特別是指一Especially one
1281850 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子元件的散熱器 種水冷式散熱裝置。 【先前技術】 返著科技的進步，電腦的運算速度亦 地，曾當中，然而，運算速度的增進，所面臨二大= 即=散熱問題’對於中央處理器（cpu)及繪圖處理器仰U) 此。一般而言，大都是在CPU與GPU電子元件上加 衣政熱器，早期的散熱器僅需要紹製的散熱鰭片，之後， 再於散熱籍片上加裝風扇，卩用加快氣流的流動，以提古 散熱量。近年來，則出現利用冷卻水流來增加攜熱量的： 冷式散熱|置’以突破傳統利用氣流散熱的限制。 如圖1所示’習知之水冷式散熱裝置1，如中華民國公 告第458317號「CPU水冷散熱裝置之改良」新型專利案， 包含-底座11、-蓋合於該底座u之頂蓋12，及設置在該 頂蓋12上的一入水管13與—出水管Η。該底座n上形成 有-呈彎曲狀並與該人、出水管13、14連通的水道⑴， 藉此使冷卻水於該彎曲的水道lu中流動，以達到吸熱效果 由上述况明不難發現，在實際使用上，由於底部的冷 卻水軚罪近CPU，較容易吸收熱量，因此其溫昇會較快。 幂所皆知的是，當兩物體的溫差減小時，則其吸熱效率亦 會隨之降低，該水冷式散熱裝置i的水流設計並未能有效 5 1281850 地將底部較高溫的冷卻水向上㈣，致使其常處於底部而 影響吸熱效果。再者，冷卻水所流經的面積並不大， 熱功能仍然有限。 〃 如圖2、3所示，另—習知之水冷式散熱裝置2,如中 華民國中請案號第9321·號「電腦水冷式散熱裝置」新 型專利案，是錢善上述_而設計，該水冷式散熱裝置21281850 IX. Description of the Invention: [Technical Field] The present invention relates to a water-cooling type heat sink for a heat sink of an electronic component. [Prior Art] Back to the advancement of technology, the computer's computing speed is also the same, once, however, the speed of computing, the face of the two major = ie = heat dissipation problem for the central processing unit (cpu) and graphics processor ) This. In general, most of the CPU and GPU electronic components are added to the heat exchanger. The early heat sink only needs the heat-dissipating fins. After that, a fan is added to the heat-dissipating film to speed up the flow of air. To mention the amount of heat dissipation. In recent years, there has been a use of cooling water flow to increase the amount of heat carried: cold cooling | set to break the traditional use of airflow cooling restrictions. As shown in FIG. 1 , the conventional water-cooled heat sink 1 , such as the Republic of China Announcement No. 458317 “Improvement of CPU Water Cooling Heat Dissipation Device”, includes a base 11 and a top cover 12 covering the base u. And an inlet pipe 13 and an outlet pipe provided on the top cover 12. The base n is formed with a water passage (1) which is curved and communicates with the person and the water outlet pipes 13 and 14, thereby allowing cooling water to flow in the curved water passage lu to achieve an endothermic effect. In actual use, because the cooling water at the bottom is near the CPU, it is easier to absorb heat, so its temperature rise will be faster. It is well known that when the temperature difference between two objects is reduced, the heat absorption efficiency will also decrease. The water flow design of the water-cooled heat sink i does not effectively raise the bottom higher temperature cooling water (4). So that it is often at the bottom and affects the endothermic effect. Furthermore, the area through which the cooling water flows is not large, and the thermal function is still limited. 〃 As shown in Figures 2 and 3, another well-known water-cooled heat sink 2, such as the Republic of China Zhongzhong No. 9321· “Computer Water-cooled Heat Dissipator” new patent case, is designed by Qian Shan. Water-cooled heat sink 2
包含-广“反2卜-可與該底板21蓋合的殼座Μ、多數密 集没置於纟亥底板21上並客晉於兮M rt ^ ^ 谷置於δ亥叙座22内的散熱鰭片23 ，及設置在該殼座22兩側的一入水管24盥一出水这乃 使冷卻水自該人水管24流人，並通過所述的散^片Η 進行吸熱’再於該出水管25流出，以數眾多且密集的散熱 •讀片23，來增加吸熱面積。 然而，因為所述之散熱鰭片23密集設置的關係，阻礙 了冷卻水的流動，而迫使大部分的冷卻水會沿著阻礙較小 的周邊空間流動，使得通過所述之散熱鰭片23的流量減少 ，讓散熱效果的提昇變得很有限。同樣地，位於底部的冷 卻水亦未能有效地被向上帶離，仍然未能有效地發揮該^ 冷式散熱裝置2應有之散熱效果。 【發明内容】 因此，本發明之目#，即在提供一種水冷式散熱袭置 ，可以使冷卻水被迫地由下向上的流動，將底部較高溫部 分的熱量帶走，以提高散熱效率。 於是，本發明之水冷式散熱裝置，包含一基座、一可 與該基座相互蓋合的殼蓋，及一套設於該基座上的套塊， 1281850 該基座具有一底板，及複數間隔設置在該底板上的傳熱立 柱，該殼蓋具有一頂壁，及一自該頂壁周緣向下延伸的圍 繞壁’該頂壁與圍繞壁相配合界定出一容水空間，該圍繞 壁形成有與该谷水空間相連通的一入水孔與一出水孔，該 入水孔是鄰近於該基座之底板，而該出水孔是鄰近於該頂 壁，該套塊容置於該殼蓋之容水空間中並具有一套塊本體 、複數貫通地形成於該套塊本體並可供該複數傳熱立柱穿 伸的水流通孔、一形成於該套塊本體底部並連通該入水孔 與每一水流通孔的連通槽，及一自該套塊本體底面向下延 伸的阻水壁，該阻水壁是鄰近於該殼蓋之出水孔。 本發明之功效在於將該殼座上的入水孔設置在較為靠 近於該基座之底板，可使冷卻水一開始即進入與電子元件 接觸而溫度較高的底板上，並利用該套塊之阻水壁阻擋冷 卻水直接從該出水孔流出，而使冷卻水能沿該基座之每一 傳熱立柱周緣向上流動，再從該出水孔流出，藉此讓冷卻 水被迫地能由下向上流動，以較大的溫差，提昇冷卻水的 吸熱效率，藉此提高其散熱量。 【貫施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之四個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明中，類似的元件是以相同的編號來表示。 如圖4、5所示，本發明之水冷式散熱裝置的第一較佳 7 1281850 罢！ ^ s基座4、一可與該基座4相互蓋合固定的殼 氣5、一套設在該基座4上的套塊6，以及一密封環7。 4該基座4具有一底板41、多數間隔排列設置在該底板 上的傳熱立柱42、一形成於該底板41頂面並環繞該多 數，熱立柱42的環槽43，及四形成於該底板Μ上並位於 该環槽43外側的^位穿孔44。在該第—較佳實施例中，所 ，的傳熱立柱42是呈圓柱狀並由該底板41向上延伸，且 疋Ή攻底板41為一體成型地製造，當然，前述的傳熱立柱 42也可以另外製造，之後，再予以結合固定於該底板*丨上 〇 該殼蓋5具有一頂壁5 1、一自該頂壁5丨周緣向下延伸 的圍繞壁52、一設置在該圍繞壁52上的入水管53、一設 置在该圍繞壁52並與該入水管53相對的出水管54，及四 没置在該圍繞壁52外側面上並分別對應該基座4之該四定 位穿孔44的凸塊55。該頂壁51與圍繞壁52相配合可界定 出一容納冷卻水的容水空間5 0。 該圍繞壁52上形成有一連通該容水空間5〇與該入水 管53的入水孔521、一連通該容水空間50與該出水管54 並與該入水孔521相對的出水孔522，及三形成於該圍繞壁 52内壁面上的凹陷部523。其中，該入水孔521是鄰近該 基座4之底板41，而該出水孔522則是鄰近該頂壁51。每 一凸塊55上形成有一螺孔551，可利用四隻螺絲（圖未示）分 別穿過該基座4之該四定位穿孔44並螺鎖於對應的螺孔 551中，將該殼蓋5固定蓋合在該基座4上。 8 1281850 配&圖6 „亥套塊6谷置於該殼蓋5之容水空間5〇中 ’並具有一套塊本體61、多數貫通地形成於該套塊本體61 上並可供該基座4之每一值勒士上 專…、立柱42穿伸的水流通孔62、 -形成於該套塊本體61底部的連通槽63、—自該套塊本體 61底面向下延伸的阻水嘮u ^ 64、一形成於該套塊本體61頂 面並鄰近該出水孔522的容水凹# 65，及三分別設置在該 套塊本體61外表面上並可分別對應容置於該圍繞壁52之 三凹陷部523中的凸起部66。該阻水壁“是鄰近於該殼蓋 5上的出水孔522。在該第_較佳實施例中，該阻水壁64 是位於該套塊本體61的側緣，使冷卻水能流過每一傳熱立 柱42之後，才被該阻水至壁64所擒止。 每一個水流通孔62的直徑均大於每一傳熱立柱42，使 冷卻水能於每一個傳熱立柱42與水流通孔62之間的空間 流動，以帶走所述傳熱立柱42上的熱量。該連通槽63是 連通該入水孔521與每一水流通孔62。該阻水壁64主要是 用來阻擋冷卻水從該連通槽63直接流出該出水孔522，迫 使冷卻水此進入所述的水流通孔62中。該容水凹槽65是 與鄰近該出水孔522附近的水流通孔62(即該套塊6右半側 的水流通孔62)相連通，可增加等待欲從該出水孔522排出 的冷卻水。當然，該容水凹槽65實際上是不一定要設置的 ，不應以此為限。 該三凸起部66是用於防止在組裝時安裝方位的錯誤（或 稱防呆功能）。在實際設計時，也可只使用單一個凸起部％ ，並配合對應的凹陷部523，同樣也可以達到防止組裝錯誤 1281850 的目的，不應以此侷限本發明。 该密封環7是設置在該基座4與該殼蓋5之間，使兩 者能達到密合，以防止冷卻水從該容水空間5〇中洩漏。在 該第一較佳實施例中，該密封環7是容置於該基座4之環 曰3中並被δ亥冗又盖5之圍繞壁5 2所抵壓，該密封環7 的形狀則需配合該環槽43的形狀而設計。應注意的是，在 貫際上，也可以不設置該密封環7，直接將該殼蓋5密封地 黏固於該基座4之底板41上，或是使該圍繞壁52嵌入該 %槽43中，再予以膠合固定，同樣都能防止漏水，不應以 此侷限本發明之申請專利範圍。 如圖5所示，該水冷式散熱裝置在運作時，是讓冷卻 水自忒设蓋5之入水管53進入，通過該圍繞壁52之入水 孔521而從該容水空間5〇的底部流入該連通槽63中，由 於該阻水壁64的阻擋作用，可使冷卻水逐漸於該容水空間 5〇内上昇並沿著每一傳熱立柱42的表面向上流動，以吸收 其熱量。之後，自每一水流通孔62流出的冷卻水即會從鄰 近該頂壁51的出水孔522流出，並排出該出水管54，或是 容置於該容水凹槽65中等待排出。 由於該基座4之底板41是直接接觸發熱的電子元件（如 CPU、GPU) ’所以與該底板41連接的每一傳熱立柱42底 部溫度會是較高的，藉由將該入水孔521設置於鄰近於該 基座4之底板41的位置，讓輸入的冷卻水可先與較高溫的 傳熱立柱42底部進行熱交換，並配合將該出水孔522設置 在鄰近該頂壁51的位置，讓冷卻水被強迫地再向上流動， 10 1281850 以自泫出水孔522排出。當溫差愈大時，其吸熱速率亦會 隨之增加’藉此，確實將該基座4上之最高熱量帶走，有 效提南該水冷式散熱裝置的散熱量。 如圖7、8所示，本發明之水冷式散熱裝置的第二較佳 貝施例，大致上是該第一較佳實施例相同，相同之處不再 贅述’其中不同之處在於：該水冷式散熱it置更包含複數 呈螺旋狀的引導套件8，每-引導套件8可套設於該基座4 之每一傳熱立柱42上並對應容置於該套塊6之每一水流通 孔62内。 當-冷卻水由該套塊6之連通槽63流至每一水流通孔Μ 時，可利用所述的引導套件8引導冷卻水呈螺旋狀的方式 環繞每一傳熱立柱42周緣流動，透過流動路徑的增加，以 延長冷卻水接觸每一傳熱立柱42的時間，以提高吸熱量。 同牯，旎透過每一引導套件8與傳熱立柱42相配合形成毛 細現象，提供向上拉引的力量，讓冷卻水向上流動，並使 其流動規律穩定，以減少相互干涉而形成擾流的問題，使 冷卻水能穩定均勻吸熱。 如圖9所示，本發明之水冷式散熱裝置的第三較佳實 施例，大致上是該第一較佳實施例相同，相同之處不再贅 述，其中不同之處在於··該基座4之每一傳熱立柱42具有 一柱體421，及一自該柱體421向外螺旋地延伸的引導凸垣 422。利用每一引導凸垣422可引導冷卻水環繞每一柱體 421流動，同樣可以增加流動路徑、延長吸熱時間並減少干 涉問題’達到提南吸熱量之目的。 1281850 如圖ίο所示，本發明水冷式散熱裝置之一第四較佳實 施例，大致上是該第一較佳實施例相同，相同之處不再贅 述’其中不同之處在於：該基座4之每_傳熱立柱42上形 成有一呈螺旋狀的引導凹槽423，利用每一引導凹槽4幻可 引導冷卻水環繞每-傳熱立柱42流動，同樣可㈣加流動 路徑、延長《時間並減少干涉的問題，達到提高吸熱量 之目的。 歸納上述，本發明之水冷式散熱裝置，是令該入水孔 521鄰近於該基座4之底板41，且令該出水孔522設置於 鄰近該殼蓋5之頂壁51，使得冷卻水可先流至該底板μ盘 每-傳熱立柱42的底部，再被強迫地由下而上的流動排出' "亥出水孔522 ’可確貫將較高溫的熱量部分帶走。另外，如 圖8 10所示’可利用設置在每一傳熱立柱外的引導套 件8’或是利用所述的引導凸垣422，或是引導凹槽似之 設計’引導冷卻水以螺旋的方式向上流動增加流動的路 徑’延長接觸吸熱的時間，以有效地提高散熱效率並減少 干涉的現象’故確實能達到本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實播夕益 _ 具施之辄圍，即大凡依本發明申請專利 fe圍及卷明β兄明内谷所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是-立體分解圖，說明一習知之水冷式散熱 為中華民國公告第伽17號「咖水冷散熱裝置之改 12 1281850 新型專利案； *圖2是一俯視圖，說明另一習知之水冷式散熱裝置為 中華民國巾請案號第93214246號「電腦水冷式散熱裝置」 新型專利案； 圖3是一剖面側視圖，配合說明圖2 ; 圖4是一立體分解圖，說明本發明水冷式散熱裝置之 第一較佳實施例；Including - wide "anti-2" - the shell seat that can be covered with the bottom plate 21, most of which are not placed on the bottom floor 21 of the 纟 并 并 并 并 并 并 并 的 的 的 的 的 的 的 的The fins 23 and a water inlet pipe 24 disposed on both sides of the casing 22 are discharged from the water pipe 24, and the cooling water flows from the human water pipe 24, and the heat is absorbed by the diffuser. The water pipe 25 flows out, and the heat absorption area is increased by a large number of dense heat dissipation reading sheets 23. However, because of the dense arrangement of the heat dissipation fins 23, the flow of the cooling water is hindered, and most of the cooling water is forced. It will flow along the less obstructed peripheral space, so that the flow rate through the fins 23 is reduced, and the heat dissipation effect is limited. Similarly, the cooling water at the bottom is not effectively taken up. Therefore, the cooling effect of the cooling device 2 is still not effectively utilized. Accordingly, the object of the present invention is to provide a water-cooling heat-dissipating device, which can make the cooling water forced. From the bottom up flow, the heat at the bottom of the higher temperature part Carrying away to improve heat dissipation efficiency. Thus, the water-cooling heat sink of the present invention comprises a base, a cover that can be covered with the base, and a set of sleeves disposed on the base, 1281850 The base has a bottom plate and a plurality of heat transfer columns disposed on the bottom plate. The cover has a top wall and a surrounding wall extending downward from the periphery of the top wall. The top wall cooperates with the surrounding wall. Defining a water-receiving space, the surrounding wall is formed with a water inlet hole and a water outlet hole communicating with the valley water space, the water inlet hole is adjacent to the bottom plate of the base, and the water outlet hole is adjacent to the top wall, The sleeve is received in the water-receiving space of the cover and has a block body, a plurality of water circulation holes formed in the sleeve body and accessible for the plurality of heat transfer columns, and a sleeve formed on the sleeve The bottom of the block body communicates with the communication groove of the water inlet hole and each water circulation hole, and a water blocking wall extending downward from the bottom surface of the body of the block, the water blocking wall is adjacent to the water outlet hole of the cover. The effect is to set the water inlet hole on the housing Close to the bottom plate of the base, the cooling water can enter the bottom plate which is in contact with the electronic component and has a higher temperature from the beginning, and the water blocking wall of the block blocks the cooling water from flowing directly from the water outlet hole, so that Cooling water can flow upward along the periphery of each heat transfer column of the base, and then flows out from the water outlet hole, thereby allowing the cooling water to be forced to flow from bottom to top, and the heat absorption efficiency of the cooling water is increased by a large temperature difference. Therefore, the above-mentioned and other technical contents, features and effects of the present invention will be clearly described in the following detailed description of the four preferred embodiments with reference to the drawings. Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals. As shown in Figures 4 and 5, the first comparison of the water-cooled heat sink of the present invention Good 7 1281850 Stop! ^ s base 4, a casing 5 which can be fixed to the base 4, a set of sleeves 6 provided on the base 4, and a sealing ring 7. 4, the base 4 has a bottom plate 41, a plurality of heat transfer columns 42 arranged at intervals on the bottom plate, a ring groove 43 formed on the top surface of the bottom plate 41 and surrounding the plurality of hot columns 42, and four The bottom plate is located on the bottom of the ring groove 43 and is located at the position of the hole 44. In the first preferred embodiment, the heat transfer column 42 is cylindrical and extends upward from the bottom plate 41, and the hammer bottom plate 41 is integrally formed. Of course, the heat transfer column 42 is also It can be separately manufactured, and then combined and fixed on the bottom plate. The cover 5 has a top wall 51, a surrounding wall 52 extending downward from the periphery of the top wall 5, and a surrounding wall. An inlet pipe 53 on the 52, an outlet pipe 54 disposed on the surrounding wall 52 opposite to the inlet pipe 53, and four are not disposed on the outer side of the surrounding wall 52 and respectively correspond to the four positioning perforations of the base 4. The bump 55 of 44. The top wall 51 cooperates with the surrounding wall 52 to define a water receiving space 50 for accommodating cooling water. A water inlet hole 521 communicating with the water receiving space 5 and the water inlet pipe 53 is formed in the surrounding wall 52, and a water outlet hole 522 communicating with the water receiving space 50 and the water outlet pipe 54 and opposite to the water inlet hole 521, and Three recesses 523 are formed on the inner wall surface of the surrounding wall 52. The water inlet hole 521 is adjacent to the bottom plate 41 of the base 4, and the water outlet hole 522 is adjacent to the top wall 51. A screw hole 551 is formed in each of the bumps 55, and the four positioning holes 44 of the base 4 are respectively screwed into the corresponding screw holes 551 by using four screws (not shown), and the cover is screwed into the corresponding screw holes 551. 5 is fixedly attached to the base 4. 8 1281850 & Figure 6 „Hui cover 6 valley is placed in the water-receiving space 5〇 of the cover 5' and has a block body 61, a plurality of penetratingly formed on the sleeve body 61 and available for Each of the bases 4 has a water supply hole, a water passage hole 62 through which the column 42 extends, a communication groove 63 formed at the bottom of the sleeve body 61, and a resistance extending downward from the bottom surface of the sleeve body 61. a water sluice u ^ 64, a water-receiving recess # 65 formed on a top surface of the sleeve body 61 and adjacent to the water outlet hole 522, and three are respectively disposed on the outer surface of the sleeve body 61 and respectively corresponding to the housing A raised portion 66 in the three recessed portion 523 of the wall 52. The water blocking wall "is adjacent to the water outlet hole 522 in the cover 5 of the cover. In the first preferred embodiment, the water blocking wall 64 is located at a side edge of the sleeve body 61 so that cooling water can flow through each of the heat transfer columns 42 before being blocked by the water to the wall 64. stop. Each of the water circulation holes 62 has a larger diameter than each of the heat transfer columns 42 so that cooling water can flow in a space between each of the heat transfer columns 42 and the water circulation holes 62 to carry away the heat transfer columns 42. Heat. The communication groove 63 communicates with the water inlet hole 521 and each of the water circulation holes 62. The water blocking wall 64 is mainly for blocking the cooling water from directly flowing out of the water outlet hole 522 from the communication groove 63, and forcing the cooling water to enter the water circulation hole 62. The water receiving groove 65 communicates with the water circulation hole 62 adjacent to the water outlet hole 522 (that is, the water circulation hole 62 on the right half side of the sleeve 6), and can increase the cooling water waiting to be discharged from the water outlet hole 522. . Of course, the water-receiving groove 65 is not necessarily provided, and should not be limited thereto. The three bosses 66 are used to prevent an error in mounting orientation during assembly (or a foolproof function). In the actual design, only a single convex portion % can be used, and the corresponding concave portion 523 can be matched, and the purpose of preventing assembly error 1281850 can also be achieved, and the present invention should not be limited thereto. The seal ring 7 is disposed between the base 4 and the cover 5 so that the two can be brought into close contact to prevent leakage of cooling water from the water receiving space 5. In the first preferred embodiment, the sealing ring 7 is received in the ring 3 of the base 4 and is pressed by the surrounding wall 52 of the cover 5, the shape of the sealing ring 7. It is designed to match the shape of the ring groove 43. It should be noted that, in a continuous manner, the sealing ring 7 may not be provided, and the cover 5 may be sealingly adhered to the bottom plate 41 of the base 4 or the surrounding wall 52 may be embedded in the % slot. In the case of 43, the glue is fixed again, which also prevents water leakage, and should not limit the scope of the patent application of the present invention. As shown in FIG. 5, the water-cooling heat dissipating device is operated to allow cooling water to enter from the water inlet pipe 53 of the cover 5, and flows from the bottom of the water-receiving space 5 through the water inlet hole 521 of the surrounding wall 52. In the communication groove 63, due to the blocking action of the water blocking wall 64, the cooling water can be gradually raised in the water receiving space 5 and flow upward along the surface of each heat transfer column 42 to absorb the heat. Thereafter, the cooling water flowing out from each of the water circulation holes 62 flows out from the water outlet hole 522 of the top wall 51, and is discharged from the water outlet pipe 54, or is accommodated in the water receiving groove 65 for discharge. Since the bottom plate 41 of the susceptor 4 is in direct contact with the heat-generating electronic components (such as CPU, GPU) 'the bottom temperature of each heat transfer column 42 connected to the bottom plate 41 is higher, by the water inlet hole 521 Positioned adjacent to the bottom plate 41 of the base 4, the input cooling water can be first heat exchanged with the bottom of the higher temperature heat transfer column 42 and the water outlet hole 522 is disposed adjacent to the top wall 51. The cooling water is forced to flow upward again, 10 1281850 is discharged from the water outlet hole 522. When the temperature difference is larger, the heat absorption rate will also increase. Thus, the highest heat on the susceptor 4 is indeed taken away, effectively reducing the heat dissipation of the water-cooled heat sink. As shown in FIGS. 7 and 8, the second preferred embodiment of the water-cooling heat sink of the present invention is substantially the same as the first preferred embodiment, and the same portions are not described again. The difference is that: The water-cooling heat-dissipating device further includes a plurality of spiral guiding members 8 , and each guiding package 8 can be sleeved on each of the heat-transfer columns 42 of the base 4 and correspondingly disposed in each of the waters of the sleeve 6 Inside the flow hole 62. When the cooling water flows from the communication groove 63 of the sleeve 6 to each of the water circulation holes, the guiding package 8 can be used to guide the cooling water to spiral around the circumference of each heat transfer column 42 to pass through. The flow path is increased to extend the time that the cooling water contacts each heat transfer column 42 to increase the heat absorption. At the same time, the rafter cooperates with the heat transfer column 42 through each guide set 8 to form a capillary phenomenon, which provides the upward pulling force, allows the cooling water to flow upward, and stabilizes the flow law to reduce mutual interference and form a turbulent flow. The problem is that the cooling water can be stably and evenly absorbed. As shown in FIG. 9, the third preferred embodiment of the water-cooling heat sink of the present invention is substantially the same as the first preferred embodiment, and the same portions are not described again, wherein the difference is that the base is Each of the heat transfer columns 42 has a cylinder 421 and a guiding rib 422 extending helically outward from the cylinder 421. With each of the guiding ridges 422, the cooling water can be directed to flow around each of the cylinders 421, which also increases the flow path, prolongs the heat absorbing time, and reduces the interference problem. 1281850 As shown in FIG. 1 , a fourth preferred embodiment of the water-cooling heat sink of the present invention is substantially the same as the first preferred embodiment, and the same portions are not described again. The difference is that the base Each of the heat transfer columns 42 is formed with a spiral guiding groove 423. With each guiding groove 4, the cooling water can be guided to flow around each heat transfer column 42. Similarly, the flow path can be extended (4). Time and reduce the problem of interference to achieve the purpose of increasing heat absorption. In summary, the water-cooling heat dissipating device of the present invention is such that the water inlet hole 521 is adjacent to the bottom plate 41 of the base 4, and the water outlet hole 522 is disposed adjacent to the top wall 51 of the cover 5 so that the cooling water can be first Flowing to the bottom of the bottom plate per-heat transfer column 42, and then forcing the bottom-up flow to exit the "Hai water hole 522' can surely carry away the higher temperature heat portion. In addition, as shown in FIG. 810, 'the guide set 8' disposed outside each heat transfer column can be utilized or the guide groove 422 can be used, or the guide groove can be designed to guide the cooling water to spiral. The way the upward flow increases the flow path 'expanding the time of contact heat absorption to effectively improve the heat dissipation efficiency and reduce the interference phenomenon', so the object of the present invention can be achieved. However, the above description is only a preferred embodiment of the present invention, and when it is not possible to limit the present invention to the present invention, it is a matter of application, that is, according to the present invention, the patent application and the disclosure of the β brother The simple equivalent changes and modifications made by the inner valley are still within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view showing a conventional water-cooled heat dissipation for the Republic of China Announcement No. 17 "Café Water Cooling Device Change 12 1281850 New Patent Case; * Figure 2 is a top view illustrating Another conventional water-cooling type heat sink is a new type of patent of the Republic of China Paper No. 93214246 "Computer Water-cooled Heat Dissipating Device"; FIG. 3 is a cross-sectional side view, with reference to FIG. 2; FIG. 4 is an exploded perspective view. A first preferred embodiment of the water-cooled heat sink of the present invention is illustrated;
圖5是一剖面側視圖，配合說明圖4 ; 圖6是一立體圖，說明該水冷式散熱裝置之一套塊的 底部構造； 圖7是一立體分解圖，說明本發明水冷式散熱裝置之 第二較佳實施例； 圖8是一剖面側視圖，配合說明圖7 ; 圖9是一剖面側視圖，說明本發明水冷式散熱裝置之 第三較佳實施例；及Figure 5 is a cross-sectional side view, with reference to Figure 4; Figure 6 is a perspective view of the bottom structure of the block of the water-cooled heat sink; Figure 7 is an exploded perspective view of the water-cooled heat sink of the present invention Figure 2 is a cross-sectional side view, with reference to Figure 7; Figure 9 is a cross-sectional side view showing a third preferred embodiment of the water-cooled heat sink of the present invention;
圖10是一剖面側視圖 第四較佳實施例。 說明本發明水冷式散熱裂置之 13 1281850 【主要元件符號說明】 * …基座 523… …凹陷部 …底板 5 3 入水管 42…… 〃傳熱立柱 >出水管 421 …柱體 5 5…… …凸塊 4 2 2…… …引導凸垣 551 - 螺孔 423 ~ …引導凹槽 …套塊 ^ ΐ- …環槽 61 …套塊本體 …定位穿孔 62 …水流通孔 5…… /…殼蓋 63 ^ …連通槽 5 0… …容水空間 6 ^|· '· Κ， …阻水壁 51 ^ …頂壁 65 …容水凹槽 5 2…… …圍繞壁 66 凸起部 521 ……入水孔 7… . …密封環 522… …出水孔 8 — …引導套件Figure 10 is a cross-sectional side view of a fourth preferred embodiment. Description of the water-cooled heat-dissipating crack of the present invention 13 1281850 [Main component symbol description] * ... pedestal 523 ... recessed portion ... bottom plate 5 3 water inlet pipe 42 ... 〃 heat transfer column > water outlet pipe 421 ... cylinder 5 5... ...bumps 4 2 2 ... ... guide ridges 551 - screw holes 423 ~ ... guide grooves ... sleeves ^ ΐ - ... ring grooves 61 ... sleeve body ... positioning perforations 62 ... water circulation holes 5 ... /... Shell cover 63 ^ ... communication groove 5 0 ... water-contained space 6 ^|· '· Κ, ... water-blocking wall 51 ^ ... top wall 65 ... water-receiving groove 5 2 ... ... around wall 66 convex portion 521 ... ...water inlet hole 7.......seal ring 522...water outlet hole 8 - ... guide kit
1414