CN202565146U - Built-in type water-cooling heat radiation board for power module - Google Patents
Built-in type water-cooling heat radiation board for power module Download PDFInfo
- Publication number
- CN202565146U CN202565146U CN2012201559781U CN201220155978U CN202565146U CN 202565146 U CN202565146 U CN 202565146U CN 2012201559781 U CN2012201559781 U CN 2012201559781U CN 201220155978 U CN201220155978 U CN 201220155978U CN 202565146 U CN202565146 U CN 202565146U
- Authority
- CN
- China
- Prior art keywords
- water
- substrate
- built
- heat radiation
- power module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a built-in type water-cooling heat radiation board for a power module, which comprises an integral substrate. Watercourses are drilled inside the substrate. The watercourses are provided with at least a water inlet and at least a water outlet on the side face of the substrate. The built-in type water-cooling heat radiation board for the power module has the beneficial effects that by adopting the integral substrate, the water leakage phenomenon can be effectively avoided under a continuous vibration condition, the heat radiation effect of the power module can be improved, running of a device is more reliable, difficulty of production technology can be reduced and the production cost can be reduced.
Description
Technical field
The utility model relates to a kind of power model and uses built-in water-cooling plate.
Background technology
Along with the fast development of power electronic technology, power model is as the core component of current transformer, and its cooling technology is very crucial, directly has influence on the reliability of equipment operation.The main type of cooling of existing power model has: natural cooling, forced air cooling, boiler water circulation cooling etc.; Wherein the boiler water circulation cooling is with its good cooling results; The heat-radiating substrate volume is little, particularly can more and more be used widely with the shared same water circulation system of other parts that need cool off in the system.
Generally be employed in the substrate of surface fluting, add a cover plate again, play heat sinking function, but this kind structure can not guarantee good sealing under the condition that continues vibrations, occur the situation of infiltration easily, influence the life-span of equipment through the fluid sealant sealing.
Summary of the invention
Be technical deficiency more than solving, it is a kind of simple in structure that the utility model provides, and the power model of having avoided drainage under the condition that continues vibrations, occurring is used built-in water-cooling plate.
The utility model is realized through following measure:
A kind of power model of the utility model is used built-in water-cooling plate, comprises a monolith substrate, said base
Be drilled with water channel in the plate, said water channel is provided with a water inlet and a delivery port at least in substrate side surfaces.
Above-mentioned water channel comprises some cross channels and two the vertical water channels that are connected, and cross channel is in substrate side surfaces
The equal shutoff of opening sealing screw is arranged, said two vertical water channels at two openings of substrate side surfaces respectively as water inlet and delivery port.
Aforesaid substrate is an aluminum material.
The beneficial effect of the utility model is:
Adopt monolith substrate, effectively avoided under the condition that continues vibrations, drainage occurring, improved the radiating effect of power model, make equipment operation more reliable, reduced the manufacture craft difficulty, reduced cost of manufacture.
Description of drawings
Fig. 1 is the cross-sectional view of the utility model.
Among the figure: 1 substrate, 2 vertical water channels, 3 cross channels, 4 sealing screws, 5 water inlets, 6 delivery ports.
Embodiment
As shown in Figure 1, a kind of power model of the utility model is used built-in water-cooling plate, comprises an integral body and has certain thickness substrate 1, and be drilled with water channel in the substrate 1, water channel is provided with a water inlet 5 and a delivery port 6 at least in substrate side surfaces.Cooling water gets into water channel from water inlet 5, flows out from delivery port 6 then, takes away heat.Water channel can be drilled to tortuous circuitous passage also can be drilled to crisscross form.
Enumerate a kind of embodiment at present, water channel be drilled to some cross channels 3 and two the vertical water channels 2 that are connected,
Cross channel 3 has sealing screw 4 in the equal shutoff of opening of substrate 1 side, adds fluid sealant, plays the effect of sealing.Two vertical water channels 2 at two openings of substrate 1 side respectively as water inlet 5 and delivery port 6.Processing is got up more conveniently like this, and cost is lower.Substrate 1 aluminium prepared material, heat-conducting effect is better.Be applicable to the heat radiation of IGBT, IPM constant power module.
The foregoing description is said to be in order to specify this patent; Though describe through specific term in the literary composition; But can not limit the protection range of this patent with this; The personage who is familiar with this technical field can change or revise it after the spirit of understanding this patent and principle and reach equivalent purpose, and this equivalence change and modification all should be covered by the claim scope and define in the category.
Claims (3)
1. a power model is used built-in water-cooling plate, it is characterized in that: comprise a monolith substrate, be drilled with water channel in the said substrate, said water channel is provided with a water inlet and a delivery port at least in substrate side surfaces.
2. use built-in water-cooling plate according to the said power model of claim 1; It is characterized in that: said water channel comprises some cross channels and two the vertical water channels that are connected; Cross channel has sealing screw in the equal shutoff of the opening of substrate side surfaces, said two vertical water channels at two openings of substrate side surfaces respectively as water inlet and delivery port.
3. use built-in water-cooling plate according to claim 1 or 2 said power models, it is characterized in that: said substrate is an aluminum material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201559781U CN202565146U (en) | 2012-04-13 | 2012-04-13 | Built-in type water-cooling heat radiation board for power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201559781U CN202565146U (en) | 2012-04-13 | 2012-04-13 | Built-in type water-cooling heat radiation board for power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202565146U true CN202565146U (en) | 2012-11-28 |
Family
ID=47214757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201559781U Expired - Fee Related CN202565146U (en) | 2012-04-13 | 2012-04-13 | Built-in type water-cooling heat radiation board for power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202565146U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107724A (en) * | 2013-01-29 | 2013-05-15 | 上海电气集团股份有限公司 | Modularized structure of three-level converter |
| CN111829285A (en) * | 2020-06-01 | 2020-10-27 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with extend function |
-
2012
- 2012-04-13 CN CN2012201559781U patent/CN202565146U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103107724A (en) * | 2013-01-29 | 2013-05-15 | 上海电气集团股份有限公司 | Modularized structure of three-level converter |
| CN111829285A (en) * | 2020-06-01 | 2020-10-27 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with extend function |
| CN111829285B (en) * | 2020-06-01 | 2022-11-25 | 佛山市伟卓铝业有限公司 | Aluminum alloy heat abstractor with extend function |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080314559A1 (en) | Heat exchange structure and heat dissipating apparatus having the same | |
| WO2016138692A1 (en) | Power device parallel cooling structure and electric machine controller applied by same | |
| CN202364524U (en) | Water cooling plate for cooling large-power electric power electronic device | |
| CN203896658U (en) | Water-cooled plate heat radiator | |
| CN202565146U (en) | Built-in type water-cooling heat radiation board for power module | |
| CN103458666A (en) | Double-circulation-waterway semiconductor laser refrigerating system | |
| CN103607871B (en) | A kind of cooling water channel and controller housing for power-supply controller of electric | |
| TWI744363B (en) | Cold plate assembly for electrical cabinet | |
| CN204168700U (en) | One has flow-disturbing and to interlock step straight channel cooled plate | |
| CN203490629U (en) | Liquid cooling type case | |
| CN202977401U (en) | Liquid-cooled heat dissipation module | |
| CN208523134U (en) | A kind of embedded runner liquid cooling heat-exchanger rig of printed circuit board | |
| CN207601706U (en) | A kind of casing structure for facilitating heat dissipation | |
| WO2017049867A1 (en) | Heat dissipation device and heat dissipation plate thereof | |
| CN104349648B (en) | Combined radiating component | |
| CN203537687U (en) | Case | |
| CN201532050U (en) | Cooling plate | |
| TW200741433A (en) | Liquid-cooling heat sink | |
| CN108541200B (en) | High-efficient compound heat dissipation circuit board | |
| CN203930664U (en) | A kind of cpu heat | |
| CN206040367U (en) | Forced air cooling water -cooling integrated form reactor | |
| CN203490627U (en) | Cooling type case | |
| CN207235325U (en) | Cooling device | |
| CN220782633U (en) | Water cooling structure and cooling system | |
| CN203645978U (en) | Water-cooling electronic heat radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121128 Termination date: 20150413 |
|
| EXPY | Termination of patent right or utility model |