TW200735757A - Water-cooled heat-dissipating device - Google Patents

Water-cooled heat-dissipating device

Info

Publication number
TW200735757A
TW200735757A TW095108579A TW95108579A TW200735757A TW 200735757 A TW200735757 A TW 200735757A TW 095108579 A TW095108579 A TW 095108579A TW 95108579 A TW95108579 A TW 95108579A TW 200735757 A TW200735757 A TW 200735757A
Authority
TW
Taiwan
Prior art keywords
base
water
main part
thermal conductive
adjacent
Prior art date
Application number
TW095108579A
Other languages
Chinese (zh)
Other versions
TWI281850B (en
Inventor
Jian-Rong Chen
Chia-Chien Chu
Original Assignee
Yen Sun Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yen Sun Technology Corp filed Critical Yen Sun Technology Corp
Priority to TW95108579A priority Critical patent/TWI281850B/en
Application granted granted Critical
Publication of TWI281850B publication Critical patent/TWI281850B/en
Publication of TW200735757A publication Critical patent/TW200735757A/en

Links

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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

This invention relates to a water-cooled heat-dissipating device, comprising a base, a cover covering on the base, and a bushing piece sleeved on the base. The base has a bottom board and a plurality thermal conductive posts disposed alternately. The cover has a top wall and a surrounding wall, which has an inlet adjacent to the bottom board and an outlet adjacent to the top wall. The bushing piece has a main part, a plurality of circulation apertures penetrable by the thermal conductive posts, a connection trough formed at the bottom of the main part and communicative to the inlet and the circulation apertures, and a water stopping wall adjacent to the outlet of the cover extended from the bottom of the main part downwardly. By the arrangement, the cooling water can flow bottom-up along the circumference of each thermal conductive post and bring away the maximal heat so as to largely increase the efficiency of heat dissipation.
TW95108579A 2006-03-14 2006-03-14 Water-cooled heat-dissipating device TWI281850B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95108579A TWI281850B (en) 2006-03-14 2006-03-14 Water-cooled heat-dissipating device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95108579A TWI281850B (en) 2006-03-14 2006-03-14 Water-cooled heat-dissipating device

Publications (2)

Publication Number Publication Date
TWI281850B TWI281850B (en) 2007-05-21
TW200735757A true TW200735757A (en) 2007-09-16

Family

ID=38751668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95108579A TWI281850B (en) 2006-03-14 2006-03-14 Water-cooled heat-dissipating device

Country Status (1)

Country Link
TW (1) TWI281850B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI400421B (en) * 2010-01-14 2013-07-01 Asia Vital Components Co Ltd Heat exchanger structure
CN111829285B (en) * 2020-06-01 2022-11-25 佛山市伟卓铝业有限公司 Aluminum alloy heat abstractor with extend function
CN113289739B (en) * 2021-05-26 2023-09-08 亳州学院 Low-temperature wall-breaking grinding device for processing medicine and food homolog

Also Published As

Publication number Publication date
TWI281850B (en) 2007-05-21

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees