1291610 九、發明說明： 【發明所屬之技術領域】 本發明是有關於一種電子元件的散熱器，特別是指 種水冷式散熱裝置。 疋曰 【先前技術】 隨著科技的進步，電腦的運算速度亦日趨千里，快亲 地倍增當中、然而，運算速度的增進，所面臨的—大門： 即是散熱問題，對於中央處理器（CPU)讀圖處理器 更是如此…般而言’大都是在咖與GPU電子元°件上加 裝散熱器，早期的散熱器僅需要鋁製的散熱鰭片，之後， ，於散熱鰭片上加裝風扇’利用加快氣流的流動，以提高 政熱置。近年來’ ％出現利用冷卻水流來增加攜熱量的水 冷式散熱裝置，以突破傳統利用氣流散熱的限制。 如圖1所示’習知之水冷式散熱裝置1，如中華民國公 告案號第458317號「CPU水冷散熱裝置之改良」新型專利 案^包含一底座U、一蓋合於該底座n之頂蓋12，及設置 在該頂蓋12上的-入水管13肖一出水管14。該底座。上 形成有-呈彎曲狀並與該入、出水管13、14連通的水道 m，藉此使冷卻水於該彎㈣水道⑴中流動，以達到吸 熱效果。 ,、由上述說明不難發現，在實際使用上，由於底部的冷 部水#父罪近CPU，較容易吸收熱量，因此其溫昇會較快。 眾所皆知的是，當兩物體的溫差減小時，則其吸熱效率亦 會隨之降低，該水冷式散熱裝置1的水流設計並未能有效 1291610 部較高溫的冷卻水向上帶離，致使其常處於底部而 衫a及熱效果。再者，冷卻水所流㈣面積 熱功能仍然有限。 其政 如圖 2、3所+，口 ^BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink for an electronic component, and more particularly to a water-cooled heat sink.疋曰[Prior Art] With the advancement of technology, the computing speed of computers is becoming more and more thousands of miles, and the speed of the computer is doubled. However, the increase in computing speed is faced with the door: the heat dissipation problem, for the central processing unit (CPU) The reading processor is even more so... Generally speaking, most of the heat sinks are added to the GPU and the GPU. The early heat sinks only need aluminum fins. After that, they are added to the heat sink fins. The fan is 'utilized to speed up the flow of airflow to improve the heat. In recent years, '% of water-cooled heat sinks that use cooling water flow to increase heat transfer have emerged to break the traditional use of airflow cooling. As shown in FIG. 1 , the conventional water-cooled heat sink 1 , such as the Republic of China Announcement No. 458317, "Improvement of CPU Water Cooling Heat Dissipation Device", includes a base U and a cover that covers the base n 12, and the water inlet pipe 13 disposed on the top cover 12 is a water outlet pipe 14. The base. A water channel m which is curved and communicates with the inlet and outlet pipes 13, 14 is formed thereon, whereby cooling water flows in the curved (four) water channel (1) to achieve an endothermic effect. According to the above description, it is not difficult to find that in actual use, since the cold water at the bottom is the father of the CPU, it is easier to absorb heat, so the temperature rise will be faster. It is well known that when the temperature difference between the two objects is reduced, the heat absorption efficiency is also reduced. The water flow design of the water-cooling heat sink 1 fails to effectively remove the 1291210 higher-temperature cooling water, resulting in It is often at the bottom and has a thermal effect. Furthermore, the cooling water flow (4) area heat function is still limited. Its political picture 2, 3 +, mouth ^
斤不另一習知之水冷式散熱裝置2,如中 ==請案號第93214246號「電腦水冷式散熱裝置」新 ’是為改善上制題而設計，該水冷式散熱裝置2 匕3底板21、—可與該底板21蓋合的殼座22、多數褒 集設f於該底板21上並容置於該殼座22内的散熱韓片；; ’及叹置在該殼座22兩侧的_人水管24與_出水管^。 使冷卻水自該人水管24流人，並通過所述的散熱鰭片Μ 進灯吸熱，再於該出水管25流出，以數眾多且錢的散熱 鰭片23，來增加吸熱面積。 ”，、:而’因為所述之散熱鰭片23密集設置的關係，阻礙 了冷卻水的流動，而迫使大部分的冷卻水會沿著阻礙較小 的周邊空間流動，使得通過所述之散熱鰭片23的流量減少 ，讓散熱效果的提昇變得很有限。同樣地，位於底部的冷 卻水亦未能有效地被向上帶離’仍然未能有效地發揮該水 冷式散熱裝置2應有之散熱效果。 【發明内容】 因此，本發明之目的，即在提供一種水冷式散熱裝置 ’可以使冷卻水進行上下的流動，增加流動路徑，並可將 底部高溫部分的熱量帶走，藉以提高散熱效率。 於是’本發明之水冷式散熱裝置，包含一基座，一可 與該基座相互蓋合的殼蓋、及一套設於該基座上的套塊， 6 1291610 該基座具有一底板，及間隔且直立地設置在該底板上的複 數傳熱立柱、一入水管與一出水管，該入水管與出水管是 位於該底板之兩相反侧並分別具有鄰近該底板的一入水口 與一出水口，該殼蓋具有一頂壁，及一自該頂壁周緣向下 延伸的圍繞壁，該頂壁與圍繞壁相配合可界定出一容水空 間，該頂壁上形成有分別與該基座之入水管及出水管相對 應的一入水套孔及一出水套孔，該套塊容置於該殼蓋之容 水空間中並具有一套塊本體、複數貫通地形成於該套塊本 體上並可供该複數傳熱立柱穿伸的水流通孔、分別套設於 該基座之入水管與出水管的一入水通孔與一出水通孔，及 形成於该套塊本體底面並分別連通該基座上之入水口、出 水口的第一凹槽、第二凹槽，該第一、第二凹槽可界定出 一位於該入、出水通孔之間的阻水壁。 讓冷部水於该设蓋之入水套孔流入，進到該基座之入 水管，並從該入水孔流至該套塊之第一凹槽中，由於該阻 水壁的關係，冷部水會被阻擋而沿著與該第一凹槽連通的 水流通孔向上流動，並再流入與該第二凹槽連通的水流通 孔中，接著，冷卻水會向下流人該第二凹槽中，再流入該 出水管之出水口，最後，從該殼蓋之出水套孔流出。 本發明之功效在於將該入水管之入水口設置在鄰近該 底板，讓冷卻水1始即可進入與電子元件接觸而溫度較 高的底板處，利用該套塊之阻水壁，可使冷卻水能沿著每 一傳熱立柱表面由下而上的流動，將較高溫的熱量帶走。 配合設置在鄰近該底板的出水口，再讓冷卻水向下流至該 7 1291610 第二凹槽中’以延長冷卻水的流動路徑，藉以提高散熱效 率。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之四個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明中’類似的元件是以相同的編號來表示。 如圖4、5所示，本發明之水冷式散熱裝置的一第一較 佳貫加例，包含一基座4、一可與該基座4相互蓋合的殼蓋 5、一套設在該基座4上的套塊6，及一密封環7。 該基座4具有一底板41、複數間隔且直立地設置在該 底板41上的傳熱立柱42、一與該複數傳熱立柱42間隔且 直立於該底板41 一側的入水管43、一與該複數傳熱立柱 42間隔且直立地位於該入水管43相對側的出水管44、一 形成於该底板41頂面並環繞該複數傳熱立柱42、入水管 43與出水管44的環槽45，及四相間隔地形成於該底板41 上並位於該環槽45外側的定位穿孔46。該入水管43具有 一鄰近於該底板41的入水口 431，及二分隔地設置於其外 周面上的卡位凸柱432。該出水管44亦具有—鄰近該底板 41的出水口 44丨，及二分隔地設置於其外周面上的卡位凸 柱442。在該第一較佳實施例中，該底板41、傳熱立柱42 、入水管43’及出水管44為_體成型的製成，當然，也可 以分別製造，最後再予以結合固定於該底板41上。 1291610 该殼蓋5具有一頂壁51、一自該頂壁5ι周緣向下延 :【:壁52，及四設置在該圍繞壁52外側面上並分別對應 ° 4之四定位穿孔46的凸塊53。該頂壁51與圍繞壁 52相配合界定出-可容納泠卻水的容水空間50，該頂辟51 形成有分難該基座4之人水f 43及出水f 44㈣1的 -入水套孔511及一出水套孔512，每一凸塊53形成有一 j孔531。可利用四根螺絲（圖未示）穿過該基座4之四定位 穿孔46並螺鎖於對應的螺孔531中，而將該殼蓋5固 合在該基座4上。 配合圖6’該套塊6是容置於該殼蓋5之容水空間5( 中並套設於該基座4上，該套塊6具有—概呈矩形的套塊 本體61、禝數貫通地形成於該套塊本體6ι並可供該複數傳 熱立柱42穿伸的水流通孔62、分別套設於該基座*之入水 管；43與出水管44的—人水通孔63與—出水通孔料、形成 於該套塊本體61底面並分別連通該基座上4之入水口 431 與出水口 441的第一凹槽65與第二凹槽“，及四分別與該 入水通孔63與出水通孔64連通並可容置所述卡位凸柱⑶ 、442的凹_ 67。該第一、第二凹槽&、^可界定出一 位於該入、出水通孔63、64之間的阻水壁68。 每-個水流通孔62的直徑均大於每一傳熱立柱U，使 冷卻水於每—個傳熱立柱42與水流通孔62之間的空間流 動，以帶走所述傳熱立柱42上的熱量。該阻水壁⑽主要 是讓進人該第65的冷卻水能被強迫地向上流入與該 第一凹槽65連通的水流通孔62中。 1291610 在該第一較佳實施例中，是利用四卡位凸柱432、442 分別與該四凹陷槽67嵌合，其目的是為了避免組裝錯誤， 當然也可只設置單一卡位凸柱432，及單一對應的凹陷槽 67，同樣可以防止組裝錯誤，不應以此侷限本發明之申請 專利範圍。 另外，也可透過該殼蓋5與套塊6的外型設計，例如 殼蓋5形成有至少一凹槽部，而該套塊6則對應形成有可 卡制於該凹槽部的凸柱部，使兩者僅能有單一的組合方式 ’達到組裝防呆的功能。 需說明的是，使用時，是將二水管接頭（pipe J〇int，圖 中未顯示）螺設於該頂壁51之入水套孔511與出水套孔5i2 中。然而，該二水管接頭鎖入後會向下凸出該頂壁51，而 佔用到該料空間5〇。因此，在圖4中可以發現，該套塊 6頂面之相對位置上形成有二大於該入水通孔〇與出水通 孔64的環凹槽，以閃避該二水管接頭凸出的部分。當然， 若該二水管接頭未向下凸時，則無須形成該二環凹槽之必 要。 。亥饴封環7是設置在該基座4與該殼蓋5之間，使兩 者旎達到密合，以防止冷卻水從該容水空間5()中洩漏。在 該第一較佳實施例中，該密封環7是容置於該基座4之環 槽45中並被該殼蓋5之圍繞壁52所抵壓。應注意的是， 在貝際上，也可以不設置該密封環7，直接將該殼蓋5黏固 於该基座4之底板41上，或是使該圍繞壁52嵌入該環槽 45中，再予以膠合固定，同樣能防止漏水，不應以此侷限 10 1291610 本發明之申請專利範圍。 如圖5所示’並配合圖中顯示箭頭的方向，當冷卻水 從該殼蓋5之入水套孔511流入時，會進到該基座4之入水 管43中，再從該入水管43下方的入水口 431流入該套塊6 之第一凹槽65中。由於該阻水壁68擋止的關係，冷卻水 會逐漸充滿該第一凹槽65，並沿著與該第一凹槽65連通的 水流通孔62向上流動，讓冷卻水可接觸每一傳熱立柱c 的表面’將底部最高的熱量由下而上的帶走。 而後，冷卻水會繼續往圖中右邊方向流動，並流入與 該第二凹槽66連通的水流通孔62中，再向下流入該第二 凹槽66中，在上述的水流通孔62中流動時，同樣地，: 能將每-傳熱立柱42上的熱量帶走。接著，已吸收敎量的 冷卻水會從該出水管44之出水口 441流入該出水管Μ中 ’沿著該出水管44向上流動。最後，從純蓋$之出水套 孔512流出。藉此，使冷卻水可上下地流動，延長其行 路徑’提高其散熱效率。 如圖7、8所示，本發明水冷式散熱裝置之第二較佳奋 施例’大致上是與該第一較佳實施例相同，相同之處不： 費述之處在於：該水冷式散熱裝置更包含複數 呈螺旋狀的引導套件8，每一 W ¥套件8可套設於該基座4 之每一傳熱立柱42上並對應容置 置於省套塊ό之母一水流通 孔62内。 當冷卻水在該套塊6之每一 叮、泰— 水/瓜通孔62中上下流動時 ，可透過該等W導套妹S沾、· Τ 、引導作用，讓冷卻水以螺旋狀 I291610 的方式環繞於該等傳熱立柱42表面流動，藉此增加流動的 路徑，延長冷卻水接縣—傳熱錄42的日㈣，提昇吸敎 置。同時’能透過該等引導套件8與傳熱立柱42相配合形 成毛細現象’提供向上拉弓丨的力f，讓冷卻水向上流動， 並使其流動規律穩定，以減少相互干涉而形成擾流的問題 ’使冷卻水能穩定均勻吸熱。 的一第三較佳 ，相同之處不 如圖9所示，本發明之水冷式散熱裝置 實施例，大致上是與該第一較佳實施例相同 再贅述，其中不同之處在於：該基座4之每—㈣立柱42 具有一柱體421，及—自該柱體421向外螺旋地延伸的引導 凸垣422。利用每1導凸垣422可引導冷卻水環繞每一柱 體421流動，亦可増加流動路徑、延長吸熱時間並減少干 涉問題，以提高吸熱量。 如圖10所不，本發明水冷式散熱裝置之一第四較佳實 施例，大致上是與該第一較佳實施例相同，相同之處不再 贅述’其中不同之處在於：該基座4之每一傳熱立柱42上 形成有一呈螺旋狀的引導凹槽423,利用每一引導凹槽 可引導冷卻水環繞每一傳熱立柱42㈣，同樣可以增加流 動路徑、延長吸熱時間並減少干涉的問題，達到提高吸熱 量之目的。 歸納上述，本發明之水冷式散熱裝置，是將該入水管 43之入水口 431鄰近於該基座4之底板41附近，使冷卻水 可一開始即接觸溫度較高的底板41，接著，利用該套塊6 之阻水壁68，讓冷卻水可被強迫地向上流動，將熱量由下 12 !29161〇 而上地帶走。同時，藉由將該出水管44之出水口 44ι鄰近 ^該底板4卜使得冷卻水可以再向下流動，增加流動的路 徑。另外，如圖8所示，可利用設置在每一傳熱立柱42外 的引導套件8，或是利用所述的引導凸垣422(見圖％，或是 引導凹槽423(見® 1〇)之設計，引導冷卻水以螺旋的方式向 上流動，增加流動的路徑，延長接觸吸熱的時間，以有效 地提同政熱里並且可減少流動干涉的現象，故確實能達到 本發明之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是一立體分解圖，說明一習知之水冷式散熱裝置 為中華民國公告第458317號「CPU水冷散熱裝置之改良」 新型專利； 圖2疋一俯視圖，說明另一習知之水冷式散熱裝置為 中華民國申請案號第93214246號「電腦水冷式散熱裝置」 新型專利； 圖3是一剖面側視圖，配合說明圖2 ; 圖4疋一立體分解圖，說明本發明水冷式散熱裝置之 第一較佳實施例； 圖5是一局部剖面立體圖，說明冷卻水在該第一較佳 實施例中流動的狀況； 13 1291610 圖6是一立體圖 底部構造； 外圖疋體刀解圖，說明本發明水冷式散熱裝置之 弟二較佳實施例； 圖8疋一局部剖面立體圖，配合說 圖 9 θ 疋局。卩剖面立體圖，說明本發明水冷式散熱裝 置之苐三較佳實施例；及It is not the other known water-cooling heat sink 2, such as the medium == case number No. 93214246 "computer water-cooled heat sink" new ' is designed to improve the problem, the water-cooled heat sink 2 匕 3 bottom plate 21 a housing 22 that can be covered with the bottom plate 21, a plurality of heat sinks that are disposed on the bottom plate 21 and housed in the housing 22; and 'sigh on both sides of the housing 22 _ man water pipe 24 with _ outlet pipe ^. The cooling water flows from the human water pipe 24, and absorbs heat through the heat radiating fins, and then flows out of the water outlet pipe 25 to increase the heat absorbing area by the numerous heat radiating fins 23. ",, and: 'Because of the dense arrangement of the fins 23, the flow of cooling water is hindered, and most of the cooling water is forced to flow along the obstructing smaller peripheral space, so that heat is dissipated through the said The flow rate of the fins 23 is reduced, so that the heat dissipation effect is limited. Similarly, the cooling water at the bottom is not effectively taken up by the 'still failing to effectively exert the water-cooling heat sink 2 SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a water-cooling heat dissipating device that allows the cooling water to flow up and down, increases the flow path, and removes heat from the high temperature portion of the bottom portion, thereby improving heat dissipation. The water-cooling heat sink of the present invention comprises a base, a cover that can be covered with the base, and a set of sleeves disposed on the base. 6 1291610 The base has a a bottom plate, and a plurality of heat transfer columns, a water inlet pipe and an outlet pipe disposed at an interval and upright on the bottom plate, wherein the water inlet pipe and the water outlet pipe are located on opposite sides of the bottom plate and respectively There is a water inlet and a water outlet adjacent to the bottom plate, the cover has a top wall, and a surrounding wall extending downward from the periphery of the top wall, the top wall cooperates with the surrounding wall to define a water-receiving space a water inlet hole and a water outlet hole respectively corresponding to the inlet pipe and the outlet pipe of the base are formed on the top wall, and the sleeve is received in the water receiving space of the cover and has a set of blocks a body, a plurality of through-holes formed on the sleeve body, and a water circulation hole through which the plurality of heat transfer columns can be pierced, and a water inlet hole and a water outlet hole respectively formed in the inlet pipe and the outlet pipe of the base And a first groove and a second groove formed on a bottom surface of the sleeve body and respectively communicating with the water inlet and the water outlet of the base, the first and second grooves defining a water inlet and a water outlet a water blocking wall between the through holes. The cold water flows into the water inlet hole of the cover, enters the water inlet pipe of the base, and flows from the water inlet hole into the first groove of the sleeve, due to The relationship of the water blocking wall, the cold water is blocked and flows along the water flowing in the first groove The through hole flows upward and flows into the water circulation hole communicating with the second groove, and then the cooling water flows down into the second groove, and then flows into the water outlet of the outlet pipe, and finally, from the shell The water outlet hole of the cover flows out. The effect of the invention is that the water inlet of the water inlet pipe is disposed adjacent to the bottom plate, so that the cooling water 1 can enter the bottom plate which is in contact with the electronic component and has a higher temperature, and the block is utilized. The water blocking wall allows the cooling water to flow from the bottom to the top along the surface of each heat transfer column to carry away the higher temperature heat. The water is disposed adjacent to the water outlet of the bottom plate, and then the cooling water flows down to the water. 7 1291610 'In the second groove' to extend the flow path of the cooling water, thereby improving the heat dissipation efficiency. [Embodiment] The foregoing and other technical contents, features and effects of the present invention are preferably combined with the following four reference drawings. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the detailed description of the present invention, it is to be noted that in the following description, the same elements are denoted by the same reference numerals. As shown in FIG. 4 and FIG. 5, a first preferred embodiment of the water-cooling heat dissipating device of the present invention comprises a base 4, a cover 5 which can be covered with the base 4, and a set of The sleeve 6 on the base 4 and a sealing ring 7. The base 4 has a bottom plate 41, a plurality of heat transfer columns 42 that are vertically disposed on the bottom plate 41, and a water inlet pipe 43 spaced apart from the plurality of heat transfer columns 42 and standing on the side of the bottom plate 41. The plurality of heat transfer columns 42 are spaced apart from the outlet pipe 44 on the opposite side of the inlet pipe 43 , and a ring groove 45 formed on the top surface of the bottom plate 41 and surrounding the plurality of heat transfer columns 42 , the inlet pipe 43 and the outlet pipe 44 . And positioning holes 46 formed on the bottom plate 41 at four intervals and located outside the ring groove 45. The water inlet pipe 43 has a water inlet 431 adjacent to the bottom plate 41, and two latching projections 432 disposed on the outer circumferential surface thereof. The water outlet pipe 44 also has a water outlet 44丨 adjacent to the bottom plate 41, and two latching projections 442 disposed on the outer peripheral surface thereof. In the first preferred embodiment, the bottom plate 41, the heat transfer column 42, the water inlet pipe 43', and the water outlet pipe 44 are formed by body molding. Of course, they may be separately manufactured, and finally combined and fixed to the bottom plate. 41. 1291610 The cover 5 has a top wall 51 and a downward extension from the periphery of the top wall 5 ι: [: wall 52, and four convex portions disposed on the outer side of the surrounding wall 52 and corresponding to the positioning of the perforations 46 respectively. Block 53. The top wall 51 cooperates with the surrounding wall 52 to define a water-receiving space 50 for accommodating the water, and the apex 51 is formed with a water inlet hole for the human water f 43 and the water f 44 (four) 1 of the base 4 511 and a water outlet hole 512, each of the protrusions 53 is formed with a j hole 531. Four screws (not shown) can be used to position the perforations 46 through the four of the bases 4 and are screwed into the corresponding screw holes 531, and the cover 5 is fixed to the base 4. The sleeve 6 is placed in the water-receiving space 5 of the cover 5 and is sleeved on the base 4. The sleeve 6 has a substantially rectangular sleeve body 61 and a number of turns. a water circulation hole 62 formed in the sleeve body 6 through the plurality of heat transfer columns 42 and a water inlet hole 62 which is respectively sleeved on the base *; and a water passage hole 63 of the outlet pipe 44 And a water outlet through hole, a first groove 65 and a second groove formed on the bottom surface of the sleeve body 61 and respectively communicating with the water inlet 431 and the water outlet 441 of the base 4, respectively, and the water entering the water The through hole 63 is in communication with the water outlet through hole 64 and can accommodate the recess_67 of the latching post (3), 442. The first and second recesses &, ^ can define a through hole in the inlet and outlet. The water blocking wall 68 between 63 and 64. The diameter of each water circulation hole 62 is larger than that of each heat transfer column U, so that the cooling water flows in the space between each heat transfer column 42 and the water circulation hole 62. To remove the heat from the heat transfer column 42. The water blocking wall (10) is mainly for letting the 65th cooling water be forcibly flowed upward into the water flow communicating with the first groove 65. In the first preferred embodiment, the four-position studs 432, 442 are respectively engaged with the four recessed grooves 67 for the purpose of avoiding assembly errors, and of course, only a single card can be set. The studs 432 and the single corresponding recessed grooves 67 can also prevent assembly errors, and should not be limited to the scope of the patent application of the present invention. Alternatively, the outer cover of the cover 5 and the sleeve 6 can be designed, for example. The cover 5 is formed with at least one groove portion, and the sleeve 6 is correspondingly formed with a stud portion that can be engaged with the groove portion, so that the two can only have a single combination manner to achieve assembly and foolproof function. It should be noted that, in use, a pipe joint (not shown) is screwed into the water inlet hole 511 and the water outlet hole 5i2 of the top wall 51. However, the two water pipe joint After locking, the top wall 51 is protruded downward and occupied into the material space. Therefore, it can be found in FIG. 4 that the relative positions of the top surfaces of the sleeves 6 are formed to be larger than the water inlet holes. a ring groove with the outlet hole 64 to evade the protrusion of the two water pipe joint Of course, if the two water pipe joints are not convex downward, it is not necessary to form the two ring grooves. The sealing ring 7 is disposed between the base 4 and the cover 5 so that both The crucible is brought into close contact to prevent the cooling water from leaking from the water-receiving space 5 (). In the first preferred embodiment, the sealing ring 7 is received in the ring groove 45 of the base 4 and is The cover 5 is pressed against the wall 52. It should be noted that, on the shell, the seal ring 7 may not be provided, and the cover 5 may be directly adhered to the bottom plate 41 of the base 4, or The surrounding wall 52 is embedded in the annular groove 45 and then glued and fixed, which can also prevent water leakage, and should not be limited to the scope of patent application of the present invention. As shown in FIG. 5, and in the direction of the arrow shown in the figure, when the cooling water flows in from the water inlet hole 511 of the cover 5, it enters the water inlet pipe 43 of the base 4, and from the water inlet pipe 43 again. The lower water inlet 431 flows into the first recess 65 of the sleeve 6. Due to the blocking relationship of the water blocking wall 68, the cooling water gradually fills the first groove 65 and flows upward along the water circulation hole 62 communicating with the first groove 65, so that the cooling water can contact each pass. The surface of the hot column c' takes the highest heat from the bottom up. Then, the cooling water continues to flow in the right direction in the figure, flows into the water circulation hole 62 communicating with the second groove 66, and flows downward into the second groove 66, in the water circulation hole 62 described above. When flowing, similarly: The heat on each heat transfer column 42 can be carried away. Then, the chilled water that has absorbed the enthalpy flows from the water outlet 441 of the outlet pipe 44 into the outlet pipe ’ along the outlet pipe 44. Finally, it flows out of the water outlet 512 of the pure cover. Thereby, the cooling water can flow up and down, and the traveling path is extended to improve the heat dissipation efficiency. As shown in FIGS. 7 and 8, the second preferred embodiment of the water-cooling heat dissipating device of the present invention is substantially the same as the first preferred embodiment, and the same is not the case: the water cooling type The heat dissipating device further comprises a plurality of spiral guiding sets 8 , and each W ¥ kit 8 can be sleeved on each of the heat transfer columns 42 of the base 4 and correspondingly placed in the mother water circulation hole of the provincial block 62 inside. When the cooling water flows up and down in each of the blocks 6 and the water-melon/gull through holes 62, the cooling water can be spirally shaped through the guides S, Τ, and guiding. The way around the surface of the heat transfer column 42 flows, thereby increasing the flow path, extending the cooling water to the county-heat transfer record 42 (four), and lifting the suction device. At the same time, 'the capillary phenomenon can be formed by the combination of the guide sets 8 and the heat transfer column 42', providing a force f for pulling up the bow, allowing the cooling water to flow upward and stabilizing the flow law to reduce mutual interference and form a spoiler. The problem 'to make the cooling water stable and evenly absorb heat. The third preferred embodiment is the same as the first embodiment. Each of the four (4) posts 42 has a cylinder 421, and a guide collar 422 that extends helically outwardly from the cylinder 421. Each of the guide ribs 422 can guide the flow of cooling water around each of the columns 421, and can also increase the heat absorption time by increasing the flow path, prolonging the heat absorption time, and reducing the interference problem. As shown in FIG. 10, a fourth preferred embodiment of the water-cooling heat sink of the present invention is substantially the same as the first preferred embodiment, and the same portions are not described again. The difference is that the base Each of the heat transfer columns 42 is formed with a spiral guiding groove 423. Each guiding groove can guide the cooling water around each heat transfer column 42 (4), which can also increase the flow path, prolong the heat absorption time and reduce interference. The problem is to achieve the purpose of increasing heat absorption. In summary, the water-cooling heat dissipating device of the present invention is such that the water inlet 431 of the water inlet pipe 43 is adjacent to the bottom plate 41 of the base 4, so that the cooling water can be contacted with the bottom plate 41 having a relatively high temperature from the beginning, and then utilized. The water blocking wall 68 of the sleeve 6 allows the cooling water to be forced to flow upwards, and the heat is taken up by the lower 12!29161. At the same time, by the water outlet 44 of the outlet pipe 44 adjacent to the bottom plate 4, the cooling water can flow downward again, increasing the path of the flow. Alternatively, as shown in Fig. 8, a guide set 8 disposed outside each heat transfer column 42 may be utilized, or a guide bead 422 (see Fig. %, or guide groove 423) may be utilized (see ® 1〇) The design of the invention guides the cooling water to flow upward in a spiral manner, increases the flow path, prolongs the time of contact heat absorption, effectively raises the heat and reduces the phenomenon of flow interference, and thus can achieve the object of the present invention. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are It is still within the scope of the patent of the present invention. [Simplified illustration of the drawings] Fig. 1 is an exploded perspective view showing a conventional water-cooled heat sink device for the Republic of China Announcement No. 458317 "Improvement of CPU water-cooling heat sink" Figure 2 is a top view showing another conventional water-cooled heat sink for the Republic of China Application No. 93214246 "Computer Water-Cooled Heat Dissipating Device"; Figure 3 is a FIG. 4 is an exploded perspective view showing a first preferred embodiment of the water-cooling heat sink of the present invention; FIG. 5 is a partial cross-sectional perspective view showing cooling water in the first preferred embodiment. 13 1291610 Figure 6 is a perspective view of the bottom structure; an external view of the body cutter to illustrate the preferred embodiment of the water-cooled heat sink of the present invention; Figure 8 is a partial cross-sectional perspective view 9 θ 卩. A cross-sectional perspective view illustrating a preferred embodiment of the water-cooled heat sink of the present invention;
t月忒水冷式散熱裝置之一套塊的 1SI 1 Λ 0 w 疋一局部剖面立體圖，說明本發明水冷式散熱裝 置之第四較佳實施例。 14 1291610 【主要元件符號說明】A 1SI 1 Λ 0 w 局部 a partial cross-sectional perspective view of a set of water-cooling heat sinks of the t-month, illustrating a fourth preferred embodiment of the water-cooled heat sink of the present invention. 14 1291610 [Description of main component symbols]
*基座 5 11 ^ * *tf +入水套孔 ^1* 1 yA%*rirf*> …底板 5 12 » ·> ϋ —* >：， 、出水套孔 -ή ^ Λ * « -> <· …傳熱立柱 -圍繞壁 4 21…… …柱體 53 ρ……… ，凸塊 422…… -引導凸垣 5 3 1…… 螺孔 423*““* ”引導凹槽 % ♦今令令 < ·> -套塊 3 γ λ ^ ^ ^ ^ ^ ”入水管 -套塊本體 yj «ΑΨί. <.* ，入水口 6 2 * …一 …水流通孔 4 3 2…… …卡位凸柱 3 * f! ^ V. % ^ ^ -入水通孔 4 ί S Μ * …出水管 6 4* * ΐ* - κ 4 4 * η出水通孔 1，* *，— * …出水口 6 5 4 “ … "第一凹槽 442…… “卡位凸柱 6 6…… "第二凹槽 ^ b a a ^. ^ > ^ -環槽 -t *»<- + > ΐ» ih "凹陷槽 + 4. * S Κ X » ♦定位穿孔 6 8…… ♦阻水壁 ·^ 4 -r -> ir- A 4 …殼蓋 -密封環 5 〇 …“ …容水空間 8 ----- …引導套件 1 X X >t * λ + 4 …頂壁 15*Base 5 11 ^ * *tf + Inlet hole ^1* 1 yA%*rirf*> ...Backplane 5 12 » ·> ϋ —* >:, , Outlet sleeve hole -ή ^ Λ * « - ><· ... heat transfer column - surrounding wall 4 21 ... ... cylinder 53 ρ ... ..., bump 422 ... - guide cam 5 3 1 ... screw hole 423 * "" ” guide groove % ♦Total order <·> - Set 3 γ λ ^ ^ ^ ^ ^ "Inlet pipe - sleeve body yj «ΑΨί. <.* , water inlet 6 2 * ... a... water circulation hole 4 3 2...... ...the card post 3 * f! ^ V. % ^ ^ - water inlet hole 4 ί S Μ * ... water outlet 6 4* * ΐ* - κ 4 4 * η water outlet hole 1, * *, — * ... water outlet 6 5 4 “ ... "first groove 442... “card post 6 6 ... " second groove ^ baa ^. ^ > ^ - ring groove -t *»< ;- + > ΐ» ih "recessed groove + 4. * S Κ X » ♦ positioning perforation 6 8... ♦ water blocking wall ·^ 4 -r -> ir- A 4 ... cover-seal ring 5 〇..."...water space 8 -----...boot kit 1 XX >t * λ + 4 ... top wall 15