223.
  • The first cover 3 closes the open side 223. That is, the first cover 3 moves toward the open side 223, so that the first cover 3 can cover the body 2 to close the open side 223, thereby forming the heat exchanger.
  • The present invention can be applied to the heat dissipation of a heat-generating source (such as a computer, notebook computer, communication housing or other industrial electronic apparatus). The electronic elements in the heat-generating source convert electricity into heat energy. One side of the body 2 (i.e. the surface of the body 2 opposite to the open side 223) is positioned to face the heat-generating source. After the fluid in the spiral guiding trough 22 exchanges the heat with the heat-generating source, the portion of the fluid in the spiral guiding trough 22 close to the heat-generating source (with a higher temperature) and the portion of the fluid in the spiral guiding trough 22 (with a lower temperature) can be mixed sufficiently, thereby achieving an excellent heat-exchanging effect of the heat exchanger (or enhancing the thermal-conducting efficiency of the fluid).
  • Please refer to FIG. 6, which shows a second embodiment of the present invention. The second embodiment is substantially the same as the first embodiment, and thus the redundant description is omitted thereto. The only difference between the second embodiment and the first embodiment lies in that the heat exchanger further includes a second cover 7. The second cover 7 and the first cover 3 cover both sides of the body 2 respectively. The spiral guiding trough 22 are formed on both sides of the body 2 with an open side 223 respectively. The first cover 3 and the second cover 7 are used to close the open sides 223 respectively.
  • Please refer to FIGS. 7 to 9, which show a third embodiment of the present invention. The third embodiment is substantially the same as the first embodiment, and thus the redundant description is omitted thereto. The only difference between the third embodiment and the first embodiment lies in that the heat exchanger further includes at least one first turbulent unit 4 provided on a wall surface 226 of the spiral guiding trough 22. In the present embodiment, the first turbulent unit 4 is provided on the closed side 224 of the spiral guiding trough 22. The first cover 3 has at least one second turbulent unit 5 facing the open side 223 of the spiral guiding trough 22. Thus, in the present embodiment, the first turbulent unit 4 and the second turbulent unit 5 are provided on the closed side 224 and the open side 223 of the spiral guiding trough 22 respectively. The first turbulent unit 4 and the second turbulent unit 5 are protrusions provided on the closed side 224 and the open side 223 of the spiral guiding trough 22 respectively.
  • Please refer to FIGS. 5, 9, and 10, the fluid can enter the heat exchanger via the second port 222 and exit via the first port 221. Alternatively, the fluid can enter the heat exchanger via the first port 222 and exit via the second port 221. In the present embodiment, the fluid enters the heat exchanger via the second port 222, flows toward the first port 221 and exits the heat exchanger via the tube 31 (as indicated by the arrows of FIG. 10). That is to say, the fluid flows into the heat exchanger via the second port 222 and into the first channel 225 of the spiral guiding trough 22. After the fluid flows through the first channel 225, it enters the spiral guiding trough 22 and flows toward the center 21 of the body 2 along the spiral guiding trough 22. Since the fluid generates a three-dimensional secondary flow (i.e. dean vortices) due to the inertia force and the centrifugal force, the fluid field in the spiral guiding trough 22 generates two vortices that are symmetrical to each other with two opposite rotating directions. The vortices (indicated by the arrows in FIG. 5) flow between the outer side 227 (the side away from the center 21) and the inner side 228 (the side close to the center 21).
  • At the same time, the fluid in the spiral guiding trough 22 flows along the first turbulent unit 4 and the second turbulent unit 5 of the first cover 3, thereby generating a swirling flow in the spiral guiding trough 22 to increase the coefficient of thermal convection therein. The first turbulent unit 4 and the second turbulent unit 5 also generate two vortices that are symmetrical to each other with opposite rotating directions in the spiral guiding trough 22. The vortices (as indicated by the arrows in FIG. 5) flow between the outer side 227 (the side away from the center 21) and the inside side 227 (the side close to the center 21) in the spiral guiding trough 22, thereby enhancing the strength of turbulence and thermal-conducting effect. The vortices caused by the first turbulent unit 4 and the second turbulent unit 5 are of the same directions as that of Dean vortices. Thus, the secondary flow caused by the first turbulent unit 4 and the second turbulent unit 5 also increases strength of turbulence in the spiral guiding trough 22 and the thermal-conducting effect of the heat exchanger.
  • According to the above, in comparison with prior art, the present invention allows the fluid to flow along the first turbulent unit 4 and the second turbulent unit 5 of the spiral guiding trough 22, thereby increasing the strength of Dean vortices, swirling flow, turbulent flow, and laminar flow. Not only the fluid can be mixed in the spiral guiding trough 22 fore more times, but also the thermal-conducting capacity and the coefficient of thermal performance of the fluid can be increased.
  • Please refer to FIGS. 11 and 12, which show the fourth embodiment of the present invention. The most components of the fourth embodiment are the same as those of the third embodiment, and thus the redundant description is omitted for clarity. The only difference between the fourth embodiment and the third embodiment lies in that a spiral guiding trough 61 is formed on both sides of the body 2 with an open side 611, 612 respectively. A first cover 3 (the same as that of the third embodiment) and a second cover 7 face the open sides 611 and 612 respectively to cover the body 2 and close the open sides 611, 612. The first cover 3 has a tube 31 in communication with the first port 221. The first cover 3 and the second cover 7 have the second turbulent unit 5 and the third turbulent unit 8 respectively, thereby increasing the strength of turbulent flow in the spiral guiding trough and the thermal-conducting effect of the heat exchanger.
  • Please refer to FIGS. 13 and 14, which show the fifth embodiment of the present invention. The most components of the fifth embodiment are the same as those of the third embodiment, and thus the redundant description is omitted for clarity. The only difference between the fifth embodiment and the third embodiment lies in that the first turbulent unit 4 and the second turbulent unit 5 are formed into troughs provided on the closed side 224 and the open side 223 of the spiral guiding trough 22 respectively. Thus, the secondary flow caused by the first turbulent unit 4 and the second turbulent unit 5 can increase the strength of turbulent flow in the spiral guiding trough and the thermal-conducting effect in the heat exchanger.
  • Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.

Claims (23)

1. A heat exchanger, including:
a body having a center and a spiral guiding trough extending spirally and outwardly from the center toward an outside of the center, a radius of the spiral guiding trough increasing gradually from the center toward the outside of the center, and
a first port and a second port being in communication with the spiral guiding trough respectively.
2. The heat exchanger according to claim 1, wherein the first port is positioned in the center, and the second port is positioned in the outside of the center.
3. The heat exchanger according to claim 2, wherein the spiral guiding trough has a first channel provided between the spiral guiding trough and the second channel in communication with the second port.
4. The heat exchanger according to claim 1, further including at least one first cover for covering the body, the first cover having a tube in communication with the first port.
5. The heat exchanger according to claim 2, further including at least one first cover for covering the body, the first cover having a tube in communication with the first port.
6. The heat exchanger according to claim 4, wherein the spiral guiding trough is formed on one side of the body with an open side, the first cover seals the open side.
7. The heat exchanger according to claim 1, further including a first cover and a second cover for covering both sides the body, the spiral guiding trough is formed on both sides of the body with an open side respectively, the first cover and the second cover seal the open side respectively.
8. A heat exchanger, including:
a body having a center and a spiral guiding trough extending spirally and outwardly from the center toward an outside of the center, a radius of the spiral guiding trough increasing gradually from the center toward the outside of the center, a first port and a second port being in communication with the spiral guiding trough respectively; and
at least one first turbulent unit provided on a wall surface of the spiral guiding trough.
9. The heat exchanger according to claim 8, wherein the first turbulent unit is a protrusion.
10. The heat exchanger according to claim 8, wherein the first turbulent unit is a trough.
11. The heat exchanger according to claim 8, wherein the spiral guiding trough is formed with an open side on one side of the body, and a closed side on the other side.
12. The heat exchanger according to claim 8, wherein the spiral guiding trough has a first channel in communication with the second port.
13. The heat exchanger according to claim 11, further including at least one first cover facing the open side for covering the body to seal the open side, the first cover having a tube in communication with the first port.
14. The heat exchanger according to claim 13, wherein the first cover has at least one second turbulent unit corresponding to the open side of the spiral guiding trough.
15. The heat exchanger according to claim 14, wherein the second turbulent unit is a protrusion.
16. The heat exchanger according to claim 14, wherein the second turbulent unit is a trough.
17. The heat exchanger according to claim 8, wherein the spiral guiding trough is formed on both sides of the body with an open side respectively.
18. The heat exchanger according to claim 17, further including a first cover and a second cover facing the two open sides for covering the body to seal the open sides.
19. The heat exchanger according to claim 18, wherein the first cover and the second cover have at least one second turbulent unit and at least one third turbulent unit corresponding to the open sides of the spiral guiding trough respectively.
20. The heat exchanger according to claim 19, wherein the second turbulent unit and the third turbulent unit are protrusions.
21. The heat exchanger according to claim 19, wherein the second turbulent unit and the third turbulent unit are troughs.
22. The heat exchanger according to claim 19, wherein the first turbulent unit is a protrusion, and the third turbulent unit is a trough.
23. The heat exchanger according to claim 19, wherein the first turbulent unit is a trough, and the third turbulent unit is a protrusion.
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150191352A1 (en) * 2014-01-07 2015-07-09 Advanced Cooling Technologies, Inc. Fuel reforming system and process
EP2728987A3 (en) * 2012-10-31 2017-04-12 Deere & Company Cooling apparatus for an electrical substrate
TWI619918B (en) * 2016-08-31 2018-04-01 Asia Vital Components Co Ltd Cooling water drain device and water cooling module thereof
US10557391B1 (en) * 2017-05-18 2020-02-11 Advanced Cooling Technologies, Inc. Incineration system and process
US20200079178A1 (en) * 2018-09-06 2020-03-12 Robert Bosch Gmbh Sensor unit of a vehicle
CN114152132A (en) * 2021-11-22 2022-03-08 南京理工大学 Micro-channel heat exchanger based on dean vortex
US11326836B1 (en) * 2020-10-22 2022-05-10 Asia Vital Components Co., Ltd. Vapor/liquid condensation system
US11644254B2 (en) 2018-09-04 2023-05-09 Ovh Thermal transfer device having a fluid conduit

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6397932B1 (en) * 2000-12-11 2002-06-04 Douglas P. Calaman Liquid-cooled heat sink with thermal jacket
US6666262B1 (en) * 1999-12-28 2003-12-23 Alstom (Switzerland) Ltd Arrangement for cooling a flow-passage wall surrounding a flow passage, having at least one rib feature
US6814132B1 (en) * 1999-04-16 2004-11-09 Kankyo Co., Ltd. Heat exchanger, a method for producing the same and a dehumidifier containing the same
US20050011635A1 (en) * 2003-07-15 2005-01-20 Industrial Technology Research Institute Cold plate with vortex generator
US6867973B2 (en) * 2003-03-05 2005-03-15 Shyy-Woei Chang Heat dissipation device with liquid coolant
US20060266498A1 (en) * 2005-05-27 2006-11-30 Tay-Jian Liu Liquid cooling system suitable for removing heat from electronic components
US7204299B2 (en) * 2004-11-09 2007-04-17 Delphi Technologies, Inc. Cooling assembly with sucessively contracting and expanding coolant flow
US20080029251A1 (en) * 2006-08-02 2008-02-07 Alps Electric Co., Ltd. Water-cooled heat sink and water-cooled system

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9903367D0 (en) * 1999-09-20 1999-09-20 Alfa Laval Ab A spiral heat exchanger
JP3979143B2 (en) * 2002-03-27 2007-09-19 株式会社日立製作所 Cooling device for information processing equipment
TWI281850B (en) * 2006-03-14 2007-05-21 Yen Sun Technology Corp Water-cooled heat-dissipating device
CN101153607B (en) * 2006-09-30 2010-11-10 宝宁科技股份有限公司 Water pump device of radiating system
WO2009104426A1 (en) * 2008-02-21 2009-08-27 日本軽金属株式会社 Method of manufacturing heat transfer plate

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6814132B1 (en) * 1999-04-16 2004-11-09 Kankyo Co., Ltd. Heat exchanger, a method for producing the same and a dehumidifier containing the same
US6666262B1 (en) * 1999-12-28 2003-12-23 Alstom (Switzerland) Ltd Arrangement for cooling a flow-passage wall surrounding a flow passage, having at least one rib feature
US6397932B1 (en) * 2000-12-11 2002-06-04 Douglas P. Calaman Liquid-cooled heat sink with thermal jacket
US6867973B2 (en) * 2003-03-05 2005-03-15 Shyy-Woei Chang Heat dissipation device with liquid coolant
US20050011635A1 (en) * 2003-07-15 2005-01-20 Industrial Technology Research Institute Cold plate with vortex generator
US7204299B2 (en) * 2004-11-09 2007-04-17 Delphi Technologies, Inc. Cooling assembly with sucessively contracting and expanding coolant flow
US20060266498A1 (en) * 2005-05-27 2006-11-30 Tay-Jian Liu Liquid cooling system suitable for removing heat from electronic components
US20080029251A1 (en) * 2006-08-02 2008-02-07 Alps Electric Co., Ltd. Water-cooled heat sink and water-cooled system

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2728987A3 (en) * 2012-10-31 2017-04-12 Deere & Company Cooling apparatus for an electrical substrate
US20150191352A1 (en) * 2014-01-07 2015-07-09 Advanced Cooling Technologies, Inc. Fuel reforming system and process
US9595726B2 (en) * 2014-01-07 2017-03-14 Advanced Cooling Technologies, Inc. Fuel reforming system and process
TWI619918B (en) * 2016-08-31 2018-04-01 Asia Vital Components Co Ltd Cooling water drain device and water cooling module thereof
US10557391B1 (en) * 2017-05-18 2020-02-11 Advanced Cooling Technologies, Inc. Incineration system and process
US11644254B2 (en) 2018-09-04 2023-05-09 Ovh Thermal transfer device having a fluid conduit
US20200079178A1 (en) * 2018-09-06 2020-03-12 Robert Bosch Gmbh Sensor unit of a vehicle
US11326836B1 (en) * 2020-10-22 2022-05-10 Asia Vital Components Co., Ltd. Vapor/liquid condensation system
CN114152132A (en) * 2021-11-22 2022-03-08 南京理工大学 Micro-channel heat exchanger based on dean vortex

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