TW200504791A - Substrate processing device of transporting type - Google Patents

Substrate processing device of transporting type

Info

Publication number
TW200504791A
TW200504791A TW092120389A TW92120389A TW200504791A TW 200504791 A TW200504791 A TW 200504791A TW 092120389 A TW092120389 A TW 092120389A TW 92120389 A TW92120389 A TW 92120389A TW 200504791 A TW200504791 A TW 200504791A
Authority
TW
Taiwan
Prior art keywords
water
substrate
stream side
bubble
processing section
Prior art date
Application number
TW092120389A
Other languages
Chinese (zh)
Other versions
TWI227035B (en
Inventor
Hitoshi Tauchi
Haruhiko Koizumi
Original Assignee
Sumitomo Precision Prod Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Precision Prod Co filed Critical Sumitomo Precision Prod Co
Application granted granted Critical
Publication of TWI227035B publication Critical patent/TWI227035B/en
Publication of TW200504791A publication Critical patent/TW200504791A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

In a substrate processing device of transporting type performing the etching processing etc., the substrate (10) sequentially passes through a drug-fluid processing section (40) and a water-washing section (50) etc., its purpose is to prevent the occurrence of the spots at the bubble-jet processing section (54) mounted in the water-washing section (50), and at the same time to prevent the drying of the substrate (10). In order to attain this purpose, a shield-plate for preventing the mist sputtering is mounted at the up-stream side and the down-stream side of two fluid-nozzle rows (56) for performing the bubble-jet processing. At the down-stream side of the shield-plate located at least at the most down-stream side among several shield-plates, a water-supply means (58) supplying the cleansing water to the surface of the substrate (10) is mounted. A separating wall (52) is provided to separate the bubble-jet processing section (54) from the next processing section (55). At the down-stream side of the separating wall (52), a water-supply means (58) supplying the cleansing water to the surface of the substrate (10) is mounted.
TW092120389A 2002-02-25 2003-07-25 Substrate processing device of transporting type TWI227035B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2002/001684 WO2003071594A1 (en) 2002-02-25 2002-02-25 Carrier type substrate processing device

Publications (2)

Publication Number Publication Date
TWI227035B TWI227035B (en) 2005-01-21
TW200504791A true TW200504791A (en) 2005-02-01

Family

ID=27742310

Family Applications (1)

Application Number Title Priority Date Filing Date
TW092120389A TWI227035B (en) 2002-02-25 2003-07-25 Substrate processing device of transporting type

Country Status (3)

Country Link
JP (1) JPWO2003071594A1 (en)
TW (1) TWI227035B (en)
WO (1) WO2003071594A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4365192B2 (en) * 2003-11-25 2009-11-18 住友精密工業株式会社 Transport type substrate processing equipment
JP4789446B2 (en) * 2004-09-27 2011-10-12 芝浦メカトロニクス株式会社 Substrate processing equipment
JP4851776B2 (en) * 2004-11-02 2012-01-11 昭和電工株式会社 Liquid honing machine and liquid honing method
KR100691479B1 (en) 2005-12-20 2007-03-12 주식회사 케이씨텍 Etching chamber for large area substrate
WO2008087903A1 (en) * 2007-01-15 2008-07-24 Shibaura Mechatronics Corporation Apparatus and method for processing substrate
JP5454834B2 (en) * 2007-08-30 2014-03-26 日立化成株式会社 Roughening device
JP4977230B2 (en) * 2010-03-31 2012-07-18 積水化学工業株式会社 Etching method and apparatus
JP2012126582A (en) * 2010-12-13 2012-07-05 Asahi Glass Co Ltd Method for producing cover glass for display device
JP2013026490A (en) * 2011-07-22 2013-02-04 Tokyo Electron Ltd Substrate processor
JP6366328B2 (en) * 2014-04-02 2018-08-01 株式会社中西製作所 Nozzle tube unit and cleaning device using the same
CN106971966A (en) * 2017-04-06 2017-07-21 安徽熙泰智能科技有限公司 A kind of semiconductor chip cleaning device
KR102410120B1 (en) * 2020-09-14 2022-06-21 주식회사 티케이씨 Vertical Typed Continuous Developing System Having Improved Stain Proof Function
TWI821799B (en) * 2020-12-28 2023-11-11 日商芝浦機械電子裝置股份有限公司 Substrate processing equipment

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594863B2 (en) * 1995-06-01 2004-12-02 株式会社半導体エネルギー研究所 Method for manufacturing active matrix display device
JP3315611B2 (en) * 1996-12-02 2002-08-19 三菱電機株式会社 Two-fluid jet nozzle for cleaning, cleaning device, and semiconductor device
JP2000323813A (en) * 1999-05-12 2000-11-24 Dainippon Screen Mfg Co Ltd Substrate treatment unit

Also Published As

Publication number Publication date
JPWO2003071594A1 (en) 2005-06-16
TWI227035B (en) 2005-01-21
WO2003071594A1 (en) 2003-08-28

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees