TW200508317A - Resin molded product production process, metal structure production process, and resin molded product - Google Patents

Resin molded product production process, metal structure production process, and resin molded product

Info

Publication number
TW200508317A
TW200508317A TW093107796A TW93107796A TW200508317A TW 200508317 A TW200508317 A TW 200508317A TW 093107796 A TW093107796 A TW 093107796A TW 93107796 A TW93107796 A TW 93107796A TW 200508317 A TW200508317 A TW 200508317A
Authority
TW
Taiwan
Prior art keywords
resin molded
molded product
production process
resist layer
metal structure
Prior art date
Application number
TW093107796A
Other languages
English (en)
Inventor
Taiji Nishi
Takenori Kitani
Yukihiro Yanagawa
Motohiro Fukuda
Rei Nagayama
Original Assignee
Kuraray Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kuraray Co filed Critical Kuraray Co
Publication of TW200508317A publication Critical patent/TW200508317A/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/753—Medical equipment; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/756—Microarticles, nanoarticles

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Micromachines (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
TW093107796A 2003-03-24 2004-03-23 Resin molded product production process, metal structure production process, and resin molded product TW200508317A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003080140A JP3990307B2 (ja) 2003-03-24 2003-03-24 樹脂成形品の製造方法、金属構造体の製造方法、チップ

Publications (1)

Publication Number Publication Date
TW200508317A true TW200508317A (en) 2005-03-01

Family

ID=32821421

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093107796A TW200508317A (en) 2003-03-24 2004-03-23 Resin molded product production process, metal structure production process, and resin molded product

Country Status (6)

Country Link
US (1) US20040191704A1 (zh)
EP (1) EP1462859A3 (zh)
JP (1) JP3990307B2 (zh)
KR (1) KR20040084674A (zh)
CN (2) CN100344430C (zh)
TW (1) TW200508317A (zh)

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JP4819146B2 (ja) * 2003-07-11 2011-11-24 株式会社クラレ 燃料電池の流路部材用スタンパの製造方法、燃料電池用流路部材の製造方法、燃料電池用流路部材及び燃料電池
JP4840756B2 (ja) 2005-01-14 2011-12-21 セイコーインスツル株式会社 電鋳型とその製造方法及び電鋳部品の製造方法
JP2007062253A (ja) * 2005-09-01 2007-03-15 Japan Science & Technology Agency マイクロチップの基板形成用金型の製造方法及び該金型を用いたマイクロチップの基板の製造方法
US20070202560A1 (en) * 2006-02-24 2007-08-30 National Food Research Institute Resin microchannel array, method of manufacturing the same and blood test method using the same
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JP4834426B2 (ja) * 2006-03-06 2011-12-14 キヤノン株式会社 インクジェット記録ヘッドの製造方法
CN101517130B (zh) * 2006-08-07 2011-12-28 精工电子有限公司 电铸模的制造方法、电铸模及电铸部件的制造方法
KR100803749B1 (ko) * 2006-08-31 2008-02-15 삼성전기주식회사 대면적 스템퍼 제조방법
EP2230206B1 (fr) * 2009-03-13 2013-07-17 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
EP2230207A1 (fr) 2009-03-13 2010-09-22 Nivarox-FAR S.A. Moule pour galvanoplastie et son procédé de fabrication
WO2010113545A1 (ja) * 2009-03-31 2010-10-07 コニカミノルタオプト株式会社 射出成形用マスター型の製造方法、射出成形用マスター型及び射出成形用金型
JP5580546B2 (ja) * 2009-04-07 2014-08-27 ルネサスエレクトロニクス株式会社 レジストパターン形成方法
KR101537619B1 (ko) * 2009-09-09 2015-07-17 엘지전자 주식회사 사출금형용 스탬퍼 제작방법
JP5381647B2 (ja) * 2009-11-26 2014-01-08 トヨタ紡織株式会社 燃料電池用セパレータ及びその製造方法
EP2405300A1 (fr) 2010-07-09 2012-01-11 Mimotec S.A. Méthode de fabrication de pièces métalliques multi niveaux par un procédé du type LIGA et pièces obtenues par la méthode
CN102147569B (zh) * 2010-12-02 2012-10-10 天津海鸥表业集团有限公司 多层结构的微部件及固化的su8光刻胶薄片的加工方法
CN102096318B (zh) * 2011-01-17 2012-05-23 南京航空航天大学 激光直写技术制备多级结构微阵列的方法
JP4803328B1 (ja) * 2011-03-15 2011-10-26 オムロン株式会社 コネクタ用接続端子及び当該端子の製造方法
EP2781627A4 (en) * 2011-11-15 2015-06-17 Leap Co Ltd METHOD OF MANUFACTURING MULTILAYER TRANSFER FORM, MULTI-STAGE TRANSFER FORM AND COMPONENT MANUFACTURED IN THESE METHODS
US9108216B2 (en) * 2012-01-12 2015-08-18 Dai Nippon Printing Co., Ltd. Vapor deposition mask, method for producing vapor deposition mask device and method for producing organic semiconductor element
JP6098855B1 (ja) * 2016-08-05 2017-03-22 株式会社プロセス・ラボ・ミクロン 凸状金型の製造方法
EP3454122B1 (fr) * 2017-09-11 2020-02-19 Patek Philippe SA Genève Procede de fabrication par technologie liga d'une microstructure metallique comportant au moins deux niveaux
CN108311177B (zh) * 2018-01-15 2020-07-31 中国科学院上海微系统与信息技术研究所 一种3d pdms微流控芯片对准组装结构的制作方法
KR102137774B1 (ko) * 2018-12-27 2020-07-24 부산대학교 산학협력단 고분자 평면 광소자용 단일 정렬 멀티패턴 제조 방법
EP3839625A1 (fr) * 2019-12-18 2021-06-23 Nivarox-FAR S.A. Procede de fabrication d'un composant horloger et composant obtenu selon ce procede
JP7356184B2 (ja) * 2022-02-18 2023-10-04 有限会社アキュラス 光吸収体の製造方法

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Also Published As

Publication number Publication date
EP1462859A2 (en) 2004-09-29
JP2004284225A (ja) 2004-10-14
JP3990307B2 (ja) 2007-10-10
US20040191704A1 (en) 2004-09-30
CN1532036A (zh) 2004-09-29
KR20040084674A (ko) 2004-10-06
CN1979345A (zh) 2007-06-13
CN100344430C (zh) 2007-10-24
EP1462859A3 (en) 2012-06-20

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