TW200741433A - Liquid-cooling heat sink - Google Patents

Liquid-cooling heat sink

Info

Publication number
TW200741433A
TW200741433A TW095115376A TW95115376A TW200741433A TW 200741433 A TW200741433 A TW 200741433A TW 095115376 A TW095115376 A TW 095115376A TW 95115376 A TW95115376 A TW 95115376A TW 200741433 A TW200741433 A TW 200741433A
Authority
TW
Taiwan
Prior art keywords
liquid
heat
heat sink
casing
cooling
Prior art date
Application number
TW095115376A
Other languages
Chinese (zh)
Other versions
TWI292863B (en
Inventor
Cheng-Tien Lai
Zhi-Yong Zhou
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW95115376A priority Critical patent/TWI292863B/en
Publication of TW200741433A publication Critical patent/TW200741433A/en
Application granted granted Critical
Publication of TWI292863B publication Critical patent/TWI292863B/en

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A liquid-cooling heat sink used for cooling a heat generating electronic element is disclosed. The liquid-cooling heat sink includes a casing and a heat exchanger enclosed within the casing. An inlet and an outlet are defined through the casing. The heat exchanger comprises a plurality of heat exchanging plate having at least one opening formed thereon stacked one on another. The at least one opening of each heat exchanging plate is fluidly connected to the at least one opening of at least one adjacent heat plate so as to forming at least one flow channel for a liquid coolant.
TW95115376A 2006-04-28 2006-04-28 Liquid-cooling heat sink TWI292863B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW95115376A TWI292863B (en) 2006-04-28 2006-04-28 Liquid-cooling heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW95115376A TWI292863B (en) 2006-04-28 2006-04-28 Liquid-cooling heat sink

Publications (2)

Publication Number Publication Date
TW200741433A true TW200741433A (en) 2007-11-01
TWI292863B TWI292863B (en) 2008-01-21

Family

ID=45067656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW95115376A TWI292863B (en) 2006-04-28 2006-04-28 Liquid-cooling heat sink

Country Status (1)

Country Link
TW (1) TWI292863B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558971B (en) * 2015-01-30 2016-11-21 訊凱國際股份有限公司 Liquid-cooled-type heat-dissipating structure and method of manufacturing the same
WO2022253241A1 (en) * 2021-06-03 2022-12-08 苏州汇川联合动力系统有限公司 Heat exchange assembly, heat dissipation structure, and electric motor controller

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI698620B (en) * 2018-05-08 2020-07-11 大陸商上海綠曜能源科技有限公司 Liquid-heat-transmission device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI558971B (en) * 2015-01-30 2016-11-21 訊凱國際股份有限公司 Liquid-cooled-type heat-dissipating structure and method of manufacturing the same
WO2022253241A1 (en) * 2021-06-03 2022-12-08 苏州汇川联合动力系统有限公司 Heat exchange assembly, heat dissipation structure, and electric motor controller

Also Published As

Publication number Publication date
TWI292863B (en) 2008-01-21

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Legal Events

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MC4A Revocation of granted patent