TW200507104A - Plasma etching method and plasma treatment apparatus - Google Patents
Plasma etching method and plasma treatment apparatusInfo
- Publication number
- TW200507104A TW200507104A TW093118870A TW93118870A TW200507104A TW 200507104 A TW200507104 A TW 200507104A TW 093118870 A TW093118870 A TW 093118870A TW 93118870 A TW93118870 A TW 93118870A TW 200507104 A TW200507104 A TW 200507104A
- Authority
- TW
- Taiwan
- Prior art keywords
- radio frequency
- mhz
- power source
- matching unit
- frequency power
- Prior art date
Links
- 238000001020 plasma etching Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 238000009832 plasma treatment Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32137—Radio frequency generated discharge controlling of the discharge by modulation of energy
- H01J37/32155—Frequency modulation
- H01J37/32165—Plural frequencies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/32174—Circuits specially adapted for controlling the RF discharge
- H01J37/32183—Matching circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- General Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Plasma Technology (AREA)
- ing And Chemical Polishing (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003285125A JP3905870B2 (ja) | 2003-08-01 | 2003-08-01 | プラズマ処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200507104A true TW200507104A (en) | 2005-02-16 |
TWI311782B TWI311782B (zh) | 2009-07-01 |
Family
ID=34364864
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW093118870A TW200507104A (en) | 2003-08-01 | 2004-06-28 | Plasma etching method and plasma treatment apparatus |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP3905870B2 (zh) |
KR (1) | KR100702726B1 (zh) |
CN (1) | CN100477104C (zh) |
TW (1) | TW200507104A (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI488545B (zh) * | 2007-09-10 | 2015-06-11 | Tokyo Electron Ltd | Plasma processing device and plasma processing method and memory medium |
US9466475B2 (en) | 2007-11-05 | 2016-10-11 | Ulvac, Inc. | Ashing device |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7879185B2 (en) * | 2003-12-18 | 2011-02-01 | Applied Materials, Inc. | Dual frequency RF match |
JP4550507B2 (ja) * | 2004-07-26 | 2010-09-22 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置 |
JP4515950B2 (ja) * | 2005-03-31 | 2010-08-04 | 東京エレクトロン株式会社 | プラズマ処理装置、プラズマ処理方法およびコンピュータ記憶媒体 |
CN100367829C (zh) * | 2005-12-08 | 2008-02-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种等离子体激励方法 |
JP5031252B2 (ja) * | 2006-03-30 | 2012-09-19 | 東京エレクトロン株式会社 | プラズマ処理装置 |
CN101207034B (zh) * | 2006-12-20 | 2010-05-19 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 腔室上盖及包含该上盖的反应腔室 |
US20080197015A1 (en) * | 2007-02-16 | 2008-08-21 | Terry Bluck | Multiple-magnetron sputtering source with plasma confinement |
US9536711B2 (en) * | 2007-03-30 | 2017-01-03 | Lam Research Corporation | Method and apparatus for DC voltage control on RF-powered electrode |
US8450635B2 (en) | 2007-03-30 | 2013-05-28 | Lam Research Corporation | Method and apparatus for inducing DC voltage on wafer-facing electrode |
JP5319150B2 (ja) * | 2008-03-31 | 2013-10-16 | 東京エレクトロン株式会社 | プラズマ処理装置及びプラズマ処理方法及びコンピュータ読み取り可能な記憶媒体 |
CN102438389B (zh) | 2010-09-29 | 2013-06-05 | 中微半导体设备(上海)有限公司 | 单一匹配网络、其构建方法和该匹配网络射频功率源系统 |
CN102694525B (zh) * | 2011-03-23 | 2015-12-02 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 双频滤波装置及其处理方法和半导体设备 |
US8420545B2 (en) * | 2011-05-23 | 2013-04-16 | Nanya Technology Corporation | Plasma etching method and plasma etching apparatus for preparing high-aspect-ratio structures |
CN103187943B (zh) * | 2011-12-28 | 2017-02-08 | 中微半导体设备(上海)有限公司 | 一种用于静电吸盘的射频滤波器 |
JP6785101B2 (ja) * | 2016-09-09 | 2020-11-18 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
US10410836B2 (en) * | 2017-02-22 | 2019-09-10 | Lam Research Corporation | Systems and methods for tuning to reduce reflected power in multiple states |
KR102330944B1 (ko) * | 2018-01-29 | 2021-12-01 | 가부시키가이샤 알박 | 반응성 이온 에칭 장치 |
KR102223875B1 (ko) * | 2019-10-30 | 2021-03-05 | 주식회사 뉴파워 프라즈마 | 다중 주파수를 사용하는 건식 식각 장비를 위한 고주파 전원 장치 |
-
2003
- 2003-08-01 JP JP2003285125A patent/JP3905870B2/ja not_active Expired - Lifetime
-
2004
- 2004-06-28 TW TW093118870A patent/TW200507104A/zh unknown
- 2004-07-22 KR KR1020040057249A patent/KR100702726B1/ko active IP Right Review Request
- 2004-07-30 CN CNB2004100702424A patent/CN100477104C/zh active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI488545B (zh) * | 2007-09-10 | 2015-06-11 | Tokyo Electron Ltd | Plasma processing device and plasma processing method and memory medium |
US9466475B2 (en) | 2007-11-05 | 2016-10-11 | Ulvac, Inc. | Ashing device |
Also Published As
Publication number | Publication date |
---|---|
JP3905870B2 (ja) | 2007-04-18 |
TWI311782B (zh) | 2009-07-01 |
KR100702726B1 (ko) | 2007-04-03 |
CN100477104C (zh) | 2009-04-08 |
JP2005056997A (ja) | 2005-03-03 |
KR20050016012A (ko) | 2005-02-21 |
CN1581445A (zh) | 2005-02-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW200507104A (en) | Plasma etching method and plasma treatment apparatus | |
US7879185B2 (en) | Dual frequency RF match | |
KR101164531B1 (ko) | 스위칭 가능한 바이어스 파워를 구비하는 플라즈마 챔버 및 이를 위한 스위칭 가능한 주파수 rf 매치 네트워크 | |
KR100648336B1 (ko) | 플라즈마 챔버와 관련하여 사용되는 고정 임피던스 변형 네트워크 장치 및 방법 | |
WO2001082467A3 (en) | Method and apparatus for generating a signal having at least one desired output frequency utilizing a bank of vibrating micromechanical devices | |
TW200504815A (en) | Apparatus using hybrid coupled plasma | |
JPWO2019212799A5 (zh) | ||
TW200520150A (en) | A method for forming dummy structures for improved CMP and reduced capacitance | |
TW200504870A (en) | Rf pulsing of a narrow gap capacitively coupled reactor | |
WO2003054911A3 (en) | Plasma process apparatus | |
AU2002213451A1 (en) | System, apparatus, and method for processing wafer using single frequency rf power in plasma processing chamber | |
WO2003101160A3 (en) | Method and apparatus for vhf plasma processing | |
EP0831680A4 (en) | DEVICE AND METHOD FOR TREATING PLASMA | |
PT1439883E (pt) | Dispositivo e método para terapia electromagnética | |
MY132614A (en) | Adjustable dual frequency voltage dividing plasma reactor | |
EP0793254A3 (en) | Plasma processing apparatus and plasma processing method | |
WO2004012235A3 (en) | Atmospheric pressure plasma processing reactor | |
EP1179834A3 (en) | Plasma processing apparatus and performance validation system therefor | |
WO2003037386A3 (en) | Sterilization of articles using capillary discharge plasma | |
CN110867362A (zh) | 射频结构、工艺腔室和等离子体的生成方法 | |
TW200618105A (en) | Plasma chamber system and method of ashing photoresist pattern formed on substrate having low-k dielectric layer using the same | |
JP4408707B2 (ja) | プラズマ処理装置 | |
WO2005069703A3 (de) | Plasmabehandlung grossvolumiger bauteile | |
TWI416995B (zh) | A plasma processing chamber having a switchable bias frequency, and a switchable matching network | |
WO2006133132A3 (en) | Combinations of plasma production devices and method and rf driver circuits with adjustable duty cycle |