200424024 玖、發明說明： 【發明所屬之技術領域】 本發明關於-種在被處理物的表面噴射蒸汽來進行基汽 處理的蒸汽處理裝置，特別是關於適用於半導體裝置、液 晶顯示面板等製造工序中的清洗（漂洗）工序和光姑刻工序 的抗蝕層剝離工序等的技術。 【先前技術】 在半導體裝置、液晶顯示面板等電子機器的領域中，在 其製造過程中必須有對半導體基板或玻璃基板等被處理基 板進行清洗處理 的工序。 在用於如此的清洗工序中的清洗裝置中，有一種將蒸汽 噴射到被處理基板的表面來進行清洗的類型的清洗裝置/。 圖4是示意喷射蒸汽型的先前清洗裝置的簡略構成圖（例 如，參照專利文獻1)。 圖4中的符號60為腔室。在該腔室6〇裏具有：送出被處理 基板61的機構62、基板的支承旋轉機構63、接觸被支承於 该支承旋轉機構63上的基板61並供給基板表面水蒸汽的蒸 汽導入口 71、將水蒸汽噴射在基板61表面的水蒸汽噴嘴 72、將氣體噴射在基板61表面的氣體喷嘴73及排氣排液機 構66 〇 在使用圖4的清洗裝置來清洗基板時，將輸送到腔室6〇 内的被處理基板61支承在支承旋轉機構63上之後，來自氣 體嘴嘴7 3的氣體喷射在該被清洗基板61的表面，同時，夢 由從水蒸汽喷嘴72喷射水蒸汽來進行清洗處理。 89543.doc 200424024 【專利文獻l】 特開2001-252631號公報。 發明所欲解決之問題 但是圖4如此的裝置，清洗之後的蒸汽，因從被處理基板 61彈回等而向整個腔室6〇内飛散，有時會附著在腔室6〇的 内壁等上。清洗之後的蒸汽，由於含有許多從基板除去的 除去物，所以，上述除去物會附著在腔室6〇的内壁等上。 另外’由於腔室60的排氣是由排氣排液機構66進行統一 排氣’所以，清洗後的蒸汽在進入排氣的氣流之前會附著 在月X·至6 0的内壁上凝結。在該冷凝液中，由於溶解有附著 在腔室60内壁的除去物，一旦它們落在被清洗基板上，就 會産生已經洗淨的面再度被污染的問題。另外，在先前清 洗裝置中，由於腔室60内由排氣•排液機構66 一起進行，所 以，排氣量增多。 另外，並且有些構成腔室60的材料會溶解於附著在上述 内壁的冷凝液中，而掉落在被清洗基板上產生污染之類的 問題。此情形之對策，雖然可以淨化腔室，即，由不會污 杂被處理基板的材料來構成腔室，但如此成本太高。 【發明内容】 本發明係鑒於上述情況，目的在於提供一種能夠防止從 被處理物除去的除去物再次附著在被處理物上，而且能夠 減小排氣量、降低成本的蒸汽處理裝置。 本發明者爲了解決上述課題刻苦鑽研以及反復研究，結 果發現，由於附著在被處理物上的微粒子等的粒子和有機 89543.doc 200424024 物等附著物，用蒸汽比用液體的方法更容易除去，所以藉 由凋整了溫度和壓力的蒸汽喷射在被處理物上能夠高效率 地除去，另外，從被處理物除去的除去物和液體一起排出 比和蒸汽一起排出，搬運除去物的能力更高，將供給蒸汽 處理後的瘵汽冷卻成爲冷凝液，並藉由與該冷凝液一起排 出能夠高效率地排出上述除去物，藉由以上處理能夠解決 上述課題而完成了本發明。 即，本發明的蒸汽處理裝置，其特徵在於，具有蒸汽處 理邛，其包含向被處理物喷射用於蒸汽處理的蒸汽的蒸汽 噴嘴、設在該蒸汽噴嘴附近並將供給於蒸汽處理後的蒸汽 的至；一部分排出到蒸汽處理系統外的排氣機構、以及冷 部瘵汽處理後的蒸汽的冷卻機構，在上述被處理物表面與 上述蒸汽處理部間之間隙中，形成使由上述冷卻機構所冷 部而凝結的上述蒸汽的冷凝液流過的流路。 從瘵汽喷嘴噴射出的蒸汽，不限於水蒸汽，根據本發明 的瘵况處理裝置的用途也可以是抗蝕層剝離液等藥液的蒸 汽。 根據此種結構的蒸汽處理裝置，藉由調整由蒸汽喷射嘴 噴朝向基板的蒸汽的溫度和壓力，能夠高效率地除去被處 理物上的附著物。之後，由於供給蒸汽處理後的蒸汽的至 °卩为被上述冷卻機構冷卻成爲冷凝液，所以，供給蒸 汽處理後仍以蒸汽形式存在的蒸汽減少，而且，由於剩下 的該蒸汽能夠由排氣機構迅速排出到蒸汽處理部的系統 外，所以，與先前裝置相比，供給蒸汽處理後的蒸汽飛散 89543.doc 200424024 的區域減小，且從被處理物除去的有機物和塵埃等的除去 物與上述冷凝液一起、能夠經由上述流路高效率地排出到 蒸汽處理系統外，從而能夠防止從被處理物除去的除去物 (被處理物的除去物）再次附著在被處理物上。 並且’在本實施例的蒸汽處理裝置中，供給於蒸汽處理 後的蒸汽繼續以蒸汽形式存在的蒸汽減少，能夠減小排氣 量。 ’、 另外’在本發明的蒸汽處理裝置中，由於供給於蒸汽處 理後的瘵汽飛散的區域減小，因此不需淨化蒸汽處理裝置 的整體，例如，由於只要由不會污染被處理物的材料來構 成排氣機構部分即可，能夠消減淨化所必需的材料費，從 而能夠實現低成本。 在本發明的蒸汽處理裝置中，上述冷卻機構也可以包含 冷部流入上述排氣機構前的蒸汽的第丨冷卻機構，及冷卻通 過上述排氣機構的蒸汽的第2冷卻機構。 根據此種結構的蒸汽處理裝置，由於能夠提高供給蒸汽200424024 (1) Description of the invention: [Technical field to which the invention belongs] The present invention relates to a steam treatment device that sprays steam on the surface of an object to perform base steam treatment, and particularly relates to a semiconductor device, a liquid crystal display panel, and other manufacturing processes Technologies such as a cleaning (rinsing) step and a photoresist peeling step in a photolithography step. [Prior Art] In the field of electronic devices such as semiconductor devices and liquid crystal display panels, a process of cleaning a substrate to be processed, such as a semiconductor substrate or a glass substrate, is required in the manufacturing process. Among the cleaning devices used in such a cleaning process, there is a type of cleaning device that sprays steam on the surface of a substrate to be processed to perform cleaning. Fig. 4 is a schematic configuration diagram showing a conventional cleaning device of a steam jet type (for example, refer to Patent Document 1). The symbol 60 in FIG. 4 is a chamber. The chamber 60 includes a mechanism 62 for sending out a substrate 61 to be processed, a support rotation mechanism 63 for the substrate, a steam inlet 71 for contacting the substrate 61 supported by the support rotation mechanism 63 and supplying water vapor on the surface of the substrate, A water vapor nozzle 72 that sprays water vapor on the surface of the substrate 61, a gas nozzle 73 that sprays gas on the surface of the substrate 61, and an exhaust and drainage mechanism 66. When the substrate is cleaned using the cleaning device of FIG. 4, it is conveyed to the chamber. After the substrate 61 to be processed within 60 is supported on the supporting and rotating mechanism 63, the gas from the gas nozzle 73 is sprayed on the surface of the substrate 61 to be cleaned, and at the same time, the steam is sprayed from the steam nozzle 72 to clean deal with. 89543.doc 200424024 [Patent Document 1] JP 2001-252631. The problem to be solved by the invention. However, in the device shown in FIG. 4, the steam after cleaning is scattered into the entire chamber 60 due to the rebound of the substrate 61 to be processed, etc., and may be attached to the inner wall of the chamber 60 and the like. . Since the steam after cleaning contains many removed matter removed from the substrate, the removed matter adheres to the inner wall of the chamber 60 or the like. In addition, since the exhaust of the chamber 60 is uniformly exhausted by the exhaust liquid discharge mechanism 66, the cleaned steam adheres to the inner wall of the month X to 60 and condenses before entering the exhaust airflow. In this condensate, since the removed substances adhering to the inner wall of the chamber 60 are dissolved, once they fall on the substrate to be cleaned, there is a problem that the cleaned surface is contaminated again. Moreover, in the conventional cleaning device, the exhaust / drain mechanism 66 is performed together in the chamber 60, and therefore, the exhaust amount is increased. In addition, some materials constituting the chamber 60 may be dissolved in the condensate adhering to the inner wall, and fall on the substrate to be cleaned, causing problems such as contamination. In this case, although the chamber can be purified, that is, the chamber is made of a material that does not contaminate the substrate to be processed, the cost is too high. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a steam treatment apparatus capable of preventing the removed matter removed from the to-be-processed object from being reattached to the to-be-processed object, and capable of reducing the exhaust gas volume and cost. The present inventors worked diligently and repeatedly in order to solve the above-mentioned problems, and as a result, it was found that, since particles such as fine particles and organic 89543.doc 200424024 adhered to the object to be processed are more easily removed by steam than by liquid, Therefore, the temperature and pressure of the steam can be efficiently removed on the object to be treated. In addition, the removed object and the liquid are discharged together with the liquid rather than the steam, and the ability to transport the removed object is higher. The radon steam after the steam supply process is cooled to become a condensate, and the above-mentioned removed matter can be efficiently discharged by discharging together with the condensate. The above-mentioned process can solve the above-mentioned problems and completed the present invention. That is, the steam treatment apparatus of the present invention includes a steam treatment unit including a steam nozzle for injecting steam for steam treatment to a treatment object, and the steam nozzle provided near the steam nozzle and supplied to the steam treatment steam. A part of the exhaust mechanism exhausted to the outside of the steam processing system and the cooling mechanism of the steam after the steam treatment in the cold part are formed in the gap between the surface of the object to be processed and the steam processing part. A flow path through which the condensate of the steam condensed in the cooled portion flows. The steam ejected from the radon steam nozzle is not limited to water vapor, and the application of the weather treatment device according to the present invention may be steam of a chemical solution such as a resist peeling liquid. According to the steam processing apparatus having such a structure, by adjusting the temperature and pressure of the steam sprayed toward the substrate from the steam injection nozzle, it is possible to efficiently remove the adhered matter on the processing object. After that, since the steam supplied to the steam treatment is cooled to a condensate by the cooling mechanism, the steam that still exists as steam after the steam treatment is reduced, and because the remaining steam can be exhausted by the exhaust gas The mechanism is quickly discharged to the outside of the system of the steam treatment section. Therefore, compared with the previous device, the area where the steam after the steam treatment is scattered is 89543.doc 200424024, and the organic matter, dust, etc. removed from the object to be treated and The condensate can be efficiently discharged to the outside of the steam treatment system through the flow path together, and it is possible to prevent the removed matter (removed matter of the processed matter) removed from the processed object from adhering to the processed object again. In addition, in the steam processing apparatus of this embodiment, the steam supplied to the steam treatment continues to be reduced in the form of steam, and the exhaust gas amount can be reduced. In addition, in the steam treatment apparatus of the present invention, since the area where radon steam supplied after the steam treatment is scattered is reduced, it is not necessary to purify the entire steam treatment apparatus. For example, as long as it does not contaminate the object to be treated, Materials can be used to form the exhaust mechanism part, which can reduce the material cost necessary for purification, and can achieve low cost. In the steam processing apparatus of the present invention, the cooling mechanism may include a second cooling mechanism for cooling the steam before the cold portion flows into the exhaust mechanism, and a second cooling mechanism for cooling the steam passing through the exhaust mechanism. According to the steam processing apparatus having such a structure, it is possible to increase the supply of steam
ί飞被上述第2冷卻機構冷卻而成爲冷凝液， 到蒸汽處理系統外， 了上述排氣機構的蒸 液，從被處理物除去 89543.doc 200424024 上述流路高效率地排 的除去物與該冷凝液一起 出到蒸汽處理系統外。 另外，在本發明的蒸汽處理裝置 液排出蒸汽處理系統外的冷凝液排出機構， 流路連通。 驭彳土為與上述 很稞此種結構的蒸汽處 、六狄A 、 田於月b夠提高通過上述 机路的冷凝液的排出效果，所 ^ ^ ^ 仏此夠挺冋被該冷凝液搬 勺被處理物的除去物的排出效果 ^ 仗而也犯夠提高防止 被處理物的除去物再次附著在被處理物上的效果。 另外，本發明的蒸汽處理袭置，較佳為具有使上述被處 ^里物以傾斜的狀態輸送的傾斜輸送機構。在此種情況下， 蒸A贺€較佳為设在被移動物的移動方向一側。 根據此種結構的蒸汽處理裝置，由於沿被處理物的移動 方向，以被處理物上升的角度傾斜輸送，供給蒸汽處理後 產生的冷凝液能夠高效率地脫離被處理物，所以能夠進一 步提高冷凝液以及被處理物的除去物的排出效果，也能夠 進一步提高防止被處理物的除去物再次附著在被處理物上 的效果，從而能夠高效率地進行蒸汽處理。 另外，本發明的蒸汽處理裝置，也可以是使上述第1冷卻 機構與上述第2冷卻機構一體化的裝置。 根據此種結構的蒸汽處理裝置，與分別設置第1冷卻機構 和上述第2冷卻機構的情況相比較，具有能夠小型化蒸汽處 理裝置的優點。 【實施方式】 89543.doc -11- 200424024 以下參照圖式對本發明的實施例進行說明。另外，以下 所敍述的實施方式’係對於將本發明的蒸汽處理裝置應用 於對被處理物的數百酿方形、較佳為卜2 m方形的大型的 玻璃基板等的被處理基板進行濕刻處理後，進行實施清洗 處理（漂洗處理）工序的情況進行說明。 、 彳 [弟1實施例] 圖1係表示本發明的第i實施例的蒸汽處理裝置的概略結 構的剖面圖。 第1實施例的蒸汽處理裝置，呈右· 衣罝具有·以本體1和設置在該 本體1側方的多數個蒸汽噴嘴2致太辦％ μ …、/飞貨㊆2爲主體的瘵汽處理部1〇、和 多數個輸送滚輪（輸送機構）25。 在本體1上’設有將供給蒸汽處理後的蒸汽的至少一部分 :㈣蒸汽處理系統外的排氣機構5、對供給蒸汽處理後的 洛汽進行冷卻的冷卻機構6、將被該冷卻機構6冷卻而凝社 的蒸汽的冷凝液排出到蒸汽處理系統外的冷凝液排出機構 8。蒸汽處理部H)的本體1的底面具有平坦面。另外，本體又 的側面之中設有蒸汽噴嘴2_侧的側面呈傾斜面。 、本實施例的蒸汽處理裝置的蒸汽處理部10,配設於在！ :處理時的被處理基板A的上侧，並設置爲此時在蒸汽處楚 :被處理基板A的表面之間具有間隙。另外，在編 ,、的表面和蒸汽處理部1G的間隙中形成有被上述冷 部機構6冷卻而凝結的蒸汽的冷凝液可以藉由的流㈣。 多數個輸送滾輪（輸送機構）25輸送經濕刻處理後的被處 理基板A，並能夠使其從蒸汽處理部1〇的下方藉由。另外， 89543.doc -12- 200424024 圖中的符號S爲被處理基板A的輸送方向（移動方向）。 瘵八喷嘴2沿本體1的側面設有多數個，被處理基板A被輸 送到療汽處理部10的下側時，使這些多數個蒸汽喷嘴2位於 被處理基板A的上側，並且沿與被處理基板a的移動方向交 又的方向並排设置。在被處理基板A被輸送到蒸汽處理部工〇 的下侧時，各蒸汽噴嘴2的前端配置爲朝向被處理基板八的 表面。另外，在圖1中，由於其他的蒸汽喷嘴2被前面一側 的瘵汽噴嘴2擋住而看不見，所以只圖示出一根蒸汽噴嘴2。 用於供給該蒸汽喷嘴2蒸汽的蒸汽供給源2a，藉由連接管 2b連t在各療汽喷嘴2上。本實施例的蒸汽處理裝置在用於 j述此種清洗工序時，由蒸汽供給源以供給各蒸汽噴嘴2水 又/飞另外，在蒸汽供給源2a上具有將供給該蒸汽供給源 2a的液體1^加熱並氣化的加熱機構（圖示省略卜 在蒸汽供給源2a上還具有對加熱上述液體Li而產生蒸汽 的溫度、蒸汽的壓力、蒸汽飽和度、蒸汽産生量進行控制 的控制機構（圖示省略）。 、在進行蒸汽處理時，蒸汽處理部10，其蒸汽噴嘴2配置在 被處理基板A的輸送方向s 一側。 在進行蒸汽處理時，向本則的底面和被處理基板A表面 的間隙中、並朝向被處理基板A表面，從多數㈣汽喷嘴2 喷射蒸汽Gl ’利用該蒸汽Glit行清洗。因此，在本則的底 面和被處理基板A表面的間隙中形成蒸汽處理區域Μ。另 外’該蒸汽處理區域14主要形成於比後面敍述的冷卻用管 6a靠蒸汽噴嘴2-側的本體i的底面（噴嘴一側底面^和被 89543.doc -13 - 200424024 處理基板A表面之間的間隙的區域。 排氣機構5是由設在本體丨上的多數個蒸汽排氣管5&和連 接在各蒸汽排氣管5a上的排氣泵5b所構成。 設在本m上的多數個蒸汽排氣f5a，在被處理基板八被 輸送到蒸汽處理部1〇的下侧時，這些多數個蒸汽排氣管 在被處理基板A的上側並且沿與被處理基板八的移動方 向s交差的方向並排配置。各蒸汽排氣f5a，被設置成從本 體1的上面向底面傾斜。另外，各蒸汽排氣管端部在 本體1的底面開口，各蒸汽排氣f5a與本體i的底面和被處 理基板A表面的間隙連通。蒸汽排氣管5 &的開口部$ c形成於 蒸汽喷嘴2的附近位置。而且’在圖^，由於其他的蒸汽 喷嘴5a被前面一側的蒸汽嘴料撐住而看不見，所以只圖 示出一個蒸汽排氣管5a。 ―供^蒸汽處理後的蒸汽g2(有時也稱爲蒸汽處理後的蒸 >·〇儘官存在於本體！的底面和被處理基板 =的_，至少-部分蒸汽處理後的蒸汽〇2能=: 瘵八排氣官5a被排出到蒸汽處理系統外。 冷卻機構6’㈣成於本體i上比蒸汽排氣管㈣近基汽 喷嘴2的冷卻用管^和連接在該冷卻用管6a上的冷卻:儲 蓄槽^t構成。該冷卻用管_延伸方向平行於多數個蒸 Π的排列方向。另外，該冷卻用管6a設置成接觸到比 蒸汽排氧管5a靠近基汽哈π, …π贺1 2一側的本體1的底面（喷嘴側 底面）la和蒸汽排氣管5a的側面。 在該冷卻機構6中，在蒸汽處理時從冷卻水儲蓄槽❿向冷 89543.doc -14- 200424024 部用官6a内供給冷卻水6c，但由於該冷卻用管以接觸喷嘴 側底面la ’所以藉由冷卻用管對蒸汽處理後的蒸汽中 心入療八排氣官5a之前的蒸汽進行冷卻，能夠使其成爲蒸 π的~ /疑液L2。该冷凝液h存在於被處理基板a表面和噴嘴 側底面1 a的間隙中。 另外，由於該冷卻用管6a接觸蒸汽排氣管化的側面，所 以I由瘵 >飞排氣管5&内的蒸汽處理後的蒸汽至少有一部 刀知到冷部，並能夠成爲蒸汽的冷凝液^。由於該蒸汽排 乳官5a如上述那樣是傾斜的，所以，在蒸汽排氣管化產生 的蒸汽的冷凝液L2被傳送到管的内表面而落在被處理基板 A表面和本體i底面的間隙中。因而，蒸汽處理後的蒸汽& 的大部分在冷卻用管6 a的附近被冷卻而成爲蒸汽的冷凝液 [2。 本貫施例中的冷卻機構6，是將對流入排氣機構前的蒸汽 進行冷卻的第1冷卻機構、與對經由排氣機構的蒸汽進行冷 卻的第2冷卻機構一體化而成的冷卻機構。 冷凝液排出機構8，係由在與本體丨設有蒸汽喷嘴2一侧相 反侧的側面附近所設置的多數個冷凝液排出管8a、及連接 在該冷凝液排出管8a上的排液泵8b所構成。 設在本體1上的多數個冷凝液排出管8a，被設置爲在將被 處理基板A輸送到蒸汽處理部1〇的下側時，這些多數個冷凝 液排出官8a，在被處理基板a的上側並且沿與被處理基板a 的私動方向S父差的方向並排設置。另外，各冷凝液排出管 8a的一端在本體丨的底面開口，該冷凝液排出管“與本體丄 89543.doc -15- 200424024 的底面和被處理基板絲面的間隙連通。而且，在圖！中， 由於其他的冷凝_At8a被前面—侧的冷㈣排出管8a 擒住而看不見，所以只圖示出—個冷凝液排出管 冷凝液排出機構8在蒸汽處理時，一旦排液祕動作，則 在蒸汽排氣管5a和冷卻用管6a的附近産生的蒸汽的冷凝液 l2 ’經由比蒸汽排氣管5a靠近冷凝液排出管κ則的本體丄 的底面（排出管側底面）lb和被處理基板A表面㈣隙進入 冷凝液排出管8 a，並經由該冷凝液排出管8 &内排出到蒸汽 處理的系統外。因而，排出管側底㈣和被處理基板A表面 的間隙’ iU蒸汽的冷凝液的流路15。該流路15形成於蒸 汽處理區域14的後方（與被處理基板的前進方向相反的方 向）。 使用圖1所示的蒸汽處理裝置10對被處理基板八實施蒸汽 處理來清洗基板表面，其實施過程如下·· k冷部水儲蓄槽6b向冷卻用管6a供給冷卻水6c，同時使 排氣泵5b以及排液泵8b動作的蒸汽處理部10的下側，一邊 以規定速度由輸送滾輪25輸送被處理基板a，一邊由多數個 条噴鳴2將療Ά贺射到被處理基板A的表面實施蒸汽處 理’除去附著在基板A表面的附著物。在蒸汽處理時，控制 由蒸汽噴嘴2噴射的蒸汽，而對應附著在基板a上的附著物 的種類’由上述控制機構控制蒸汽壓和溫度等條件，能夠 以高效率率除去附著物。 雖然蒸汽處理後的蒸汽G2存在於本體1的底面和被處理 基板A之間，但蒸汽處理後的蒸汽G2至少有一部分經由蒸汽 89543.doc -16- 200424024 排氣官5a内排出到蒸汽處理系統外，另外，蒸汽處理後的 療汽G2之中流入蒸汽排氣管5&前的蒸汽h的一部分和流入 蒸汽排氣官5a的蒸汽〇2的一部分，在冷卻用管以的附近被 冷部成爲療汽的冷凝液l2。這些蒸汽的冷凝液。經由流路 15進入冷凝液排出管心内，並經由冷凝液排出管“被排出 到蒸汽處理系統外。 採用本實施例的蒸汽處理裝置，被處理基板A的附著物能 夠被從療汽噴嘴向基板噴射的蒸汽高效率地去除。 之後’由於蒸汽處理後的蒸汽A的大部分被冷卻用管6a 冷卻成爲蒸汽的冷凝液La，所以，供給蒸汽處理後仍以蒸 A开/式、、k續存在的療汽減少，而且，由於剩下的該蒸汽由 排氣機構5能夠迅速排出到蒸汽處理部的系統外，所以，與 先岫虞置相比，蒸汽處理後的蒸汽飛散的區域減小，從被 處理基板A除去的有機物和塵埃等的除去物（被處理基板的 除去物）能夠與蒸汽的冷凝液&一起，依序經由流路15和冷 凝液排出管8a高效率地排出蒸汽處理系統外，能夠防止被 處理基板的除去物再次附著在被處理基板上。 並且，在本實施例的蒸汽處理裝置中，供給於蒸汽處理 後的蒸汽02仍以蒸汽形式存在的蒸汽減少，能夠減小排氣 量。 2外，在本實施例的蒸汽處理裝置中，供給蒸汽處理後 的条AG2飛散區域減少，所以不需要淨化整個蒸汽處理裝 置例如，只要將蒸汽排氣管5a的内面和本體丨的底面用不 會污染被處理基板A的材料構成即可，所以可以減少因淨化 89543.doc -17- 200424024 所需要的材料費用，可降低成本。 另外，在本實施例的蒸汽處理裝置中，配置在蒸汽處理 部10的冷卻機構26，兼作第i冷卻機構和第2冷卻機構，所 以與分別設置上述第1冷卻機構和上述第2冷卻機構的情況 相比，具有能夠使蒸汽處理裝置小型化的優點。 [第2實施例] 圖2係表示本發明的第2實施例的蒸汽處理裝置的概略結 構的剖面圖。 第2實施例的蒸汽處理裝置，與圖1所示的第1實施例的蒸 汽處理裝菫的不同之處在於，設置在蒸汽處理裝置1 〇a上的 冷卻機構’係由第1冷卻機構26、及與該第1冷卻機構26分 開來設置的第2冷卻機構36所構成。 第1冷卻機構26 ’係由在比蒸汽排氣管5a靠近蒸汽喷嘴2 的形成在本體1上的冷卻用管26a及與該冷卻用管26a連接 的冷卻水儲蓄槽26b所構成。該冷卻用管26a的延伸方向與 多數個蒸汽嘴嘴2的排列方向平行。另外，該冷卻用管2 6 a 設置成接觸比蒸汽排氣管5a靠近蒸汽噴嘴2 一側的本體i的 底面（喷嘴側底面）la。 第2冷卻機構36，係由在比蒸汽排氣管5&靠近冷凝液排出 管8a的形成在本體1上的冷卻用管36a及與該冷卻用管36a 連接的冷卻水儲蓄槽36b所構成。該冷卻用管36a的延伸方 向與多數個蒸汽喷嘴2的排列方向平行。另外，該冷卻用管 36a設置成接觸蒸汽排氣管5a的側面和排出管側底面ib。 在該冷卻機構26中，在蒸汽處理時，從冷卻水儲蓄槽26b 89543.doc -18- 200424024 向冷卻用管26a内供給冷卻水26c，但由於該冷卻用管26a接 觸喷嘴側底面1 a，所以利用冷卻用管26a可對蒸汽處理後的 蒸汽G2之中流入蒸汽排氣管5a前的蒸汽進行冷卻，並使之 成爲蒸汽的冷凝液L2。該冷凝液L2存在於被處理基板a表面 和噴嘴側底面1 a的間隙中。 在該冷卻機構36中，在蒸汽處理時，從冷卻水儲蓄槽36b 向冷卻用管26a内供給冷卻水36c，但由於該冷卻用管36a接 觸蒸汽排氣管5a的側面，所以經由蒸汽排氣管5&内的蒸汽 處理後的蒸汽G2的至少一部分被冷卻，並能夠成爲蒸汽的 冷凝液L2。·由於該蒸汽排氣管5a如上述般為傾斜的，所以， 在条汽排氣管5a産生的蒸汽的冷凝液卜被傳送到管内表 面、並落在被處理基板A表面和本體1底面的間隙中。另外， 由於忒冷卻用管3 6a接觸排出管側底面1 b，所以在蒸汽& 不進入瘵汽排氣管5a内而到達排出管側底面lb和被處理基 才的間隙中的情況下，冷卻該蒸汽&被冷卻，能夠成爲蒸 :的冷凝社2。因❿，蒸汽處理後的蒸汽62的大部分，在 P用& 26a以及3 6a的附近被冷卻而成爲蒸汽的冷凝液 L2 〇 ％例的冷卻機構的類型，係分別設置對流入排氣機 構^蒸汽進行冷卻的第1冷卻機構26、與對經由排氣機構 的条汽進行冷卻的第2冷卻機構3 6者。 使用圖2所示的基、卞_ 理來 …/飞處理瓜置對被處理基板A實施蒸汽肩 理“洗基板表面，實施以下過程。 從對應於冷卻用；^ % 用& 26a、36a的冷卻水儲蓄槽供給有冷名 89543.doc _ 19- 200424024 水，且於排氣泵5b以及排液泵8b工作的蒸汽處理部丨〇的下 側，一邊以規定速度由輸送滾輪25輸送被處理基板a，一邊 由多數個蒸汽喷嘴2將蒸汽壓和溫度等條件受到控制的蒸 Ά喷射到被處理基板A的表面實施蒸汽處理，而除去附著在 基板A表面的附著物。 蒸汽處理後的蒸汽G2，雖然存在於本體1的底面和被處理 基板A之間，但蒸汽處理後的蒸汽〇2至少一部分，經由蒸汽 排氧管5 a内排出蒸汽處理糸統外，另外，蒸汽處理後的蒸 汽中流入蒸汽排氣管5a前的蒸汽G2的一部分，在冷卻用 管26a的附进被冷卻成爲蒸汽的冷凝液L2。另外，在蒸汽處 理後的蒸汽G2中流入了蒸汽排氣管5a的蒸汽G2的一部分， 在冷卻用管36a的附近被冷卻成爲蒸汽的冷凝液L2。另外， 在有於蒸汽處理後的蒸汽G2中沒流入蒸汽排氣管5a内而到 達排出管侧底面lb和被處理基板a之間的間隙的蒸汽(^的 情況下，使這些蒸汽G2在冷卻用管36a的附近被冷卻而成爲 蒸汽的冷凝液L2。這些蒸汽的冷凝液L2經由流路丨5進入冷 凝液排出管8a内，並經由冷凝液排出管8&排出到蒸汽處理 糸統外。 採用本實施例的蒸汽處理裝置，由於能夠提高蒸汽處理 後的蒸汽G2的冷凝效果，所以，從被處理基板出去的除去 物能夠與冷凝液L2—起經由流路丨5而進一步高效率地排出 到蒸汽處理系統外。 [第3實施例] 圖3係表示本發明的第3實施例的蒸汽處理裝置的概略結 89543.doc -20- 200424024 構的剖面圖。 …第3實施例的蒸汽處理裝置，與圖1所示的第1實施例的蒸 汽處理裝置的不同之處，在於具有以傾斜的狀態輸送被處 理基板的多數個輸送滾輪（傾斜輸送機構）35,另外-點是， 在，汽處理部1Gb上沒有設置冷凝液排出機構8。 多數個輸送滾輪35(傾斜輸送機構）以傾斜的狀態輸送濕 處理後的被處理基板A，使其能夠藉由蒸汽處理部⑽的下 方。具體地說，多數個輸送滾輪35被設置成能夠以被處理 基板Α/σ私動方向（輸送方向）§上升的角度進行輸送。 使用圖3所示的蒸汽處理裝置對被處理基板Α實施蒸汽處 理來清洗基板表面，其實施過程如下。 從冷卻水儲蓄槽6b向冷卻用管6a供給冷卻水6c，並且由 輸送滾輪3 5將被處理基板a以沿移動方向（輸送方向）上升 的角度並以規定速度輸送到使排氣泵5b工作的蒸汽處理部 10的下側，同時將控制了蒸汽壓和溫度等條件的、從多數 個瘵汽喷嘴2噴出的蒸汽、噴射到被處理基板a的表面實施 蒸汽處理，除去附著在基板A表面的附著物。在蒸汽處理 時’如像上述般傾斜輸送被處理基板A，則在比蒸汽處理區 域14低的位置形成流路15。 蒸汽處理後的蒸汽G2雖然存在於本體1的底面和被處理 基板A之間，但蒸汽處理後的蒸汽G2的至少一部分經由蒸汽 排氣管5a排出到蒸汽處理系統外，另外，蒸汽處理後的蒸 汽G2中流入蒸汽排氣管5a前的蒸汽02的一部分、及流入了 蒸汽排氣管5a的蒸汽G2的一部分，在冷卻用管6a的附近被 89543.doc -21 · 200424024 冷卻而成爲蒸汽的冷凝液La。這些蒸汽的冷凝液^經由流 路15到達被處理基板A的端部並在這裏落到下方，被排出到 蒸汽處理系統外。 本實施例的蒸汽處理裝置，能夠防止從被處理基板A除去 的除去物再次附著在被處理基板A上，而且能夠減少排氣 量’能夠實現低成本的蒸汽處理裝置。 另外，在第1〜第3實施例中，雖然是對將本發明應用於用 於進行清洗的裝置進行了說明，但本發明並不限於清洗工 序，本發明還能夠應用於進行像抗蝕層剝離工序等除去被 處理物的柄著物的一種以上工序的裝置。 另外，在第1〜第3實施例中，雖然對被處理物爲數百瓜瓜 方形，較佳為1〜2 m方形的大型玻璃基板等被處理基板的情 進行了 u兒月但也可以為如半導體晶圓的圓形被處理物。 根據以上5兒明的本發明，能夠防止從被處理物除去的除 去物再次附著在被處理物上，而且能夠減少排氣量，能夠 貫現低成本的蒸汽處理裝置。 【圖式簡單說明】 圖1係表示本發明第丨實施例的蒸汽處理裝置的概略構成 圖。 圖2係表示本發明第2實施例的蒸汽處理裝置的概略構成 圖。 圖3係表示本發明第3實施例的蒸汽處理裝置的概略構成 圖。 圖4係表示使用蒸汽來清洗基板的類型與先前清洗裝置 89543.doc -22- 200424024 的概略構成圖。 【圖式代表符號說明】 1 本體 1 a 喷嘴侧底面 lb 排出管側底面 2 蒸汽喷嘴 5 排氣機構 5a 蒸汽排氣管 5b 排氣泵 5c 開口部 6 冷卻機構（第1以及第2冷卻機構） 6a > 26a、36a 冷卻用管 6b 、 26b 、 36b 冷卻水儲蓄槽 6c ^ 26c λ 36c 冷卻水 8 冷凝液排出機構 8a 冷凝液排出管 8b 排液泵 10、10a、10b 蒸汽處理部 14 蒸汽處理區域 15 流路 25 輸送滾輪（輸送機構） 26 第1冷卻機構 36 第2冷卻機構 35 輸送滾輪（傾斜輸送機構） 89543.doc -23- 200424024The fly is cooled by the second cooling mechanism to become a condensate, and the steam from the exhaust mechanism is removed from the steam treatment system, and the object to be treated is removed 89543.doc 200424024. The condensate goes out of the steam treatment system together. In the steam treatment device of the present invention, the flow path is communicated with the condensate discharge mechanism outside the liquid discharge steam treatment system. Yutu soil is similar to the above steam structure, Liu Di A, Tian Yuyue b, which is enough to improve the drainage effect of the condensate passing through the above-mentioned machine, so ^ ^ ^ This is quite enough to be moved by the condensate The effect of removing the removed object from the processed object is also effective in preventing the removed object from being attached to the processed object again. In addition, the steam treatment apparatus of the present invention preferably has an inclined conveying mechanism for conveying the object to be inclined in an inclined state. In this case, it is preferable that the steamed steam pump is provided on the moving direction side of the object to be moved. According to the steam treatment device having such a structure, the condensate generated after the steam treatment is supplied can be efficiently separated from the object to be processed, because the object to be processed is obliquely transported along the moving direction of the object to be processed. The discharge effect of the liquid and the removed object can further improve the effect of preventing the removed object from adhering to the object again, so that the steam treatment can be performed efficiently. The steam processing apparatus of the present invention may be an apparatus in which the first cooling mechanism and the second cooling mechanism are integrated. Compared with the case where the first cooling mechanism and the above-mentioned second cooling mechanism are separately provided, the steam processing apparatus having such a structure has an advantage that the steam processing apparatus can be miniaturized. [Embodiment] 89543.doc -11- 200424024 The embodiment of the present invention will be described below with reference to the drawings. In addition, the embodiment described below is a method of applying a steam processing apparatus of the present invention to wet-etching a to-be-processed substrate such as a large glass substrate having a square shape of several hundred squares, preferably a 2 m square. A case where a washing process (rinsing process) is performed after the process will be described.彳 [First embodiment] Fig. 1 is a sectional view showing a schematic configuration of a steam processing apparatus according to an i-th embodiment of the present invention. The steam processing apparatus of the first embodiment is a steam processing apparatus having a right side. The main body 1 and a plurality of steam nozzles 2 provided on the side of the main body 1 are used to perform steam treatment.部 10, and a plurality of conveyance rollers (conveyance mechanism) 25. The main body 1 is provided with at least a part of steam to be supplied with steam treatment: 的 an exhaust mechanism 5 outside the steam treatment system, a cooling mechanism 6 to cool the steam after supplying steam treatment, and the cooling mechanism 6 The condensate of the steam cooled and condensed is discharged to the condensate discharge mechanism 8 outside the steam processing system. The bottom surface of the main body 1 of the steam treatment part H) has a flat surface. In addition, among the side surfaces of the main body, the side surface provided with the steam nozzle 2_ side is an inclined surface. 2. The steam processing unit 10 of the steam processing apparatus of this embodiment is arranged at! : The upper side of the substrate A to be processed at the time of processing, and set to be in the steam at this time: There is a gap between the surfaces of the substrate A to be processed. In addition, a condensate of the steam condensed by the cold section mechanism 6 is formed in the gap between the surface of the braided body and the steam treatment section 1G, and the flow of the condensate can be passed. The plurality of conveyance rollers (conveyance mechanisms) 25 convey the substrate A to be processed after the wet-etching process, and can pass the substrate A from below the steam processing unit 10. In addition, the symbol S in the figure of 89543.doc -12-200424024 is the conveyance direction (moving direction) of the substrate A to be processed. There are a plurality of eight nozzles 2 along the side of the main body 1, and when the substrate A to be processed is transported to the lower side of the steam treatment unit 10, the plurality of steam nozzles 2 are positioned on the upper side of the substrate A to be processed, and along the substrate The moving directions of the processing substrates a are arranged side by side. When the substrate A to be processed is conveyed to the lower side of the steam processing section, the tip of each steam nozzle 2 is arranged to face the surface of the substrate to be processed 8. In addition, in FIG. 1, since the other steam nozzle 2 is blocked by the radon steam nozzle 2 on the front side and is invisible, only one steam nozzle 2 is shown. A steam supply source 2a for supplying steam from the steam nozzle 2 is connected to each therapy steam nozzle 2 through a connecting pipe 2b. When the steam processing device of this embodiment is used in the cleaning process described above, water is supplied to each steam nozzle 2 from a steam supply source. In addition, the steam supply source 2a includes a liquid to be supplied to the steam supply source 2a. 1 ^ Heating and vaporizing heating mechanism (illustration omitted. The steam supply source 2a also has a control mechanism that controls the temperature, pressure, saturation, and amount of steam generated by heating the liquid Li to generate steam.) (The illustration is omitted). During the steam processing, the steam processing unit 10 and the steam nozzle 2 are arranged on the conveying direction s side of the substrate A. When performing the steam processing, the bottom surface of the rule and the surface of the substrate A are processed. The gap G1 is directed toward the surface of the substrate A to be processed, and steam G1 ′ is sprayed from the majority of the steam nozzles 2 to be cleaned by the steam Glit. Therefore, a steam processing region M is formed in the gap between the bottom surface of the rule and the surface of the substrate A to be processed. In addition, the steam treatment region 14 is mainly formed on the bottom surface of the main body i on the side of the steam nozzle 2-side than the cooling pipe 6a described later (the bottom surface on the nozzle side ^ and the jacket 89543.doc -13-200424024 The area where the gap between the surfaces of the substrate A is processed. The exhaust mechanism 5 is composed of a plurality of steam exhaust pipes 5 & provided on the main body 丨 and an exhaust pump 5b connected to each steam exhaust pipe 5a. When the plurality of steam exhaust f5a provided on the main m are conveyed to the lower side of the steam processing unit 10, the plurality of steam exhaust pipes are on the upper side of the substrate A and along the The directions intersecting with the moving direction s of the substrate 8 to be processed are arranged side by side. Each of the steam exhaust f5a is arranged to be inclined from the upper surface of the main body 1. The end of each of the steam exhaust pipes is opened at the bottom of the main body 1. The steam exhaust f5a communicates with the gap between the bottom surface of the body i and the surface of the substrate A to be processed. The opening $ c of the steam exhaust pipe 5 & is formed near the steam nozzle 2. Also, in FIG. The nozzle 5a is supported by the steam nozzle on the front side and is invisible, so only one steam exhaust pipe 5a is shown. ―Supply steam after steam treatment g2 (sometimes also called steam after steam treatment>) · 〇All officials exist on the bottom of the body! The processing substrate = _, at least-part of the steam after the steam treatment 02 = = 瘵 Eight exhaust officers 5a are discharged to the outside of the steam processing system. The cooling mechanism 6 'is formed on the body i closer to the steam exhaust pipe. The cooling pipe ^ of the base steam nozzle 2 and the cooling: storage tank ^ t connected to the cooling pipe 6a. The cooling pipe _ extends in a direction parallel to the arrangement direction of the plurality of steaming pipes. In addition, the cooling pipe 6a is provided so as to contact the bottom surface (nozzle-side bottom surface) 1a of the main body 1 closer to the base steam π, ... π1, 12 than the steam exhaust pipe 5a, and the side surface of the steam exhaust pipe 5a. In this cooling mechanism 6, During the steam treatment, the cooling water 6c is supplied from the cooling water storage tank ❿ to the cooling 89543.doc -14-200424024. The cooling pipe 6c is contacted by the cooling pipe so as to contact the bottom side la 'of the nozzle side. After the steam treatment, the steam center is cooled before entering the eight exhaust officer 5a, and the steam center can be turned into π ~ / suspect liquid L2. This condensed liquid h exists in the gap between the surface of the substrate to be processed a and the nozzle-side bottom surface 1a. In addition, since the cooling pipe 6a contacts the side of the steam exhaust pipe, at least one part of the steam treated steam from the steam exhaust pipe 5 & is known to the cold part, and can be steam Condensate ^. Since the steam drainer 5a is inclined as described above, the condensate L2 of the steam generated by the steam exhaust pipe is transferred to the inner surface of the pipe and falls on the gap between the surface of the substrate A to be processed and the bottom surface of the body i. in. Therefore, most of the steam & after the steam treatment is cooled in the vicinity of the cooling pipe 6 a to become a condensate of the steam [2. The cooling mechanism 6 in the present embodiment is a cooling mechanism that integrates a first cooling mechanism that cools the steam before flowing into the exhaust mechanism, and a second cooling mechanism that cools the steam passing through the exhaust mechanism. . The condensate discharge mechanism 8 includes a plurality of condensate discharge pipes 8a provided near the side opposite to the side where the steam nozzle 2 is provided, and a discharge pump 8b connected to the condensate discharge pipe 8a. Made up. The plurality of condensate discharge pipes 8a provided in the main body 1 are arranged such that when the substrate A to be processed is transported to the lower side of the steam processing unit 10, the plurality of condensate discharge tubes 8a are disposed on the substrate to be processed a The upper side is arranged side by side in the direction of the parental movement direction S of the processed substrate a. In addition, one end of each condensate discharge pipe 8a is open at the bottom surface of the main body, and the condensate discharge pipe communicates with the gap between the bottom surface of the main body 丄 89543.doc -15-200424024 and the silk surface of the substrate to be processed. Also, in the figure! In the other, because the other condensation_At8a is caught by the front-side cold heading discharge pipe 8a and cannot be seen, only one condensate discharge pipe is shown in the condensate discharge mechanism 8 during steam treatment. Then, the condensate l2 'of the steam generated near the steam exhaust pipe 5a and the cooling pipe 6a passes through the bottom surface (the discharge pipe side bottom surface) lb of the body lb, which is closer to the condensate discharge pipe κ than the steam exhaust pipe 5a. The gap on the surface of the substrate A to be processed enters the condensate discharge pipe 8a, and is discharged to the outside of the steam processing system through the condensate discharge pipe 8 &. Therefore, the gap between the bottom side of the discharge pipe and the surface of the substrate A to be processed ' iU steam condensate flow path 15. This flow path 15 is formed at the rear of the steam processing area 14 (the direction opposite to the advancing direction of the substrate to be processed). The steam processing device 10 shown in FIG. The steam treatment is used to clean the surface of the substrate. The implementation process is as follows: k The cold water storage tank 6b supplies the cooling water 6c to the cooling pipe 6a, and at the same time, the exhaust pump 5b and the drain pump 8b are operated. On the side, while the substrate to be processed a is being conveyed by the conveying roller 25 at a predetermined speed, a plurality of blasts 2 are sprayed on the surface of the substrate A to be treated and steam treatment is performed to remove the adhered matter on the surface of the substrate A. During the steam treatment, the steam sprayed from the steam nozzle 2 is controlled, and according to the type of the adhered matter attached to the substrate a, the conditions such as the vapor pressure and temperature are controlled by the above-mentioned control mechanism, and the adhered matter can be removed at a high efficiency. The processed steam G2 exists between the bottom surface of the main body 1 and the substrate A to be processed, but at least a part of the steam processed steam G2 is discharged to the outside of the steam processing system through the steam 89543.doc -16- 200424024 exhaust officer 5a. In addition, a part of the steam h flowing into the steam exhaust pipe 5 before the steam treatment steam G2 and a part of the steam 02 flowing into the steam exhaust pipe 5a are placed in the cooling pipe. Become close to the cold portion of the vapor condensate treatment l2. These steam condensate via the flow passage 15 into the inner stylet condensate discharge, and is discharged via a condensate pipe "steam is discharged to outside the processing system. With the steam processing apparatus of this embodiment, the adherend of the substrate A to be processed can be efficiently removed by the steam ejected from the steam treatment nozzle toward the substrate. After that, since most of the steam A after the steam treatment is cooled by the cooling pipe 6a to become the steam condensate La, the steam after the steam treatment is still in the form of steam A //, and k is reduced, and, Since the remaining steam can be quickly discharged to the outside of the system of the steam processing unit by the exhaust mechanism 5, the area in which the steam after the steam treatment is scattered is smaller than that of the previous one, and the area removed from the substrate A to be processed is reduced. Organic matter, dust, and other removed matter (removed matter of the substrate to be processed) can be efficiently discharged out of the steam treatment system through the flow path 15 and the condensate discharge pipe 8a in sequence with the steam condensate &, and can be prevented from being processed. The removed matter of the substrate is attached to the substrate to be processed again. Furthermore, in the steam processing apparatus of this embodiment, the steam 02 supplied to the steam treatment is still reduced in the form of steam, and the exhaust gas amount can be reduced. In addition, in the steam treatment device of this embodiment, the scattering area of the strip AG2 after the steam treatment is reduced, so there is no need to purify the entire steam treatment device. For example, as long as the inner surface of the steam exhaust pipe 5a and the bottom surface of the main body are not used, The material configuration that can contaminate the substrate A to be processed is sufficient, so the material cost required for purification 89543.doc -17- 200424024 can be reduced, and the cost can be reduced. In addition, in the steam processing apparatus of the present embodiment, the cooling mechanism 26 disposed in the steam processing unit 10 doubles as the i-th cooling mechanism and the second cooling mechanism. Compared with this case, there is an advantage that the steam processing apparatus can be miniaturized. [Second Embodiment] Fig. 2 is a sectional view showing a schematic configuration of a steam processing apparatus according to a second embodiment of the present invention. The steam processing apparatus of the second embodiment is different from the steam processing apparatus of the first embodiment shown in FIG. 1 in that a cooling mechanism 'provided on the steam processing apparatus 10a is a first cooling mechanism 26 And a second cooling mechanism 36 provided separately from the first cooling mechanism 26. The first cooling mechanism 26 'is composed of a cooling pipe 26a formed on the main body 1 near the steam nozzle 2 than the steam exhaust pipe 5a, and a cooling water storage tank 26b connected to the cooling pipe 26a. The extending direction of the cooling pipe 26a is parallel to the arrangement direction of the plurality of steam nozzles 2. The cooling pipe 2 6 a is provided so as to contact the bottom surface (nozzle-side bottom surface) la of the body i closer to the steam nozzle 2 than the steam exhaust pipe 5 a. The second cooling mechanism 36 is composed of a cooling pipe 36a formed on the body 1 closer to the condensate discharge pipe 8a than the steam exhaust pipe 5 and a cooling water storage tank 36b connected to the cooling pipe 36a. The extending direction of the cooling pipe 36a is parallel to the arrangement direction of the plurality of steam nozzles 2. The cooling pipe 36a is provided so as to contact the side surface of the steam exhaust pipe 5a and the exhaust pipe side bottom surface ib. In this cooling mechanism 26, during the steam treatment, the cooling water 26c is supplied from the cooling water storage tank 26b 89543.doc -18-200424024 into the cooling pipe 26a. However, since the cooling pipe 26a contacts the nozzle-side bottom surface 1a, Therefore, by using the cooling pipe 26a, the steam before the steam-treated steam G2 flows into the steam exhaust pipe 5a can be cooled and made into the steam condensate L2. This condensed liquid L2 exists in the gap between the surface of the substrate to be processed a and the nozzle-side bottom surface 1a. In this cooling mechanism 36, during the steam treatment, the cooling water 36c is supplied from the cooling water storage tank 36b into the cooling pipe 26a. However, since the cooling pipe 36a contacts the side of the steam exhaust pipe 5a, the steam is exhausted through the steam At least a part of the steam G2 after the steam treatment in the pipe 5 & is cooled and can be a condensate L2 of the steam. Since the steam exhaust pipe 5a is inclined as described above, the condensate of the steam generated in the steam exhaust pipe 5a is transferred to the inner surface of the pipe and falls on the surface of the substrate A to be processed and the bottom surface of the main body 1. In the gap. In addition, since the thorium cooling pipe 36a contacts the exhaust pipe side bottom surface 1b, when steam & does not enter the thorium steam exhaust pipe 5a and reaches the gap between the exhaust pipe side bottom surface 1b and the substrate to be treated, Cooling the steam & is cooled, and it can be a steaming condensing company 2. Because of this, most of the steam 62 after the steam treatment is cooled in the vicinity of P & 26a and 36a to become the condensate L2 of the steam, which is a type of cooling mechanism. Each type of cooling mechanism is provided with an inflow and exhaust mechanism. ^ The first cooling mechanism 26 for cooling the steam and the second cooling mechanism 36 for cooling the steam passing through the exhaust mechanism. Using the base and substrate shown in Fig. 2 ... / fly processing, steaming the substrate A to be processed "wash the surface of the substrate, and implement the following process. For cooling; ^% use & 26a, 36a The cooling water storage tank is supplied with cold name 89543.doc _ 19- 200424024, and is conveyed by the conveying roller 25 at a predetermined speed under the steam processing unit 丨 〇 which operates the exhaust pump 5b and the discharge pump 8b. The substrate a is processed, and a plurality of steam nozzles 2 are used to spray steam with controlled conditions such as steam pressure and temperature on the surface of the substrate A to be processed to perform a steam treatment to remove the adhered matter on the surface of the substrate A. After the steam treatment Although the steam G2 exists between the bottom surface of the body 1 and the substrate A to be processed, at least a part of the steam 02 after the steam treatment is discharged out of the steam treatment system through the steam exhaust pipe 5a. A part of the steam G2 before the steam flows into the steam exhaust pipe 5a is cooled by the condensate L2 attached to the cooling pipe 26a. The steam G2 flows into the steam exhaust pipe 5a A part of the steam G2 is cooled to become a steam condensate L2 in the vicinity of the cooling pipe 36a. In addition, the steam G2 that has undergone the steam treatment does not flow into the steam exhaust pipe 5a and reaches the bottom side 1b of the discharge pipe side and the In the case of processing the steam in the gap between the substrates a, the steam G2 is cooled in the vicinity of the cooling pipe 36a to become a steam condensate L2. The steam condensate L2 enters the condensate through the flow path 5 The exhaust pipe 8a is discharged to the outside of the steam treatment system through the condensate discharge pipe 8 &. With the steam treatment apparatus of this embodiment, the condensation effect of the steam G2 after the steam treatment can be improved. The removed matter can be discharged to the outside of the steam treatment system through the flow path 5 together with the condensate L2. [Third Embodiment] Fig. 3 shows the outline of a steam treatment device according to a third embodiment of the present invention. 895895.doc -20- 200424024 structured cross-sectional view.… The steam treatment apparatus of the third embodiment differs from the steam treatment apparatus of the first embodiment shown in FIG. 1 in that it has a tilt The majority of the conveyance rollers (inclined conveyance mechanism) 35 for conveying the substrate to be processed are in a state that the condensate discharge mechanism 8 is not provided in the steam processing unit 1Gb. The plurality of conveyance rollers 35 (inclined conveyance mechanism) are inclined The substrate A to be processed after being wet-processed is conveyed so that it can pass under the steam processing section 多数. Specifically, a plurality of conveying rollers 35 are provided so that the substrate A to be processed can be moved in a private direction (conveying direction). ) § It is conveyed at an ascending angle. The substrate surface A to be processed is subjected to steam treatment using a steam processing apparatus shown in FIG. 3 to clean the surface of the substrate. The implementation process is as follows. The cooling water 6c is supplied from the cooling water storage tank 6b to the cooling pipe 6a. The substrate to be processed a is conveyed by the conveying rollers 35 at an angle rising in the moving direction (conveying direction) to the lower side of the steam processing unit 10 that operates the exhaust pump 5b at a predetermined speed, and the steam pressure is controlled. The steam sprayed from the plurality of krypton nozzles 2 under conditions such as temperature and temperature is sprayed onto the surface of the substrate a to be processed, and steam treatment is performed to remove the components adhering to the surface of the substrate A. Attachments. At the time of steam processing ', the substrate A to be processed is transported obliquely as described above, and the flow path 15 is formed at a position lower than that of the steam processing region 14. Although the steam-treated steam G2 exists between the bottom surface of the main body 1 and the substrate A to be processed, at least a part of the steam-treated steam G2 is discharged to the outside of the steam processing system through the steam exhaust pipe 5a. A part of the steam 02 before the steam G2 flows into the steam exhaust pipe 5a and a part of the steam G2 flowing into the steam exhaust pipe 5a are cooled in the vicinity of the cooling pipe 6a by 89543.doc -21 · 200424024 to become steam. Condensate La. The condensed liquid ^ of the vapor reaches the end of the substrate A to be processed through the flow path 15 and falls here, and is discharged to the outside of the steam processing system. The steam processing apparatus of this embodiment can prevent the removed matter removed from the processed substrate A from adhering to the processed substrate A again, and can reduce the amount of exhaust gas. In addition, in the first to third embodiments, the present invention has been described as being applied to an apparatus for cleaning. However, the present invention is not limited to the cleaning process, and the present invention can also be applied to image resists. An apparatus for one or more steps of removing a handle of an object to be processed, such as a peeling step. In addition, in the first to third embodiments, although the object to be processed is a large-sized glass substrate such as a large-sized glass substrate having a square shape of several hundred squares, preferably a square of 1 to 2 m, it may be used for several months. It is a round object such as a semiconductor wafer. According to the present invention described above, it is possible to prevent the removed matter from being removed from being adhered to the to-be-processed object, and to reduce the amount of exhaust gas, thereby realizing a low-cost steam treatment apparatus. [Brief Description of the Drawings] Fig. 1 is a schematic configuration diagram showing a steam processing apparatus according to a first embodiment of the present invention. Fig. 2 is a schematic configuration diagram showing a steam processing apparatus according to a second embodiment of the present invention. Fig. 3 is a schematic configuration diagram showing a steam processing apparatus according to a third embodiment of the present invention. FIG. 4 is a schematic diagram showing a type of substrate cleaning using steam and a conventional cleaning device 89543.doc -22- 200424024. [Description of representative symbols] 1 body 1 a Nozzle side bottom surface lb Discharge pipe side bottom surface 2 Steam nozzle 5 Exhaust mechanism 5a Steam exhaust pipe 5b Exhaust pump 5c Opening 6 Cooling mechanism (first and second cooling mechanisms) 6a > 26a, 36a Cooling pipes 6b, 26b, 36b Cooling water storage tanks 6c ^ 26c λ 36c Cooling water 8 Condensate discharge mechanism 8a Condensate discharge pipe 8b Liquid discharge pump 10, 10a, 10b Steam treatment unit 14 Steam treatment Zone 15 Flow path 25 Conveying roller (conveying mechanism) 26 First cooling mechanism 36 Second cooling mechanism 35 Conveying roller (inclined conveying mechanism) 89543.doc -23- 200424024
A Gi G2 l2 S 被處理基板（被處理物） 蒸汽 供給蒸汽處理後的蒸汽（蒸汽處理後的 蒸汽） 蒸汽的冷凝液 輸送方向。 89543.doc -24-A Gi G2 l2 S To-be-processed substrate (to-be-processed object) Steam Supply steam-treated steam (steam-treated steam). Condensate of steam Conveying direction. 89543.doc -24-