TW201020494A - Structure of heat exchanger - Google Patents

Structure of heat exchanger Download PDF

Info

Publication number
TW201020494A
TW201020494A TW099100907A TW99100907A TW201020494A TW 201020494 A TW201020494 A TW 201020494A TW 099100907 A TW099100907 A TW 099100907A TW 99100907 A TW99100907 A TW 99100907A TW 201020494 A TW201020494 A TW 201020494A
Authority
TW
Taiwan
Prior art keywords
heat exchanger
center
spiral
exchanger structure
cover
Prior art date
Application number
TW099100907A
Other languages
Chinese (zh)
Other versions
TWI400421B (en
Inventor
Shi-Wei Zhang
gui-feng Jiang
Original Assignee
Asia Vital Components Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Vital Components Co Ltd filed Critical Asia Vital Components Co Ltd
Priority to TW099100907A priority Critical patent/TWI400421B/en
Priority to US12/710,299 priority patent/US20110168360A1/en
Publication of TW201020494A publication Critical patent/TW201020494A/en
Application granted granted Critical
Publication of TWI400421B publication Critical patent/TWI400421B/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12Elements constructed in the shape of a hollow panel, e.g. with channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D9/00Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall
    • F28D9/04Heat-exchange apparatus having stationary plate-like or laminated conduit assemblies for both heat-exchange media, the media being in contact with different sides of a conduit wall the conduits being formed by spirally-wound plates or laminae
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention provides a structure of heat exchanger which comprises a main body having a center; a spiral guiding groove radially encircling and extending from the center toward the outer end opposite to the center, and the radial radius of gyration of the spiral guiding groove is gradually increased from the center toward the outer end; and a first opening and a second opening respectively connected with the spiral guiding groove. With the invented design combining the spiral guiding groove and the main body, the fluid-mixing effect of fluids flowing in the spiral guiding groove is greatly enhanced, so as to effectively provide good heat-transferring effect.

Description

201020494 六、發明說明: 【發明所屬之技術領域】 本發明係有關於一種熱交換器,尤指一種提高熱傳效率之熱 交換器結構。 '' 【先前技術】201020494 VI. Description of the Invention: [Technical Field] The present invention relates to a heat exchanger, and more particularly to a heat exchanger structure which improves heat transfer efficiency. '' 【Prior technology】

隨著電子資訊科技的曰益進步,使得電子設備(如電腦、筆記 型電腦、通IfL機箱...等)的使用日趨普及且應用更為廣泛;然而, 電子=備在高速運作電子元件會產生賴,触無法及 時將刖述廢熱排㈣子設斜,極容祕這些廢熱雜在電子設 備内,使電子設_部及其㈣子元件的溫度不斷地攀升,進而 導致電子元件目過糾發纽障、損壞或運作鱗降低等情況。 而各知為了改善上述散熱問題,一般較常見都是在電子設備 内裝設-散熱風扇來_散熱,但因其散熱風扇之氣流量受限, 使其散熱效果難以提升,且降溫幅度也受限的情況,所以業者便 尋求另-種解決方式,即使用—水冷式散熱裝置直接貼附在發熱 兀件上,如(中央處理器⑽)、顧、南、北橋晶片等),並由〆 泵浦自儲水槽⑽冷卻㈣導人到水冷式散熱裝置中,使冷卻液 體與該水冷讀絲倾魏耕魏的録作 液體再由水冷=賴裝置的―出相流出至—散_組,再經由 冷部後再送__水槽’軌藉由冷卻_循環來幫助散熱, 降低發熱it件溫度’使其發熱元件能順利運作。 雖所述水冷式散熱裝置能改善细氣流散熱的問題, 但部延伸㈣-烟題,即水冷式散絲置緊貼餘發執元件的 端面(即為吸熱面)僅針在同—處_係,使得在水料裝置内 3 201020494 的冷卻液體僅有-最下層之流體部份與吸熱面產生熱交換作用, 且所述冷卻液體滯留在水冷式散熱裝置之時間過短,以導致冷卻 液體尚未吸收足夠的熱量,便立即快速的由前述出水口導出^斤 以俾使水冷魏大打折扣贼其_絲不佳, 極不彰顯。 7瑕热双禾 請參閱第丨麟示’ f知技術揭露—種水冷式散熱結構係 包3 一底座10及一蓋體⑴其令該蓋體11具有-容置空間⑴、 :進水管m及-出水管113,前述進水管112及出水管113分別 形成在該蓋體11的兩相對侧上,且與容置空間⑴彼此相連通, H倾蓋體u相蓋合—起’且底座ig上配設有複數散 =片(圖13,該等散熱鰭片13包覆在該蓋體u的容置空 ^ 1内,且其彼此間形成複數單向流道131,並分別與所述進水 =m及出水管113相對應,所以當―冷卻液體由該進水管ιΐ2 空間⑴内後,透過複數單向流道131引導冷卻液 果 體触細#13作熱賴,財效提升散 然而’雖上述之散熱結構中,可_該等散熱鰭片13之設立, 藉以增加散熱面積,以使冷卻液體流過複數單向流道i3i時可 =冷卻液體於該等流道之停滞時間以便帶走較多之熱源以作熱 L、麼:由t因單向流道131係以多數鰭片之間隔形成,致使流 擦阻力增加,於定泵功率之條件下,冷卻流體流速低,熱 之伴隨高壓損絲,進祕響冷卻液體自散鐘片13 對(,,、傳量,因此’俾使整體的熱交換效率及埶傳效果明顯不 201020494 以上所述’習知技術具有下列缺點: 1·冷卻液體於底座過短,致使熱傳效果不彰; 2·冷卻液龍下雜料之聽_,致熱傳效果不佳; 3. 熱交換效率不佳; 4. 散熱效果不佳。 =疋’有鑑於上述制品所衍生的各項缺點,本案之發明人 ^竭其^,以從事該行業多年之經驗,潛心、研究加蘭新改良, ,、於成功研發完成本件「熱交換器結構」t,實為一具功效 之創作。 曰 【發明内容】 爰此,為解決上述f知技術之缺點,本發明之主要目的,係 ^一種具有螺卿⑽設狀敝換輯構,令賴旋導引槽 提尚熱傳遞能力及熱性能係數者。 一為達述之目的’本發明係提供一種熱交換器結構其包括: φ 一本體,該本體具有—中心,及從該中心朝相對該中心的外侧徑 向環繞延伸之-螺旋導引槽,且賴旋導引槽的徑向迴轉半徑^ 侧逐漸増加’及一第一通口與一第二通口分別連通該 、 ,亦此可藉由本發明之螺旋導引槽的設計,俾使能夠 增強在該螺旋導引槽其内流動的一流體混合效果,更進而有效達 到絕佳的熱傳效果者。 本發明係另提供一種熱交換器結構,包括:一本體,具有一 及螺%導引槽從該中心朝相對該中心的外侧後向環繞延 伸’且該螺旋導引槽的徑向迴轉半徑從本體巾心往外側逐漸增 5 201020494 加及帛通口與一第二通口分別連通該螺旋導引槽;及至少 一第一擾流單元,係設於螺旋料槽之壁面。 根據本發明上述實施所述之螺旋導引槽在該本體的—侧形成 一開放侧,另-側為封_,且包括至少—第—蓋體相對該開放 側,並蓋合該本體以賴該耻側,城第—蓋體具有至少一第 二擾流單元對應該職導引槽之職侧,第—蓋體具 管連通該第一通口。 ,根據本發明上述實施所述之螺旋導引槽在該本體的兩側分別 形成-開放側,且包括-第—蓋體及—第二蓋體,分別相對兩開 放侧’並蓋合本體以封閉該開放侧,且該第—蓋體及第二蓋體分 別具有至少H流單元及至少_第三擾流單元對應該螺旋導 引槽之開姑你丨。 根據本發明上述實施所述之螺旋導引槽具有一第一通道,咳 第-通道係連通該第二通Π,且該第—通道經由該第二通^相^ 該螺旋導引槽與第一通口。 本發明之上述目的及其結構與功能上的雜,將依據所附圖 式之較佳實施例予以說明。 【實施方式】 本發明係提供-賴錢賭構’ _係為本發 例,請參Μ 2、3、4、5圖,本發鴨_種敏鋪結構,在本 發明之第_較佳實補’該熱交換躲構係包括-本體2,該本體 2具有一中心21 (如®中虛線軸表示)’從該中心21她對該中 心2i的外侧徑向環繞延伸有-螺旋導引槽22,且該螺旋導⑽ 22的徑向迴轉半徑從該中心21外側逐漸增加,換言之, 201020494 述螺旋導引槽22從該中心21朝; 延伸,以使舞㈣㈣、心朝 本體2 _方向徑向環繞 間m、二 料所稱職導㈣22);如參 閱第2圖所補螺旋導⑽22整_成繼的形態。 另者,該本體更具有一第一通口 221及-第二通口 222,該第 一通口 221係設在中心21處,該第二通Π 222則設在中心21的 外側,並且前述第一通口 2?1盥贫 , I仏與第二通口 222分別連通該職導 引槽22。 ❿ 前述螺旋導引㈣具有-第-通道225,該第一通道哪設 在該螺旋導引槽22與該第二通口 222之間,且連通該第二通口 222 ’以使-流體(如冷卻液體、水)可從該螺旋導引槽22之第二 通口 222流入,並透過該螺旋導引槽烈的徑向迴轉半徑的離心 力’以增強該流體混合,並經該第一通口 221將前述流體導引出 至一軸管31外。 即刖述流體由該第二通口 222流過該第-通道225後,並隨 著該螺旋弯道(即前述職導引槽22)朝該第一通口 221方向流 ❹動,此_趣會關卿道之迴轉半徑繼巾^ 21方向逐漸減 小,令流體因為離心力及慣性力在螺旋導引槽22的内壁雙重作用 下產生三維的二次流作用(Secondary Flow),也就是Dean渦流 (Dean Vortics)的發生,亦即螺旋導引槽22中的流場同時發生兩 對稱但繞轉方向相反的屑流(如參閱第4、5圖),這個渦流(第5 圖中箭頭所示)在螺旋導引槽22的内壁外侧227 (遠離中心21的 一侧)與内壁内側228 (靠近中心21的一侧)之間流動。 俟,前述流體流經該第一通口 221後,會由該軸管31導出至 對接的一泵浦(圖中未示),再由該泵浦將流體輸送回到該第二通 7 201020494 口 222 ’因此’使得前述流體在螺旋導引槽22内與泵浦間一直持 續循環下’以達到極佳的水德環散熱效果。 此外,本發明主要係藉由該螺旋導引槽22使其内流動的流 體’受到二次流的影響㈣強流體的混合,以有效提升整體熱交 換效率,進而熱傳效果也相對提高。 請復參閱第2、3圖所示’該熱交換器結構更包括至少一第一 蓋體3 ’該第-蓋體3相對蓋合該本體2,且前述第-蓋體3具有 前述轴管31,該軸管31連通該第一通口 221,且該轴管31與第 一通口 221及該螺旋導引槽22及該第二通口 222形成一貫通的狀 態,並且,該螺旋導引槽22在該本體2 —側形成一開放側223, 且該開放側223相對一封閉側224,即前述螺旋導引槽22貫通在 本體2的一側’並在貫通側形成所述開放側223,且本體2的另一 側不被螺旋導引槽22貫通,因此形成封閉侧224相對該開放侧 223。 而前述第一蓋體3封閉該開放侧223,就是所述第一蓋體3 朝對應前述開放侧223方向移動,以使該第一蓋體3蓋合在該本 體2上並封閉該開放侧223,以構成所述熱交換器結構。 並且,本發明係應用在對一發熱源散熱,這個發熱源尤指電 子設備(如電腦、筆記型電腦、通訊機箱或其他工業電子設備)内 的電子元件因為運作所產生的電能物理轉化為熱能的作用,將本 體2的一側(即為該本體2相反該開放側223的端面)相對該發熱 源,利用該螺旋導引槽22其内的流體對發熱源產生的熱作熱交換 後,透過該螺旋導引槽22之徑向迴轉半徑的離心力及慣性力,使 在螺旋導引槽22中靠近發熱源-侧的趙(這—侧的流體溫度較 201020494 ' 高)與遠離發熱源一侧的流體(這一側的流體故溫度相對較低) 快速混合一起,以有效增加流體的混合效果,更進而有效達到絕 佳熱交換之熱傳效果(或提升流體的熱傳遞效率)。 請參閱第6圖所示,係本發明之第二較佳實施例,該較佳實 施例大致與前第一較佳實施例相同,在此不另外贅述,其兩者不 同處為:前述熱交換器結構更包括一第二蓋體7,該第二蓋體7與 前述第一蓋體3相對蓋合該本體2的兩侧,並且該螺旋導引槽22 _ 在該本體2的兩侧分別形成一開放侧223,並藉由前述第一、二蓋 體3、7分別封閉對應該開放侧223。 請參閱第7、8、9圖所示,係本發明之第三較佳實施例,該 較佳實施例大致與前第一較佳實施例相同,其不同處在於:更包括 至少一第一擾流單元4 ’該第一擾流單元4係設置於該螺旋導引槽 22之壁面226,在本較佳實施例該第一擾流單元4係設置於其螺 旋導引槽22之封閉侧224,並且該第一蓋體3相對於螺旋導引槽 22之開放侧223位置處具有至少一第二擾流單元5,因此在本較 Ο 佳實施例中,其第一擾流單元4與第二擾流單元5係分別設置於 螺旋導引槽22之封閉侧224與開放側223,且其第一擾流單元4 與第二擾流單元5為凸體設置於螺旋導引槽22之封閉侧泣4與開 放侧223。 請同時配合參照第5、9、1〇圖所示,其熱交換器内之流體係 可選擇從第二通口 222進入朝第一通口 221流出,或者從第一通 口 221進入朝第一通口 222、流出’本說明表示流體從第二通口怨 進入並朝第-通口 221經過軸管31流出(如第1()圖箭頭所示), 也就是說’其流體係從第二通口 222進入並流入至螺旋導引槽^ 9 201020494 的第一通道225’當流體通過第一通道225後即進入徑向迴轉的螺 旋導引槽22,並沿著螺旋導引槽22往本體2的中心21流動,由 於其流體在繞曲的螺旋導引槽22中流動,使得流體因為慣性力及 離心力的雙重作用下產生三維的二次流現象(se⑽d fl〇w),也 就是Dean渦流(Dean Vortices)的發生,亦即螺旋導引槽22中 的流場同時發生兩對稱但繞轉方向相反的渦流,此渦流(第5圖 中箭頭所示)在螺旋導引槽22的外侧227 (遠離中心21的一侧) 與内侧228 (靠近中心21的一側)之間流動。 同時在螺旋導引槽22内的流體沿著該壁面226與第一蓋體3 上之第-擾流單兀4與第二擾流單元5在螺旋導引槽22内的螺旋 流道流動’以在螺旋導引槽22 t產生渴流(Swirling flow),提 高螺旋導引槽22⑽流場之熱對流係數,而其第一擾流單元4與 第二擾流單元5於螺旋導引槽22中也會使流體產生兩對稱但繞轉 方向相反的麟’此麟(第5圖巾箭頭所示)在職導引槽 的外側227 (遠離中心21的一側)與内侧微(靠近中心21的一 侧)之間流動,以產生具有提高奈流強度之熱傳強化效果,又該 第-擾流單元4與第二錢單元5所導引出之喊與— vortices同向’耻魏體可藉由第—擾流單元4與第二擾流單 π 5所導因出之二次流’亦可增強螺旋彎道之渦流強度進一步 提高此熱交換器之熱傳效果。 承上所述’她習知本發_結構提供趣沿著職導引槽 以及第-擾流單元4與第二擾流單元5流動,並使流體產生^ » l (Dean vortices)、屬流、層流及紊流的強度增加,不僅增 加螺旋導引槽22喊體混合的次數,且轴提高_的熱傳遞能 201020494 力及熱性能係數。 請參照第11、12圖所示係為本發明第四較佳實施例,其大部 分元件與連結關係與功用與第三較佳實施例相同,在此不對相同 部分贅述’該較佳實施例與第三較佳實施例不同處為一螺旋導引 槽61在本體2的兩侧分別形成一開放侧611、612,一第一蓋體3 (與第三較佳實施例相同)及一第二蓋體7分別相對兩開放側 611、612,並對應蓋合該本體2,進而封閉兩開放側6U、612, 該第一蓋體3具有一軸管31連通第一通口 221,且其第一蓋體3 與第二蓋體7分別具有第二擾流單元5與第三擾流單元8,亦可增 強螺旋f道之麻強度,進-步提高此熱交換器之熱傳效果。曰 請參照第13、14圖所示,係為本發明第五較佳實施例,其大 部分元件與連結_與_與第三較佳實施術目同,在此不對相 同部分贅述’嫌佳實施倾第三健實關不同處為該第一擾 流單元4與第二擾流單元5係以凹槽形式設置於螺旋導引槽^之 封閉侧224與開放侧223,因此其流體可藉由其第一擾流單元* 與第二獄單元5所導因m亦可職微彎道之渦流 強度,進而提高此熱交換器之熱傳效果。 綜上所述,本發_提供之—種「熱交飢 t利之要件,銳法提料财請,轉惠予料,實為感 惟以上所述者,僅係本翻之較佳可行之實施例而已,舉凡 利用本發明上述之方法、形 人 卜 ^狀、構造、裝置所為之變化,皆應包 3於本案之權利範圍内。 201020494 【圖式簡單說明】' 第1圖係習知之水冷式散熱結構分解示意圖; ' 第2圖係本伽之第—較佳實補之分解示意圖; 第3圖係本義之第—較佳實細之組合料圖; =圖縣翻之第—較佳實施例之螺旋料槽局部立體透 第5圖係為第4圖之截面流體產生_渦流之示意圖; 第6圖係本發明之第二較佳實施例之分解示意圖; 第7圖為本發明第三較佳實施例之立體分解示意圖; ❹ 第8圖為本發明第三較佳實細之讀組合示意圖; 第9圖為本發明第三較佳實施例之立體剖視示意圖,· 第10圖為本發明第三較佳實施例之實施示意圖; 第11圖為本發明第四較佳實施例之立體分解示意圖; 第12圖為本發明第四較佳實施例之立體剖視示意圖; 第13圖為本發明第五較佳實蘭之立體分解示意圖; 第14圖為本發明第五較佳實施例之立體剖視示意圖。 【主要元件符號說明】 本體2 中心21 螺旋導引槽22 第一通口 221 第二通口 222 開放侧223 12 201020494 封閉侧224 第一通道225 壁面226 外侧227 内侧228 第一蓋體3 轴管31 第一擾流單元4 第二擾流單元5 螺旋導引槽61 開放侧611、612 第二蓋體7 第三擾流單元8With the advancement of electronic information technology, the use of electronic devices (such as computers, notebook computers, and IfL chassis, etc.) has become more popular and widely used. However, electronic devices are required to operate electronic components at high speeds. It is impossible to promptly set the waste heat exhaustion (4) in a timely manner. It is extremely secretive that the waste heat is mixed in the electronic equipment, so that the temperature of the electronic component and its (four) sub-components continuously rises, which leads to the electronic components being corrected. Barriers, damage, or reduced operating scales. In order to improve the above-mentioned heat dissipation problem, it is generally common to install a heat-dissipating fan in the electronic device to dissipate heat. However, due to the limited airflow of the cooling fan, the heat dissipation effect is difficult to increase, and the cooling rate is also affected. In the limited situation, the industry has sought another solution, that is, using a water-cooled heat sink directly attached to the heating element, such as (central processing unit (10)), Gu, South, North Bridge, etc.) The pump is cooled from the storage tank (10) (4) and guided to the water-cooled heat sink, so that the cooling liquid and the water-cooled reading wire are poured into the liquid of the Wei-Geng Wei, and then the water-cooled = the phase-out of the device is discharged to the group. After the cold part, the __sink's rail is cooled by cooling_cycle to help dissipate heat, and the temperature of the heat-generating part is lowered to make the heating element operate smoothly. Although the water-cooled heat dissipating device can improve the problem of heat dissipation of the fine airflow, the extension (4)-the smoke problem, that is, the water-cooled loose filament is placed close to the end face of the remaining hair component (that is, the heat absorbing surface) is only in the same place_ Therefore, the cooling liquid in the water supply device 3 201020494 only has a heat exchange effect between the lowermost fluid portion and the heat absorption surface, and the cooling liquid stays in the water-cooling heat sink for too short time to cause the cooling liquid After not absorbing enough heat, it will be quickly and quickly exported from the aforementioned water outlet to make the water-cooled Wei Da thief _ _ silk is not good, very inconspicuous. 7瑕热双禾, please refer to the 丨 示 示 f f f f f f f f 种 种 种 种 种 种 种 种 种 种 种 种 种 种 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一 一And the water outlet pipe 113, the water inlet pipe 112 and the water outlet pipe 113 are respectively formed on opposite sides of the cover body 11, and communicate with the accommodating space (1), and the H tilting cover body u is covered and erected A plurality of scatters are provided on the ig (FIG. 13), the heat dissipation fins 13 are wrapped in the accommodating space 1 of the cover body u, and a plurality of unidirectional flow channels 131 are formed between the igs, and respectively The inlet water = m corresponds to the outlet pipe 113, so when the "cooling liquid" is in the space (1) of the inlet pipe ι 2, the cooling liquid body is touched through the plurality of one-way flow passages 131. However, in the above-mentioned heat dissipation structure, the heat dissipation fins 13 can be set up to increase the heat dissipation area so that the cooling liquid flows through the plurality of one-way flow paths i3i = the stagnation of the cooling liquid in the flow channels Time to take more heat sources for heat L, y: due to t one-way flow channel 131 is formed by the interval of most fins, Increase the flow friction resistance, under the condition of constant pump power, the cooling fluid flow rate is low, the heat is accompanied by the high pressure loss wire, and the secret cooling liquid is self-dispersing the clock piece 13 (,,, the mass, so '俾 makes the whole The heat exchange efficiency and the rumbling effect are obviously not 201020494. The above-mentioned techniques have the following disadvantages: 1. The cooling liquid is too short at the base, resulting in a poor heat transfer effect; The heat transfer effect is not good; 3. The heat exchange efficiency is not good; 4. The heat dissipation effect is not good. =疋' In view of the shortcomings derived from the above products, the inventor of this case has exhausted his work to engage in the industry for many years. Experience, concentrating, researching the new improvement of Garan, and successfully developing the "heat exchanger structure" of this piece, it is a kind of effective creation. 曰 [Summary] In order to solve the shortcomings of the above-mentioned technology, The main object of the present invention is to provide a heat-transfer capability and a thermal coefficient of performance for a slewing guide groove. The switch structure includes: Φ a body having a center, and a spiral guiding groove extending radially from the center toward the outer side opposite to the center, and the radial radius of gyration of the sliding guide groove is gradually increased and the first A port and a second port are respectively connected to each other, and the spiral guiding groove of the present invention can also enhance the fluid mixing effect in the spiral guiding groove, and is more effective. The invention further provides a heat exchanger structure, comprising: a body having a snail guide groove extending from the center toward the outer side of the center, and the spiral The radial radius of rotation of the guiding groove is gradually increased from the center of the body to the outer side of the body. 201020494 is further provided, wherein the opening and the second opening respectively communicate with the spiral guiding groove; and at least one first spoiler unit is arranged in the spiral The wall of the trough. The spiral guiding groove according to the above embodiment of the present invention forms an open side on the side of the body, and the other side is a seal _, and includes at least a first cover body opposite to the open side, and covers the main body The shame side, the city first cover body has at least one second spoiler unit facing the job side of the occupation guide groove, and the first cover body tube communicates with the first port. The spiral guiding groove according to the above-mentioned embodiment of the present invention forms an open side on both sides of the body, and includes a first cover body and a second cover body respectively opposite to the two open sides and covering the body The open side is closed, and the first cover body and the second cover body respectively have at least an H flow unit and at least a third third flow flow unit corresponding to the opening of the spiral guide groove. The spiral guiding groove according to the above embodiment of the present invention has a first passage, the cough-channel is connected to the second ventilation, and the first passage is connected to the second through the second A mouth. The above object of the present invention, as well as its structure and function, will be explained in accordance with the preferred embodiments of the drawings. [Embodiment] The present invention provides a _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The heat exchange hiding system includes a body 2 having a center 21 (as indicated by the dashed axis in the ®) 'from the center 21 she extends radially around the center 2i with a spiral guide The groove 22, and the radial radius of gyration of the spiral guide (10) 22 gradually increases from the outer side of the center 21, in other words, the spiral guide groove 22 of 201020494 extends from the center 21; so that the dance (four) (four), the heart toward the body 2 _ direction Radial encirclement between m and second materials (4) 22); as shown in Figure 2, the spiral guide (10) 22 is completed. In addition, the body further has a first opening 221 and a second opening 222. The first opening 221 is disposed at the center 21, and the second opening 222 is disposed outside the center 21, and the foregoing The first port 2?1 is poor, and the I port and the second port 222 are respectively connected to the job guiding groove 22. The aforementioned spiral guide (4) has a -th channel 225, which is disposed between the spiral guide groove 22 and the second port 222, and communicates with the second port 222' to enable - fluid ( For example, a cooling liquid, water) may flow from the second port 222 of the spiral guiding groove 22, and transmit a centrifugal force of a radial radius of revolution of the spiral guiding groove to enhance the fluid mixing, and the first pass The port 221 guides the aforementioned fluid out of a shaft tube 31. That is, after the second port 222 flows through the first channel 225, and the spiral channel (ie, the aforementioned guiding groove 22) flows toward the first port 221, the The radius of gyration of Guan Qingdao is gradually reduced in the direction of the towel ^ 21, so that the fluid generates a three-dimensional secondary flow (Secondary Flow) due to centrifugal force and inertial force under the double action of the inner wall of the spiral guiding groove 22, that is, Dean The occurrence of eddy currents (Dean Vortics), that is, the flow field in the spiral guide groove 22 simultaneously generates two symmetrical but opposite directions of the flow (as shown in Figures 4 and 5), this eddy (the arrow in Figure 5) Between the outer wall 227 of the spiral guide groove 22 (the side away from the center 21) and the inner wall inner side 228 (the side close to the center 21).俟, after the fluid flows through the first port 221, it is led out from the shaft tube 31 to a pump (not shown) that is docked, and the pump then transports the fluid back to the second pass 7 201020494 The port 222 'so' allows the aforementioned fluid to continue to circulate between the screw guide groove 22 and the pump to achieve an excellent water ring heat dissipation effect. Further, the present invention mainly relies on the influence of the secondary flow by the fluid guiding body 22 in the spiral guiding groove 22 (four) mixing of the strong fluid to effectively improve the overall heat exchange efficiency, and the heat transfer effect is relatively improved. Referring to FIGS. 2 and 3, the heat exchanger structure further includes at least one first cover 3'. The first cover 3 is opposite to the body 2, and the first cover 3 has the aforementioned shaft tube. 31, the shaft tube 31 communicates with the first port 221, and the shaft tube 31 forms a through state with the first port 221 and the spiral guiding groove 22 and the second port 222, and the spiral guide The guiding groove 22 forms an open side 223 on the side of the body 2, and the open side 223 is opposite to a closed side 224, that is, the spiral guiding groove 22 penetrates through one side of the body 2 and forms the open side on the through side. 223, and the other side of the body 2 is not penetrated by the helical guide groove 22, thus forming the closed side 224 opposite the open side 223. The first cover body 3 closes the open side 223, that is, the first cover body 3 moves toward the corresponding open side 223, so that the first cover body 3 covers the body 2 and closes the open side. 223 to constitute the heat exchanger structure. Moreover, the present invention is applied to heat dissipation to a heat source, especially an electronic component in an electronic device (such as a computer, a notebook computer, a communication case, or other industrial electronic device). The electrical energy generated by the operation is physically converted into heat energy. The side of the body 2 (that is, the end surface of the body 2 opposite to the open side 223) is heat-exchanged by the heat generated by the fluid in the spiral guiding groove 22 with respect to the heat source. Through the centrifugal force and the inertial force of the radial radius of gyration of the spiral guiding groove 22, the spring in the spiral guiding groove 22 close to the heat source side (the temperature of the fluid on the side is higher than 201020494') and away from the heat source The fluid on the side (the fluid on this side is relatively low in temperature) is quickly mixed together to effectively increase the mixing effect of the fluid, and more effectively achieve the heat transfer effect of the excellent heat exchange (or increase the heat transfer efficiency of the fluid). Referring to FIG. 6 , which is a second preferred embodiment of the present invention, the preferred embodiment is substantially the same as the first preferred embodiment, and is not further described herein. The difference between the two is: the aforementioned heat. The switch structure further includes a second cover body 7 opposite to the first cover body 3 to cover both sides of the body 2, and the spiral guide groove 22 _ on both sides of the body 2 An open side 223 is formed respectively, and the corresponding open side 223 is closed by the first and second covers 3, 7 respectively. Referring to Figures 7, 8, and 9, which are the third preferred embodiment of the present invention, the preferred embodiment is substantially the same as the first preferred embodiment, except that it further includes at least one first The first spoiler unit 4 is disposed on the wall surface 226 of the spiral guiding groove 22, and the first spoiler unit 4 is disposed on the closed side of the spiral guiding groove 22 in the preferred embodiment. 224, and the first cover 3 has at least one second spoiler unit 5 at a position relative to the open side 223 of the spiral guide groove 22, so in the present preferred embodiment, the first spoiler unit 4 The second spoiler unit 5 is disposed on the closed side 224 and the open side 223 of the spiral guiding groove 22, respectively, and the first spoiler unit 4 and the second spoiler unit 5 are disposed in the spiral guiding groove 22 The side weep 4 and the open side 223 are closed. Please also refer to the fifth, ninth, and first drawings, and the flow system in the heat exchanger can be selected to enter the first port 221 from the second port 222, or enter the first port 221. A port 222, the outflow 'This description indicates that the fluid enters from the second port and flows out toward the first port 221 through the shaft tube 31 (as indicated by the arrow in the first figure), that is, 'the flow system is from The first port 222 enters and flows into the first channel 225' of the spiral guiding groove ^ 9 201020494. When the fluid passes through the first channel 225, it enters the radially rotating helical guiding groove 22 and along the helical guiding groove 22 Flowing toward the center 21 of the body 2, since the fluid flows in the curved spiral guiding groove 22, the fluid generates a three-dimensional secondary flow phenomenon (se(10)d fl〇w) due to the inertial force and the centrifugal force, that is, The Dean vortex (Dean Vortices) occurs, that is, the flow field in the spiral guiding groove 22 simultaneously has two symmetrical vortices which are opposite in the direction of rotation, and the eddy current (shown by an arrow in FIG. 5) is in the spiral guiding groove 22 Outside 227 (one side away from center 21) and inner side 228 (near middle Between flow) side 21. At the same time, the fluid in the spiral guiding groove 22 flows along the wall surface 226 and the first spoiler unit 4 on the first cover 3 and the spiral flow path in the spiral guiding groove 22 of the second spoiler unit 5' The convection flow is generated in the spiral guiding groove 22 t to increase the thermal convection coefficient of the flow field of the spiral guiding groove 22 (10), and the first spoiler unit 4 and the second spoiler unit 5 are in the spiral guiding groove 22 It also causes the fluid to produce two symmetrical but opposite directions of the lining 'this lining (shown by the arrow in Fig. 5) on the outer side 227 of the serving guide groove (the side away from the center 21) and the inner side (close to the center 21) Flowing between one side) to produce a heat transfer enhancement effect with enhanced inflow strength, and the shunting and vortices directed by the first spoiler unit 4 and the second money unit 5 The secondary flow 'induced by the first spoiler unit 4 and the second spoiler single π 5 can also enhance the eddy current intensity of the spiral curve to further improve the heat transfer effect of the heat exchanger. In accordance with the above-mentioned 'her knowing the hair _ structure, the interesting guiding guide groove and the first spoiler unit 4 and the second spoiler unit 5 flow, and the fluid is generated ^ » l (Dean vortices), genus The increase in the strength of the laminar flow and the turbulent flow not only increases the number of times the spiral guide groove 22 is shuffled, but also increases the heat transfer energy of the shaft and the coefficient of thermal performance. The fourth embodiment of the present invention is the same as the third preferred embodiment. The components and functions of the present invention are the same as those of the third preferred embodiment. Different from the third preferred embodiment, a spiral guiding groove 61 defines an open side 611, 612 on both sides of the body 2, a first cover 3 (same as the third preferred embodiment) and a first The two cover bodies 7 are respectively opposite to the two open sides 611, 612, and correspondingly cover the body 2, thereby closing the two open sides 6U, 612. The first cover body 3 has a shaft tube 31 communicating with the first through port 221, and The cover body 3 and the second cover body 7 respectively have a second spoiler unit 5 and a third spoiler unit 8, which can also enhance the hemp strength of the spiral f-channel and further improve the heat transfer effect of the heat exchanger. Please refer to Figures 13 and 14 for the fifth preferred embodiment of the present invention. Most of the components are the same as the third and preferred embodiments, and the same part is not described herein. The third spoiler is different in that the first spoiler unit 4 and the second spoiler unit 5 are disposed in a groove form on the closed side 224 and the open side 223 of the spiral guiding groove, so that the fluid can be borrowed The first spoiler unit* and the second prison unit 5 can also cause the eddy current intensity of the micro curve to improve the heat transfer effect of the heat exchanger. In summary, this issue _ provides a kind of "hot hunger huntering, the sharp method of withdrawing money, the benefit of the material, it is the above, only the best of this turn For example, the changes in the method, the shape, the structure, and the device of the present invention are all included in the scope of the present application. 201020494 [Simple description of the drawing] 'The first picture is a conventional one. Schematic diagram of the water-cooled heat dissipation structure; 'Fig. 2 is the decomposition diagram of the best of the gamma - the better actual compensation; the third figure is the combination of the original meaning - the best combination of the material; FIG. 6 is a schematic exploded view of a second preferred embodiment of the present invention; FIG. 7 is a schematic view of a second preferred embodiment of the present invention; FIG. 3 is a schematic exploded view of a third preferred embodiment of the present invention; FIG. 9 is a schematic cross-sectional view of a third preferred embodiment of the present invention; The figure is a schematic diagram of the implementation of the third preferred embodiment of the present invention; 4 is a perspective view of a fourth preferred embodiment of the present invention; FIG. 13 is a perspective exploded view of a fifth preferred embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 3 is a perspective view of a fifth preferred embodiment of the present invention. [Main component symbol description] Main body 2 Center 21 Spiral guide groove 22 First port 221 Second port 222 Open side 223 12 201020494 Closed side 224 First Channel 225 Wall 226 Outside 227 Inner side 228 First cover 3 Shaft tube 31 First spoiler unit 4 Second spoiler unit 5 Spiral guide groove 61 Open side 611, 612 Second cover 7 Third spoiler unit 8

Claims (1)

201020494 七、申请專利範圍: 1. 一種熱交換器結構,包括: 一本體’具有一中心,及從該中心朝相對該中心的外側徑向環 繞延伸之-螺旋導弓丨槽,且該職導引槽的徑向迴轉半徑從本 體中心往外側逐漸增加,及一第一通口與一第二通口分別連通 該螺旋導引槽。 2. 如申μ專利細第丨項所述之熱交換器結構,其中該第一通口 °又在該中心處,該第二通nS在該中心的外侧。 3. 如申請專利範圍第2項所述之熱交換器結構其中該螺旋導引 槽具有-第一通道,其設在該螺旋導引槽與該第二通口之間, 且連通該第二通口。 4.如申%專利細第丨或2項所述之熱交換聽構,更包括至少 一第-蓋體相對蓋合該本體,且該第—蓋體具有—軸管連通該 5·如申請專利細第4項所述之敝結構,其中該螺旋導引201020494 VII. Patent application scope: 1. A heat exchanger structure comprising: a body having a center and a spiral guide bow groove extending radially from the center toward the outer side of the center, and the guide The radial radius of rotation of the slot gradually increases from the center of the body to the outside, and a first port and a second port respectively communicate with the screw guide groove. 2. The heat exchanger structure of claim 5, wherein the first port is at the center and the second port nS is outside the center. 3. The heat exchanger structure of claim 2, wherein the spiral guiding groove has a first passage disposed between the spiral guiding groove and the second opening, and communicating with the second Pass. 4. The heat exchange hearing structure according to claim 2 or 2, further comprising at least one first-lid body oppositely covering the body, and the first cover body has a shaft tube connected to the 5 The crucible structure described in the fourth item of the patent, wherein the spiral guide β Γίϊί體—侧形成—開放側,前述第—蓋體封閉該開放侧。 .如申印專她圍第1項所述之熱交換器結構,更包括—第一蓋 體及-第二蓋體相對蓋合該本體的兩側,該螺旋導引槽在該本 體的兩侧分別形成—開放側,並藉由前述第―、二八〆 閉對應該開放側。 —/刀別封 7. —種熱交換器結構,包括·· 一本體,具有一中心, 的外侧徑向環繞延伸, 及一螺旋導引做該中心朝相_中心 且該螺旋導⑽的徑向迴轉半徑從本體 14 201020494 中心往外侧逐漸增加’及―第-通口與-第二通时別連通該 螺旋導引槽;及 至少一第一擾流單元,係設於螺旋導引槽之壁面。 8.如申請專利細第7項所述之熱錢器結構,其巾該第一擾流 單元為凸體。 9·如申請專利_第7項所述之熱交換賭構,其中該第一擾流 單元為凹槽。 β 10·如中請專利範圍第7項所述之熱交換器結構,其中該職導引 槽在該本體的一側形成有一開放側,另一侧為封閉侧。 11. 如申請專利範㈣7項所述之熱交換器結構,其中該螺旋導引 槽具有一第一通道連通該第二通口。 12. 如申請專利範圍第1Q項所述之熱交換器結構更包括至少一 第一蓋體相對該開放侧,並蓋合該本體以封閉該開放侧,且該 第一蓋體具有一軸管連通該第一通口。 ❹ 13. 如申請專利範圍第12項所述之熱交換器結構其中該第一蓋 體具有至少一第二擾流單元對應該螺旋導引槽之開放侧。 14·如申請專利範圍第13項所述之熱交換器結構,其中該第二擾 流單元為凸體。 15. 如申請專利範圍第13項所述之熱交換器結構,其中該第二擾 流單元為凹槽。 16. 如申請專利範圍第7項所述之熱交換器結構’其中該螺旋導引 槽在該本體的兩侧分別形成一開放侧。 15 201020494 17·如申請專利範I6項所述之熱交換器結構,更包括-第- 蓋體及-第二蓋趙,分卿對兩開賴,並蓋合本體以封閉該 開放侧。 18. 如申請專利範111第Π項所述之熱交換ϋ結構,其巾該第一蓋 體與第二蓋體分別具有至少-第二賊單元及至少-第三擾流 早元對應該螺旋導引槽之開放侧。 19. 如申請專利範圍第18項所述之熱交換器結構,其中該第二擾 流單元及第三擾流單元為凸體。 20. 如申請專利範圍第18項所述之熱交換器結構,其中該第二擾 流單元及第三擾流單元為凹槽。 21. 如申請專利範圍第18項所述之熱交換器結構,其中該第一擾 流單元為凸體,而該第三擾流單元為凹槽。 22. 如申請專纖圍第18項所狀熱交換^結構其巾該第一援 流單元為凹槽,而該第三擾流單元為凸體。 16β Γ ϊ ϊ 体 - side formation - open side, the aforementioned first - cover closes the open side. For example, the heat exchanger structure according to item 1 of the present invention includes: a first cover body and a second cover body oppositely covering the two sides of the body, the spiral guide groove being on the two sides of the body The sides are respectively formed on the open side, and the open side is closed by the aforementioned first and second eight. - / knife seal 7. A heat exchanger structure, including a body having a center, the outer radial extending around, and a spiral guide to make the center toward the center - center and the diameter of the spiral guide (10) The spiral guiding groove is connected to the radius of gyration from the center of the body 14 201020494 to the outer side and the first and second ports are connected to the spiral guiding groove; and at least one first spoiler unit is disposed in the spiral guiding groove Wall. 8. The structure of the hot money device according to claim 7, wherein the first spoiler unit is a convex body. 9. The heat exchange framework of claim 7, wherein the first spoiler unit is a groove. The heat exchanger structure of claim 7, wherein the working guide groove has an open side on one side of the body and a closed side on the other side. 11. The heat exchanger structure of claim 4, wherein the spiral guiding groove has a first passage communicating with the second opening. 12. The heat exchanger structure of claim 1Q further comprising at least one first cover opposite the open side and covering the body to close the open side, and the first cover has a shaft tube connection The first port. The heat exchanger structure of claim 12, wherein the first cover has at least one second spoiler unit corresponding to an open side of the spiral guide groove. 14. The heat exchanger structure of claim 13, wherein the second spoiler unit is a convex body. 15. The heat exchanger structure of claim 13, wherein the second spoiler unit is a groove. 16. The heat exchanger structure of claim 7, wherein the spiral guide groove forms an open side on each side of the body. 15 201020494 17· The heat exchanger structure as claimed in claim 1, wherein the heat exchanger structure further comprises a first cover and a second cover, and the two sides are open to cover the body to close the open side. 18. The heat exchange crucible structure of claim 11, wherein the first cover and the second cover respectively have at least a second thief unit and at least a third turbulent early element corresponding to the spiral The open side of the guide groove. 19. The heat exchanger structure of claim 18, wherein the second spoiler unit and the third spoiler unit are convex. 20. The heat exchanger structure of claim 18, wherein the second spoiler unit and the third spoiler unit are grooves. 21. The heat exchanger structure of claim 18, wherein the first spoiler unit is a convex body and the third spoiler unit is a groove. 22. If the heat exchange structure of the item 18 of the special fiber is applied, the first auxiliary unit is a groove, and the third spoiler unit is a convex body. 16
TW099100907A 2010-01-14 2010-01-14 Heat exchanger structure TWI400421B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW099100907A TWI400421B (en) 2010-01-14 2010-01-14 Heat exchanger structure
US12/710,299 US20110168360A1 (en) 2010-01-14 2010-02-22 Heat exchanger

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW099100907A TWI400421B (en) 2010-01-14 2010-01-14 Heat exchanger structure

Publications (2)

Publication Number Publication Date
TW201020494A true TW201020494A (en) 2010-06-01
TWI400421B TWI400421B (en) 2013-07-01

Family

ID=44257613

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099100907A TWI400421B (en) 2010-01-14 2010-01-14 Heat exchanger structure

Country Status (2)

Country Link
US (1) US20110168360A1 (en)
TW (1) TWI400421B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8867210B2 (en) * 2012-10-31 2014-10-21 Deere & Company Cooling apparatus for an electrical substrate
US9595726B2 (en) * 2014-01-07 2017-03-14 Advanced Cooling Technologies, Inc. Fuel reforming system and process
TWI619918B (en) * 2016-08-31 2018-04-01 Asia Vital Components Co Ltd Cooling water drain device and water cooling module thereof
US10557391B1 (en) * 2017-05-18 2020-02-11 Advanced Cooling Technologies, Inc. Incineration system and process
EP3792576B1 (en) 2018-09-04 2022-12-21 Ovh Water block having a fluid conduit
DE102018215142A1 (en) * 2018-09-06 2020-03-12 Robert Bosch Gmbh Sensor unit of a vehicle
US11326836B1 (en) * 2020-10-22 2022-05-10 Asia Vital Components Co., Ltd. Vapor/liquid condensation system
CN114152132B (en) * 2021-11-22 2024-02-20 南京理工大学 Micro-channel heat exchanger based on Dien vortex

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3090915B1 (en) * 1999-04-16 2000-09-25 株式会社カンキョー Heat exchanger, method of manufacturing the same, and dehumidifier including the same
SE9903367D0 (en) * 1999-09-20 1999-09-20 Alfa Laval Ab A spiral heat exchanger
DE19963373A1 (en) * 1999-12-28 2001-07-12 Abb Alstom Power Ch Ag Device for cooling a flow channel wall surrounding a flow channel with at least one rib train
US6367543B1 (en) * 2000-12-11 2002-04-09 Thermal Corp. Liquid-cooled heat sink with thermal jacket
JP3979143B2 (en) * 2002-03-27 2007-09-19 株式会社日立製作所 Cooling device for information processing equipment
US6867973B2 (en) * 2003-03-05 2005-03-15 Shyy-Woei Chang Heat dissipation device with liquid coolant
TW200503608A (en) * 2003-07-15 2005-01-16 Ind Tech Res Inst Cooling plate having vortices generator
US7204299B2 (en) * 2004-11-09 2007-04-17 Delphi Technologies, Inc. Cooling assembly with sucessively contracting and expanding coolant flow
TWI262761B (en) * 2005-05-27 2006-09-21 Foxconn Tech Co Ltd Liquid cooling apparatus
TWI281850B (en) * 2006-03-14 2007-05-21 Yen Sun Technology Corp Water-cooled heat-dissipating device
JP2008041750A (en) * 2006-08-02 2008-02-21 Alps Electric Co Ltd Water-cooling heat sink and water-cooling system
CN101153607B (en) * 2006-09-30 2010-11-10 宝宁科技股份有限公司 Water pump device of radiating system
WO2009104426A1 (en) * 2008-02-21 2009-08-27 日本軽金属株式会社 Method of manufacturing heat transfer plate

Also Published As

Publication number Publication date
TWI400421B (en) 2013-07-01
US20110168360A1 (en) 2011-07-14

Similar Documents

Publication Publication Date Title
TW201020494A (en) Structure of heat exchanger
Reddy et al. MHD boundary layer flow, heat and mass transfer analysis over a rotating disk through porous medium saturated by Cu-water and Ag-water nanofluid with chemical reaction
Sheikholeslami et al. Second law analysis for nanofluid turbulent flow inside a circular duct in presence of twisted tape turbulators
Deng et al. Design of practical liquid metal cooling device for heat dissipation of high performance CPUs
TWI400420B (en) Spiral heat exchanger
TWM289878U (en) Heat-dissipation structure of water-cooling type parallel runner
TW200937173A (en) Heat-removal device
CN106852092B (en) A kind of novel mechanical pump liquid cooling heat radiation system
TWM279915U (en) Water-cooling heat dissipation mechanism
TWI380161B (en)
JP2016537598A (en) Geothermal probe with mixing element
CN102131367B (en) Heat exchanger structure
Liu et al. A study on a simplified liquid cooling system with a pump serving as cold plate
CN205726844U (en) Heat sink device
TWI281850B (en) Water-cooled heat-dissipating device
JP3164946U (en) Heat exchanger structure
TWM385030U (en) Structure of heat exchanger
CN204007216U (en) A kind of novel radiating device
Mahian et al. Entropy generation minimization in nanofluid flow
JP2011185457A (en) Heat exchanger structure
TWM318895U (en) Composite heat exchanging device
Fuskele et al. Heat transfer enhancement in a circular tube fitted with twisted tape having continuous cut edges using CuO-water nanofluid
Kandlikar Design considerations for cooling high heat flux IC chips with microchannels
CN103970243A (en) Notebook computer structure for conduction and convection heat radiation by using upper cover
TWM434973U (en) Liquid-cooling type heat dissipation device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees