KR100537316B1 - Steam transaction device - Google Patents

Abstract

An object of the present invention is to provide a steam treatment device which can prevent the removed matter removed from the object to be reattached to the object, can reduce the amount of exhaust gas, and has a low cost.

In order to solve the above problems, and a steam injection nozzle (2) for spraying toward the steam (G _1), the object to be treated (A) for the steam treatment, it is provided in the vicinity of the steam injection nozzle (2), provided in the steam treatment steam processing unit comprising at least a portion of the steam (G ₂₎ to the exhaust mechanism (5), and a cooling mechanism (6) to cool the steam (G _2), and after steam treatment for discharging a off - system (系外) of the steam treatment after the (10 And a flow path 15 through which the condensed liquid L ₂ , which is steam condensed and cooled by the cooling mechanism 6, is passed between the surface of the object A and the pole of the steam treatment unit 10. Formed steam treatment apparatus.

Description

Steam Treatment Unit {STEAM TRANSACTION DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a steam treatment apparatus for injecting steam onto a surface of an object to be treated, and in particular, for use in a cleaning (rinsing) process in a manufacturing process such as a semiconductor device or a liquid crystal display panel, or a resist stripping process in a photolithography process. It relates to a technique suitable for the following.

In the field of electronic devices, such as a semiconductor device and a liquid crystal display panel, the process of carrying out the washing process of to-be-processed substrates, such as a semiconductor substrate and a glass substrate, is essential during the manufacturing process.

One type of cleaning apparatus used in such a cleaning process is a type of cleaning by spraying steam onto the surface of a substrate to be processed. 4 is a view showing a schematic configuration of a conventional washing apparatus of the type for injecting steam (see Patent Document 1, for example).

Reference numeral 60 in FIG. 4 denotes a chamber. The chamber 60 is brought into contact with the mechanism 62 for carrying out the substrate 61 to be processed, the support / rotation mechanism 63 of the substrate, and the substrate 61 supported by the support / rotation mechanism 63. A water vapor inlet 71 for supplying water vapor to the substrate surface, a water vapor injection nozzle 72 for injecting water vapor onto the surface of the substrate 61, a gas injection nozzle 73 for injecting gas to the surface of the substrate 61, and And an exhaust / drainage mechanism 66.

To clean the substrate to be processed using the cleaning device of FIG. 4, after the substrate 61 to be conveyed into the chamber 60 is supported by the support / rotation mechanism 63, the substrate to be cleaned 61 is cleaned. The cleaning process is performed by injecting gas from the gas injection nozzle 73 onto the surface of the gas injector and spraying water vapor from the steam injection nozzle 72.

[Patent Document]

Japanese Laid-Open Patent Publication 2001-252631

However, in the cleaning apparatus as shown in FIG. 4, the vapor after being provided for cleaning may bounce off the substrate 61 to be scattered and spread to all regions within the chamber 60, and may adhere to the inner wall of the chamber 60 or the like. Since the vapor | steam after providing for washing | cleaning often contains the removal material from a board | substrate, the said removal material will adhere to the inner wall of the chamber 60, etc.

In addition, since the exhaust of the chamber 60 is exhausted by the exhaust / drainage mechanism 66, the vapor after being provided for cleaning may adhere to the inner wall of the chamber 60 or the like before condensing the air flow of the exhaust. In this condensate, the remover adhering to the inner wall of the chamber 60 is dissolved, and when it falls on the substrate to be cleaned, there is a problem of contaminating the surface already cleaned. In the conventional cleaning apparatus, since the chamber 60 is collectively performed by the exhaust / drainage mechanism 66, the amount of exhaust gas increases.

In addition, depending on the material constituting the chamber 60, there is a problem in that it dissolves in the condensate attached to the inner wall, which falls and contaminates the substrate to be cleaned. The countermeasure may be made of a material that cleans the chamber, that is, does not cause contamination of the substrate to be processed, but increases the cost.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and it is possible to prevent the removal of the removed matter from being reattached to the to-be-processed object, to reduce the displacement, and to provide a low-cost steam treatment apparatus. It is a task.

MEANS TO SOLVE THE PROBLEM As a result of earnestly examining and researching in order to solve the said subject, as for a particle | grains, such as a particle, which adhere to the to-be-processed object, or an adherent, such as an organic substance, steam is easier to remove than a liquid, and therefore, temperature and pressure are adjusted. It is possible to efficiently remove a vapor by injecting it into the object, and since it is more transportable of the substance to be removed with the liquid than to be discharged with the vapor, it is necessary to The vapor was cooled to a condensate, and it was found that the above problems can be solved by allowing the removed product to be efficiently discharged together with the condensate.

That is, the steam processing apparatus of this invention is provided with the steam injection nozzle which inject | pours the steam for steam processing toward a to-be-processed object, and this steam injection nozzle is installed in the vicinity of this steam injection nozzle, and at least one part of the steam provided to the steam process is based on a steam treatment system. A steam processing section comprising an exhaust mechanism for discharging to the outside and a cooling mechanism for cooling the steam after being provided to the steam processing, wherein the steam is cooled and condensed by the cooling mechanism between the surface of the object and the steam processing section. Characterized in that a flow path through which the condensate can pass.

The steam injected from the steam injection nozzle is not limited to water vapor, and may be steam of a chemical liquid such as a resist stripping liquid depending on the use of the steam treatment apparatus of the present invention.

According to the steam processing apparatus of such a structure, the deposit of a to-be-processed object can be efficiently removed by adjusting the temperature or the pressure of the steam sprayed toward a board | substrate from a steam spray nozzle. And since at least a part of the steam after being provided for the steam treatment is cooled by the cooling mechanism to become a condensate, it is less likely to continue to exist in the vapor state after being provided for the steam treatment, and it is further left by the exhaust mechanism that remains in this steam state. Since it can be quickly discharged to the outside of the steam treatment section, compared with the conventional apparatus, the area where the steam after the steam treatment is scattered is at least scattered, and the removed substances such as organic matter or dust removed from the workpiece are together with the condensate. It is possible to efficiently discharge to the outside of the steam treatment through the flow path, it is possible to prevent the removal (removed material) removed from the object to be reattached to the object.

In addition, in the steam treatment apparatus of the present invention, the amount of steam after the steam treatment is continuously kept in the vapor state can be reduced, so that the displacement can be reduced.

Moreover, in the steam processing apparatus of this invention, since the area | region where the steam after provided for steam processing is scattered is at least, it is not necessary to clean the whole steam processing apparatus. For example, since the exhaust mechanism portion may be made of a material which does not have a risk of contaminating the object to be processed, the material cost required for cleaning can be reduced, and the cost can be reduced.

In the steam processing apparatus of this invention, the said cooling mechanism may consist of a 1st cooling mechanism which cools the steam before inflow of the said exhaust mechanism, and a 2nd cooling mechanism which cools the steam which passes through the said discharge mechanism.

According to the steam treatment apparatus of this structure, the condensation effect of the steam after being provided to the steam treatment can be improved, so that the removed matter removed from the object to be processed is passed together with the condensate through the flow path more efficiently outside of the steam treatment system. Can be discharged. Specifically, at least a part of the steam after being provided to the steaming treatment is cooled by the first cooling mechanism to be a condensate before inflow of the discharge mechanism, and the removed material from the object to be treated is passed through the flow path along with the condensate and steamed. Can be efficiently discharged to the outside of the system, and what has entered the exhaust mechanism as steam after being provided to the steam treatment is cooled by the second cooling mechanism to form a condensate. Passing through the flow path can be efficiently discharged to the outside of the steam treatment system.

Moreover, in the steam processing apparatus of this invention, it is preferable that the condensate discharge mechanism which discharges the condensate of the said steam out of the system of a steam process communicates with the said flow path.

According to the steam treatment apparatus of such a structure, since the discharge effect of the condensate liquid which passes through the said flow path can be improved, the discharge effect of the removal object of the to-be-processed object conveyed by this condensate can also be improved, and the removal object of the to-be-processed object can be improved. The effect of preventing reattachment to the processed material can also be improved.

Moreover, in the steam processing apparatus of this invention, it is preferable that the inclination conveyance mechanism which conveys the said to-be-processed object in the inclined state is provided. In this case, it is preferable that the steam injection nozzle is provided on the moving direction side of the workpiece.

According to the steam treatment apparatus having such a configuration, the condensate generated after being provided to the steam treatment can be efficiently separated from the object by being conveyed obliquely at an angle at which the object is raised in the moving direction of the object. The effect of discharging the removal of the workpiece can be further improved, and the effect of preventing the removal of the removal of the workpiece to be reattached to the workpiece can be further improved, so that the steam treatment can be performed efficiently.

Moreover, in the steam processing apparatus of this invention, the said 1st cooling mechanism and the said 2nd cooling mechanism may be integrated.

According to the steam processing apparatus of such a structure, compared with the case where a 1st cooling mechanism and a said 2nd cooling mechanism are provided separately, there exists an advantage that a steam processing apparatus can be miniaturized.

Embodiment of the invention

Embodiments of the present invention will be described below with reference to the drawings. In the embodiment described below, after the wet etching treatment of the steam treatment apparatus of the present invention on a substrate to be treated, such as a large glass substrate, which is about several hundred mm in width and preferably 1 to 2 m in width, as the object to be treated, The case where it applies to the steam treatment apparatus used suitably when performing the process of washing process (rinse process) is demonstrated.

[First embodiment]

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows schematic structure of the steam processing apparatus of 1st Embodiment of this invention.

The steam processing apparatus of the first embodiment includes a steam processing unit 10 mainly comprising a main body 1 and a plurality of steam injection nozzles 2 provided on the side of the main body 1, and a plurality of conveying rollers 25. Mechanism) is provided.

The main body 1 includes an exhaust mechanism 5 for discharging at least a part of the steam after the steam treatment to the outside of the steam treatment, a cooling mechanism 6 for cooling the steam after the steam treatment, and this cooling mechanism 6 The condensate discharge mechanism 8 which discharges the condensed liquid of the steam condensed by condensation | cooling and condensed out of the steam processing system is provided. The bottom face of the main body 1 of the steam processing part 10 is provided with the flat surface. Moreover, the side surface of the side in which the steam injection nozzle 2 is installed among the side surfaces of the main body 1 is inclined obliquely.

The steam processing part 10 of the steam processing apparatus of this embodiment is arrange | positioned above the to-be-processed board | substrate A at the time of a steaming process, so that a clearance gap may be formed between the steam processing part 10 and the surface of the to-be-processed board | substrate A. FIG. Is placed. Moreover, the flow path 15 through which the condensed liquid of the vapor cooled and condensed by the cooling mechanism 6 is formed between the surface of this to-be-processed substrate A and the pole of the steam process part 10 is formed.

The several conveyance roller 25 can convey the to-be-processed board | substrate A after a wet etching process, and can pass the steam processing part 10 below. In addition, in the figure, the code | symbol S is a conveyance direction (moving direction) of the to-be-processed substrate A. FIG.

The plurality of steam injection nozzles 2 are provided along the side surface of the main body 1, so that when the substrate A to be processed is conveyed below the steam processing unit 10, the plurality of steam injection nozzles 2 are avoided. It is arrange | positioned above the process board | substrate A and arrange | positioned in the direction which cross | intersects the movement direction of the process board | substrate A. FIG. The tip of each steam injection nozzle 2 is an arrangement | positioning toward the surface of the to-be-processed substrate A, when the to-be-processed substrate A is conveyed below the steam process part 10. In addition, in FIG. 1, only one steam injection nozzle 2 is shown since the other steam injection nozzle 2 is not covered by the steam injection nozzle 2 in the front.

Each steam injection nozzle 2 is connected with the steam supply source 2a for supplying steam to this steam injection nozzle 2 via the connection pipe 2b. When the steam treatment apparatus of this embodiment is used in the above washing process, water vapor is supplied from the steam supply source 2a to each steam injection nozzle 2. In addition, the steam supply 2a is provided with heating means (not shown) which heats and vaporizes the liquid L ₁ supplied to this steam supply 2a.

In addition, the steam supply source 2a is provided with a control mechanism (not shown) for controlling the temperature of the steam generated by heating the liquid L ₁ , the pressure of the steam, the steam saturation, and the amount of steam generated.

When performing a steam process, the steam process part 10 is arrange | positioned so that the steam injection nozzle 2 may become the conveyance direction S side of the to-be-processed substrate A. FIG.

In the steam treatment, steam G ₁ is injected from the plurality of steam injection nozzles 2 between the bottom of the main body 1 and the gap between the surface of the substrate A and the surface of the substrate A. This steam G ₁ is washed. Therefore, the steam process area | region 14 is formed between the bottom face of the main body 1 and the pole of the to-be-processed substrate A surface. In addition, this steam process area | region 14 has a space | interval between the bottom face (1a: bottom face of nozzle side) and the to-be-processed substrate A surface of the main body 1 by the steam injection nozzle 2 side rather than the cooling pipe 6a mentioned later. It is mainly formed in the area.

The exhaust mechanism 5 is comprised from the several steam exhaust pipe 5a provided in the main body 1, and the exhaust pump 5b connected to each steam exhaust pipe 5a.

When the to-be-processed board | substrate A is conveyed below the steam process part 10, when the to-be-processed board | substrate A is conveyed to the some steam exhaust pipe 5a provided in the main body 1, these some steam exhaust pipes 5a are the to-be-processed board | substrate A ) And arranged in a direction intersecting with the movement direction S of the substrate A to be processed. Each vapor exhaust pipe 5a is provided so that it may incline obliquely from the upper surface side of the main body 1 to the bottom surface side. One end of each of the steam exhaust pipes 5a is opened at the bottom of the main body 1, and each of the steam exhaust pipes 5a is in communication with a gap between the bottom of the main body 1 and the surface of the substrate A to be processed. . The opening 5c of the steam exhaust pipe 5a is formed at a position near the steam injection nozzle 2. In addition, in FIG. 1, since only the other steam exhaust pipe 5a is not obscured by the front steam exhaust pipe 5a, only one steam exhaust pipe 5a is shown.

The steam G ₂ (sometimes described as steam after steam treatment) after being provided for the steam treatment is present between the bottom face of the main body 1 and the substrate to be processed A. The steam treatment is performed by operating the exhaust pump 5b. At least a part of the subsequent steam G ₂ can be discharged to the outside of the steam treatment system through the steam exhaust pipe 5a.

The cooling mechanism 6 includes a cooling pipe 6a formed in the main body 1 near the steam injection nozzle 2 than the steam exhaust pipe 5a, and a cooling water storage tank 6b connected to the cooling pipe 6a. Consists of The extending direction of this cooling pipe 6a becomes a direction parallel to the arrangement direction of the some steam injection nozzle 2. In addition, the cooling pipe 6a has a lower surface (1a: bottom surface of the nozzle side) of the main body 1 on the steam injection nozzle 2 side and a side surface of the steam exhaust pipe 5a than the steam exhaust pipe 5a. It is installed to be in contact.

The cooling mechanism 6 is supplied with cooling water 6c from the cooling water storage tank 6b into the cooling pipe 6a at the time of steam treatment, and this cooling pipe 6a is in contact with the bottom face 1a of the nozzle side. Therefore, in the steam G ₂ after the steam treatment in the cooling pipe 6a, the one before the inflow to the steam exhaust pipe 5a is cooled to form a condensed liquid L _{2 of} steam. This condensate L ₂ exists between the surface of the substrate A to be processed and the gap between the bottom face 1a on the nozzle side.

In addition, since the cooling pipe 6a is in contact with the side surface of the steam exhaust pipe 5a, at least a part of the steam G ₂ after the steaming treatment passing through the steam exhaust pipe 5a is cooled to condense the steam. (L ₂ ). Since the steam exhaust pipe 5a is inclined obliquely as described above, the condensate L ₂ of steam generated in the steam exhaust pipe 5a is formed along the inner surface of the substrate A and the body of the substrate A to be processed. It falls between the poles of the bottom face of (1). Therefore, most of the steam G ₂ after steam treatment is cooled near the cooling pipe 6a to become the condensate L _{2 of the} steam.

The cooling mechanism 6 of this embodiment is a type in which the 1st cooling mechanism which cools the steam before inflow of an exhaust mechanism, and the 2nd cooling mechanism which cools the steam which passes through an exhaust mechanism are integrated.

The condensate discharge mechanism 8 includes a plurality of condensate discharge pipes 8a provided near the side of the main body 1 on the side opposite to the side on which the steam injection nozzle 2 is installed, and drainage connected to each condensate discharge pipe 8a. It consists of the pump 8b.

When the several condensate discharge pipe 8a provided in the main body 1 conveyed the to-be-processed board | substrate A below the steam processing part 10, these several condensate discharge pipes 8a are the to-be-processed board | substrate A ), Or arranged in a direction intersecting with the movement direction of the substrate A to be processed. Moreover, one end of each condensate discharge pipe 8a is opened in the bottom face of the main body 1, and this condensate discharge pipe 8a is in communication with the space | interval of the bottom face of the main body 1, and the to-be-processed substrate A surface. . 1, only one condensate discharge pipe 8a is shown since the other condensate discharge pipe 8a is not hidden by the front condensate discharge pipe 8a.

When the condensate discharge mechanism 8 operates the drainage pump 8b during steam treatment, the condensate L ₂ of steam generated near the steam exhaust pipe 5a or the cooling pipe 6a is a steam exhaust pipe ( It enters into the condensate discharge pipe 8a through the gap between the bottom face (1b: bottom face of the discharge pipe side) of the main body 1 by the side of the condensate discharge pipe 8a, and the to-be-processed substrate A surface rather than 5a), and this condensate It passes through the discharge pipe 8a, and can discharge | emit out of a steam processing system. Therefore, the clearance gap between the bottom face 1b of the discharge pipe side and the surface of the substrate A to be processed becomes the flow path 15 of the condensate of steam. This flow path 15 is formed behind the steam processing region 14 (direction opposite to the traveling direction of the substrate to be processed).

The steam treatment is performed on the substrate A by using the steam treatment apparatus 10 as shown in FIG. 1 to clean the substrate surface as follows.

At the same time as the cooling water 6c is supplied to the cooling pipe 6a from the cooling water storage tank 6b, and the exhaust pump 5b and the drainage pump 8b are operated, a conveying roller Steam is sprayed on the surface of the to-be-processed substrate A from several steam injection nozzles 2, conveying the to-be-processed substrate A by a predetermined | prescribed speed by 25, and steaming is performed, and the surface of the board | substrate A is carried out. Remove attachments from The steam injected from the plurality of steam injection nozzles 2 during the steam treatment is controlled by the control mechanism according to the type of deposit adhered to the substrate A so that the vapor deposit or the temperature is controlled. Controlled to be removed.

The steam G ₂ after steaming is present between the bottom surface of the main body 1 and the substrate A to be processed, and at least a part of the steam G ₂ after steaming passes through the steam exhaust pipe 5a to steam the steaming. the system being discharged outside, and a portion of the steam (G ₂₎ flowing into the part and vapor exhaust pipe (5a) of the steam (G _2), before flowing into the steam exhaust pipe (5a) of the steam (G ₂₎ after the steam treatment It cools in the vicinity of the cooling pipe 6a, and becomes the condensate L _{2 of} steam. The condensate L ₂ of these vapors passes through the flow path 15 into the condensate discharge pipe 8a and passes through the condensate discharge pipe 8a to be discharged out of the steam treatment system.

According to the steam treatment unit of the present embodiment, the attachment of the substrate (A) can be efficiently removed by the steam (G ₁₎ is injected toward the substrate from the vapor spray nozzle.

Since most of the steam G ₂ after the steam treatment is cooled by the cooling pipe 6a to become the condensate L ₂ of the steam, the steam G ₂ is less likely to continue to exist in the steam state after being provided to the steam treatment. What remains in the state can be quickly discharged out of the steam treatment section by the exhaust mechanism 5, so that the area where steam after steam treatment is scattered is reduced compared with the conventional apparatus, and removed from the substrate A to be processed. Removed substances such as organic matters and dust (removed substrates to be processed) pass through the flow path 15 and the condensed liquid discharge pipe 8a in order together with the condensed liquid G ₂ of the vapor in order, and efficiently out of the system of steam treatment. It can discharge, and it can prevent that the removal of the to-be-processed board | substrate reattaches to a to-be-processed board.

Furthermore, in the steam processing apparatus of this embodiment, it is less likely that the steam G ₂ provided after the steam processing continues to exist in the steam state, and the displacement can be reduced.

In addition, the steam treatment apparatus of the present embodiment, the steam (G ₂₎ so that a region in which scattering at least there is no need to call the entire blue steaming device provided after the steam treatment. For example, since the inner surface of the steam exhaust pipe 5a and the bottom surface of the main body 1 may be made of a material which does not contaminate the substrate A to be processed, the material cost required for cleaning can be reduced, resulting in low cost. have.

Moreover, in the steam processing apparatus of this embodiment, since the cooling mechanism 26 with which the steam processing part 10 is equipped also serves as a 1st cooling mechanism, and a 2nd cooling mechanism, a 1st cooling mechanism and a 2nd cooling mechanism are separated separately. Compared with the installation, there is an advantage that the steam treatment apparatus can be miniaturized.

Second Embodiment

It is sectional drawing which shows schematic structure of the steam processing apparatus of 2nd Embodiment of this invention.

The steam processing apparatus of the second embodiment is particularly different from the steam processing apparatus of the first embodiment shown in FIG. 1. The cooling mechanism provided in the steam processing unit 10a includes the first cooling mechanism 26 and the first cooling mechanism. It is a point comprised from the 2nd cooling mechanism 36 provided separately from the cooling mechanism 26. FIG.

The 1st cooling mechanism 26 is the cooling pipe 26a formed in the main body 1 near the steam injection nozzle 2 rather than the steam exhaust pipe 5a, and the cooling water storage tank connected to this cooling pipe 26a. It consists of 26b. The extension direction of this cooling pipe 26a becomes a direction parallel to the arrangement direction of the some steam injection nozzle 2. Moreover, this cooling pipe 26a is provided so that it may contact the bottom face 1a (bottom face of a nozzle side) of the main body 1 by the steam injection nozzle 2 side rather than the vapor exhaust pipe 5a.

The 2nd cooling mechanism 36 is the cooling pipe 36a formed in the main body 1 near the condensate discharge pipe 8a rather than the vapor exhaust pipe 5a, and the cooling water storage tank connected to this cooling pipe 36a. It consists of 36b. The extension direction of this cooling pipe 36a becomes a direction parallel to the arrangement direction of the some steam injection nozzle 2. Moreover, this cooling pipe 36a is provided in contact with the side surface of the steam exhaust pipe 5a and the bottom face 1b of the discharge pipe side.

The cooling mechanism 26 is supplied with cooling water 26c from the cooling water storage tank 26b into the cooling pipe 26a at the time of steam treatment, and this cooling pipe 26a contacts the bottom face 1a on the nozzle side. Since the cooling pipe 26a is used, the condensate L ₂ of the steam can be cooled by cooling the one before the inflow to the steam exhaust pipe 5a in the steam G ₂ after the steam treatment. This condensate L ₂ exists between the surface of the substrate A to be processed and the gap between the bottom face 1a on the nozzle side.

The cooling mechanism 36 is supplied with cooling water 36c from the cooling water storage tank 36b into the cooling pipe 36a at the time of steam treatment, and the cooling pipe 36a is in contact with the side surface of the steam exhaust pipe 5a. Therefore, at least a part of the steam G ₂ after the steam treatment passing through the steam exhaust pipe 5a can be cooled to form a condensed liquid L _{2 of} steam. Since the steam exhaust pipe 5a is inclined obliquely as described above, the condensed liquid L ₂ of the steam generated in the steam exhaust pipe 5a passes along the inner surface of the substrate A to be processed and the body 1. ) Falls between poles of the bottom. In addition, since the cooling pipe 36a is in contact with the bottom face 1b on the discharge pipe side, the cooling pipe 36a does not enter the vapor exhaust pipe 5a and is disposed between the bottom face 1b on the discharge pipe side and the substrate A to be processed. If the vapor has been reached (G _2), by cooling the steam (G ₂₎ it is to be condensed with (L ₂₎ of the steam. Therefore, most of the steam G ₂ after the steam treatment is cooled near the cooling pipes 26a and 36a to become the condensate L _{2 of the} steam.

The cooling mechanism of this embodiment is of the type provided separately from the 1st cooling mechanism 26 which cools the steam before inflow of exhaust mechanism, and the 2nd cooling mechanism 36 which cools the steam which passes through the exhaust mechanism.

The steam treatment is performed on the substrate A to be treated using the steam treatment apparatus as shown in FIG. 2 to clean the substrate surface as follows.

While the cooling water is supplied from the cooling water storage tanks corresponding to the cooling pipes 26a and 36a, the conveying roller 25 is located below the steam treatment section 10a in which the exhaust pump 5b and the drainage pump 8b are operated. Steam by subjecting the surface of the substrate A to be treated with the vapor controlled by the conditions such as the vapor pressure or the temperature from the plurality of steam injection nozzles 2 while conveying the substrate A to be processed at a predetermined speed. The deposit on the surface of the substrate (A) is removed.

The steam G ₂ after steaming is present between the bottom surface of the main body 1 and the substrate A to be processed, and at least a part of the steam G ₂ after steaming passes through the steam exhaust pipe 5a to steam the steaming. the system being discharged outside, and a part of the steam (G _2), before flowing into the steam exhaust pipe (5a) of the steam (G ₂₎ after the steam treatment is cooled in the vicinity of the cooling pipe (26a) for the condensate of the vapor (L ₂₎ Becomes In addition, a part of the steam G ₂ introduced into the steam exhaust pipe 5a of the steam G ₂ after steam treatment is cooled near the cooling pipe 36a to become a condensate L _{2 of} steam. In addition, if there is a vapor it reaches the gap of the steam treatment after the steam (G ₂₎ of the steam exhaust pipe (5a) discharging the bottom surface (1b) of the pipe-side without being introduced into the target substrate (A), these vapor (G ₂ ) Is cooled near the cooling pipe 36a to become a condensate L _{2 of} steam. The condensate L ₂ of these vapors passes through the flow path 15 into the condensate discharge pipe 8a and passes through the condensate discharge pipe 8a to be discharged out of the steam treatment system.

According to the steam processing apparatus of this embodiment, since the condensation effect of the steam G ₂ after steam processing can be improved, the remove | eliminated material removed from the to-be-processed board | substrate passes through the flow path 15 with the condensate L ₂ . Therefore, it can be discharged more efficiently outside of the steam treatment system.

[Third Embodiment]

It is sectional drawing which shows schematic structure of the steam processing apparatus of 3rd Embodiment of this invention.

The steam processing apparatus of the third embodiment is particularly different from the steam processing apparatus of the first embodiment illustrated in FIG. 1, including a plurality of conveying rollers 35 (inclined conveying mechanism) for conveying the substrate to be processed in an inclined state. Moreover, the condensate discharge | release mechanism 8 is not provided in the steam process part 10b.

The some conveyance roller 35 (inclined conveyance mechanism) can convey in the state which inclined the to-be-processed substrate A after a wet process, and can pass below the steam process part 10b. Specifically, the some conveyance roller 35 is arrange | positioned so that conveyance is possible at the angle which the to-be-processed substrate A raises to a movement direction (S: conveyance direction).

The steam treatment is performed on the substrate A to be treated using the steam treatment apparatus as shown in FIG. 3 to clean the substrate surface as follows.

The cooling water 6c is supplied to the cooling pipe 6a from the cooling water storage tank 6b, and is treated by the conveying roller 35 under the steam treatment section 10b where the exhaust pump 5b is operated. The vapor | steam in which conditions, such as steam pressure or temperature, were controlled from the some steam injection nozzle 2 was conveyed to the surface of the to-be-processed substrate A, conveying the board | substrate A at the predetermined speed by the angle which raises to a moving direction (conveying direction). It sprays and performs a steaming process, and removes the deposit on the surface of the board | substrate (A). At the time of steam processing, when the to-be-processed substrate A is inclinedly conveyed as mentioned above, the flow path 15 is formed in the position lower than the steam process area | region 14. FIG.

The steam G ₂ after steaming is present between the bottom surface of the main body 1 and the substrate A to be processed, and at least a part of the steam G ₂ after steaming passes through the steam exhaust pipe 5a to steam the steaming. the system being discharged outside, and a portion of the steam (G ₂₎ flowing into the part and vapor exhaust pipe (5a) of the steam (G ₂₎ prior to flowing into the steam exhaust pipe (5a) of the steam (G ₂₎ after the steam treatment It cools in the vicinity of the cooling pipe 6a, and becomes the condensate L _{2 of} steam. The condensate L ₂ of these vapors passes through the flow path 15 to reach an end portion of the substrate A to be processed and falls downward from the discharged to the outside of the steam treatment system.

Also in the steam processing apparatus of this embodiment, it is possible to prevent the removed matter removed from the processing target substrate A from being reattached to the processing target substrate A, further reducing the displacement and realizing a low cost steam processing apparatus. Can be.

Further, in the first to third embodiments, the case where the present invention is applied to the apparatus for performing the cleaning treatment has been described, but not only the cleaning process but also one or more kinds of processes for removing the adherends of the target object, such as a resist stripping process, are performed. It can also be applied to an apparatus for

In addition, in the first to third embodiments, the case where the object to be processed is a substrate to be processed such as a large glass substrate having a width of several hundreds of mm, preferably 1 to 2 m in width, has been described. It may be.

As described above, according to the present invention, it is possible to prevent the removed matter removed from the object to be reattached to the object, and to reduce the amount of exhaust gas, thereby achieving a low cost steam treatment apparatus.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram which shows the steam processing apparatus of 1st Embodiment of this invention.

2 is a schematic configuration diagram showing a steam treatment apparatus according to a second embodiment of the present invention.

3 is a schematic configuration diagram showing a steam treatment apparatus according to a third embodiment of the present invention.

4 is a diagram showing a schematic configuration of a conventional cleaning device which is a type of using steam for cleaning a substrate.

* Description of the symbols for the main parts of the drawings *

One … main body

1a. Bottom of nozzle side

1b. Bottom of the discharge pipe side

2 … Steam jet nozzle

5... Exhaust mechanism

5a... Steam exhaust pipe

5b... Exhaust pump

5c... Opening

6. Cooling mechanism (first and second cooling mechanism)

6a, 26a, 36a... Cooling pipe

6b, 26b, 36b... Cooling water reservoir

6c, 26c, 36c... cooling water

8 … Condensate Discharge Mechanism

8a. Condensate Discharge Pipe

8b. Drainage pump

10, 10a, 10b... Steam treatment

14. Steam treatment area

15... Euro

25…. Conveying roller

26. 1st cooling mechanism

36. 2nd cooling mechanism

35. Conveying roller (incline conveying mechanism)

A… Substrate to be processed (Treatment)

G ₁ . steam

G ₂ . Steam after steam treatment (steam after steam treatment)

L ₂ . Condensate of steam

S… Conveying direction

Claims (7)

A steam injection nozzle for injecting steam for steam treatment toward the object to be treated and an exhaust mechanism provided near the steam injection nozzle and discharging at least a portion of the steam provided to the steam treatment to the outside of the steam treatment; And a steam treatment section comprising a cooling mechanism for cooling the steam after being provided to the steam treatment, wherein a condensate of the steam cooled and condensed by the cooling mechanism can pass between the surface of the object and the gap of the steam treatment portion. Steam processing device, characterized in that the flow path is formed. The steam processing apparatus according to claim 1, wherein the cooling mechanism comprises a first cooling mechanism for cooling the steam before the exhaust mechanism is introduced, and a second cooling mechanism for cooling the steam passing through the exhaust mechanism. The steam processing apparatus according to claim 1, wherein a condensate discharging mechanism for discharging the condensate of said steam out of the system of steam processing is in communication with said flow path. The steam treatment apparatus according to claim 1, wherein an inclined conveying mechanism for conveying the object to be processed in an inclined state is provided. The steam processing apparatus according to claim 2, wherein a condensate discharging mechanism for discharging the condensate of said steam out of the system of steam processing is in communication with said flow path. The steam treatment apparatus according to claim 2, wherein an inclined conveying mechanism for conveying the object to be processed is inclined. The steam treatment apparatus according to claim 2, wherein the first cooling mechanism and the second cooling mechanism are integrated.